CN202894599U - Laser cutting device used for machining embedding knife line seam in die board - Google Patents
Laser cutting device used for machining embedding knife line seam in die board Download PDFInfo
- Publication number
- CN202894599U CN202894599U CN 201220624510 CN201220624510U CN202894599U CN 202894599 U CN202894599 U CN 202894599U CN 201220624510 CN201220624510 CN 201220624510 CN 201220624510 U CN201220624510 U CN 201220624510U CN 202894599 U CN202894599 U CN 202894599U
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- cutter
- laser
- cutting device
- laser cutting
- machining
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Abstract
The utility discloses a laser cutting device used for machining an embedding knife line seam in a die board. The laser cutting device used for machining the embedding knife line seam in the die board comprises work table, wherein a motor-driven feed plate capable of making reciprocating motion is arranged on the work table, a clamp is arranged on the motor-driven feed plate, a supporting frame is further fixed on the working table, a laser cutter is arranged on the support frame, a controller is arranged on the side face of the working table, and the controller is respectively connected with the motor-driven feed plate and the laser cutter. The laser cutting device used for machining the embedding knife line seam in the die board has the advantages of being simple in operation, high in production efficiency, and low in manufacturing cost.
Description
Technical field
The utility model relates to the laser processing technology field, particularly a kind of laser cutting device of inlaying cutter linear slit crack for the processing mould cutting plate.
Background technology
Die cutting plate is product necessary on the printing packaging industry, inlays the slit that cutter uses on the die cutting plate and is called the cutter line, and the cutter line is very important.The quality that the cutter line is inlayed at die cutting plate directly affects quality, precision and the efficient of die cutting operation.If the cutter line is excessively loose, may make cutter loosening or come off, also may make cutter occur rocking, affect cut quality; If cutter line tension can make the die cutting plate warpage play drum, the lighter affects the die cutting operation quality, and the severe one die cutting plate has just been scrapped.
Summary of the invention
The purpose of this utility model is in order to address the above problem, to have designed a kind of laser cutting device of inlaying cutter linear slit crack for the processing mould cutting plate.
Realize that the above-mentioned purpose the technical solution of the utility model is, a kind of laser cutting device of inlaying cutter linear slit crack for the processing mould cutting plate, comprise workbench, workbench is provided with the electronic feedboard that can move reciprocatingly, on the electronic feedboard jig is installed, also is fixed with support on the workbench, laser cutter is installed on the support, the side of workbench is provided with controller, and controller is connected with laser cutter with electronic feedboard respectively.
Described laser cutter is the pulse laser cutter.
The dutycycle of pulse laser is 40%-80% in the described pulse laser cutter.
The repetition rate of pulse laser is 15Hz-65Hz in the described pulse laser cutter.
The average output power of pulse laser is 800W-1700W in the described pulse laser cutter.
The processing mould cutting plate that is used for that utilizes the technical solution of the utility model to make is inlayed the laser cutting device in cutter linear slit crack, in cutting process, with pulse laser continuous punching on die cutting plate, certain lap is arranged between each hole, this has just stayed many crest lines that the face of cylinder crosses at die cutting plate, the enveloping surface line of these crest lines forms two planes that cooperate with the cutter line, because two planes are to produce certain interference at small size, in the crest line both sides very large space is arranged, be the wooden adjustment that certain strain and self-alignment are arranged at crest line place, can produce enough clamping forces and also can not make die cutting plate produce buckling deformation.
Description of drawings
Fig. 1 is the structural representation of inlaying the laser cutting device in cutter linear slit crack for the processing mould cutting plate described in the utility model;
Among the figure, 1, workbench; 2, electronic feedboard; 3, jig; 4, support; 5, laser cutter; 6, controller.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is specifically described, the structural representation of inlaying the laser cutting device in cutter linear slit crack for the processing mould cutting plate described in the utility model such as Fig. 1, as shown in the figure, a kind of laser cutting device of inlaying cutter linear slit crack for the processing mould cutting plate, comprise workbench 1, workbench is provided with the electronic feedboard 2 that can move reciprocatingly, jig 3 is installed on the electronic feedboard, also be fixed with support 4 on the workbench, laser cutter 5 is installed on the support, the side of workbench is provided with controller 6, and controller is connected with laser cutter with electronic feedboard respectively.Wherein, described laser cutter is the pulse laser cutter; The dutycycle of pulse laser is 40%-80% in the described pulse laser cutter; The repetition rate of pulse laser is 15Hz-65Hz in the described pulse laser cutter; The average output power of pulse laser is 800W-1700W in the described pulse laser cutter.
The technical program adopts pulse laser to get continuously a plurality of holes that certain lap is arranged on die cutting plate, make and stayed uniformly many crest lines in the groove of cutting, these crest lines have formed two faces that contact with the cutter line, because the both sides of crest line protruding tip have very large space, therefore each tip can easily produce strain when contacting with the cutter line, can automatically adjust, avoid occurring the phenomenon of tension, owing in laser processing procedure, there are a lot of parameters can both affect the size of processing, repetition rate such as pulse laser, the average output power of when pulse of the duty of pulse laser is finely tuned above-mentioned parameter and just can be sought the wide size of desirable seam.
Dutycycle was defined as in the cycle of a light pulse, bright dipping time and the light pulse ratio of cycle time.Width with the raising die cutting plate joint-cutting of dutycycle is also increasing, and reason is that the mean power along with the raising output of dutycycle is also improving, so the width of joint-cutting is also increasing.And the upper and lower opening variation tendency of otch is identical.Experiment shows, optimum value when duty is closed in 70% left and right sides.For pulse laser, the speed of pulse is that repetition rate also is important parameter, and the different cutting effects of value differ greatly, by experiment as can be known, change along with repetition rate, width of slit broadens gradually, and its reason is along with its mean power of raising of repetition rate is also improving, and has a significant feature to be no matter how many values of repetition rate is, the size of joint-cutting upper and lower opening all is the same, in other words, it is wide that the change repetition rate can change seam, but can not turn over the feature all over rectangular slits.Seam is wide for about 1.5mm when repetition rate is 20Hz.In sum, can obtain comparatively desirable numerical value by adjusting each above-mentioned parameter, the clamping force that can reach the tool setting line is moderate, to improve the crudy of die cutting plate.
Technique scheme has only embodied the optimal technical scheme of technical solutions of the utility model; some changes that those skilled in the art may make some part have wherein all embodied principle of the present utility model, belong within the protection domain of the present utility model.
Claims (5)
1. one kind is used for the processing mould cutting plate and inlays the laser cutting device in cutter linear slit crack, comprise workbench (1), it is characterized in that, workbench is provided with the electronic feedboard (2) that can move reciprocatingly, jig (3) is installed on the electronic feedboard, also is fixed with support (4) on the workbench, laser cutter (5) is installed on the support, the side of workbench is provided with controller (6), and controller is connected with laser cutter with electronic feedboard respectively.
2. according to claim 1ly inlay the laser cutting device in cutter linear slit crack for the processing mould cutting plate, it is characterized in that described laser cutter is the pulse laser cutter.
3. according to claim 2ly inlay the laser cutting device in cutter linear slit crack for the processing mould cutting plate, it is characterized in that the dutycycle of pulse laser is 40%-80% in the described pulse laser cutter.
4. according to claim 2ly inlay the laser cutting device in cutter linear slit crack for the processing mould cutting plate, it is characterized in that the repetition rate of pulse laser is 15Hz-65Hz in the described pulse laser cutter.
5. according to claim 2ly inlay the laser cutting device in cutter linear slit crack for the processing mould cutting plate, it is characterized in that the average output power of pulse laser is 800W-1700W in the described pulse laser cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220624510 CN202894599U (en) | 2012-11-23 | 2012-11-23 | Laser cutting device used for machining embedding knife line seam in die board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220624510 CN202894599U (en) | 2012-11-23 | 2012-11-23 | Laser cutting device used for machining embedding knife line seam in die board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202894599U true CN202894599U (en) | 2013-04-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220624510 Expired - Fee Related CN202894599U (en) | 2012-11-23 | 2012-11-23 | Laser cutting device used for machining embedding knife line seam in die board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202894599U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106660088A (en) * | 2014-07-22 | 2017-05-10 | 蒂森克虏伯钢铁欧洲股份公司 | Device and method for structuring a roller by means of laser removal |
-
2012
- 2012-11-23 CN CN 201220624510 patent/CN202894599U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106660088A (en) * | 2014-07-22 | 2017-05-10 | 蒂森克虏伯钢铁欧洲股份公司 | Device and method for structuring a roller by means of laser removal |
| CN106660088B (en) * | 2014-07-22 | 2019-09-03 | 蒂森克虏伯钢铁欧洲股份公司 | For stripping the device and method for making roll structure by laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Tianjin Inst. of Laser Technology Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20151123 |
|
| EXPY | Termination of patent right or utility model |