CN202855785U - Heat dissipation sheet used on solar silicon wafer - Google Patents
Heat dissipation sheet used on solar silicon wafer Download PDFInfo
- Publication number
- CN202855785U CN202855785U CN 201220580324 CN201220580324U CN202855785U CN 202855785 U CN202855785 U CN 202855785U CN 201220580324 CN201220580324 CN 201220580324 CN 201220580324 U CN201220580324 U CN 201220580324U CN 202855785 U CN202855785 U CN 202855785U
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- CN
- China
- Prior art keywords
- heat dissipation
- base
- blades
- dissipation sheet
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a heat dissipation sheet used on a solar silicon wafer for improving the heat dissipation efficiency. The whole heat dissipation sheet is made from the aluminum alloy material through compression. The heat dissipation sheet comprises a base, a plurality of blades are arranged at the middle portion of the upper surface of the base, the blades are in a fan-shaped distribution in the vertical direction, and raised portions or grooves are distributed on the side surface and the upper surface of the base and the surfaces of the blades. Through the surfaces on which the tooth-shaped raised portions and grooves are arranged, the surface area of a heat dissipation device is increased, that is the heat dissipation surface which is contact with the air is increased, so the heat dissipation efficiency of the heat dissipation device is improved.
Description
Technical field
The utility model relates to a kind of for the fin on the solar energy silicon crystal chip.
Background technology
Fig. 1 is existing for the fin on the solar energy silicon crystal chip, and whole the compacting by aluminum alloy materials forms, and comprises base 1, and the upper surface middle part of base 1 is provided with some blades 2, and blade 2 in the vertical directions are fan-shaped distribution.Base 1 lower surface of heat abstractor is fitted by glue and solar energy silicon crystal chip surface, because aluminum alloy materials has good heat conductivity, so that the heat that solar energy silicon crystal chip produces at work can conduct by the lower surface of heat abstractor base 1 to whole heat abstractor, dispel the heat in the surface that then directly contacts by everywhere on the heat abstractor and air.Improve the radiating effect of existing heat abstractor, usually by increasing the quantity that protrudes out length or increase blade 2 of heat abstractor blade 2, the surface that heat abstractor is contacted with air increases to accelerate heat radiation.But these methods all need to increase the manufactured materials of heat abstractor, can increase the manufacturing cost of equipment when using in a large number.
The utility model content
The problem that the utility model solves is: provide a kind of radiating efficiency high be used for fin on the solar energy silicon crystal chip.
The technical solution of the utility model is: a kind of for the fin on the solar energy silicon crystal chip, the whole compacting by aluminum alloy materials forms, and comprises base, and the upper surface middle part of base is provided with some blades, and the blade in the vertical direction is fan-shaped distribution.The side of described base, upper surface and blade surface are covered with respectively projection or groove.
The beneficial effects of the utility model are: the heat-delivery surface at heat abstractor is covered with projection, has effectively increased the area of the heat radiation of heat abstractor, thereby improves radiating efficiency.
Description of drawings
Fig. 1 is existing for the fin on the solar energy silicon crystal chip;
Fig. 2 is that the utility model is used for the fin on the solar energy silicon crystal chip;
Fig. 3 is the enlarged drawing at A place among Fig. 2.
Among the figure: 1, base, 2, blade, 3, projection.
Embodiment
Below in conjunction with accompanying drawing, describe specific embodiments of the present utility model in detail.
Shown in Figure 2 be the utility model provide a kind of for the fin on the solar energy silicon crystal chip, the whole compacting by aluminum alloy materials forms, include base 1, base 1 upper surface middle part is provided with some blades 2, blade 2 in the vertical directions are fan-shaped distribution, and the surface of the side of base 1, upper surface and blade 2 is covered with respectively projection 3 or groove.
When heat abstractor uses, the lower surface of base 1 is fitted by glue and solar energy silicon crystal chip surface, because aluminum alloy materials has good heat conductivity, the heat that solar energy silicon crystal chip produces at work can send by the lower surface of base 1 whole heat abstractor to, dispels the heat in the surface that then directly contacts by everywhere on the heat abstractor and air.The heat-delivery surface that the utility model provides is covered with the heat abstractor of projection 3, the smooth heat abstractor without projection 3 of but heat-delivery surface identical with original geomery is compared, effectively increased the area of heat-delivery surface on the heat abstractor, the radiating efficiency of heat abstractor is improved.
Claims (1)
1. fin that is used on the solar energy silicon crystal chip, the whole compacting by aluminum alloy materials forms, comprise base, the upper surface middle part of base is provided with some blades, the blade in the vertical direction is fan-shaped distribution, it is characterized in that: the side of described base, upper surface and blade surface are covered with respectively projection or groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220580324 CN202855785U (en) | 2012-11-06 | 2012-11-06 | Heat dissipation sheet used on solar silicon wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220580324 CN202855785U (en) | 2012-11-06 | 2012-11-06 | Heat dissipation sheet used on solar silicon wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202855785U true CN202855785U (en) | 2013-04-03 |
Family
ID=47986952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220580324 Expired - Fee Related CN202855785U (en) | 2012-11-06 | 2012-11-06 | Heat dissipation sheet used on solar silicon wafer |
Country Status (1)
Country | Link |
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CN (1) | CN202855785U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102916069A (en) * | 2012-11-06 | 2013-02-06 | 江苏第一金合金有限公司 | Cooling fin used for solar silicon wafer |
-
2012
- 2012-11-06 CN CN 201220580324 patent/CN202855785U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102916069A (en) * | 2012-11-06 | 2013-02-06 | 江苏第一金合金有限公司 | Cooling fin used for solar silicon wafer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20151106 |
|
EXPY | Termination of patent right or utility model |