CN202795325U - Positioning fixture for adhering anisotropic conductive adhesive to flexible circuit board for capacitive screens - Google Patents
Positioning fixture for adhering anisotropic conductive adhesive to flexible circuit board for capacitive screens Download PDFInfo
- Publication number
- CN202795325U CN202795325U CN 201220477512 CN201220477512U CN202795325U CN 202795325 U CN202795325 U CN 202795325U CN 201220477512 CN201220477512 CN 201220477512 CN 201220477512 U CN201220477512 U CN 201220477512U CN 202795325 U CN202795325 U CN 202795325U
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- pressing plate
- adhering
- bonding
- positioning fixture
- anisotropic conductive
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Abstract
The utility model discloses a positioning fixture for adhering an anisotropic conductive adhesive to a flexible circuit board for capacitive screens, which comprises an adhering positioning fixture baseplate, the underside of the adhering positioning fixture baseplate is fixedly connected with an adhering machine baseplate through screws, two fixed seats are arranged above the adhering positioning fixture baseplate through screws, the symmetric inner sides of the two fixed seats are provided with shaft holes, a pressing plate is provided with a handle, one end of the pressing plate is provided with a shaft hole and connected with the shaft holes of the fixed seats through a connecting shaft, a magnet and a positioning pin are embedded in a position above the adhering positioning fixture baseplate and corresponding to the other end of the pressing plate, the tip of the other end of the pressing plate is provided with a gap, and the gap is correspondingly matched with the positioning pin. The positioning fixture disclosed by the utility model is convenient to operate, accurate in positioning and high in adhering precision, and can effectively guarantee the quality of touch screens.
Description
Technical field
The utility model relates to capacitance plate, particularly the localization tool of the bonding anisotropic conductive of a kind of capacitance plate FPC.
Background technology
FPC is very important parts in the capacitive touch screen, realizes being connected with capacitive touch screen electric conductivity by bonding anisotropic conductive.Present technological process is: FPC is placed on the profile localization tool (being installed in different side's conducting resinl bonder) that correspondence is installed, and adopts vacuum suction, realize the location.This FPC+anisotropic conductive is bonding → technological process of capacitance touch screen binding, when FPC and anisotropic conductive are bonding, often by FPC profile location, this mode efficient is low, and because the deviation of its profile and softer material characteristics, can cause locating unstable and affect bonding low precision, finally affect the quality of touch-screen.
The utility model content
Technical problem to be solved in the utility model is, adopt the principle of pilot pin trepanning, at two pilot holes that diameter is suitable of FPC design, and when making, finishes FPC the processing of pilot hole, according to the pilot hole specification on the soft circuit, design the pilot pin localization tool (being installed on the anisotropic conductive bonder) of a supporting pilot hole.
The utility model solves the problems of the technologies described above by the following technical programs, the bonding localization tool of capacitance plate FPC anisotropic conductive, it is characterized in that, comprise: a bonding localization tool substrate below is fixedly connected with the bonder substrate by screw, bonding localization tool substrate top is equipped with two holders by screw, the symmetrical inboard of two holders is provided with axis hole, pressing plate is equipped with handle, one end of pressing plate is provided with axis hole and is connected with the holder axis hole by coupling spindle, corresponding position embedded magnet and the pilot pin of bonding localization tool substrate top and the pressing plate other end, the termination of the other end of pressing plate is provided with breach, and its breach is corresponding with pilot pin to match.
The utility model has the advantage of that the bonding localization tool of capacitance plate FPC is easy to operate, accurate positioning, bonding precision is high, effectively guarantees the quality of touch-screen.
Description of drawings
Fig. 1 is the bonding localization tool vertical view of the utility model anisotropic conductive.
Fig. 2 is that the A of Fig. 1 is to partial cutaway schematic.
Fig. 3 be among Fig. 2 B-B to structural representation.
Fig. 4 is the local enlarged diagram at C place among Fig. 3.
Among the figure: 1, bonding localization tool substrate, 2, holder, 3, magnet, 4, handle, 5, pilot pin, 6, screw, 7, pressing plate, 8, coupling spindle, 9, the bonder substrate.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples, referring to Fig. 1 to Fig. 4, the bonding localization tool of capacitance plate FPC anisotropic conductive, comprise: a bonding localization tool substrate 1 below is fixedly connected with bonder substrate 9 by screw 6, bonding localization tool substrate 1 top is equipped with two holders 2 by screw 6, two holders, 2 symmetrical inboards are provided with axis hole, pressing plate 7 is equipped with handle 4, one end of pressing plate 7 is provided with axis hole and is connected with holder 2 axis holes by coupling spindle 8, the corresponding position embedded magnet 3 of bonding localization tool substrate 1 top and pressing plate 7 other ends and pilot pin 5, the termination of the other end of pressing plate 7 is provided with breach, its breach and 5 corresponding matching of pilot pin.
Embodiment:A preferred embodiments of the present utility model is with bonding localization tool substrate 1 and anisotropic conductive bonder substrate 9, by connecting screw 6 bonding localization tool substrate 1 to be fixed on the anisotropic conductive bonder.Steel pressing plate 7 and steel pressing plate holder 2 are fixed on the localization tool substrate 9 by screw 8; Coupling spindle 8 will connect steel pressing plate 7 and be connected on the holder 2, and manual driven steel pressing plate handle 4 can make 7 upsets of steel pressing plate; Magnet 3 is embedded on the bonding localization tool substrate 1, and pilot pin 5 close-fittings are installed on the bonding localization tool substrate 1, and matches with breach that a termination of pressing plate 7 is provided with.
During use, bonding localization tool substrate 1 is fixed on the anisotropic conductive bonder substrate 9 by connecting screw 6, and bonding localization tool substrate 1 is adjusted.Hand-held steel pressing plate handle 4 is dug pressing plate 7, FPC is enclosed within on the pilot pin 5 of bonding localization tool substrate 1, steel pressing plate handle 4 is closed, the magnet 3 that this moment, steel pressing plate 7 was embedded on the bonding localization tool substrate 1 holds so that FPC is held down, restart the anisotropic conductive bonder, bonding finishing, manually just steel pressing plate handle 4 is mentioned to steel pressing plate 7 and is opened, FPC with bonding good anisotropic conductive takes out again, finishes the bonding operation of capacitance plate FPC anisotropic conductive.
Claims (1)
1. the localization tool of the bonding anisotropic conductive of capacitance plate FPC, it is characterized in that, comprise: a bonding localization tool substrate below is fixedly connected with the bonder substrate by screw, bonding localization tool substrate top is equipped with two holders by screw, the symmetrical inboard of two holders is provided with axis hole, pressing plate is equipped with handle, one end of pressing plate is provided with axis hole and is connected with the holder axis hole by coupling spindle, corresponding position embedded magnet and the pilot pin of bonding localization tool substrate top and the pressing plate other end, the termination of the other end of pressing plate is provided with breach, and its breach is corresponding with pilot pin to match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220477512 CN202795325U (en) | 2012-09-19 | 2012-09-19 | Positioning fixture for adhering anisotropic conductive adhesive to flexible circuit board for capacitive screens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220477512 CN202795325U (en) | 2012-09-19 | 2012-09-19 | Positioning fixture for adhering anisotropic conductive adhesive to flexible circuit board for capacitive screens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202795325U true CN202795325U (en) | 2013-03-13 |
Family
ID=47822544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220477512 Expired - Fee Related CN202795325U (en) | 2012-09-19 | 2012-09-19 | Positioning fixture for adhering anisotropic conductive adhesive to flexible circuit board for capacitive screens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202795325U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830886A (en) * | 2012-09-19 | 2012-12-19 | 江西联创电子有限公司 | Positioning jig for anisotropic conductive adhesive for adhering flexible circuit board of capacitance screen |
| CN112743470A (en) * | 2021-01-08 | 2021-05-04 | 广东风华高新科技股份有限公司 | Positioning clamp and positioning method of chip capacitor |
-
2012
- 2012-09-19 CN CN 201220477512 patent/CN202795325U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830886A (en) * | 2012-09-19 | 2012-12-19 | 江西联创电子有限公司 | Positioning jig for anisotropic conductive adhesive for adhering flexible circuit board of capacitance screen |
| CN112743470A (en) * | 2021-01-08 | 2021-05-04 | 广东风华高新科技股份有限公司 | Positioning clamp and positioning method of chip capacitor |
| CN112743470B (en) * | 2021-01-08 | 2024-03-19 | 广东风华高新科技股份有限公司 | Positioning clamp and positioning method for chip capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330096 Nanchang high tech Development Zone, Jingdong Road, No. 1699, No. Patentee after: JIANGXI LIANCHUANG ELECTRONICS CO.,LTD. Address before: 330096 Nanchang high tech Development Zone, Jingdong Road, No. 1699, No. Patentee before: JIANGXI LIANCHUANG ELECTRONIC Co.,Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330096 Nanchang high tech Development Zone, Jingdong Road, No. 1699, No. Patentee after: JIANGXI LIANCHUANG ELECTRONIC Co.,Ltd. Address before: 330096 Nanchang high tech Development Zone, Jingdong Road, No. 1699, No. Patentee before: JIANGXI LIANCHUANG ELECTRONICS CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20210919 |