CN202721804U - Bluetooth earphone circuit board - Google Patents
Bluetooth earphone circuit board Download PDFInfo
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- CN202721804U CN202721804U CN 201220265192 CN201220265192U CN202721804U CN 202721804 U CN202721804 U CN 202721804U CN 201220265192 CN201220265192 CN 201220265192 CN 201220265192 U CN201220265192 U CN 201220265192U CN 202721804 U CN202721804 U CN 202721804U
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- bluetooth earphone
- circuit plate
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- earphone circuit
- cabling
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Abstract
The utility model provides a Bluetooth earphone circuit board which comprises a signal layer S1, a ground layer G, a power supply layer P and a signal layer S2 from top to bottom, wherein a radio frequency signal layer and an audio signal layer in the Bluetooth earphone circuit board are respectively arranged at the signal layer S1 and the signal layer S2, the audio signal layer and the radio frequency signal layer are isolated by the ground layer G and the power supply layer P, in the audio signal layer, a differential wiring principle is implemented in audio wiring, a differential mode is used by a power supply which supplies power to an audio circuit, and the differential wiring has the characteristics of same length, same thickness, a same distance between wires and parallel wires. By using the Bluetooth earphone circuit board of the utility model, signal interference can be reduced comprehensively from the aspects of signal layer arrangement, a microphone end and a speaker end, and the sound quality of a Bluetooth earphone is improved.
Description
Technical field
The utility model relates to the bluetooth earphone technical field, more specifically, relates to a kind of Dolby circuit plate that is applied in the bluetooth earphone.
Background technology
The raising of social informatization degree so that people can communicate whenever and wherever possible and exchange.Along with the application of the ear inserting type communication headsets such as single sound channel bluetooth headset, stereo communication headset, the user can continue the work in the hand in communication.Short-distance wireless communication technology as a kind of low cost low-power consumption, blue tooth products and applications of wireless technology obtain popularizing fast and widely, bluetooth earphone becomes at present most widely used in daily life Bluetooth technology gradually, pass through bluetooth earphone, the cellphone subscriber can realize wireless handsfree function, and needn't hang down from the head as it is single line to mobile phone.
Yet the extensive application of various electronic equipments brings increasing noise.In noise circumstance, communicate, badly influence definition and the intelligibility of communication speech.When noise height to a certain extent the time, not only communication just can't be carried out, and can hurt people's hearing and physical and mental health at all.Therefore, solve the noise problem in the noise problem, particularly communication process, become the current urgent demand of people.
Fig. 1 is the schematic diagram of existing bluetooth earphone internal circuit board.As shown in Figure 1, existing Bluetooth earphone circuit plate (PCB) is generally four-layer circuit board, and ground floor is signals layer S1, and the second layer is stratum G, and the 3rd layer is bus plane P, and the 4th layer is signals layer S2.Because bluetooth earphone PCB itself is smaller, and in order to realize increasing function, the device on the PCB is also more and more, and the cloth board space is more and more less, and this is just so that the simulated audio signal of bluetooth earphone is subjected to the interference probability of noise increasing.
The source of bluetooth earphone noise mainly contains following several at present:
1, power supply is to the interference of audio signal.Because the existence of power supply ripple, pulse, surge, the noise that causes power supply to cause is easy to just be coupled in the audio signal.
2, grounding system is to the interference of audio signal.Because bluetooth earphone PCB area is all smaller, the area on ground also can reduce relatively, causes that ground bullet, ground level are unstable, signal refluxes slow, is easy to audio signal is exerted an influence.
3, the phase mutual interference between the device of earphone inside, between the circuit trace.Because the distance between the bluetooth earphone internal components is all closer, cabling is also closer, so some sensitive signals probably are subject to the interference of clock, radiofrequency signal.
4, TDMA noise is the noise of 217HZ from the frequency of GSM, because GSM is dual-mode communication, as long as communication is arranged, just has to disturb and exists.
Therefore, in order to allow bluetooth earphone obtain good tonequality, reducing system noise is the problem that must solve.
The utility model content
In view of the above problems, the purpose of this utility model provides and a kind ofly reduces noise jamming by the method for improving head circuit, and the wiring by improving pcb board is to reach the purpose that reduces earphone noise.
The Bluetooth earphone circuit plate that the utility model provides comprises signals layer S1, ground plane G, bus plane P and signals layer S2 from top to bottom, wherein,
Radiofrequency signal layer in the described Bluetooth earphone circuit plate and audio signal layer divide and are located at signals layer S1 and signals layer S2, with ground plane G and bus plane P described audio signal layer and radiofrequency signal layer are kept apart; And,
At described audio signal layer, the audio frequency cabling is implemented difference cabling principle, also adopts the mode of difference for the power supply to the voicefrequency circuit power supply; And,
Described difference cabling is isometric, etc. equidistant and parallel between thick, line.
In addition, preferred scheme is, at two signal ends of the microphone of the described Bluetooth earphone circuit plate inductance of access of all connecting; And the cabling of described microphone adopts the difference cabling.
In addition, preferred scheme is, is connected with an electric capacity between two differential signals of the microphone of described Bluetooth earphone circuit plate.
In addition, preferred scheme is, accesses respectively a low frequency decoupling capacitance and a high frequency decoupling capacitance at the bias supply output of described microphone; And,
The ground of the bias supply of described microphone adopts the mode of difference cabling, and with more than on every side interval, the ground 0.3mm.
In addition, preferred scheme is, is in series with magnetic bead at two signal ends of the loud speaker of described Bluetooth earphone circuit plate; And the cabling of described loud speaker adopts the difference cabling.
In addition, preferred scheme is, respectively accesses an electric capacity, the other end ground connection of described electric capacity at two signal ends of the loud speaker of described Bluetooth earphone circuit plate.
In addition, preferred scheme is to connect respectively at the two-loudspeaker end of described Bluetooth earphone circuit plate and access an inductance.
Utilize above-mentionedly according to Bluetooth earphone circuit plate of the present utility model, can disturb from the comprehensive reduction signal of signals layer layout, microphone end, loud speaker end, improve the tonequality of bluetooth earphone.
In order to realize above-mentioned and relevant purpose, one or more aspects of the present utility model comprise the feature that the back will describe in detail and particularly point out in the claims.Following explanation and accompanying drawing describe some illustrative aspects of the present utility model in detail.Yet, the indication of these aspects only be some modes that can use in the variety of way of principle of the present utility model.In addition, the utility model is intended to comprise all these aspects and their equivalent.
Description of drawings
By the content of reference below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present utility model, other purpose of the present utility model and result will understand and easy to understand more.In the accompanying drawings:
Fig. 1 is the schematic diagram of existing bluetooth earphone internal circuit board.
Fig. 2 is the microphone terminal circuit figure according to the utility model embodiment.
Fig. 3 is the Mike's bias power supply circuit figure according to the utility model embodiment.
Fig. 4 is the loud speaker terminal circuit figure according to the utility model embodiment.
Identical label is indicated similar or corresponding feature or function in institute's drawings attached.
Embodiment
Below with reference to accompanying drawing specific embodiment of the utility model is described in detail.
The Bluetooth earphone circuit plate that the utility model provides is identical with existing bluetooth earphone internal circuit board on overall structure, is four-layer circuit board, and ground floor is signals layer S1 from top to bottom, and the second layer is stratum G, and the 3rd layer is bus plane P, and the 4th layer is signals layer S2.Because powerful receiving and transmitting signal during because of radiofrequency signal work, meeting interference tones weak signal, therefore, in the layout of the circuit board that the utility model provides, the S1 layer is laid radiofrequency signal, the S2 layer is laid audio signal, allows radio frequency separate with audio frequency, to prevent that radiofrequency signal is to the interference of audio signal as far as possible.
Certainly, also can lay audio signal at the S1 layer in S2 layer laying radiofrequency signal, as long as the stratum G in the middle of utilizing and bus plane P separate audio signal layer and radiofrequency signal layer physics.
In the Bluetooth earphone circuit plate, powerful receiving and transmitting signal during radiofrequency signal work, meeting interference tones weak signal can effectively reduce radio layer to the impact of audio frequency so audio-frequency unit and radio frequency part are accomplished good isolation.
And in Bluetooth earphone circuit plate of the present utility model, the audio frequency cabling adopts difference cabling principle, also adopts the mode of difference for the power supply to the voicefrequency circuit power supply, and the differential lines setting be requirement isometric, etc. equidistant and parallel between thick, line.
When adopting the design of above-mentioned difference symmetry, if there is noise interferences to come, noise interferences meeting equal distribution forms common-mode signal on two differential lines.This common-mode signal amplitude equates, single spin-echo, can cancel out each other, and final the elimination disturbed, thereby obtains good speech quality.
Fig. 2 shows the circuit diagram according to the microphone end of the Bluetooth earphone circuit plate of the utility model embodiment.
As shown in Figure 2, in the present embodiment, the cabling of microphone adopts the difference cabling, to reduce the ripple of power supply, has reduced strong signal to the interference of weak signal.And (between two differential signals) have access to capacitor C 24 between the two-way input of microphone signal, with the common mode disturbances between the establishment audio signal wire, also are the coupled interference between filtering microphone two differential signal lines.
And also connect respectively in microphone two-way input signal inductance L 8 of access, L9 are to play the effect of filtering low-frequency noise.
In addition, can also access respectively ground capacity C10, a C23 at microphone two-way input, play filtering TDMA noise, 217H
ZThe effect of disturbing.
In the present embodiment, two-way input at microphone also is connected in series with respectively capacitor C 16, C9, these two electric capacity are placed near master controller (MCU) end of bluetooth earphone, play the high-frequency noise of filtering master controller (MCU) periphery, the effect of isolated DC signal.
The audio-frequency unit power supply that Fig. 3 shows according to the utility model embodiment is microphone bias power circuit schematic diagram.As shown in Figure 3, for effective filtering noise, in the present embodiment, the bias supply output of microphone accesses respectively a low frequency decoupling capacitance C30 and a high frequency decoupling capacitance C32, and, the ground of the bias supply of microphone adopts the mode of difference cabling, to reduce the ripple of power supply, reduces strong signal to the interference of weak signal.
Wherein, the ground of capacitor C 26, C30 and C32 electric capacity links up by an independent cabling, and is separated by more than the 0.3mm with other ground on every side, and the mode of this single-point grounding in low-frequency channel has realized that effectively the loop is the shortest, disturbs minimum.
Fig. 4 shows the loud speaker terminal circuit schematic diagram according to the utility model embodiment.
As shown in Figure 4, the cabling of loud speaker also adopts the difference cabling mode, and the setting of difference cabling is in order to reduce the ripple of power supply, to have reduced strong signal to the interference of weak signal.In addition, be in series with magnetic bead at loud speaker two signal ends, with the high-frequency noise that plays filtering master controller (MCU) periphery, the effect of isolated DC signal.
In addition, at loud speaker end filtering noise, respectively access a capacitor C 2, C3 at two signal ends of loud speaker for further, these two electric capacity one ends are connected respectively other end ground connection with the signal segment of loud speaker.
Moreover connecting respectively at the two-loudspeaker end that adopts the difference cabling has access to inductance B1, a B2, the series connection access of inductance better filter away high frequency noise to the interference of audio signal.
By the improvement of above wiring to the bluetooth earphone pcb board, audio signal layer and radiofrequency signal layer physical isolation are come, disturbed condition is down to minimum.At microphone end and loud speaker Duan Jun signal is adopted the difference cabling mode, tonequality that can comprehensive raising bluetooth earphone.Be that audio input end improves tonequality at the microphone end, namely deal with problems from the source, effectively reduce and disturb; At loud speaker end difference cabling, can play the output of protection audio frequency, prevent the effect of disturbing.In addition, VDD-to-VSS difference cabling is arranged the ripple that can also reduce power supply, reduced strong signal to the interference of weak signal.
As above describe according to Bluetooth earphone circuit plate of the present utility model in the mode of example with reference to accompanying drawing.But, it will be appreciated by those skilled in the art that the Bluetooth earphone circuit plate that proposes for above-mentioned the utility model, can also make various improvement on the basis that does not break away from the utility model content.Therefore, protection range of the present utility model should be determined by the content of appending claims.
Claims (7)
1. a Bluetooth earphone circuit plate comprises signals layer S1, ground plane G, bus plane P and signals layer S2 from top to bottom, it is characterized in that,
Radiofrequency signal layer in the described Bluetooth earphone circuit plate and audio signal layer divide and are located at signals layer S1 and signals layer S2, with ground plane G and bus plane P described audio signal layer and radiofrequency signal layer are kept apart; And,
At described audio signal layer, the audio frequency cabling is implemented difference cabling principle, also adopts the mode of difference for the power supply to the voicefrequency circuit power supply; And,
Described difference cabling is isometric, etc. equidistant and parallel between thick, line.
2. Bluetooth earphone circuit plate as claimed in claim 1 is characterized in that,
At two signal ends of the microphone of the described Bluetooth earphone circuit plate inductance of access of all connecting; And,
The cabling of described microphone adopts the difference cabling.
3. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
Between two differential signals of the microphone of described Bluetooth earphone circuit plate, be connected with an electric capacity.
4. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
Bias supply output at described microphone accesses respectively a low frequency decoupling capacitance and a high frequency decoupling capacitance; And,
The ground of the bias supply of described microphone adopts the mode of difference cabling, and with more than on every side interval, the ground 0.3mm.
5. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
Two signal ends at the loud speaker of described Bluetooth earphone circuit plate are in series with magnetic bead; And,
The cabling of described loud speaker adopts the difference cabling.
6. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
Two signal ends at the loud speaker of described Bluetooth earphone circuit plate respectively access an electric capacity, the other end ground connection of described electric capacity.
7. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
The two-loudspeaker end of described Bluetooth earphone circuit plate connect respectively the access inductance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220265192 CN202721804U (en) | 2012-06-06 | 2012-06-06 | Bluetooth earphone circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220265192 CN202721804U (en) | 2012-06-06 | 2012-06-06 | Bluetooth earphone circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202721804U true CN202721804U (en) | 2013-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220265192 Expired - Fee Related CN202721804U (en) | 2012-06-06 | 2012-06-06 | Bluetooth earphone circuit board |
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| CN (1) | CN202721804U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102780938A (en) * | 2012-06-06 | 2012-11-14 | 歌尔声学股份有限公司 | Bluetooth headset circuit board |
| CN107343241A (en) * | 2017-09-01 | 2017-11-10 | 深圳市中芯微电子有限公司 | A kind of USB power supply wire and wireless one digital earphones and audio-frequency amplifier |
-
2012
- 2012-06-06 CN CN 201220265192 patent/CN202721804U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102780938A (en) * | 2012-06-06 | 2012-11-14 | 歌尔声学股份有限公司 | Bluetooth headset circuit board |
| CN102780938B (en) * | 2012-06-06 | 2015-04-15 | 歌尔声学股份有限公司 | Bluetooth headset circuit board |
| CN107343241A (en) * | 2017-09-01 | 2017-11-10 | 深圳市中芯微电子有限公司 | A kind of USB power supply wire and wireless one digital earphones and audio-frequency amplifier |
| CN107343241B (en) * | 2017-09-01 | 2023-09-22 | 深圳市中芯微电子有限公司 | USB power supply wired wireless integrated digital earphone and audio amplifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20200606 |
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| CF01 | Termination of patent right due to non-payment of annual fee |