CN202793872U - Preparation template device for wafer sample of fixed point cutting machine - Google Patents
Preparation template device for wafer sample of fixed point cutting machine Download PDFInfo
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- CN202793872U CN202793872U CN 201220404877 CN201220404877U CN202793872U CN 202793872 U CN202793872 U CN 202793872U CN 201220404877 CN201220404877 CN 201220404877 CN 201220404877 U CN201220404877 U CN 201220404877U CN 202793872 U CN202793872 U CN 202793872U
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Abstract
The utility model discloses a preparation template device for a wafer sample of a fixed point cutting machine. The preparation template device comprises a calibrating part, a positioning part, marks and a sample hole, wherein the calibrating part is provided with at least one straight line; the positioning part is strip-shaped and connected with the calibrating part; the marks comprise a first mark, a second mark, a third mark and a fourth mark; the first mark and the second mark are used for positioning a first direction; the third mark and the fourth mark are used for positioning a second direction; the first mark, the second mark, the third mark and the fourth mark are positioned at the positioning part; and the sample hole is used for determining the position of a target. The preparation template device for the wafer sample of the fixed point cutting machine, provided by the utility model, can prepare the proper wafer sample for the fixed point cutting machine; and by the wafer sample, the fixed point cutting machine can precisely cut the target in a wafer with angle lattice along the lattice direction, so that the preparation speed and the preparation efficiency of a cross-sectional sample are improved.
Description
Technical field
The utility model relates to the failure analysis of wafer, and the wafer sample that particularly relates to a kind of cutting machine of fixing a point prepares plate device.
Background technology
In the physical arrangement of wafer scale failure analysis (Wafer Level FA), cross-section analysis (Cross Section) is a kind of commonly used and Physical Analysis Methods effectively.The failure analysis instrument that uses mainly contains cross section machining tool and cross-section equipment, wherein, the cross section machining tool comprises fixed point cutting machine (SELA) and focused ion beam analyser (FIB) etc., and cross-section equipment comprises optical microscope (OM) and surface sweeping electron microscope (SEM) etc.When cross-section analysis, generally first wafer sample is put into the cross section machining tool, utilize the cross section machining tool to prepare cross-sectional sample, again the cross section of cross-sectional sample is put under the cross-section equipment and observes, analyze.
Along with the development of semicon industry, the wafer of 45 ° of lattices (Wafer) has obtained using more and more widely.Present wafer for 45 ° of lattices, for the sample of some analytical structures (Pattern) size greater than the large scale structure of 10 μ m, such as pad (Pad), or the wafer sample of some repetitive structures, it is little that cross-sectional sample prepares the difficulty preparation, can make by hand the method for sliver directly carry out the cross-sectional sample preparation, but the limitation of the method is exactly can only be for large Pattern or repetitive structure, and the sample preparation success ratio is also lower; And for the sample of some analytical structure sizes less than the small scale structures of 10 μ m, surpassed the limit of manual sliver precision, so must be by means of certain cross section machining tool, such as fixed point cutting machine or focused ion beam analyser.Wherein, the machining precision of focused ion beam analyser is high, can cut through row 45 ° direction, so adopt the focused ion beam analyser to prepare for little Pattern, success ratio is high, but the cross section is longer process time, cost is also higher, inefficent, thus need to utilize the fixed point cutting machine, to improve the efficient of cross section processing.
Before using the fixed point cutting machine to carry out cross section processing, need first whole wafer to be prepared into wafer sample, wherein, the size of wafer sample is about 10mm * 20mm, have target (Target) point in the wafer sample, target is the place that needs to carry out cross-section analysis in the wafer.Use the fixed point cutting machine to carry out the cross section and add man-hour, the wafer sample for preparing is before put into the fixed point cutting machine, the fixed point cutting machine aims at the mark and some wafer sample is cut, and is prepared into cross-sectional sample.But because the cut direction of fixed point cutting machine is restricted, can't accurately the target among 45 ° of lattice wafer be cut along lattice direction.So want to use the fixed point cutting machine to prepare cross-sectional sample, just need to be prepared along the wafer sample of lattice direction to the fixed point cutting machine.
Therefore, how to be prepared along the wafer sample of lattice direction to the fixed point cutting machine, thereby to improve speed and the success ratio that the fixed point cutting machine prepares cross-sectional sample, become the problem that those skilled in the art need to solve.
The utility model content
The purpose of this utility model is, provide a kind of wafer sample of the cutting machine of fixing a point to prepare plate device, to solve the existing problem that suitable wafer sample can't be provided as the fixed point cutting machine, the fixed point cutting machine can be accurately cut the target that has in the wafer of angle lattice along lattice direction, thereby improve preparation speed and the efficient of cross-sectional sample.
For solving the problems of the technologies described above, the utility model provides a kind of wafer sample of the cutting machine of fixing a point to prepare plate device, comprising:
Calibrator unit has at least one straight line;
Positioning element, described positioning element are bar shaped, and width is more than or equal to 10mm, and length is more than or equal to 20mm, and described positioning element is connected with described calibrator unit, has angle between at least one straight line of described positioning element and described calibrator unit;
Mark, described mark comprises for the first mark of first direction location, the second mark and is used for the 3rd mark and the 4th mark that second direction is located, described the first mark, the second mark, the 3rd mark and the 4th mark all are positioned on the described positioning element, the distance of the first direction of described the first mark and the second mark is 18mm～22mm, the distance of the second direction of described the 3rd mark and the 4th mark is 8mm～12mm, described first direction is the length direction of described positioning element, and described second direction is the Width of described positioning element; And
Sample well be used for to be determined the target location, and described sample well is positioned on the described positioning element, and the first direction position at described sample well center is positioned at 1/2nd places of distance of the first direction of described the first mark and the second mark.
Further, described calibrator unit comprises at least one bar shaped main body, and described straight line is one side of described bar shaped main body.
Further, described bar shaped main body is fixedly connected with positioning element.
Further, the angle between the bar shaped length of side of described positioning element and described bar shaped main body is 30 °～60 °.
Further, the width of described bar shaped main body is 5mm～20mm, and length is 20mm～400mm.
Further, described calibrator unit comprises that also be used to the parts of measuring the angle between described positioning element and the described bar shaped main body, described parts link to each other with described bar shaped main body.
Further, described bar shaped main body is rotatably connected with positioning element.
Further, the angle of described positioning element and described bar shaped main body be 0 °～90 ° adjustable.
Further, the diameter of described sample well is less than or equal to 3mm.
Further, the length of described positioning element is 20mm～400mm.
Further, the second direction position at described sample well center is positioned at 1/2nd places of distance of the second direction of described the 3rd mark and the 4th mark.
Further, the distance of the second direction of the second direction position of described sample well and described the 3rd mark or the 4th mark is zero.
Compared with prior art, the wafer sample of the fixed point cutting machine that the utility model provides prepares plate device, has angle between at least one straight line of described positioning element and described calibrator unit, compared with prior art, described positioning element can be determined the lattice direction of wafer, and can prepare the wafer sample that lattice direction parallels with long limit by this preparation plate device, carry out the cross section and add man-hour when wafer sample being put into the fixed point cutting machine, the fixed point cutting machine can be accurately cuts the target that has in the wafer of lattice along lattice direction, thereby improves preparation speed and the efficient of cross-sectional sample.
Description of drawings
Fig. 1 a-Fig. 1 d is the synoptic diagram that the wafer sample of the fixed point cutting machine of the utility model one embodiment prepares plate device;
Fig. 2 is the synoptic diagram that the wafer sample of the fixed point cutting machine of another embodiment of the utility model prepares plate device.
Embodiment
Below in conjunction with synoptic diagram the wafer sample of fixed point cutting machine of the present utility model being prepared plate device is described in more detail, wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
In the following passage, with way of example the present invention is described more specifically with reference to accompanying drawing.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-accurately ratio, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Core concept of the present utility model is, provide a kind of wafer sample of the cutting machine of fixing a point to prepare plate device, the wafer sample of this fixed point cutting machine prepares plate device and comprises calibrator unit, positioning element, mark and sample well, described sample well can be determined the position of target, has angle between at least one straight line of described positioning element and described calibrator unit, make described positioning element can determine the lattice direction of wafer, again by the first mark, the second mark, the 3rd mark and the 4th mark carry out mark to wafer, thereby determine wafer sample, in the wafer sample of determining, lattice direction parallels with the long limit of wafer sample.So carry out the cross section and add man-hour when wafer sample being put into the fixed point cutting machine, the fixed point cutting machine can be accurately cuts the target that has in the wafer of angle lattice along lattice direction, thereby improves preparation speed and the efficient of cross-sectional sample.
The wafer sample of below enumerating described fixed point cutting machine prepares several embodiment of plate device, to clearly demonstrate content of the present invention, will be clear that, content of the present utility model is not restricted to following examples, and the improvement of other routine techniques means by those of ordinary skills is also within thought range of the present utility model.
[the first embodiment]
Among this first embodiment, calibrator unit is a bar shaped main body, and described bar shaped main body is fixedly connected with positioning element.Below please refer to Fig. 1 a-Fig. 1 d, Fig. 1 a-Fig. 1 d is the synoptic diagram that the wafer sample of the fixed point cutting machine of the utility model one embodiment prepares plate device.
The wafer sample of fixed point cutting machine prepares plate device and comprises calibrator unit, and calibrator unit has at least one straight line, is used for calibrating mutually with the horizontal line of the analytical structure (Pattern) of wafer, and can be used as the benchmark of positioning element 102 orientation angles.Better, in the present embodiment, calibrator unit is a bar shaped main body 101, described straight line is one side of bar shaped main body 101.As shown in Figure 1a, bar part 101 has long straight line, can calibrate easily.In addition, calibrator unit is not limited to this structure, be triangular structure, have semi-circular structure or the irregular structure of a straight flange such as calibrator unit, even calibrator unit can also be a steel wire, as long as the structure of calibrator unit has at least one straight line, also within thought range of the present invention.Better, the width of bar shaped main body 101 is 5mm～20mm, conveniently to carry out horizontal calibration, reaches the location of wafer sample.Better, width is 8mm, 10mm, 15mm, 18mm.The length of bar shaped main body 101 is unsuitable too short, and too weak point is inconvenient to calibrate, and that length is better is 20mm～400mm, such as 30mm, 50mm, 100mm, 150mm, 200mm, 300mm, 350mm.
Positioning element 102, positioning element 102 is bar shaped, positioning element 102 is connected with calibrator unit, because calibrator unit is a bar shaped main body 101 in the present embodiment, so positioning element 102 bar shaped main bodys 101 are connected.In the present embodiment, bar shaped main body 101 is fixedly connected with positioning element 102, can be fixed in the contact place by glue, or bar shaped main body 101 is connected with positioning element 102 and fixes by nail, and restriction is not done in concrete fixed position.In the present embodiment, positioning element 102 is 30 °～60 ° with the angle α on the long limit of bar shaped main body 101, to be used for the wafer of 30 °～60 ° of lattices.When being used for the wafer of 45 ° of lattices, what angle α was better is 43 °～47 °, such as 45 °, but the angle of concrete angle α is consistent with the lattice angle of wafer, be used for determining the direction of lattice angle, but because manufacturing tolerance allows the lattice angle of angle α and wafer to have ± 2 ° error.The width of positioning element 102 is more than or equal to 10mm, and to guarantee to make the width of location wafer sample out, the width of better positioning element 102 is 10mm, 12mm, 15mm, 18mm, 20mm.The length of positioning element 102 needs greater than 20mm, and better to guarantee to make the length of location wafer sample out, the length of positioning element 102 is 20mm～400mm, such as 20mm, 30mm, 50mm, 100mm, 150mm, 200mm, 300mm, 350mm.
Mark is used for determining size and the position on wafer of wafer sample, comprise the first mark 111 for the first direction location, the second mark 112 and the 3rd mark 113 of locating for second direction, the 4th mark 114, the first mark 111, the second mark 112, the 3rd mark 113 and the 4th mark 114 all are positioned on the positioning element 102, the distance L 1 of the first direction of the first mark 111 and the second mark 112 is 20mm, can have ± error of 2mm exists, to be complementary with the fixed point cutting machine, the distance L 2 of the second direction of the 3rd mark 113 and the 4th mark 114 is 10mm, can have ± error of 2mm exists, to be complementary with the fixed point cutting machine.The particular location of the first mark 111, the second mark 112, the 3rd mark 113 and the 4th mark 114 is unfixing, can be the position distribution shown in Fig. 1 a-Fig. 1 d, but be not limited to this several position distribution, as long as can determine a rectangle that is about 10mm * 20mm by mark, namely within thought range of the present invention.In Fig. 1 a, the first mark 111, the second mark 112 are in the same side of positioning element 102, and the 3rd mark 113 and the 4th mark 114 are positioned at the end of positioning element 102 bar shapeds; In Fig. 1 b, the first mark 111, the second mark 112 are in the both sides of positioning element 102, and the 3rd mark 113 and the 4th mark 114 are positioned at the middle part of positioning element 102 bar shapeds; In Fig. 1 c, the first mark 111 and the 4th mark 114 coincide, but can determine equally the size of wafer sample and the position on wafer by the first mark 111, the second mark 112, the 3rd mark 113 these three marks.The position of the first mark 111, the second mark 112, the 3rd mark 113 and the 4th mark 114 is not positioned at the lap of bar part 101 and positioning element 102, to realize carrying out wafer the function of mark.
In the present embodiment, the first direction position at sample well 104 centers can be positioned at the junction of positioning element 102 and calibrator unit, shown in Fig. 1 a-Fig. 1 b, also can be positioned at portion other than connected portion of positioning element 102 and calibrator unit, shown in Fig. 1 c-Fig. 1 d.But when the first direction position at sample well 104 centers can be positioned at the junction of positioning element 102 and calibrator unit, find the position of target (Target) for convenient at wafer, the correspondence position in calibrator unit loading product hole 104 can need to be opened a hole large equally with sample well 104.
Be not limited to four kinds of structures of Fig. 1 a-Fig. 1 d in the present embodiment, when being positioned at 1/2nd place of distance of second direction of the 3rd mark 113 and the 4th mark 114 such as the second direction position when sample well 104 centers, the width of positioning element 102 also can be greater than 10mm.
The wafer sample of the fixed point cutting machine in the present embodiment prepares plate device when using, at first, select the pattern of fixed point cutting machine, i.e. overall process (Full Process) pattern or single cutting (Single Cleave) pattern according to the analytical structure (Pattern) of wafer; Then, the preparation plate device of the concrete sample well of model selection 104 positions according to the fixed point cutting machine, be 1/2nd places of the distance of the second direction position at the sample well 104 centers second direction that is positioned at the 3rd mark 103 and the 4th mark 104, or the distance of the second direction of the second direction position at sample well 104 centers and described the 3rd mark 113 or the 4th mark 114 is zero; Then, to prepare plate device is put on the wafer, and will prepare plate device and wafer is placed under the optical microscope (OM), by optical microscope (OM) target on the wafer (Target) is moved in the sample well 104 and (to make target in sample well 104 central authorities as far as possible), so that can see target (Target) by sample well 104; The horizontal line of analytical structure (Pattern) parallels on the rotation preparation plate device, the straight line that makes calibrator unit and wafer; Make marks at wafer with marking pen according to the mark on the preparation plate device; Wafer from taking off, can be determined a rectangle according to mark and (is about 10mm * 20mm), cut out this rectangle, forms wafer sample; Wafer sample is put into the fixed point cutting machine carry out cross section processing, prepare cross-sectional sample, the cross section of cross-sectional sample is put under the surface sweeping electron microscope (SEM) carries out cross-section, analysis again.
[the second embodiment]
Below please refer to Fig. 2, Fig. 2 is the synoptic diagram that the wafer sample of the fixed point cutting machine of another embodiment of the utility model prepares plate device, and in the drawings, identical reference number represents to be equal to the label among Fig. 1 a-Fig. 1 d.The second embodiment is on the basis of the first embodiment, difference is, calibrator unit also comprises the measurement component 121 for the angle α between measurement and positioning parts 102 and the bar shaped main body 101, bar shaped main body 101 is rotatably connected with positioning element 102, with the convenient angle α that regulates between positioning element 102 and the bar shaped main body 101, angle α be 0 °～90 ° adjustable.When being 45 ° such as the lattice angle when wafer, angle α can be adjusted to 45 °, to be consistent with the lattice angle.In preferred embodiment, measurement component 121 is positioned at an end of bar shaped main body 101, the angled scale of measurement component 121 tools, and the length of positioning element 102 is not shorter than the length of bar shaped main body 101, conveniently to read the number of degrees of angle α.But present embodiment is not limited to structure shown in Figure 2, can also be positioned at such as measurement component 121 near the junction of bar shaped main body 101 and positioning element 102, when the length of positioning element 102 there is not bar shaped main body 101 length, also can read easily angle α.
In this second embodiment, calibrator unit also comprises the measurement component 121 for the angle α between measurement and positioning parts 102 and the bar shaped main body 101, bar shaped main body 101 is rotatably connected with positioning element 102, can regulate angle α according to different lattice direction, can reach the beneficial effect of flexible positioning element 102 directions.
In sum, the wafer sample of fixed point cutting machine described in the utility model prepares plate device, provide a kind of wafer sample of the cutting machine of fixing a point to prepare plate device, the wafer sample of this fixed point cutting machine prepares plate device and comprises calibrator unit, positioning element, mark and sample well, described sample well can be determined the position of target, has angle between at least one straight line of described positioning element and described calibrator unit, make described positioning element can determine the lattice direction of wafer, again by the first mark, the second mark, the 3rd mark and the 4th mark carry out mark to wafer, thereby determine wafer sample, in the wafer sample of determining, lattice direction parallels with the long limit of wafer sample.So carry out the cross section and add man-hour when wafer sample being put into the fixed point cutting machine, the fixed point cutting machine can be accurately cuts the target that has in the wafer of angle lattice along lattice direction, thereby improves preparation speed and the efficient of cross-sectional sample.Compared with prior art, the wafer sample of the fixed point cutting machine that the utility model provides prepares plate device, has angle between at least one straight line of described positioning element and described calibrator unit, compared with prior art, described positioning element can be determined the lattice direction of wafer, and can prepare the wafer sample that lattice direction parallels with long limit by this preparation plate device, carry out the cross section and add man-hour when wafer sample being put into the fixed point cutting machine, the fixed point cutting machine can be accurately cuts the target that has in the wafer of angle lattice along lattice direction, thereby improves preparation speed and the efficient of cross-sectional sample.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (12)
1. the wafer sample of the cutting machine of fixing a point prepares plate device, it is characterized in that, comprising:
Calibrator unit has at least one straight line;
Positioning element, described positioning element are bar shaped, and width is more than or equal to 10mm, and length is more than or equal to 20mm, and described positioning element is connected with described calibrator unit, has angle between at least one straight line of described positioning element and described calibrator unit;
Mark, described mark comprises for the first mark of first direction location, the second mark and is used for the 3rd mark and the 4th mark that second direction is located, described the first mark, the second mark, the 3rd mark and the 4th mark all are positioned on the described positioning element, the distance of the first direction of described the first mark and the second mark is 18mm～22mm, the distance of the second direction of described the 3rd mark and the 4th mark is 8mm～12mm, described first direction is the length direction of described positioning element, and described second direction is the Width of described positioning element; And
Sample well be used for to be determined the target location, and described sample well is positioned on the described positioning element, and the first direction position at described sample well center is positioned at 1/2nd places of distance of the first direction of described the first mark and the second mark.
2. the wafer sample of fixed point cutting machine as claimed in claim 1 prepares plate device, it is characterized in that, described calibrator unit comprises at least one bar shaped main body, and described straight line is one side of described bar shaped main body.
3. the wafer sample of fixed point cutting machine as claimed in claim 2 prepares plate device, it is characterized in that, described bar shaped main body is fixedly connected with positioning element.
4. the wafer sample of fixed point cutting machine as claimed in claim 3 prepares plate device, it is characterized in that, the angle between the bar shaped length of side of described positioning element and described bar shaped main body is 30 °～60 °.
5. the wafer sample of fixed point cutting machine as claimed in claim 3 prepares plate device, it is characterized in that, the width of described bar shaped main body is 5mm～20mm, and length is 20mm～400mm.
6. the wafer sample of fixed point cutting machine as claimed in claim 2 prepares plate device, it is characterized in that, described calibrator unit comprises that also be used to the measurement component of measuring the angle between described positioning element and the described bar shaped main body, described measurement component links to each other with described bar shaped main body.
7. the wafer sample of fixed point cutting machine as claimed in claim 6 prepares plate device, it is characterized in that, described bar shaped main body is rotatably connected with positioning element.
8. the wafer sample of fixed point cutting machine as claimed in claim 6 prepares plate device, it is characterized in that, the angle of described positioning element and described bar shaped main body be 0 °～90 ° adjustable.
9. the wafer sample such as the described fixed point cutting machine of any one among the claim 1-8 prepares plate device, it is characterized in that the diameter of described sample well is less than or equal to 3mm.
10. the wafer sample such as the described fixed point cutting machine of any one among the claim 1-8 prepares plate device, it is characterized in that, the length of described positioning element is 20mm～400mm.
11. the wafer sample such as the described fixed point cutting machine of any one among the claim 1-8 prepares plate device, it is characterized in that the second direction position at described sample well center is positioned at 1/2nd places of distance of the second direction of described the 3rd mark and the 4th mark.
12. the wafer sample such as the described fixed point cutting machine of any one among the claim 1-8 prepares plate device, it is characterized in that, the distance of the second direction of the second direction position of described sample well and described the 3rd mark or the 4th mark is zero.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220404877 CN202793872U (en) | 2012-08-15 | 2012-08-15 | Preparation template device for wafer sample of fixed point cutting machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220404877 CN202793872U (en) | 2012-08-15 | 2012-08-15 | Preparation template device for wafer sample of fixed point cutting machine |
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| CN202793872U true CN202793872U (en) | 2013-03-13 |
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| CN 201220404877 Expired - Fee Related CN202793872U (en) | 2012-08-15 | 2012-08-15 | Preparation template device for wafer sample of fixed point cutting machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104865107A (en) * | 2014-02-20 | 2015-08-26 | 中芯国际集成电路制造(上海)有限公司 | Plane TEM sample preparation method |
-
2012
- 2012-08-15 CN CN 201220404877 patent/CN202793872U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104865107A (en) * | 2014-02-20 | 2015-08-26 | 中芯国际集成电路制造(上海)有限公司 | Plane TEM sample preparation method |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130424 |
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Effective date of registration: 20130424 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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