CN202915450U - Spliced paving floor heating structure with surface heat dissipation and back heat insulation - Google Patents
Spliced paving floor heating structure with surface heat dissipation and back heat insulation Download PDFInfo
- Publication number
- CN202915450U CN202915450U CN 201220635519 CN201220635519U CN202915450U CN 202915450 U CN202915450 U CN 202915450U CN 201220635519 CN201220635519 CN 201220635519 CN 201220635519 U CN201220635519 U CN 201220635519U CN 202915450 U CN202915450 U CN 202915450U
- Authority
- CN
- China
- Prior art keywords
- heat insulation
- insulation layer
- back side
- heat conduction
- floor heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Floor Finish (AREA)
Abstract
The utility model discloses a spliced paving floor heating structure with surface heat dissipation and back heat insulation. The spliced paving floor heating structure with the surface heat dissipation and the back heat insulation comprises a plurality of base units which are mutually spliced, each base unit is composed of an outer shell body, a carbon crystal heating piece and a low heat conduction heat insulation layer, the low heat conduction heat insulation layer is filled in the outer shell body, and the carbon crystal heating piece is arranged between the outer shell body and the low heat conduction heat insulation layer. The spliced paving floor heating structure with the surface heat dissipation and the back heat insulation has the advantage of improving the defects that existing electric floor heating is big energy consumption and slow in temperature lifting.
Description
Technical field
The utility model relates to a kind of floor heating structure, especially relates to the warm structure of assembly floor file of a kind of surface radiating and back side thermal insulation.
Background technology
Floor heating is the abbreviation of floor panel heating, is take whole ground as radiator, and by the heating agent in the flooring radiation layer, the whole ground of homogeneous heating utilizes the make progress rule of radiation of the accumulation of heat on ground self and heat to conduct from the bottom to top, reaches the purpose of heating.Compare with traditional heating system, it is even, comfortable that floor heating has heat radiation, and cleaning is healthy, and environmental protection and energy saving are elegant in appearance, safe and reliable, the advantages such as extra long life and efficient sound insulation.
Present floor heating is divided into two kinds of water floor heating and electric floor heatings.According to present industry construction reference: the water floor heating is not to be higher than 60 ℃ hot water as heating agent take temperature, circulates in the heating tube in being embedded in the below ground packed layer, heats whole floor; The electricity floor heating is outer surface to be allowed to be limited on the operating temperature 65 ℃ heating cable be embedded in the floor, realizes the mode of ground radiation heating take heating cable as the thermal source heating floor.The shortcoming of tradition water floor heating/electric floor heating is power consumption, and no matter water floor heating and electric floor heating all must be indoor with just temperature radiation being advanced behind 20 centimeters left and right sides floor heatings, not only of a specified duration but also lot of energy of stand-by period.
The utility model content
Technical problem to be solved in the utility model is: provide the warm structure of assembly floor file of a kind of surface radiating and back side thermal insulation, to improve existing electric floor heating power consumption and the slow shortcoming that heats up.
For solving the problems of the technologies described above, the technical solution of the utility model is: structure is warmed up in the assembly floor file of a kind of surface radiating and back side thermal insulation, comprise the elementary cell that several splice mutually, it is characterized in that, described elementary cell comprises outer cover body, carbon crystal heating sheet and low heat conduction heat insulation layer, described low heat conduction heat insulation layer is filled in the described outer cover body, and described carbon crystal heating sheet is arranged between described outer cover body and the low heat conduction heat insulation layer.
Preferably, the material of described outer cover body can adopt fiberglass, ABS plastic, PP plastics, PE plastics or PS plastics.
Preferably, add or do not add highly heat-conductive material during the inherent forming process of glass fiber reinforced plastics of described fiberglass.
Preferably, described highly heat-conductive material can be adopted as alumina powder, graphite, boron nitride, carbonization silicon or Yangization ?Danization Aluminum powder.
Preferably, described low heat conduction heat insulation layer is polyurethane foam.
Adopted technique scheme, the beneficial effects of the utility model are: the utility model final products are warm for piecing together floor file, adopt special process, utilize the highly heat-conductive material surface radiating, low Heat Conduction Material back plate design forms heat insulation layer, avoids the energy going down, and single face is heating upwards, programming rate is fast, reduces thermal losses.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further specified.
As shown in Figure 1, structure is warmed up in the assembly floor file of a kind of surface radiating and back side thermal insulation, comprise the elementary cell that several splice mutually, elementary cell comprises outer cover body 2, carbon crystal heating sheet 1 and low heat conduction heat insulation layer 3, low heat conduction heat insulation layer 3 is filled in the outer cover body 2, and carbon crystal heating sheet 1 is arranged between outer cover body 2 and the low heat conduction heat insulation layer 3.In the present embodiment, low heat conduction heat insulation layer 3 is polyurethane powder.
In the present embodiment, the material of outer cover body 2 is fiberglass, can certainly adopt ABS plastic, PP plastics, PE plastics or PS plastics.
In order to improve programming rate, reduce thermal losses, be added with highly heat-conductive material during the inherent forming process of glass fiber reinforced plastics of fiberglass, in the present embodiment, highly heat-conductive material is alumina powder, can certainly adopt highly heat-conductive material can adopt graphite, boron nitride, carbonization silicon or Yangization ?Danization Aluminum powder.
The utility model adopts special process, utilizes the highly heat-conductive material surface radiating, and low Heat Conduction Material back plate design forms heat insulation layer, avoids the energy going down, and single face is heating upwards, and programming rate is fast, reduces thermal losses.
The utility model can place floor surface, radiation quick and energy-conservation (traditional floor heating designs in floor panel structure, after heat energy is absorbed by the floor in a large number just radiation enter indoor); And take in conveniently, can realize the floor heating in winter, the demand of taking in summer; Surface decoration materials variation can be combined with carpet, timber, floor tile; Adopt the brilliant plate of carbon as supplying heat source, tool far infrared thermal radiation has health-care effect; Can be paved with ground, room, or local the laying used.
The utility model is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done all drop within the protection domain of the present utility model.
Claims (5)
1. the warm structure of the assembly floor file of a surface radiating and back side thermal insulation, it is characterized in that, comprise the elementary cell that several splice mutually, it is characterized in that, described elementary cell comprises outer cover body, carbon crystal heating sheet and low heat conduction heat insulation layer, described low heat conduction heat insulation layer is filled in the described outer cover body, and described carbon crystal heating sheet is arranged between described outer cover body and the low heat conduction heat insulation layer.
2. the warm structure of the assembly floor file of a kind of surface radiating as claimed in claim 1 and back side thermal insulation is characterized in that, the material of described outer cover body can adopt fiberglass, ABS plastic, PP plastics, PE plastics or PS plastics.
3. the warm structure of the assembly floor file of a kind of surface radiating as claimed in claim 2 and back side thermal insulation is characterized in that, adds or do not add highly heat-conductive material during the inherent forming process of glass fiber reinforced plastics of described fiberglass.
4. the warm structure of the assembly floor file of a kind of surface radiating as claimed in claim 3 and back side thermal insulation is characterized in that, described highly heat-conductive material can be adopted as alumina powder, graphite, boron nitride, carbonization silicon or Yangization ?Danization Aluminum powder.
5. such as the warm structure of the assembly floor file of the described a kind of surface radiating of the arbitrary claim of claim 1-4 and back side thermal insulation, it is characterized in that, described low heat conduction heat insulation layer is polyurethane foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220635519 CN202915450U (en) | 2012-11-26 | 2012-11-26 | Spliced paving floor heating structure with surface heat dissipation and back heat insulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220635519 CN202915450U (en) | 2012-11-26 | 2012-11-26 | Spliced paving floor heating structure with surface heat dissipation and back heat insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202915450U true CN202915450U (en) | 2013-05-01 |
Family
ID=48163761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220635519 Expired - Fee Related CN202915450U (en) | 2012-11-26 | 2012-11-26 | Spliced paving floor heating structure with surface heat dissipation and back heat insulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202915450U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102927607A (en) * | 2012-11-26 | 2013-02-13 | 昆山桑德勒电子实业有限公司 | Splicing paving type floor heating structure with heat dissipation surface and adiabatic back surface |
| CN103470002A (en) * | 2013-09-16 | 2013-12-25 | 江西斯洛特石业有限公司 | Far infrared floor heating stone tile |
-
2012
- 2012-11-26 CN CN 201220635519 patent/CN202915450U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102927607A (en) * | 2012-11-26 | 2013-02-13 | 昆山桑德勒电子实业有限公司 | Splicing paving type floor heating structure with heat dissipation surface and adiabatic back surface |
| CN103470002A (en) * | 2013-09-16 | 2013-12-25 | 江西斯洛特石业有限公司 | Far infrared floor heating stone tile |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201373491Y (en) | Dry terrestrial heat supplying system | |
| CN103267315B (en) | Recycled constant-temperature ceramic floor integrated system | |
| CN201448928U (en) | Floor heating system of electrothermal films | |
| CN207214212U (en) | A kind of dual-purpose ground heating floor of water power | |
| CN204676819U (en) | Heat retaining and exothermal floor tile | |
| CN203462678U (en) | Capillary decorating board | |
| CN204850353U (en) | Novel heating floor | |
| CN202915450U (en) | Spliced paving floor heating structure with surface heat dissipation and back heat insulation | |
| CN102927607A (en) | Splicing paving type floor heating structure with heat dissipation surface and adiabatic back surface | |
| CN202969840U (en) | Refrigeration and heating floorboard structure | |
| CN203285015U (en) | Quick floor heating nano carbon crystal plank brick | |
| CN203010755U (en) | Dry-type floor heating module | |
| CN202647959U (en) | Electric floor heating structure | |
| CN204174868U (en) | A kind of heating power flooring heating system | |
| CN203385065U (en) | Recycled constant temperature ceramic floor integrated system | |
| CN203375520U (en) | Waterproof carbon-fiber infrared heating floor tile | |
| CN203010741U (en) | Novel electric floor heater | |
| CN207962822U (en) | One kind can assembled graphene floor heating structure | |
| CN104179322A (en) | Electric heating flooring heating system | |
| CN203249309U (en) | Radiant floor heating module | |
| CN201605785U (en) | Self-limiting temperature electric heating band skirting | |
| CN203478421U (en) | Energy-saving electric heating floor | |
| CN202915451U (en) | Support structure of spliced paving floor heating | |
| CN203050039U (en) | Heat conducting board structure of floor heating system | |
| CN203462717U (en) | Quick-to-mount low-temperature alloy high-intensity pressure-resistance composite heating floor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190909 Address after: 226100 Binjiang Street, Haimen City, Nantong City, Jiangsu Province, 1699 Binggang Avenue Patentee after: JIANGSU YAOYAN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Address before: 215300 No. 1, South Jinsha River Road, Kunshan Development Zone, Jiangsu Patentee before: KUNSHAN SUNDERER ELECTRONIC INDUSTRIAL Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20211126 |