CN202727173U - Multi-line forming die for quad-flat no-lead integrated circuit carrier tapes - Google Patents

Abstract

The utility model provides a multi-line forming die for quad-flat no-lead integrated circuit carrier tapes. The multi-line forming die comprises compression rings on both sides, and a plurality of die cavity forming rings and edge forming rings are arranged between the compression rings, the die cavity forming rings and the edge forming rings are spaced from each other, the inner sides of the compression rings are connected with the die cavity forming rings. If necessary, die cavity forming rings with different sizes can be used to produce different products in one-step forming process. Particularly, the four top corners of a spacing rib which is arranged on each die cavity forming ring are linear or arc-shaped transitions to form an anti-blocking structure, and the design of the structure can ensure that the gap among the four top corners of the side wall of each die cavity forming ring is unchanged, and thus ensure that an integrated circuit is placed in or taken out smoothly.

Description

A kind of quad flat non-pin integrated circuit bearing band is lined up mould more

Technical field

The utility model relates to a kind of integrated circuit bearing band mould, is specifically related to a kind of quad flat non-pin integrated circuit bearing band and lines up mould more.

Background technology

Fast development along with Electronic Assemblies technology-surface mounting technology of new generation (SMT), the volume of conditional electronic components and parts is constantly compressed to diminish, the appearance and size of part components and parts even be compressed into to 5mm, thereby realized the high density of electronic product assembling, high integrated, miniaturization, and the operating type of the production automation is also more and more universal.And be used for to realize client's electronic product automatic wire charging packaging material---physical dimension and the required precision of carrying belt are also more and more higher.

Production field at integrated circuit (IC) carrying belt, the general employing of the die cavity rectangular configuration identical with the circuit profile to QFN series integrated circuit bearing band splendid attire circuit, can form certain fillet at carrying belt die cavity corner position after the moulding, this is easy to cause the problem of card circuit when circuit loads; Will guarantee also that when the carrying belt moulding its moulding is upright, die cavity corner position size will satisfy matching requirements fully after the moulding, so its forming stability requires high, wayward; Solve the problem of getting stuck such as independent increase cavity dimension, then can cause because circuit appearance and size is less the upset of circuit in the carrier band die cavity.

At home single roller forming technique is used in the production of small size carrying belt mostly at present, in general, this technology exists following defective in the production of the high-end integrated circuit bearing band of QFN:

1, the rectangle mold cavity of shaped article has the hidden danger that gets stuck with circuit when loading or take out;

2, the shaped article size is unstable, the uniformity of wayward bulk article size;

3, speed of production is low, substantially remains between 150～180m/h;

4, mould is owing to be integrative-structure, and maintenance cost is higher, and local damage then can cause scrapping of a whole set of mould;

5, the Mould Machining difficulty is large, causes the Mould Machining cost high.

The utility model content

The purpose of this utility model is the problem for the prior art existence, provides a kind of production stability quad flat non-pin integrated circuit bearing band high and simultaneously production different cultivars carrying belt to line up mould more.

For this reason, the utility model adopts following technical scheme:

A kind of quad flat non-pin integrated circuit bearing band is lined up mould more, comprise the pressure ring that is positioned at both sides, be provided with mold cavity forming ring and edge forming ring between the described pressure ring, the alternate setting with the edge forming ring of described mold cavity forming ring, and the inboard of pressure ring connects the die cavity forming ring.

Described mold cavity forming ring is provided with the isolation bar of equidistantly arranging, and is formed into die cavity between the adjacent isolation bar, and the width of described isolation bar is slightly larger than the width of forming cavity.

Four drift angles of described isolation bar adopt straight line or arc transition.

The width of described mold cavity forming ring radially reduces from outside to inside gradually, is formed with the vacuum suction seam between mold cavity forming ring and edge forming ring and the pressure ring.

The beneficial effects of the utility model are:

1, have a plurality of mold cavity forming rings and can change as required the mold cavity forming ring of different size, one-shot forming can be produced different products;

2, four of isolation bar drift angles form the Anti-blockage structure after adopting straight line or arc transition, and this structural design can make four drift angles of carrying belt cavity lateral have the fixed interval (FI), and the assurance integrated circuit is put into smoothly and taken out;

3, upper bottom was more smooth after the vacuum suction seam that forms between mold cavity forming ring and edge forming ring and the pressure ring can make the carrying belt moulding;

4, shaped article dimensionally stable, and speed can reach 1000m/h;

5, mold cavity forming ring and edge forming ring are relatively independent, can change flexibly at any time in the situation of a damage therein, do not affect the result of use of mold integral.

Description of drawings

Fig. 1 is structural representation of the present utility model;

Fig. 2 is the front view of the utility model mold cavity forming ring;

Fig. 3 is the partial enlarged drawing of A part among Fig. 2;

Fig. 4 is the side view of the utility model mold cavity forming ring;

Fig. 5 is the partial enlarged drawing of B part among Fig. 4.

The specific embodiment

As shown in Figure 1, a kind of quad flat non-pin integrated circuit bearing band is lined up mould more, comprise the pressure ring 1,2 that is positioned at both sides, be provided with mold cavity forming ring 3 and edge forming ring 4 between the pressure ring 1,2, mold cavity forming ring 3 and the 4 alternate settings of edge forming ring, and pressure ring 1,2 inboard connect die cavity forming ring 3; Die cavity forming ring 3 is four in the present embodiment, and edge forming ring 4 is three.Shown in Figure 4 and 5, mold cavity forming ring 3 is provided with the isolation bar 6 of equidistantly arranging, and be formed into die cavity 5 between the adjacent isolation bar 6, and the width of isolation bar 6 is slightly larger than the width of forming cavity 5; Four drift angles of isolation bar 6 adopt straight line or arc transition, so just make the carrying belt die cavity after forming cavity 5 or the moulding form respectively convex space 8 outside in the angle position, leave fixed air gap when having guaranteed the integrated circuit loading and between the wall of carrying belt die cavity chamber, thereby form the Anti-blockage structure, circuit can be packed into and take out normally.Shown in Fig. 2,3 and 5, the width of mold cavity forming ring 3 radially reduces from outside to inside gradually, so that form vacuum suction seam 7 between mold cavity forming ring 3 and edge forming ring 4 and the pressure ring 1,2.

In use, when after die assembly is finished, being enclosed within on the briquetting roller wheel face, vacuum suction seam 7 is communicated with vacuum tank on the briquetting roller, when strip when the vacuum tank correspondence position is flowed state by Hot-blast Heating to half, under vacuum action, the melting strip is adsorbed and flow to each sidewall formation of mould cavity structure consistent with mould, namely forms needed carrying belt with cavity structure at break away from moulds after supercooling.

Claims (4)

1. a quad flat non-pin integrated circuit bearing band is lined up mould more, comprise the pressure ring (1,2) that is positioned at both sides, it is characterized in that, be provided with mold cavity forming ring (3) and edge forming ring (4) between the described pressure ring (1,2), described mold cavity forming ring (3) and the alternate setting of edge forming ring (4), and the inboard of pressure ring (1,2) connects die cavity forming ring (3).

2. a kind of quad flat non-pin integrated circuit bearing band according to claim 1 is lined up mould more, it is characterized in that, described mold cavity forming ring (3) is provided with the isolation bar (6) of equidistantly arranging, be formed into die cavity (5) between the adjacent isolation bar (6), and the width of described isolation bar (6) is slightly larger than the width of forming cavity (5).

3. a kind of quad flat non-pin integrated circuit bearing band according to claim 2 is lined up mould more, it is characterized in that, four drift angles of described isolation bar (6) adopt straight line or arc transition.

4. a kind of quad flat non-pin integrated circuit bearing band according to claim 3 is lined up mould more, it is characterized in that, the width of described mold cavity forming ring (3) radially reduces from outside to inside gradually, is formed with vacuum suction seam (7) between mold cavity forming ring (3) and edge forming ring (4) and the pressure ring (1,2).

Images