CN202715723U - Double-elastic buffering stamping die - Google Patents

Double-elastic buffering stamping die Download PDF

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Publication number
CN202715723U
CN202715723U CN 201220357321 CN201220357321U CN202715723U CN 202715723 U CN202715723 U CN 202715723U CN 201220357321 CN201220357321 CN 201220357321 CN 201220357321 U CN201220357321 U CN 201220357321U CN 202715723 U CN202715723 U CN 202715723U
Authority
CN
China
Prior art keywords
spring
silica gel
wire spring
double
stamping die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220357321
Other languages
Chinese (zh)
Inventor
邓力
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHONGQING SHUNDUOLI MOTOR-VEHICLE Co Ltd
Original Assignee
CHONGQING SHUNDUOLI MOTOR-VEHICLE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHONGQING SHUNDUOLI MOTOR-VEHICLE Co Ltd filed Critical CHONGQING SHUNDUOLI MOTOR-VEHICLE Co Ltd
Priority to CN 201220357321 priority Critical patent/CN202715723U/en
Application granted granted Critical
Publication of CN202715723U publication Critical patent/CN202715723U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a double-elastic buffering stamping die, wherein a wire spring is mounted on a guide post of a female die; and a silica gel spring is mounted on the wire spring. A function of primary buffering is realized through the wire spring, and when the female die is in contact with the silica gel spring, a function of secondary buffering can be realized through the silica gel spring and the wire spring. Impact produced by the stamping die can be fully absorbed in the production process, and burrs and deformation of a stamping piece caused by impact shock can be effectively eliminated.

Description

A kind of dual elastic buffer punch die
Technical field
The utility model is a kind of dual elastic buffer punch die, belongs to field of mechanical technique.
Background technology
Present punch die all is first-level buffer, impacts because first-level buffer is not enough easily aborning, causes rushing part and burr and distortion occur.
The utility model content
The purpose of this utility model provides a kind of dual elastic buffer punch die, plays first-level buffer by wire spring, and when formpiston touched the silica gel spring, silica gel spring and wire spring played the level 2 buffering effect simultaneously.
Its objective is such realization, a kind of dual elastic buffer punch die is comprised of former, silica gel spring, wire spring, formpiston, guide pillar, guide hole, punch press connector; On the guide pillar on the former wire spring is installed, the silica gel spring is installed on the wire spring, guide pillar is connected in the guide hole, and formpiston is connected with the punch press connector.
Be connected with formpiston by the punch press connector, wire spring plays first-level buffer, when formpiston touches the silica gel spring, silica gel spring and wire spring play the level 2 buffering effect simultaneously, fully absorb aborning the impact that punch die produces, effectively eliminate impact endurance test shock and cause rushing burr and the distortion that part occurs.
Description of drawings
Concrete structure of the present utility model is provided by following examples and accompanying drawing:
Fig. 1, be a kind of dual elastic buffer punch die structure schematic diagram of the utility model.
Among Fig. 1,1, former, 2, the silica gel spring, 3, wire spring, 4, formpiston, 5, guide pillar, 6, guide hole, 7, the punch press connector.
The specific embodiment
Describe the specific works situation that the utility model proposes in detail below in conjunction with Fig. 1, in Fig. 1, on the guide pillar 5 on the former 1 wire spring 3 is installed, silica gel spring 2 is installed on the wire spring 3, guide pillar 5 is connected in the guide hole 6, and formpiston 4 is connected with punch press connector 7.
Be connected with formpiston 4 by punch press connector 7, wire spring 3 plays first-level buffer, and when formpiston 4 touched silica gel spring 2, silica gel spring 2 played the level 2 buffering effect simultaneously with wire spring 3.

Claims (1)

1. a dual elastic buffer punch die is comprised of former, silica gel spring, wire spring, formpiston, guide pillar, guide hole, punch press connector; It is characterized in that: on the guide pillar on the former wire spring is installed, the silica gel spring is installed on the wire spring, guide pillar is connected in the guide hole, and formpiston is connected with the punch press connector.
CN 201220357321 2012-07-23 2012-07-23 Double-elastic buffering stamping die Expired - Lifetime CN202715723U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220357321 CN202715723U (en) 2012-07-23 2012-07-23 Double-elastic buffering stamping die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220357321 CN202715723U (en) 2012-07-23 2012-07-23 Double-elastic buffering stamping die

Publications (1)

Publication Number Publication Date
CN202715723U true CN202715723U (en) 2013-02-06

Family

ID=47617561

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220357321 Expired - Lifetime CN202715723U (en) 2012-07-23 2012-07-23 Double-elastic buffering stamping die

Country Status (1)

Country Link
CN (1) CN202715723U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20130206

CX01 Expiry of patent term