CN202862429U - Multi-linear cutting device with shaking mechanism - Google Patents
Multi-linear cutting device with shaking mechanism Download PDFInfo
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- CN202862429U CN202862429U CN 201220496708 CN201220496708U CN202862429U CN 202862429 U CN202862429 U CN 202862429U CN 201220496708 CN201220496708 CN 201220496708 CN 201220496708 U CN201220496708 U CN 201220496708U CN 202862429 U CN202862429 U CN 202862429U
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- cutting device
- workpiece
- linear cutting
- guide wheels
- shaking mechanism
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Abstract
The utility model discloses a multi-linear cutting device with a shaking mechanism and relates to the technical field of cutting devices. The multi-linear cutting device with the shaking mechanism comprises a plurality of steel wires, two guide wheels and two steel wires. The steel wires are arranged in open grooves of the two symmetrical guide wheels in a sleeved mode, and two steel wires respectively penetrate through the guide wheels and control the guide wheels. The multi-linear cutting device with the shaking mechanism is characterized in that the multi-linear cutting device is applied to the multi-linear cutting device with a workpiece descending device which is provided with the shaking mechanism. The multi-linear cutting device is applied to the workpiece descending type multi-linear cutting device provided with the shaking mechanism enabling a workpiece to shake. The device is mainly used for machining materials such as silicon crystal, sapphire and silicon carbide (Sic) and the like which are difficult to cut, enables shortening of the space between the guide wheels to be possible, enables a body of the shaking mechanism to be minimized (the amount of components which are needed by equipment and are high in accuracy and price can be reduced to the minimum), and effectively reduces and controls manufacturing cost.
Description
Technical field
The utility model relates to the cutter sweep technical field, is specifically related to a kind of Multi-wire cutting device with head motion.
Background technology
Mainly be that monocrystalline or polycrystalline take Si as raw material made for the substrate of semiconductor, system of crystallization solar cell.The processing unit (plant) that is worked into the crystal bar of contour substrate from crystal pulling or as-cast condition comprises some steel wires 100 and two guide wheels and two steel wires, every steel wire 100 is sheathed in the fluting of two symmetrical guide wheels, two guide wheels are respectively by being through the steel wire control in the guide wheel, every steel wire 100 on one side bidirectional high speeds moves and pushes workpiece 200 on one side to, and this processing unit (plant) is that multi-wire saw is processed LED reverse mounting type and can once be obtained a large amount of wafers.During processed wafer, one is to use mortar is applied in the method for obtaining cutting power on the steel wire 100, two for adopting the methods of diamond wire, and the method that 2 kinds of use steel wires 100 carry out the high-speed mobile cutting has very large difference, and the utility model is the device that is conceived to the latter's use diamond wire processing.LED or be called as on the substrate of energy device and using the material higher than Si hardness, for example sapphire and SiC are that the difficulty of representative is cut material, in recent years owing to occurring economizing the tendency of electrification on the market, the demand of LED and energy device increases to some extent, be accompanied by the increase of substrate production amount, just require difficulty to cut the productive raising of cutting of material.
For being cut, difficulty uses more expeditiously diamond wire processing on the material, adding man-hour, effectively will cut the chip that produces and add the heat that produces man-hour and from cutting groove, discharge, and should not hinder to be fixed on the firm line such as the Buddha's warrior attendant blade, and be necessary again to prevent because heat causes workpiece 200 to be out of shape.But workpiece 200 integral body are on steel wire 100 in the existing multi-wire saw, and steel wire 100 comes in contact with workpiece 200, and chip can't effectively be discharged (Fig. 1).
The utility model content
Primary and foremost purpose of the present utility model just is to overcome the existing deficiency of existing Multi-wire cutting device, thereby a kind of Multi-wire cutting device with head motion is provided.
Multi-wire cutting device with head motion of the present utility model, comprise some steel wires, two guide wheels and two steel wires, every steel-wire armoring is located in the fluting of two symmetrical guide wheels, two steel wires are through respectively in two guide wheels controls described steel wire by described guide wheel, described Multi-wire cutting device is applied to the Multi-wire cutting device with the workpiece lowering means, on the described workpiece lowering means with head motion.
The center of shaking of described head motion is arranged in the workpiece.
The waving angle of described head motion is by the inner controlling organization adjustment of device.
Described head motion produces workpiece and shakes amplitude.
The described amplitude of amplitude of shaking is by the inner controlling organization adjustment of device.
The utility model is to be applied to workpiece descending manner Multi-wire cutting device, and with the mechanism that workpiece is shaken, is mainly used in processing and cuts material such as difficulties such as silicon wafer, sapphire, SiC.
The utility model shakes workpiece, close to the processing mode that contacts of point type, prevents that linear contact from can avoid that steel wire is whole to be contacted with workpiece between workpiece and the steel wire, can effectively discharge chip.
The utility model shakes rear workpiece and shakes amplitude, and this shakes amplitude by the inner controlling organization adjustment of device.
The utility model increases the steel wire that can avoid the shaking amplitude of workpiece and produce and the interference between the guide wheel with 2 or 3 guide wheel intervals.The narrow and small tension stability that makes of guide wheel installing space tails off the distortion that causes because of the processing impact such as the average thickness of wafer and warpage etc. after the processing, and device of the present utility model adds can be and improves the wafer yield and contribute.
The amplitude that the utility model shakes amplitude by controlling organization control, for obtaining enough waving angles, the utility model fixes on inside workpiece with the center of shaking of head motion.
The utility model makes the interval that dwindles the steel wire guide wheel become possibility, and the body of head motion is reached miniaturization, can Min. keep high accuracy product at high price, and the effect of the manufacturing cost that reduces control device is arranged.
Description of drawings
Fig. 1 is the work schematic diagram of existing wire-electrode cutting device.
Fig. 2 is structural representation of the present utility model.
Fig. 3 is the schematic diagram that the utility model machines the rear record location of workpiece.
Fig. 4 is the schematic diagram that workpiece of the present utility model contacts with steel wire.
The specific embodiment
Below in conjunction with specific embodiment, the utility model is described in further detail.Should be understood that following examples are only for explanation the utility model but not for limiting scope of the present utility model.
As shown in Figures 2 and 3, Multi-wire cutting device with head motion of the present utility model, comprise some steel wires 1, two guide wheels 2, every steel wire 1 is sheathed in the fluting of two symmetrical guide wheels 2, two steel wires 1 are through respectively in two guide wheels 2, by control guide wheel 2 control steel wires 1, described Multi-wire cutting device is applied to the Multi-wire cutting device with the workpiece lowering means, on the described workpiece lowering means with head motion.
The center of shaking 51 of described head motion is arranged in the workpiece 4.
The waving angle of described head motion is by the inner controlling organization adjustment of device.
Described head motion produces workpiece 4 and shakes amplitude.
The described amplitude of amplitude of shaking is by the inner controlling organization adjustment of device.
As shown in Figure 4, position shown in the figure, the narrow and small tension stability that makes of guide wheel 2 installing spaces occurs more than 5 degree in one-sided shaking, the distortion that causes because of the processing impact such as the average thickness of wafer and warpage etc. after the processing is tailed off, and device of the present utility model can be and improves the wafer yield and contribute.
The utility model is to be applied to workpiece 4 descending manner Multi-wire cutting devices, and with the mechanism that workpiece 4 is shaken, is mainly used in processing and cuts material such as difficulties such as silicon wafer, sapphire, SiC.
The utility model shakes workpiece 4, close to the processing mode that contacts of point type, prevents that linear contact from can avoid that steel wire 1 is whole to be contacted with workpiece 4 between workpiece 4 and the steel wire 1, can effectively discharge chip.
The utility model shakes rear workpiece 4 and shakes amplitude, and this shakes amplitude by the inner controlling organization adjustment of device.
The utility model increases 2 or 3 guide wheel 2 intervals the interference of 2 on the workpiece 4 that can avoid the shaking amplitude of workpiece 4 and produce and guide wheel.The narrow and small tension stability that makes of guide wheel 2 installing spaces tails off the distortion that causes because of the processing impact such as the average thickness of wafer and warpage etc. after the processing, and device of the present utility model adds can be and improves the wafer yield and contribute.
The amplitude that the utility model shakes amplitude by controlling organization control, for obtaining enough waving angles, the utility model fixes on workpiece 4 inside with the center of shaking 51 of head motion.
The utility model makes the interval that dwindles 2 on two guide wheels become possibility, and the body of head motion is reached miniaturization, equipment the quantity of must the high accuracy price high parts can minimize).The effect that the manufacturing cost that reduces control device is arranged.
Claims (5)
1. Multi-wire cutting device with head motion, comprise some steel wires, two guide wheels and two steel wires, every steel-wire armoring is located in the fluting of two symmetrical guide wheels, two steel wires are through respectively in two guide wheels, it is characterized in that, described Multi-wire cutting device is applied to the Multi-wire cutting device with the workpiece lowering means, on the described workpiece lowering means with head motion.
2. the Multi-wire cutting device with head motion as claimed in claim 1 is characterized in that, the center of shaking of described head motion is arranged in the workpiece.
3. the Multi-wire cutting device with head motion as claimed in claim 1 is characterized in that, the waving angle of described head motion is by the inner controlling organization adjustment of device.
4. the Multi-wire cutting device with head motion as claimed in claim 1 is characterized in that, described head motion produces workpiece and shakes amplitude.
5. the Multi-wire cutting device with head motion as claimed in claim 4 is characterized in that, the described amplitude of amplitude of shaking is by the inner controlling organization adjustment of device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220496708 CN202862429U (en) | 2012-09-26 | 2012-09-26 | Multi-linear cutting device with shaking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220496708 CN202862429U (en) | 2012-09-26 | 2012-09-26 | Multi-linear cutting device with shaking mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202862429U true CN202862429U (en) | 2013-04-10 |
Family
ID=48029180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220496708 Expired - Lifetime CN202862429U (en) | 2012-09-26 | 2012-09-26 | Multi-linear cutting device with shaking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202862429U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105279503A (en) * | 2015-11-20 | 2016-01-27 | 浙江水晶光电科技股份有限公司 | Fingerprint identification cover plate and preparation method thereof, and fingerprint identification module |
| CN105382951A (en) * | 2015-12-16 | 2016-03-09 | 哈尔滨秋冠光电科技有限公司 | Sapphire curved surface multi-line cutting method and device thereof |
-
2012
- 2012-09-26 CN CN 201220496708 patent/CN202862429U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105279503A (en) * | 2015-11-20 | 2016-01-27 | 浙江水晶光电科技股份有限公司 | Fingerprint identification cover plate and preparation method thereof, and fingerprint identification module |
| CN105279503B (en) * | 2015-11-20 | 2018-12-04 | 浙江水晶光电科技股份有限公司 | A kind of preparation method of fingerprint recognition cover board |
| CN105382951A (en) * | 2015-12-16 | 2016-03-09 | 哈尔滨秋冠光电科技有限公司 | Sapphire curved surface multi-line cutting method and device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130410 |