CN202759152U - Laser lens protection device and semiconductor laser - Google Patents
Laser lens protection device and semiconductor laser Download PDFInfo
- Publication number
- CN202759152U CN202759152U CN 201220398451 CN201220398451U CN202759152U CN 202759152 U CN202759152 U CN 202759152U CN 201220398451 CN201220398451 CN 201220398451 CN 201220398451 U CN201220398451 U CN 201220398451U CN 202759152 U CN202759152 U CN 202759152U
- Authority
- CN
- China
- Prior art keywords
- cavity
- laser
- hole
- gas
- protecting apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a laser lens protection device and a semiconductor laser. The laser lens protection device comprises a protection device main body, wherein the protection device main body is provided with a connecting cover used for connecting a laser head, a first cavity is formed in the connecting cover, and a second cavity communicating with the first cavity is formed in the protection device main body; a piece of second-level protection glass is arranged between the first cavity and the second cavity, a connecting-cover through hole is formed on one end of the first cavity opposite to the second-level protection glass, and a protective pyramidal through hole is formed on one end of the second cavity opposite to the second-level protection glass; and at least two jaws are formed on the connecting cover, a gap is formed between the two adjacent jaws, and the laser head can be clamped in the gap. The laser lens protection device provided by the utility model can be clamped on the laser head through the connecting cover, thereby facilitating the installation of the laser lens protection device and the laser head.
Description
Technical field
The utility model relates to a kind of laser lens protecting apparatus and semiconductor laser, belongs to the laser equipment field.
Background technology
Laser is a kind of device of energy Emission Lasers.Make the First maser in 1954, and obtained highly relevant microbeam.A.L. Xiao Luo in 1958 and this laser-microwave quantum amplifier principle of C.H. soup promote the use of the optical frequency scope, and have pointed out lasing method.The people such as nineteen sixty T.H. Mei Man have made first ruby laser.The people such as A. Jia Wen had made helium neon laser in 1961.The people such as R.N. Hall had formulated the gallium arsenide semiconductor laser in 1962.
The kind of laser is a lot of at present.Difference according to the operation material states of matter can be divided into all lasers following several classes: the first kind, solid-state laser (crystal and glass) laser; Equations of The Second Kind, gas laser, gas laser further can atomize gas laser, ion gas laser, molecular gas laser, quasi-molecule gas laser etc.; The 3rd class, liquid laser, the operation material that this class laser adopts mainly comprises two large classes, and a class is organic fluorescent dye solution, and another kind of is the inorganic compound solution that contains rare earth ion; The 4th class, semiconductor laser; The 5th class, free electron laser.
Wherein the semiconductor laser of the 4th class is that because the difference on the structure of matter, lasing detailed process is more special with the class laser of semi-conducting material as operation material.Common used material has GaAs (GaAs), cadmium sulfide (CdS), indium phosphide (InP), zinc sulphide (ZnS) etc.Energisation mode has electric injection, electron beam excitation and three kinds of forms of optical pumping.Semiconductor laser device, it is several to be divided into homojunction, single heterojunction, double heterojunction etc.
In the laser melting coating course of processing, semiconductor laser utilizes laser bodies 11 to produce laser, and passes through laser head 12 with Laser output, and then laser action is in workpiece 2.For avoiding the damage of laser head 12, be provided with one-level protection glass 9 at laser head 12.But because the semiconductor laser operating distance is shorter, one-level protection glass 9 is easily by pollutions such as dusts, in addition in the laser melting coating course of processing, and 3 scaling loss of the alloy splash that also may be melted.For this reason, can protector be set with protection one-level protection glass 9 at laser head 12.In this case, just need a kind of protector in order to can be installed on the laser head easily.
The utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of laser lens protecting apparatus that can be connected with the laser head convenience, and the semiconductor laser with this laser lens protecting apparatus.
Particularly, technical scheme provided by the utility model is as follows:
Technical scheme 1.
A kind of laser lens protecting apparatus, it is characterized in that, comprise the protective device main body, described protective device main body is provided with for the connection cover that connects laser head, is formed with in the described connection cover in the first cavity, the described protective device main body and is formed with the second cavity that is communicated with described the first cavity;
Between described the first cavity and described the second cavity, be provided with the secondary protection glass, the end that described the first cavity is relative with described secondary protection glass is formed with and connects the cover through hole, and the end that described the second cavity is relative with described secondary protection glass is formed with protection cone through hole;
Be formed with at least two claws on the described connection cover, have the slit between two adjacent claws, described slit can be stuck on the laser head.
Technical scheme 2.
According to technical scheme 1 described semiconductor laser, it changes part and is that described the second inside cavity is provided with ring-shaped platform, and described secondary protection glass is overlapped on the described ring-shaped platform;
Described the first inside cavity is provided with annular flange flange, and after described connection cover and described protective device main body linked together, described annular flange flange was pressed on the described secondary protection glass.
According to technical scheme 2 described semiconductor lasers; it changes part and is; be formed with on the inwall of described the first cavity on the outer wall of internal thread, described the second cavity and be formed with external screw thread, described connection cover and described protective device main body are threaded connection together.
According to technical scheme 1 ~ 3 each described semiconductor laser; it changes part and is; be provided with the first gas access and the first gas vent in described the first cavity; be provided with the second gas access and the second gas vent in described the second cavity; and described the first gas vent is communicated with described the second gas access, and described the second gas vent is described protection cone through hole.
According to technical scheme 4 described semiconductor lasers, it changes part and is that described the second cavity is cone-shaped cavity.
According to technical scheme 5 described semiconductor lasers; it changes part and is; near described protection cone through hole, has gas purging device; the lower zone of the described protection cone of gas flow purging through hole that comes from the gas vent of described gas purging device, the direction of advance of the air-flow of the gas vent of described gas purging device are towards the direction of below or are horizontal direction.
According to technical scheme 6 described semiconductor lasers, its change part is, is provided with the cooling light barrier between described protection cone through hole and described gas purging device, perhaps is provided with the cooling light barrier in the outside of described gas purging device;
Be provided with through hole in the described cooling light barrier, described through hole and described protection cone through hole align, and are provided with the cooling duct of extending around the described through hole in described cooling light barrier, are filled with coolant in the described cooling duct.
A kind of semiconductor laser is characterized in that, comprises laser bodies, is connected with laser head on the described laser bodies, and described laser head is provided with such as each described laser lens protecting apparatus in the technical scheme 1 ~ 7.
Semiconductor laser according to the technical solution of the utility model 1; owing to be formed with at least two claws at described connection cover; has the slit between two adjacent claws; described slit can be stuck on the laser head; therefore described laser lens protecting apparatus can be connected on the laser head by described connection cover, has made things convenient for the installation of laser lens protecting apparatus and laser head.
According to the semiconductor laser of the technical solution of the utility model 2, the installation of described secondary protection glass is limited, be specially and described secondary protection glass can be installed between described connection cover and the described protective device main body.For example; can ring-shaped platform be set in described the second inside cavity; and in described the first inside cavity annular flange flange is set; at first described secondary protection glass is overlapped on the described ring-shaped platform during installation; then described connection cover and described protective device main body are linked together; so that described annular flange flange can be installed with on described secondary protection glass; can fix described secondary protection glass by described ring-shaped platform and described annular flange flange like this; during dismounting only need to described connection cover and described protective device body portion from and described secondary protection glass taken out get final product, so so that the installation and removal of described secondary protection glass are all comparatively simple and convenient.
According to the semiconductor laser of the technical solution of the utility model 3, the connected mode of described connection cover and described protective device main body is limited.For example, can form internal thread at the inwall of described the first cavity, and form external screw thread at the outer wall of described the second cavity, described connection cover is threaded connection with described protective device main body be in the same place.This being threaded is a kind of dismountable connected mode, and be efficient and convenient, is conducive to operation.But need to prove, in other technologies scheme of the present utility model, be not limited to and use be threaded described connection cover and described protective device main body, but can use welding, the connected mode such as bonding.Being connected and fixed of welding, bonding these connected modes is reliable, but weak point is to be not easy to dismantle, and therefore also is not easy to replacing when described secondary protection glass damages to some extent.
Description of drawings
Fig. 1 is the schematic diagram that semiconductor laser carries out laser processing in the prior art to workpiece.
Fig. 2 is the composition schematic diagram of the utility model laser lens protecting apparatus.
Fig. 3 is the vertical view that connects cover in the laser lens protecting apparatus shown in Figure 2.
Fig. 4 is the cutaway view of the left view of Fig. 3.
Fig. 5 is the improved composition schematic diagram of laser lens protecting apparatus shown in Figure 2.
Fig. 6 is a kind of improved composition schematic diagram of laser lens protecting apparatus shown in Figure 5.
Fig. 7 is the another kind of improved composition schematic diagram of laser lens protecting apparatus shown in Figure 5.
Fig. 8 is the schematic diagram of cooling light barrier in Fig. 6 or the laser lens protecting apparatus shown in Figure 7.
Fig. 9 is the operation principle schematic diagram of the utility model semiconductor laser.
Each label in the accompanying drawing represents respectively:
11---laser bodies, 12---laser head, 2---workpiece; 3---the alloy splash of melting, 9---the one-level protection glass, 4---connect cover; 41---the first cavity, 42---connect the cover through hole, 43---claw; 44---the slit, 45---annular flange flange, 401---the first gas access; 402---the first gas vent; 5---the protective device main body, 51---the second cavity, 52---protection cone through hole; 53---ring-shaped platform; 501---the second gas access, 6---the secondary protection glass, 7---gas purging device; 8---the cooling light barrier; 81---through hole, 82---the cooling duct, 83---coolant.
Embodiment
For so that those skilled in the art can be well understood to the technical solution of the utility model more, be elaborated below in conjunction with drawings and embodiments.
See also Fig. 2, Fig. 2 is the composition schematic diagram of the utility model laser lens protecting apparatus.In Fig. 2, described laser lens protecting apparatus comprises protective device main body 5, described protective device main body 5 is provided with for the connection cover 4 that connects laser head, is formed with in the described connection cover 4 and is formed with the second cavity 51 that is communicated with described the first cavity 41 in the first cavity 41, the described protective device main body 5; Between described the first cavity 41 and described the second cavity 51, be provided with secondary protection glass 6, described the first cavity 41 and described secondary protection glass 6 relative ends are formed with and connect cover through hole 42, and described the second cavity 51 and described secondary protection glass 6 relative ends are formed with protects cone through hole 52; See also Fig. 3 and Fig. 4; Fig. 3 is the vertical view that connects cover in the laser lens protecting apparatus shown in Figure 2; Fig. 4 is the cutaway view of the left view of Fig. 3; by Fig. 3 and as can be known shown in Figure 4; be formed with at least two claws 43 on the described connection cover 4; have slit 44 between two adjacent claws 43, described slit 44 can be stuck on the laser head.
The laser lens protecting apparatus that the utility model embodiment provides; owing to be formed with at least two claws at described connection cover; has the slit between two adjacent claws; described slit can be stuck on the laser head; therefore described laser lens protecting apparatus can be connected on the laser head by described connection cover, has made things convenient for the installation of laser lens protecting apparatus and laser head.
Refer again to Fig. 2 and Fig. 4, can find out that described the second cavity 51 inside are provided with ring-shaped platform 53, described secondary protection glass 6 is overlapped on the described ring-shaped platform 53; Described the first cavity 41 inside are provided with annular flange flange 45, and after described connection cover 4 linked together with described protective device main body 5, described annular flange flange 45 was pressed on the described secondary protection glass 6.Particularly; when secondary protection glass 6 is installed; can at first described secondary protection glass 6 be overlapped on the described ring-shaped platform 53; then described connection cover 4 is linked together with described protective device main body 5; so that described annular flange flange 45 can be installed with on described secondary protection glass 6; can fix described secondary protection glass 6 by described ring-shaped platform 53 and described annular flange flange 45 like this; only described connection cover 4 need to be separated and described secondary protection glass 6 taken out get final product during dismounting with described protective device main body 5, so so that the installation and removal of described secondary protection glass 6 are all comparatively simple and convenient.
In addition, by Fig. 2 and as can be known shown in Figure 4, be formed with internal thread, be formed with external screw thread at the outer wall of described the second cavity 51 at the inwall of described the first cavity 41, described connection cover 4 is threaded connection together with described protective device main body 5.This being threaded is a kind of dismountable connected mode, and be efficient and convenient, is conducive to operation.
In Fig. 2, can see; be provided with the first gas access 401 and the first gas vent 402 in described the first cavity 41; be provided with the second gas access 501 and the second gas vent in described the second cavity 51; and described the first gas vent 402 is communicated with described the second gas access 501; for example can pass through connecting pipe (not shown) is communicated with; described connecting pipeline can be various ways, all can use such as rubber tube, plastic tube etc., and described the second gas vent is described protection cone through hole 52.The first gas access 401 of described the first cavity 41 can be communicated with gas generating unit that (gas generating unit is not shown; adopt gas generating unit of the prior art to get final product); the gas that comes from gas generating unit enters within the first cavity 41 from the first gas access 401 of the first cavity 41 and is full of the first cavity 41; gas from the first gas vent 402 of the first cavity 41 out; enter into the inside of the second cavity 51 by connecting pipeline through the second gas access 501 of the second cavity 51, and blow out straight down from the protection cone through hole 52 of the second cavity 51.In this process, the gas in the gas in the first cavity 41 and the second cavity 51 surrounds secondary protection glass 6, thereby can play the effect of protection protective glasses 6.And, be to blow downwards from protection cone through hole 52 air-flow out of the second cavity 51, can prevent the alloy splash 3 of dust and melting near secondary protection glass 6, thereby play the effect of protection secondary protection glass 6.
Described the second cavity 51 is cone-shaped cavity.Such structure not only can improve from the power of blowing of protection cone through hole 52 air-flow out.And reduced the probability that laser reflection enters cavity scaling loss secondary protection glass 6.
As the improvement to above-described embodiment, see also shown in Figure 5ly, Fig. 5 is the improved composition schematic diagram of laser lens protecting apparatus shown in Figure 2.As can be seen from Figure 5; near described protection cone through hole 52, has gas purging device 7; the lower zone of the described protection cone of gas flow purging through hole 52 that comes from the gas vent of described gas purging device 7, the direction of advance of the air-flow of the gas vent of described gas purging device 7 are towards the direction of below or are horizontal direction.Owing near described protection cone through hole 52, be provided with gas purging device 7; the air-flow that comes from the gas vent of gas purging device 7 is used for purging the lower zone of described protection cone through hole 52; the direction of advance of the air-flow of the gas vent of gas purging device 7 is towards the below or horizontal direction; so; in carrying out the laser processing procedures such as laser melting coating; the air-flow that comes from the gas vent of gas purging device 7 can constantly purge the below of described protection cone 52; thereby polluter or molten alloy splash 3 can be blown off described protection cone through hole 52; avoid polluter or molten alloy alloy splash 3 to arrive secondary protection glass 6 by described protection cone through hole 52; thereby avoid secondary protection glass 6 to be polluted or destroy, alleviated simultaneously from the impact of protection cone through hole 52 gas out on the alloy powder that is preset at surface of the work.
Further improvement as to above-described embodiment sees also Fig. 6 and Fig. 7, and Fig. 6 is a kind of improved composition schematic diagram of laser lens protecting apparatus shown in Figure 5, and Fig. 7 is the another kind of improved composition schematic diagram of laser lens protecting apparatus shown in Figure 5.As shown in Figure 6, cooling light barrier 8 can be between described protection cone through hole 52 and described gas purging device 7, be provided with, perhaps as shown in Figure 7, cooling light barrier 8 can also be provided with in the outside of described gas purging device 7; Wherein, as shown in Figure 8, be provided with through hole 81 in the described cooling light barrier 8, described through hole 81 aligns with described protection cone through hole 52; be provided with the cooling duct 82 of in described cooling light barrier 8, extending around the described through hole 81, be filled with coolant 83 in the described cooling duct.Owing to be provided with cooling light barrier 8 in the outside of described protection cone through hole 52; and be provided with cooling duct 82 in the described cooling light barrier 8; be filled with coolant 83 in the described cooling duct 82; the high temperature that produces when therefore this cooling light barrier 8 can be worked to whole laser head cools off; thereby the heat of high temperature when preventing work arrives laser head by the heat conduction; to the precise part cause thermal side in the laser head, affect the laser head normal operation.
In addition, as shown in Figure 9, the utility model also provides a kind of semiconductor laser.Described semiconductor laser comprises laser bodies 11, is connected with laser head 12 on the described laser bodies 11, and described laser head 12 is provided with the laser lens protecting apparatus described in the various embodiments described above.
As can be seen from Figure 9; the semiconductor laser that the utility model embodiment provides; because the connection cover at described laser lens protecting apparatus is formed with at least two claws; has the slit between two adjacent claws; described slit can be stuck on the laser head; therefore described laser lens protecting apparatus can be connected on the laser head by described connection cover, has made things convenient for the installation of laser lens protecting apparatus and laser head.
Claims (8)
1. laser lens protecting apparatus, it is characterized in that, comprise the protective device main body, described protective device main body is provided with for the connection cover that connects laser head, is formed with in the described connection cover in the first cavity, the described protective device main body and is formed with the second cavity that is communicated with described the first cavity;
Between described the first cavity and described the second cavity, be provided with the secondary protection glass, the end that described the first cavity is relative with described secondary protection glass is formed with and connects the cover through hole, and the end that described the second cavity is relative with described secondary protection glass is formed with protection cone through hole;
Be formed with at least two claws on the described connection cover, have the slit between two adjacent claws, described slit can be stuck on the laser head.
2. laser lens protecting apparatus according to claim 1 is characterized in that, described the second inside cavity is provided with ring-shaped platform, and described secondary protection glass is overlapped on the described ring-shaped platform;
Described the first inside cavity is provided with annular flange flange, and after described connection cover and described protective device main body linked together, described annular flange flange was pressed on the described secondary protection glass.
3. laser lens protecting apparatus according to claim 2; it is characterized in that; be formed with on the inwall of described the first cavity on the outer wall of internal thread, described the second cavity and be formed with external screw thread, described connection cover and described protective device main body are threaded connection together.
4. each described laser lens protecting apparatus according to claim 1 ~ 3; it is characterized in that; be provided with the first gas access and the first gas vent in described the first cavity; be provided with the second gas access and the second gas vent in described the second cavity; and described the first gas vent is communicated with described the second gas access, and described the second gas vent is described protection cone through hole.
5. laser lens protecting apparatus according to claim 4 is characterized in that, described the second cavity is cone-shaped cavity.
6. laser lens protecting apparatus according to claim 5; it is characterized in that; near described protection cone through hole, has gas purging device; the lower zone of the described protection cone of gas flow purging through hole that comes from the gas vent of described gas purging device, the direction of advance of the air-flow of the gas vent of described gas purging device are towards the direction of below or are horizontal direction.
7. laser lens protecting apparatus according to claim 6 is characterized in that, is provided with the cooling light barrier between described protection cone through hole and described gas purging device, perhaps is provided with the cooling light barrier in the outside of described gas purging device;
Be provided with through hole in the described cooling light barrier, described through hole and described protection cone through hole align, and are provided with the cooling duct of extending around the described through hole in described cooling light barrier, are filled with coolant in the described cooling duct.
8. a semiconductor laser is characterized in that, comprises laser bodies, is connected with laser head on the described laser bodies, and described laser head is provided with such as each described laser lens protecting apparatus in the claim 1 ~ 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220398451 CN202759152U (en) | 2012-08-13 | 2012-08-13 | Laser lens protection device and semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220398451 CN202759152U (en) | 2012-08-13 | 2012-08-13 | Laser lens protection device and semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202759152U true CN202759152U (en) | 2013-02-27 |
Family
ID=47738315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220398451 Expired - Fee Related CN202759152U (en) | 2012-08-13 | 2012-08-13 | Laser lens protection device and semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202759152U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820614A (en) * | 2012-08-21 | 2012-12-12 | 山东能源机械集团大族再制造有限公司 | Semiconductor laser device |
| CN110961786A (en) * | 2019-12-26 | 2020-04-07 | 武汉一本光电有限公司 | Multiband laser welding head |
-
2012
- 2012-08-13 CN CN 201220398451 patent/CN202759152U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820614A (en) * | 2012-08-21 | 2012-12-12 | 山东能源机械集团大族再制造有限公司 | Semiconductor laser device |
| CN110961786A (en) * | 2019-12-26 | 2020-04-07 | 武汉一本光电有限公司 | Multiband laser welding head |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102820614B (en) | A kind of semiconductor laser | |
| CN202759152U (en) | Laser lens protection device and semiconductor laser | |
| CN102773606B (en) | Semiconductor laser | |
| CN202752750U (en) | Semiconductor laser | |
| CN102857081A (en) | Inversion driving circuit for IGBT (insulated gate bipolar transistor) induction heating power source | |
| CN205869684U (en) | Plasma cutting machine guide arc control circuit | |
| CN202752749U (en) | Semiconductor laser unit | |
| CN102790351B (en) | Semiconductor laser | |
| CN206536030U (en) | A kind of selective laser fusing shaping window mirror full angle air cooling protection device | |
| CN202752748U (en) | Semiconductor laser unit | |
| CN105575898B (en) | A kind of cutting method of light emitting diode | |
| CN206753657U (en) | High pressure underground gas well emits supervising device on sinking | |
| CN207459567U (en) | A kind of CO2 laser removes the transmission line of electricity drift attached water cooling power supply integrated device of article hanger | |
| CN207521889U (en) | The cutter device and cutting equipment that a kind of achievable fixed point incision, fixed point are cut out | |
| CN212991778U (en) | Environment-friendly gas-insulated intelligent power distribution cabinet | |
| CN205869731U (en) | Power control circuit and laser cutting device of laser cutting device | |
| CN206316549U (en) | A kind of semiconductor laser | |
| CN202759147U (en) | Carbon dioxide laser | |
| CN202763296U (en) | Lens double-protection optical fiber laser cutting head | |
| CN102896422A (en) | Carbon dioxide laser | |
| CN204915448U (en) | Mine car clearance lamp device | |
| CN205091428U (en) | Thunderbolt flashover position recognition device | |
| CN211929425U (en) | Sleeve type high-voltage fuse | |
| CN213018911U (en) | Synergist storage tank for natural gas pipeline additive premixing equipment | |
| CN220782664U (en) | Nozzle with shielding gas and laser path separated |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANDONG ENERGY MACHINERY GROUP QIANYUAN STAINLESS Effective date: 20140116 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140116 Address after: 271219 Shandong city of Tai'an province Xinwen Street Office Zhang Zhuang Patentee after: Shandong Energy Machinery Group Dazu Remanufacturing Co.,Ltd. Patentee after: Shandong Energy Machinery Group Qianyuan Stainless Steel Manufacturing Co., Ltd. Address before: 271219 Shandong city of Tai'an province Xinwen Street Office Zhang Zhuang Patentee before: Shandong Energy Machinery Group Dazu Remanufacturing Co.,Ltd. |
|
| C56 | Change in the name or address of the patentee |
Owner name: SHANDONG ENERGY HEAVY EQUIPMENT GROUP DAZU REMANUF Free format text: FORMER NAME: SHANDONG ENERGY MACHINERY GROUP HAN'S REMANUFACTURING CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 271200 Shandong city of Xintai province Tai'an City Xindong town new road three Patentee after: Shandong Manufacturing Co., Ltd again of energy refitting big nation of group Patentee after: Shandong Energy Group Qianyuan Stainless Steel Manufacturing Co., Ltd, Address before: 271219 Shandong city of Tai'an province Xinwen Street Office Zhang Zhuang Patentee before: Shandong Energy Machinery Group Dazu Remanufacturing Co.,Ltd. Patentee before: Shandong Energy Machinery Group Qianyuan Stainless Steel Manufacturing Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130227 Termination date: 20190813 |