CN202828366U - Chip recognition module tray - Google Patents
Chip recognition module tray Download PDFInfo
- Publication number
- CN202828366U CN202828366U CN 201220460646 CN201220460646U CN202828366U CN 202828366 U CN202828366 U CN 202828366U CN 201220460646 CN201220460646 CN 201220460646 CN 201220460646 U CN201220460646 U CN 201220460646U CN 202828366 U CN202828366 U CN 202828366U
- Authority
- CN
- China
- Prior art keywords
- module
- chip
- module tray
- chip recognition
- recognition module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000003086 colorant Substances 0.000 abstract description 4
- 238000003860 storage Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model discloses a chip recognition module tray. The chip recognition module tray comprises a module tray body, where an installation seat used for color chips is arranged at the outer side of the module tray body. Compared with the prior art, the chip recognition module tray has the advantages that by means of the arrangement of the color chips in different colors, recognition is carried out more continently for operators on a semiconductor assembly line and on a procedure automatic system, the phenomenon of defective products caused by mixing up is effectively reduced, the operation convenience and the production efficiency are improved to the largest extent, module trays in different sizes, shapes and colors for distinguishing different module procedures and products on the assembly line of semiconductors and the accessories in the prior art are replaced, the module trays in the same color and the same shape are adopted, and therefore the batch production cost and the storage cost of client companies are effectively saved.
Description
Technical field
The utility model relates to a kind of module pallet, relates in particular to a kind of chip identification module pallet.
Background technology
The module pallet is for storage, mobile and the container of the electronic materials such as integrated circuit (IC), large-scale integration circuit (LSI), silicon chip, hard disk (HDD), LCD glass substrate, electronic components is installed, and mainly plays to prevent that above-mentioned electronic material from being polluted or damaged effect because of the dust that electrostatic force and friction bring.
Along with miniaturization and the low priceization of nearest digital product, original chip accessory is towards frivolous, short and small trend development.In addition, the module use amount of the half-blank form of assembling chip is also increasing sharply.Accordingly, when storage and transfer module, prevent from becoming gradually the focus that current people pay close attention to because external impact causes the generation of frictional static and the problem that the friction between module and packing container causes the damaged module of foreign matter.
Module storage and carrying are called as the module pallet with product, are divided into carrier band and the pallet of the IC chip of packing into.Because the module by the module pallet carrying is greenware condition, therefore after vacuum forming, keep former form, and most important from the problem of external impact force protection internal module.
Usually, the module pallet is made of lid and main body.Lid should be simple form, in order to simply identify internal module.Therefore, the module pallet adopts simple form, has electrostatic-proof function, and is transparent, and has the material of anti-stacked load-carrying function, usually adopts the transparent PET material of anti-static coating.
Main body usually adopts and can guarantee the thickness that each several part is certain after the module vacuum forming, with the alleviation external impact force, and can keep protomorphic material.In addition, when place in operation, need lamination to store and transport.
Usually the bar code by being attached to the theme side or directly confirm module information in the main body.In addition, when recycling module pallet, also need to remove the operation of the bar code that is attached to the main body side.
In the multistage operation in routine techniques, in order to distinguish every procedure, usually distinguish the module pallet of same form by different colours.Make the module pallet of multiple color, increased cost of production and operation, and be safe delivery, then need to guarantee stable tank farm stock, the problem that has directly caused inventory cost to rise.In addition, the problem that the inventory cost that also exists the user to cause because unnecessary stock increases in the routine techniques increases.
The utility model content
Goal of the invention: the purpose of this utility model is in order to solve the deficiencies in the prior art, a kind of every procedure that is easy to distinguish to be provided, reducing the chip identification module pallet of cost.
Technical scheme: in order to realize above purpose, a kind of chip identification module pallet described in the utility model, it comprises the module tray main body, is provided with in the outside of module tray main body for the mount pad that the color chip is installed.
As preferably, described mount pad is included in the block piece that breach that the module tray main body outside is provided with and tray main body lateral breach direction are extended, and the color chip is installed in the breach, realizes the location by block piece.
For the ease of identification, the height of described block piece is 1/2 of breach.
For convenient to remove, described breach is trapezoidal.
Beneficial effect: the chip identification module pallet that the utility model provides compared with prior art has the following advantages:
(1) by the color chip of different colours is set, make on the operating personnel and process automation system on the quartz conductor conveyor line, carry out more convenient identification, thereby effectively reduced the product bad phenomenon of bringing because obscuring, and improved to greatest extent operation convenience and production efficiency;
(2) replaced routine techniques on quartz conductor and accessory manufacturing line thereof, adopt the module pallet of different sizes, shape and color for distinguishing different module operations and product, can unify to adopt same CF, effectively save batch manufacturing expense and the inventory cost of client company;
(3) can paste QR code, smart code or RFID tag at the color chip, in order to preserve the making information in the routine techniques, and then enhance productivity, shorten the production cycle.
Description of drawings
Fig. 1 is birds-eye view of the present utility model;
Fig. 2 is the enlarged drawing of label 2 among Fig. 1;
Fig. 3 is the front view of mount pad 2.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, further illustrate the utility model.
A kind of chip identification module pallet as shown in Figure 1 to Figure 3, it comprises module tray main body 1, be provided with for the mount pad 2 that the color chip is installed in the outside of module tray main body 1, this mount pad 2 is included in the block piece 4 that breach 3 that module tray main body 1 outside is provided with and tray main body 1 lateral breach 3 directions are extended, the color chip is installed in the breach 3, realize the location by block piece 4, the height of this block piece 4 is 1/2 of breach 3, and described breach 3 is trapezoidal.
The utility model in use, the color chip is put into mount pad 2, thereby the operating personnel can be by color chip different module pallet of simple identification in semiconductor process, can distinguish different module operation and product, and then can produce the module pallet of solid color and form, replace producing the module pallet of different sizes, shape and color, reduced the expense of production and material requirements planning.Simultaneously, by the identifying color chip, prevent that the client from obscuring the phenomenon that drops in the operation.In addition, the client can paste QR code, smart code or RFID tag as required on the color chip, in order to preserve the making information in the routine techniques, and then enhances productivity, and shortens the production cycle.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, its objective is to allow to be familiar with these those skilled in the art and can to understand content of the present utility model and according to this enforcement, can not limit protection domain of the present utility model with this.All equivalents or modifications of having done according to the utility model Spirit Essence all should be encompassed within the protection domain of the present utility model.
Claims (4)
1. chip identification module pallet, it comprises module tray main body (1), it is characterized in that: be provided with in the outside of module tray main body (1) for the mount pad (2) that the color chip is installed.
2. chip identification module pallet according to claim 1, it is characterized in that: described mount pad (2) is included in the block piece (4) that breach (3) that module tray main body (1) outside is provided with and tray main body (1) lateral breach (3) direction are extended, the color chip is installed in the breach (3), realizes the location by block piece (4).
3. chip identification module pallet according to claim 2, it is characterized in that: the height of described block piece (4) is 1/2 of breach (3).
4. chip identification module pallet according to claim 2 is characterized in that: described breach (3) is for trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220460646 CN202828366U (en) | 2012-09-11 | 2012-09-11 | Chip recognition module tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220460646 CN202828366U (en) | 2012-09-11 | 2012-09-11 | Chip recognition module tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202828366U true CN202828366U (en) | 2013-03-27 |
Family
ID=47940130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220460646 Expired - Fee Related CN202828366U (en) | 2012-09-11 | 2012-09-11 | Chip recognition module tray |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202828366U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210114223A1 (en) * | 2019-10-21 | 2021-04-22 | Silicon Laboratories Inc. | Low-cost robotics and method therefor |
| US11529742B2 (en) | 2019-10-21 | 2022-12-20 | Silicon Laboratories Inc. | Control of low-cost robotics and method therefor |
-
2012
- 2012-09-11 CN CN 201220460646 patent/CN202828366U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210114223A1 (en) * | 2019-10-21 | 2021-04-22 | Silicon Laboratories Inc. | Low-cost robotics and method therefor |
| US11529742B2 (en) | 2019-10-21 | 2022-12-20 | Silicon Laboratories Inc. | Control of low-cost robotics and method therefor |
| US11878432B2 (en) * | 2019-10-21 | 2024-01-23 | Silicon Laboratories Inc. | Low-cost robotics for placement of integrated circuit and method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20160911 |