CN202861430U - Diamond compound cutter - Google Patents
Diamond compound cutter Download PDFInfo
- Publication number
- CN202861430U CN202861430U CN 201220525569 CN201220525569U CN202861430U CN 202861430 U CN202861430 U CN 202861430U CN 201220525569 CN201220525569 CN 201220525569 CN 201220525569 U CN201220525569 U CN 201220525569U CN 202861430 U CN202861430 U CN 202861430U
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- Prior art keywords
- diamond
- layer
- polycrystalline diamond
- diamond layer
- polycrystalline
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Abstract
The utility model discloses a diamond compound cutter. The diamond compound cutter comprises a polycrystalline diamond layer and a cemented carbide layer, wherein the polycrystalline diamond layer and the cemented carbide layer are combined to form a polycrystalline diamond layer compact, the thickness of the polycrystalline diamond layer is 0.8-1 mm, monocrystal diamond is arranged in the polycrystalline diamond layer, and the monocrystal diamond is distributed crosswise or staggered up and down in the polycrystalline diamond layer. The diamond compound cutter is low in cost, simple in structure, good in cutting effect, convenient to use and prolonged in service life.
Description
Technical field
The utility model relates to a kind of machine tool, particularly relates to a kind of diamond compound tool that is provided with polycrystalline diamond layer.
Background technology
At present, composite polycrystal-diamond is at present domestic and international widely used a kind of instrument, adopt diamond compounded superhard alloy material, concrete structure is that cemented carbide substrate and one deck polycrystalline diamond are composited, and is mainly used in cutting tool, crushing cutter and wear parts.
For example the patent No. is CN02289311.3, and publication number is the Chinese patent " a kind of ultra-thin polycrystalline diamond layer diamond cutter " of CN2579573.A kind of ultra-thin polycrystalline diamond layer diamond cutter is disclosed, the ultra-hard material poly-crystal diamond compact that is made of one deck polycrystalline diamond and one deck carbide alloy; The polycrystalline diamond layer thickness of composite polycrystal-diamond is not more than 0.25mm.The weak point of this patent is, after polycrystalline diamond layer uses wearing and tearing for a long time, causes the cutting effect variation of cutter, and service life is short.
The utility model content
The purpose of this utility model is to overcome the above-mentioned problems in the prior art, proposes a kind of diamond compound tool.The utility model adopts and be provided with single-crystal diamond in polycrystalline diamond layer, after having overcome prior art and existing polycrystalline diamond layer to use wearing and tearing for a long time, causes the technical problem of the cutting effect variation of cutter, cost is low, and is simple in structure, and cutting effect is good, easy to use, prolonged service life.
The utility model is realized by the following technical solutions:
A kind of diamond compound tool, comprise polycrystalline diamond layer and hard alloy layer, described polycrystalline diamond layer and hard alloy layer are compounded to form the polycrystalline diamond layer composite sheet, it is characterized in that: the thickness of described polycrystalline diamond layer is 0.8-1mm, be provided with single-crystal diamond in the described polycrystalline diamond layer, the transversely arranged distribution or be interspersed up and down in polycrystalline diamond layer of described single-crystal diamond.
The thickness of described polycrystalline diamond layer is 1mm.
The internal diameter of described single-crystal diamond is 0.3-0.6mm.
The internal diameter of described single-crystal diamond is different.
The utility model compared with prior art, its advantage is:
1, the utility model adopts and be provided with single-crystal diamond in polycrystalline diamond layer, after having overcome prior art and existing polycrystalline diamond layer to use wearing and tearing for a long time, causes the technical problem of the cutting effect variation of cutter, cost is low, and is simple in structure, and cutting effect is good, easy to use, prolonged service life.
2, to adopt the internal diameter of single-crystal diamond be 0.3-0.6mm to the utility model, changes according to the varied in thickness of polycrystalline diamond layer, and simple in structure, result of use is good.
3, it is different that the utility model adopts the internal diameter of single-crystal diamond, and cutting effect is good.
4, the utility model adopts single-crystal diamond in the transversely arranged distribution of polycrystalline diamond layer or is interspersed up and down; Select set-up mode according to difference cutting needs, simple in structure, easy to use, the special larger cutter of cutting that is used for.
Description of drawings
Fig. 1 is the utility model structural representation
Mark among the figure: 1, polycrystalline diamond layer, 2, hard alloy layer, 3, single-crystal diamond.
The specific embodiment
Embodiment 1:
A kind of diamond compound tool, comprise polycrystalline diamond layer 1 and hard alloy layer 2, described polycrystalline diamond layer 1 is compounded to form the polycrystalline diamond layer composite sheet with hard alloy layer 2, the thickness of described polycrystalline diamond layer 1 is 0.8mm, be provided with single-crystal diamond 3 in the described polycrystalline diamond layer 1, the transversely arranged distribution in polycrystalline diamond layer 1 of described single-crystal diamond 3.
In the utility model, the internal diameter of described single-crystal diamond 3 is 0.3mm.
The utility model in use, the welding of polycrystalline diamond layer composite sheet and metal cutter hub forms superhard cutter.
Embodiment 2:
A kind of diamond compound tool, comprise polycrystalline diamond layer 1 and hard alloy layer 2, described polycrystalline diamond layer 1 is compounded to form the polycrystalline diamond layer composite sheet with hard alloy layer 2, the thickness of described polycrystalline diamond layer 1 is 1mm, be provided with single-crystal diamond 3 in the described polycrystalline diamond layer 1, described single-crystal diamond 3 is transversely arranged distribution cloth in polycrystalline diamond layer 1.
In the utility model, the internal diameter of described single-crystal diamond 3 is 0.6mm.
Embodiment 3:
A kind of diamond compound tool, comprise polycrystalline diamond layer 1 and hard alloy layer 2, described polycrystalline diamond layer 1 is compounded to form the polycrystalline diamond layer composite sheet with hard alloy layer 2, the thickness of described polycrystalline diamond layer 1 is 1mm, be provided with single-crystal diamond 3 in the described polycrystalline diamond layer 1, described single-crystal diamond 3 is interspersed up and down in polycrystalline diamond layer 1.
In the utility model, the internal diameter of described single-crystal diamond 3 is 0.6mm.
Claims (4)
1. diamond compound tool, comprise polycrystalline diamond layer (1) and hard alloy layer (2), described polycrystalline diamond layer (1) is compounded to form the polycrystalline diamond layer composite sheet with hard alloy layer (2), it is characterized in that: the thickness of described polycrystalline diamond layer (1) is 0.8-1mm, be provided with single-crystal diamond (3) in the described polycrystalline diamond layer (1), described single-crystal diamond (3) transversely arranged distribution or be interspersed up and down in polycrystalline diamond layer (1).
2. a kind of diamond compound tool according to claim 1, it is characterized in that: the thickness of described polycrystalline diamond layer (1) is 1mm.
3. a kind of diamond compound tool according to claim 1 and 2, it is characterized in that: the internal diameter of described single-crystal diamond (3) is 0.3-0.6mm.
4. a kind of diamond compound tool according to claim 3, it is characterized in that: the internal diameter of described single-crystal diamond (3) is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525569 CN202861430U (en) | 2012-10-15 | 2012-10-15 | Diamond compound cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525569 CN202861430U (en) | 2012-10-15 | 2012-10-15 | Diamond compound cutter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202861430U true CN202861430U (en) | 2013-04-10 |
Family
ID=48028188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220525569 Expired - Fee Related CN202861430U (en) | 2012-10-15 | 2012-10-15 | Diamond compound cutter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202861430U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104651701A (en) * | 2015-02-14 | 2015-05-27 | 江苏和鹰机电科技有限公司 | Heat dissipating type composite cutter material for cutting glass fiber and preparation method thereof |
| CN107116349A (en) * | 2017-06-07 | 2017-09-01 | 马鞍山市恒利达机械刀片有限公司 | A kind of cutter production method |
-
2012
- 2012-10-15 CN CN 201220525569 patent/CN202861430U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104651701A (en) * | 2015-02-14 | 2015-05-27 | 江苏和鹰机电科技有限公司 | Heat dissipating type composite cutter material for cutting glass fiber and preparation method thereof |
| CN104651701B (en) * | 2015-02-14 | 2017-10-24 | 江苏和鹰机电科技有限公司 | Heat radiating type complex cutter material for glass-cutting fiber and preparation method thereof |
| CN107116349A (en) * | 2017-06-07 | 2017-09-01 | 马鞍山市恒利达机械刀片有限公司 | A kind of cutter production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20131015 |