CN202702872U - Multi-group type narrow material two-dimension code laser etching device - Google Patents
Multi-group type narrow material two-dimension code laser etching device Download PDFInfo
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- CN202702872U CN202702872U CN 201220317324 CN201220317324U CN202702872U CN 202702872 U CN202702872 U CN 202702872U CN 201220317324 CN201220317324 CN 201220317324 CN 201220317324 U CN201220317324 U CN 201220317324U CN 202702872 U CN202702872 U CN 202702872U
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Abstract
The utility model discloses a device capable of realizing two-dimension code laser etching in a multi-group type narrow material at the same time. By improving the structure of the traditional reeling and unreeling device, and cooperating with the speed device, the tension device, and the positioning control device and other devices, the device provided in the utility model can be used to solve the problem of the traditional etching devices of the inaccurate etching caused by the insufficient control over the material or the product operation speed and the insufficient laser intensity control. By using the device provided in the utility model, the anti-counterfeiting identification of the multi-group type two-dimension code can be realized, the etching can be accurate, and the production as well as the processing of the special anti-counterfeiting identification can be greatly improved under the precondition of guaranteeing the quality. The multi-group type narrow material two-dimension code laser etching device comprises a laser head (1), a positioning photoelectric probe (2), a dust-absorbing port (3), a dedusting brush (4), a material reeling diameter probe (5), a mechanical correcting device (6), a material walking speed compensation encoder (7), a material to be etched (8), a re-reeling machine frame (9), a main driving roller (10), a control device (11), and a special slip re-reeling ring (12).
Description
Technical field
The utility model relates to anti-fake mark, false proof signature field, is specifically related to a kind of in order to make the special equipment of anti-fake mark.
Background technology
Laser ablation also claims laser marking, is a New Processing that grows up at the beginning of the eighties at the end of the seventies, and in recent years, along with the development of laser technique, computer technology and the improvement of optics, the laser marking technology obtains very large development.
Laser marking be laser beam focusing with high-energy-density on material surface, make material surface generation physical and chemical changes, form pit, thereby obtain the mark mode of visible pattern.Control simultaneously cut-offfing of laser when laser beam moves regularly at material surface, material surface has just formed the pattern of an appointment.
Laser mainly refers to use laser to make various information flags on the surface of various base materials in the application of printing industry at present, as: sequence number, password, bar code, advantage be no material consumption, printing effect meticulousr clear, resolution ratio is higher, failure rate is low, character forever can not be wiped free of, can substitute the ink-jet ink jet numbering machine comprehensively, lossless, pollution-free, non-maintaining, operating cost is cheap; Cooperate all kinds of production lines, carry out contactless, without pause, high-quality flies laser marking online, apply to the industries such as wine brewing, food and drink, and cooperate the pharmaceutical manufacturing line to carry out the high-quality online marking on the fly of nothing pause, and can carry out accurate mark to medicine equipment, environment friendly and pollution-free, the GMP standard that meets pharmaceutical industry, beat the contents such as lot number, date of manufacture and shelf-life in medicine packing, can also be on the medicine equipment of metal material the contents such as marking sequence number, figure or date of manufacture.
Make the field at the anti-fake mark that two-dimension code is combined with anti-counterfeit printing, laser ablation technology and equipment is quick and high-precision advantage because of it, also gradually manifests its technical advantage.
For example the patent No. is 201020102478.2, and by name: the utility model patent of synchronous two-dimension code mark reading, carving device for labeling relates to a kind of synchronous two-dimension code mark reading, carving device for labeling.This device comprises the first anti-fake mark device, and its signal input part links to each other with computer two-dimensional coded signal output, is used for receiving the two-dimension code data, and these data are attached on the labeling, is attached on the product ontology by automatic labeling machine; The second false proof blaze device be used for to receive the two-dimension code data message, and forms the high energy laser beam with coded message, on the directive product ontology and form two-dimension code.By laser coding device at product ontology surface attachment two-dimension code, make product have the double anti-forge effect, can be used for the package anti-fake to many kinds of solids materials such as common metal and alloy, rare metal and alloy, metal oxide, ABS material, glasswares, its application is wide, and antifalse effect is obvious.
Application number a kind of method for anti-counterfeit of genuine piece that has been 201010101642.2 Patent Application Publication, carrying out on the false proof basis with the labeling with two-dimension code, adhere to two-dimension code by laser coding device on the product ontology surface, make product have the double anti-forge effect, effectively avoid palming off and go here and there the generation of goods phenomenon, can be used for carrying out the packing of product on the multiple material false proof, such as tangible products such as metal, plastics, glasswares, its application is extensive, and antifalse effect is remarkable.
Application number is that the patent of invention of 200710173477.X discloses a kind of dynamic gray level picture card laser engraving production system and method, and system comprises laser instrument, controller, human head picture capturing apparatus, fingerprint acquisition instrument, scanning optics and computer system.At first by computer input card card identity people's essential information with by customized informations such as digital camera, fingerprint acquisition instrument identity human head picture, fingerprints, then be processed into 8 gray scale images of certain form and size by software systems, generation contains the two-dimension code of personal information, the engraving message file of automatic Synthesis Card card, the power of last switching signal by computer control laser instrument, laser pulse or length and X, Y bidimensional galvanometer scanning system and the scanning focused lens of F-THETA obtain focused beam etching on card card material, quick, the false proof making that realizes blocking card.
Above-mentioned several patent discloses different two-dimension code laser ablation technology and the equipment of relating to, but they directly carry out the etching moulding of two-dimension code or other signs at fixing product surface or mobile product surface by described equipment, need in actual applications to use with it supporting product production line device, cost is higher, and the said equipment can not be realized organizing batch machining at flexible material more, and the scope of application and production efficiency are all not high.
Summary of the invention
The purpose of this utility model be to provide a kind of can be simultaneously many groups type flexibility in a narrow margin material realize the special equipment of two-dimension code laser ablation, by traditional unwinding and rewinding equipment is carried out architecture advances, the devices such as cooperation speed, tension force, positioning control, solved not problem accurately of etching that traditional etching apparatus causes in deficiency aspect material or the product speed of service and the laser intensity control, when realization identifies many groups type two-dimension code anti-counterfeit, accurate etching, greatly improve the production and processing efficient of special anti-counterfeiting sign under the prerequisite of ensuring the quality of products.
For achieving the above object, the utility model has adopted following technical scheme: many groups type is material two-dimension code laser ablation equipment in a narrow margin, it is characterized in that, comprise laser head 1, location photoelectric probe 2, suction port 3, dust removal brush 4, material take-up diameter detecting head 5, mechanical deflection correcting device 6, material speed of travel compensated encoder 7, material 8 to be etched, rewinding frame 9, main drive roll 10, control device 11, special slippage rewinding ring 12.
Described rewinding frame 9 is by a left side, the right side and after-poppet consist of, main drive roll 10 is installed by the circular hole that is arranged on the support of the left and right sides, one end of main drive roll 10 is connected with servomotor, provide power by it, other end mounting material speed of travel compensated encoder 7 at main drive roll 10, be provided with suction port 3 and dust removal brush 4 on the right side of main drive roll 10, the upper end of suction port 3 arranges location photoelectric probe 2, material 8 to be etched passes between location photoelectric probe 2 and the suction port 3, laser head 1 is installed on directly over the material to be etched 8 by main drive roll 10, below main drive roll 10, be provided with material roller, the top is equipped with mechanical deflection correcting device 6, in the material Scroll lower end that etching is good material take-up diameter detecting head 5, laser head 1 are installed, location photoelectric probe 2, material speed of travel compensated encoder 7 all is connected with control device 11.
During work, after material 8 to be etched unreels through the special slippage rewinding ring 12 on the unreeling shaft, at first pass through material roller and reduced the teeter that material occurs when unreeling, then through mechanical deflection correcting device 6 material is just walked, drive material by main drive roll 10 afterwards and enter the laser ablation zone, when photoelectric probe 2 below, the process of the telltale mark on the material 8 to be etched location, probe produces triggering signal, the velocity compensation signal that compounding ingredient speed of travel compensated encoder 7 measures makes laser head 1 produce the laser ablation action, etching forms required pattern on material, the photosignal that control device 11 is accepted and control is relevant, laser action, etching content etc., the suction port 3 that install laser ablation region material below, dust removal brush 4 siphons away the material that etching produces, last by the special slippage rewinding ring 12 on the wrap-up with material harvest reel; Between main drive roll and rolling, measure in real time the variation of material take-up diameter by the take-up diameter detecting head, and a 0-10V signal of measuring is transferred to master controller, internal calculation by master controller is controlled rolling speed by rolling traction servo controller, cooperate again the Pneumatic pressure and the compensation of the slip between rewinding ring inner and outer ring that are applied to the special slippage rewinding ring on the wrap-up, realize the high-accuracy and constant tension force control of etching station material to be etched.
The said equipment can be used for processing the materials such as locating thermoprint paper tinsel, anodized aluminium, aluminizer.
The group number of the said equipment rapidoprint is more than 1 group.
The width of the said equipment rapidoprint is 20-600mm.
The beneficial effects of the utility model are:
1. the location alignment of material to be etched, high-precision etching must position the tracking alignment to material, and this equipment has been realized the location of material is followed the tracks of by location photoelectric probe 2 is set.
2. the accurate adjustment of material multistage tension variation, for realizing high-precision etching, this equipment is by arranging material take-up diameter detecting head 5, mechanical deflection correcting device 6, material speed of travel compensated encoder 7 forms the control of material tension multistage tension force, and the front and back traction electric machine can carry out Synchronization Control according to speed, can make real-time adjusting according to tension variation again, the control of unwinding and rewinding tension force keeps the permanent tension force of multiple spot constant speed during the course.
3. the utility model will be organized etching unit independently more and centralized integration rationally will be set on an equipment by structure, solved not problem accurately of etching that traditional etching apparatus causes in deficiency aspect material or the product speed of service and the laser intensity control, when realization identifies many groups type two-dimension code anti-counterfeit, accurate etching, the production and processing that greatly improves special anti-counterfeiting sign under the prerequisite of ensuring the quality of products.
Description of drawings
Fig. 1 is the in a narrow margin Facad structure schematic diagram of material two-dimension code laser ablation equipment of embodiment 1 described many groups type.
Fig. 2 is the in a narrow margin side structure schematic diagram of material two-dimension code laser ablation equipment of embodiment 1 described many groups type.
Fig. 3 is the in a narrow margin Facad structure schematic diagrames of material two-dimension code laser ablation equipment of embodiment 2 described many groups types.
Fig. 4 is the in a narrow margin side structure schematic diagrames of material two-dimension code laser ablation equipment of embodiment 2 described many groups types.
Fig. 5 is equipment schematic described in the utility model.
The specific embodiment
As described in Fig. 1,2, the described many groups type of the present embodiment is material two-dimension code laser ablation equipment in a narrow margin, comprises laser head 1, location photoelectric probe 2, suction port 3, dust removal brush 4, material take-up diameter detecting head 5, mechanical deflection correcting device 6, material speed of travel compensated encoder 7, material 8 to be etched, rewinding frame 9, main drive roll 10, control device 11, special slippage rewinding ring 12.
Described rewinding frame 9 is by a left side, the right side and after-poppet consist of, main drive roll 10 is installed by the circular hole that is arranged on the support of the left and right sides, one end of main drive roll 10 is connected with servomotor, provide power by it, other end mounting material speed of travel compensated encoder 7 at main drive roll 10, be provided with suction port 3 and dust removal brush 4 on the right side of main drive roll 10, the upper end of suction port 3 arranges location photoelectric probe 2, material 8 to be etched passes between location photoelectric probe 2 and the suction port 3, laser head 1 is installed on directly over the material to be etched 8 by main drive roll 10, below main drive roll 10, be provided with material roller, the top is equipped with mechanical deflection correcting device 6, in the material Scroll lower end that etching is good material take-up diameter detecting head 5, laser head 1 are installed, location photoelectric probe 2, material speed of travel compensated encoder 7 all is connected with control device 11.
During work, after material 8 to be etched unreels through the special slippage rewinding ring 12 on the unreeling shaft, at first pass through material roller and reduced the teeter that material occurs when unreeling, then through mechanical deflection correcting device 6 material is just walked, drive material by main drive roll 10 afterwards and enter the laser ablation zone, when photoelectric probe 2 below, the process of the telltale mark on the material 8 to be etched location, probe produces triggering signal, the velocity compensation signal that compounding ingredient speed of travel compensated encoder 7 measures makes laser head 1 produce the laser ablation action, form required pattern at material, the photosignal that control device 11 is accepted and control is relevant, laser action, etching content etc., the suction port 3 that install laser ablation region material below, dust removal brush 4 siphons away the material that etching produces, last by the special slippage rewinding ring 12 on the wrap-up with material harvest reel.
As described in Fig. 3,4, the described many groups type of the present embodiment etching when material two-dimension code laser ablation equipment is used for carrying out four groups of materials in a narrow margin, its structure comprises laser head 1, location photoelectric probe 2, suction port 3, dust removal brush 4, material take-up diameter detecting head 5, mechanical deflection correcting device 6, material speed of travel compensated encoder 7, material 8 to be etched, rewinding frame 9, main drive roll 10, control device 11, special slippage rewinding ring 12.
Described rewinding frame 9 is by a left side, the right side and after-poppet consist of, main drive roll 10 is installed by the circular hole that is arranged on the support of the left and right sides, one end of main drive roll 10 is connected with servomotor, provide power by it, other end mounting material speed of travel compensated encoder 7 at main drive roll 10, be provided with suction port 3 and dust removal brush 4 on the right side of main drive roll 10, the upper end of suction port 3 arranges location photoelectric probe 2, material 8 to be etched passes between location photoelectric probe 2 and the suction port 3, laser head 1 is installed on directly over the material to be etched 8 by main drive roll 10, below main drive roll 10, be provided with material roller, the top is equipped with four groups of mechanical deflection correcting devices 6, in the material Scroll lower end that etching is good material take-up diameter detecting head 5, laser head 1 are installed, location photoelectric probe 2, material speed of travel compensated encoder 7 all is connected with control device 11; Between main drive roll and rolling, measure in real time the variation of material take-up diameter by the take-up diameter detecting head, and a 0-10V signal of measuring is transferred to master controller, internal calculation by master controller is controlled rolling speed by rolling traction servo controller, cooperate again the Pneumatic pressure and the compensation of the slip between rewinding ring inner and outer ring that are applied to the special slippage rewinding ring on the wrap-up, realize the high-accuracy and constant tension force control of etching station material to be etched.
During work, after material 8 to be etched unreels through the special slippage rewinding ring 12 on the unreeling shaft, at first pass through material roller and reduced the teeter that material occurs when unreeling, then through mechanical deflection correcting device 6 material is just walked, drive material by main drive roll 10 afterwards and enter the laser ablation zone, when photoelectric probe 2 below, the process of the telltale mark on the material 8 to be etched location, probe produces triggering signal, the velocity compensation signal that compounding ingredient speed of travel compensated encoder 7 measures makes laser head 1 produce the laser ablation action, form required pattern at material, the photosignal that control device 11 is accepted and control is relevant, laser action, etching content etc., the suction port 3 that install laser ablation region material below, dust removal brush 4 siphons away the material that etching produces, last by the special slippage rewinding ring 12 on the wrap-up with material harvest reel.
Claims (4)
1. many groups type material two-dimension code laser ablation equipment in a narrow margin is characterized in that, comprises laser head (1), location photoelectric probe (2), suction port (3), dust removal brush (4), material take-up diameter detecting head (5), mechanical deflection correcting device (6), material speed of travel compensated encoder (7), material to be etched (8), rewinding frame (9), main drive roll (10), control device (11), special slippage rewinding ring (12);
Described rewinding frame (9) is by a left side, the right side and after-poppet consist of, main drive roll (10) is installed by the circular hole that is arranged on the support of the left and right sides, one end of main drive roll (10) is connected with servomotor, provide power by it, other end mounting material speed of travel compensated encoder (7) at main drive roll (10), be provided with suction port (3) and dust removal brush (4) on the right side of main drive roll (10), the upper end of suction port (3) arranges location photoelectric probe (2), material to be etched (8) passes between location photoelectric probe (2) and the suction port (3), laser head (1) is installed on directly over the material to be etched (8) by main drive roll (10), below in main drive roll (10), be provided with material roller, the top is equipped with mechanical deflection correcting device (6), in the material Scroll lower end that etching is good material take-up diameter detecting head (5) is installed, laser head (1), location photoelectric probe (2), material speed of travel compensated encoder (7) all is connected with control device (11).
2. etching apparatus according to claim 1 is characterized in that, the material of this equipment processing is any of locating thermoprint paper tinsel, anodized aluminium, aluminizer.
3. etching apparatus according to claim 1 is characterized in that, the group number of this equipment rapidoprint is more than 1 group.
4. etching apparatus according to claim 1 is characterized in that, the width of this equipment rapidoprint is 20-600mm.
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CN 201220317324 CN202702872U (en) | 2012-07-03 | 2012-07-03 | Multi-group type narrow material two-dimension code laser etching device |
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CN 201220317324 CN202702872U (en) | 2012-07-03 | 2012-07-03 | Multi-group type narrow material two-dimension code laser etching device |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105774280A (en) * | 2016-03-28 | 2016-07-20 | 新乡市新机瑞博印刷机械有限公司 | Method and system for printing variable graphic and text information on printed product |
CN105818529A (en) * | 2016-05-11 | 2016-08-03 | 中荣印刷集团有限公司 | Sheet-fed printing material cold-waving membrane-saving unit, cold-waving method thereof and sheet-fed printing material cold-waving membrane-saving device |
CN106494094A (en) * | 2016-11-22 | 2017-03-15 | 信码互通(北京)科技有限公司 | A kind of laser marking device for the endowed production line of Quick Response Code |
CN106614988A (en) * | 2015-10-29 | 2017-05-10 | 崔峨 | Method for laser-carving demi-carcass pork online |
CN108188583A (en) * | 2017-11-20 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | Laser processing device |
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2012
- 2012-07-03 CN CN 201220317324 patent/CN202702872U/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106614988A (en) * | 2015-10-29 | 2017-05-10 | 崔峨 | Method for laser-carving demi-carcass pork online |
CN105774280A (en) * | 2016-03-28 | 2016-07-20 | 新乡市新机瑞博印刷机械有限公司 | Method and system for printing variable graphic and text information on printed product |
CN105818529A (en) * | 2016-05-11 | 2016-08-03 | 中荣印刷集团有限公司 | Sheet-fed printing material cold-waving membrane-saving unit, cold-waving method thereof and sheet-fed printing material cold-waving membrane-saving device |
CN106494094A (en) * | 2016-11-22 | 2017-03-15 | 信码互通(北京)科技有限公司 | A kind of laser marking device for the endowed production line of Quick Response Code |
CN106494094B (en) * | 2016-11-22 | 2019-09-20 | 透云物联网科技(北京)有限公司 | A kind of laser marking device for the endowed production line of two dimensional code |
CN108188583A (en) * | 2017-11-20 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | Laser processing device |
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