CN202697037U - Circuit protection module - Google Patents
Circuit protection module Download PDFInfo
- Publication number
- CN202697037U CN202697037U CN2012201578744U CN201220157874U CN202697037U CN 202697037 U CN202697037 U CN 202697037U CN 2012201578744 U CN2012201578744 U CN 2012201578744U CN 201220157874 U CN201220157874 U CN 201220157874U CN 202697037 U CN202697037 U CN 202697037U
- Authority
- CN
- China
- Prior art keywords
- thermistor
- circuit protection
- protection module
- electrode
- temperature coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
The utility model relates to a circuit protection module, comprising the components as following: a substrate, wherein at least a part of the substrate comprises a thermistor possessing a positive temperature coefficient characteristic, and the thermistor possesses a first electrode and a second electrode; and a first pad and a second pad which are positioned at the surface of the substrate. The first electrode and the second electrode are respectively led out from the first blind hole and the second blind hole to the first pad and the second pad. According to the circuit protection module, the weatherability of the element with a positive temperature coefficient is improved, the dimension requirement of the element with a positive temperature coefficient is not too high, simultaneously, the surface area is saved, the miniaturization of a printed circuit board is further promoted, simultaneously, the element with a positive temperature coefficient can be directly embedded below an assigned emitter, and the temperature-sensitive protection effect of the element with a positive temperature coefficient is enhanced. In addition, according to the circuit protection module, the production cost is substantially reduced.
Description
Technical field
The present invention relates to the circuit protection module, particularly, relate to a kind of circuit protection module with positive temperature coefficient element.
Background technology
The resistance value of conventional positive temperature coefficient (Positive Temperature Coefficient:PTC) element is worked as sharp to the reacting phase of variations in temperature.When positive temperature coefficient element during in normal behaviour in service, its resistance can be kept utmost point low value and make circuit be able to normal operation.But when overcurrent occuring or cross the phenomenon of high temperature and when making temperature rise to critical temperature, its resistance value can jump to high value state (for example 10 moment
4More than ohm) and overcurrent is oppositely offset, to reach the purpose of protective circuit element, namely in the circuit protection modular design, introduce the purpose that positive temperature coefficient element can reach protective circuit.
Yet, how to be connected in the circuit protection module positive temperature coefficient independent entry device and the problem that better effect unanimously is this area professional and technical personnel discussion that where can reach that positive temperature coefficient independent entry device is connected to the circuit protection module.On the one hand, from reaching better protection effect, positive temperature coefficient independent entry device need to be done greatly, thus the working face of lifting positive temperature coefficient independent entry device, to reach better circuit protection effect; But on the other hand, in traditional circuit protection module, the mounting means paster that positive temperature coefficient independent entry device passes through to reflux usually is to the plank of circuit protection module, and when utilizing this structure to bring overcurrent and/or overtemperature protection for the place circuit, also strengthened the volume of printed circuit board (PCB), this will have requirement to the size of product, can not be too high; And simultaneously to the dimensional requirement of positive temperature coefficient protection components and parts more and more miniaturization also be a main trend.This requires to do greatly on the one hand, requires on the other hand to do little contradiction and how to dissolve, and one of skill in the art is devoted to this always.In addition, positive temperature coefficient independent entry device also has certain requirement to operational environment, if and oxidized rear its responsive to temperature performance of positive temperature coefficient independent entry device will significantly reduce, the requirement of environment is exposed in installation site how to design positive temperature coefficient independent entry device to satisfy these components and parts, for example existing positive temperature coefficient independent entry device is done the gas leakage problem that occurs after the anti-oxygen coating processing, and suchlike problem also needs to be resolved hurrily.
Summary of the invention
According to the understanding of above-mentioned technical problem to background technology and existence, if a kind of more excellent circuit protection modular design scheme can be provided, will be very useful.
The present invention proposes a kind of circuit protection module, this circuit protection module comprises: substrate, and at least part of zone of wherein said substrate is made of the thermistor with ptc characteristics, and described thermistor has the first electrode and the second electrode; The first pad and the second pad are positioned at the surface of described substrate, and described the first electrode and the second electrode lead to described the first pad and the second pad by the first blind hole and the second blind hole respectively.
Wherein, described at least part of zone had both comprised the special case that described substrate all is made of the thermistor with ptc characteristics; Also comprise embedded situation with thermistor of ptc characteristics in the common substrate.
In one embodiment of the invention, described thermistor is coated with protective finish outward.This coating has the described thermistor of protection and prevents the effect of described thermistor oxidation.This has also just kept the stability of described thermistor material preferably, thereby has guaranteed the normal operation of described thermistor.
In one embodiment of the invention, described circuit protection module also comprises heat generating components, and itself and described thermistor are connected in parallel and with heat exchange pattern heat are delivered to described thermistor.
In one embodiment of the invention, described heat generating components directly fits to described thermistor or fits to described thermistor by Heat Conduction Material, can significantly reduce the operate time of thermistor like this, thereby can reach better circuit protection effect.Wherein, thus referring to that thermistor breaks down the actual generation of thermistor resistance substantial variations from circuit this operate time can the needed time of protective circuit.Wherein, described heat generating components comprises resistive device, perceptual device or semiconductor device.And this heat generating components has third electrode and the 4th electrode that is positioned on its two ends, and described third electrode leads to described the first pad by the 3rd blind hole, and the 4th electrode of described heat generating components is drawn by the 4th blind hole electricity.Additionally, be connected with control unit on described the 4th blind hole, the electric current of described heat generating components was flow through in control when described control unit was used for and/or overcurrent overheated when described thermistor unit, to heat described heat generating components.Alternatively, described heat generating components and described thermistor be shaped as tabular, flat thermistor and heat generating components are convenient to be installed, and can fit better thermistor and heat generating components, convenient heat conduction.
Than traditional circuit protection module; circuit protection module of the present invention has been improved the weatherability of positive temperature coefficient element; and by embedded positive temperature coefficient element; be conducive to encapsulation; simultaneously so that needn't be so harsh to the dimensional requirement of positive temperature coefficient element; economized out in addition surface area; for further compact PCB has been made contribution; can also select positive temperature coefficient element directly is embedded in below the ballistic device of appointment, improve the temperature-sensitive protection effect of positive temperature coefficient element.In addition, this circuit protection module has been saved the trouble that the user welds the positive temperature coefficient independent component, namely uses this circuit protection module significantly to reduce production costs.
Above characteristic of the present invention and other characteristics are partly set forth embodiment hereinafter clearly.
Description of drawings
Read following detailed description to non-limiting example by the reference accompanying drawing, other features, objects and advantages of the present invention will become more obvious.
Fig. 1 shows the detail of construction of positive temperature coefficient independent component 100 in the prior art;
Fig. 2 shows the relative structural representation when positive temperature coefficient independent component 100 is connected in circuit protection module 200 in the prior art;
Fig. 3 (a) shows the structural representation of one embodiment of the present of invention 300;
Fig. 3 (b) show the variant embodiment 300 of embodiments of the invention 300 ' structural representation;
Fig. 4 shows the structural representation of an alternative embodiment of the invention 400; And
Fig. 5 shows the structural representation of an alternative embodiment of the invention 500.
In the drawings, run through different diagrams, identical or similar Reference numeral represents same or analogous device (module) or step.
Embodiment
The below discusses enforcement and the use of embodiment in detail.Yet, should be appreciated that the specific embodiment of discussing only exemplarily illustrates enforcement and uses ad hoc fashion of the present invention, but not limit the scope of the invention.
Fig. 1 shows the detail of construction of positive temperature coefficient independent component 100 in the prior art.The core cell of this positive temperature coefficient independent component is the thermistor 150 with ptc characteristics.The first electrode of this thermistor 150 and the second electrode are connected to conductor 110a and 110b by blind hole 120a and 120b respectively and further are connected to the first electrode 140a and the second electrode 140b of this positive temperature coefficient independent component 100 by it.Except above-described major part, also has slave part 130 (among the figure unmarked go out) among the figure, this part comprises: cover insulating material 131a and 131b that this element is avoided, usually be embodied as green oil, usually be embodied as part 132a and the 132b of FR4/5 commonly used in the printed circuit board (PCB) for example, the sealant 133 that also has auxiliary thermistor 150 sealings with and the tack coat 134 of each layer of bonding circuit board effect.When circuit worked, when namely these positive temperature coefficient independent component 100 residing circuit part temperature were not high, the resistance value of this positive temperature coefficient independent component 100 was very little; On the contrary; if circuit breaks down; namely when positive temperature coefficient independent component 100 residing circuit part temperature are very high; the resistance of this positive temperature coefficient independent component 100 can raise when temperature surpasses a specific critical value suddenly; reduce circuital current thereby reach, play the effect of protective circuit.
Fig. 2 shows the relative structural representation when positive temperature coefficient independent component 100 is connected in circuit protection module 200 in the prior art.100 schematic diagrames that are the simplification of the positive temperature coefficient independent component 100 among Fig. 1 among the figure; the first electrode 140a of this positive temperature coefficient independent component 100 and the second electrode 140b are soldered to respectively on the first pad 260a and 260b of this circuit protection module; as having described among Fig. 1; break down at circuit; namely when positive temperature coefficient independent component 100 residing circuit part temperature are very high; the resistance of this positive temperature coefficient independent component 100 can raise when temperature surpasses a specific critical value suddenly; reduce circuital current thereby reach, play the effect of protective circuit.In order to reduce the power consumption of the required consumption of thermistor; and reduce thus heat that thermistor self produces to the impact of itself condition of work; must reduce the resistance value of thermistor when circuit normal operation of living in as far as possible; in order to reach this purpose; certainly will to strengthen the working face of the core cell thermistor 150 in the positive temperature coefficient independent component 100; this certainly will so that the volume of positive temperature coefficient independent component 100 and on circuit board shared area larger, this has also just caused the circuit protection module at its place must do greatly.The trend of this and current electronic devices and components miniaturization fails to agree.
Fig. 3 (a) shows the structural representation for one embodiment of the present of invention 300, and this embodiment 300 designs in order to solve above-mentioned contradiction just.This embodiment is a kind of circuit protection module 300, this circuit protection module 300 comprises: substrate 330, at least part of zone of wherein said substrate 330 is made of the thermistor 350 with ptc characteristics, and described thermistor 350 has the first electrode (thermistor is near the one side of pad) and the second electrode (thermistor is away from the one side of pad); The first pad 360a and the second pad 360b are positioned at the surface of described substrate 330, and described the first electrode and the second electrode lead to described the first pad 360a and the second pad 360b by the first blind hole 320a and the second blind hole 320b respectively.
Wherein, be formed to the gap 370 of described thermistor 350 first electrodes and described thermistor itself by etching around the second blind hole 320b, thereby directly be not electrically connected with described thermistor 350 first electrodes and described thermistor itself.
Fig. 3 (b) show the variant embodiment 300 of embodiments of the invention 300 ' structural representation.Equally also can be shown in the variant embodiment among Fig. 3 (b) like that, at first the second electrode of described thermistor is electrically connected to described substrate 330 ' away from the one side of described pad 360a ' and 360b ' by blind hole 320c ', and then be electrically connected to the second pad 360b ' by blind hole 320b ', wherein blind hole 320b ' and 320c ' are at described substrate 330 ' be electrically connected away from the one side of described pad 360a ' and 360b '.
By such design; originally be welded in the positive temperature coefficient independent component quilt on the substrate surface and be embedded on the substrate; so not only can save the surface area that is originally occupied by the positive temperature coefficient independent component; the positive temperature coefficient independent component can also be done greatly simultaneously; to reduce its resistance value when circuit works; and the power that consumes of the positive temperature coefficient independent component that reduces thus circuit when normal operation, also reduce its heating simultaneously, thereby reached better circuit protection effect.
Additionally, the described thermistor 350 outer protective finish that are coated with.This coating has the described thermistor 350 of protection and prevents the effect of described thermistor 350 oxidations.This has also just kept the stability of described thermistor material preferably, thereby has guaranteed the normal operation of described thermistor.
Fig. 4 shows the structural representation of an alternative embodiment of the invention; in this illustrated embodiment; described circuit protection module 400 also comprises heat generating components 480, and itself and described thermistor 450 are connected in parallel and with heat exchange pattern heat are delivered to described thermistor 450.
Alternatively, described heat generating components 480 directly fits to described thermistor 450 or fits to described thermistor 450 by Heat Conduction Material, can significantly reduce the operate time of thermistor 450 like this, thereby can reach circuit protection effect just in time.Wherein, described heat generating components comprises resistive device, perceptual device or semiconductor device.And this heat generating components has third electrode and the 4th electrode that is positioned on its two ends, and described third electrode leads to described the first pad 460a by the 3rd blind hole 420c, and the 4th electrode of described heat generating components is drawn by the 4th blind hole 420d electricity.Additionally, be connected with control unit on described the 4th blind hole 420d, the electric current of described heat generating components 480 was flow through in control when described control unit was used for and/or overcurrent overheated when described thermistor unit, to heat described heat generating components 480.Alternatively, described heat generating components 480 and described thermistor 450 be shaped as tabular, flat thermistor and heat generating components are convenient to be installed, and can fit better thermistor and heat generating components, convenient heat conduction.
Fig. 5 shows the structural representation of an alternative embodiment of the invention.Whole substrate all is to be made by the material with positive temperature coefficient among Fig. 5, and substrate 530 is connected to the first pad 560a near the one side of pad by the first blind hole 520a, and substrate 530 is connected to the second pad 560b away from the one side of pad by the second blind hole 520b.Like this; by the first blind hole 520a be connected zone 550 effect in the present embodiment that blind hole 520b connects and be equivalent to thermistor; wherein; be formed to the gap 570 of described thermistor 550 first electrodes and described thermistor itself around the second blind hole 520b by etching; thereby directly be not electrically connected with described thermistor 550 first electrodes and described thermistor itself, present embodiment can reach the circuit protection effect the same with the embodiment shown in Fig. 3.
Those skilled in the art should be understood that the embodiment shown in Fig. 3 (a), Fig. 3 (b), Fig. 4 and Fig. 5 only is example embodiment, and printed circuit board (PCB) wherein can certainly be two-layer or sandwich construction.
Than traditional circuit protection module; circuit protection module of the present invention has been improved the weatherability of positive temperature coefficient element; and by embedded positive temperature coefficient element; be conducive to encapsulation; simultaneously so that needn't be so harsh to the dimensional requirement of positive temperature coefficient element; economized out in addition surface area; for further compact PCB has been made contribution; can also select positive temperature coefficient element directly is embedded in below the ballistic device of appointment, improve the temperature-sensitive protection effect of positive temperature coefficient element.In addition, this circuit protection module has been saved the trouble that the user welds the positive temperature coefficient independent component, namely uses this circuit protection module significantly to reduce production costs.
Although in accompanying drawing and aforesaid description, illustrate in detail and described the present invention, should think that this is illustrated and describes is illustrative and exemplary, rather than restrictive; The invention is not restricted to above-mentioned execution mode.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned example embodiment, and in the situation that does not deviate from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, in any case, all should regard embodiment as exemplary, and be nonrestrictive.In addition, significantly, " comprising ", other elements and step do not got rid of in a word.A plurality of elements of stating in the device claim also can be realized by an element.The first, the second word such as grade is used for representing title, and does not represent any specific order.
Claims (9)
1. a circuit protection module is characterized in that, comprising:
Substrate, at least part of zone of wherein said substrate is made of the thermistor with ptc characteristics, and described thermistor has the first electrode and the second electrode;
The first pad and the second pad are positioned at the surface of described substrate, and described the first electrode and the second electrode lead to described the first pad and the second pad by the first blind hole and the second blind hole respectively.
2. described circuit protection module according to claim 1 is characterized in that described thermistor is coated with protective finish outward.
3. described circuit protection module according to claim 1 is characterized in that described circuit protection module also comprises heat generating components, and itself and described thermistor are connected in parallel and with heat exchange pattern heat are delivered to described thermistor.
4. described circuit protection module according to claim 3 is characterized in that described heat generating components directly fits to described thermistor or fits to described thermistor by Heat Conduction Material.
5. described circuit protection module according to claim 3 is characterized in that described heat generating components comprises resistive device, perceptual device or semiconductor device.
6. described circuit protection module according to claim 3; it is characterized in that; described heat generating components has third electrode and the 4th electrode that is positioned on its two ends, and described third electrode leads to described the first pad by the 3rd blind hole, and the 4th electrode of described heat generating components is drawn by the 4th blind hole electricity.
7. described circuit protection module according to claim 3; it is characterized in that; be connected with control unit on described the 4th blind hole, the electric current of described heat generating components was flow through in control when described control unit was used for and/or overcurrent overheated when described thermistor unit, to heat described heat generating components.
8. described circuit protection module according to claim 3 is characterized in that, described heat generating components be shaped as tabular.
9. according to each described circuit protection module in the above claim, it is characterized in that, described thermistor be shaped as tabular.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201578744U CN202697037U (en) | 2012-04-13 | 2012-04-13 | Circuit protection module |
| KR2020130002845U KR200487209Y1 (en) | 2012-04-13 | 2013-04-12 | Protection circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201578744U CN202697037U (en) | 2012-04-13 | 2012-04-13 | Circuit protection module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202697037U true CN202697037U (en) | 2013-01-23 |
Family
ID=47552586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201578744U Expired - Lifetime CN202697037U (en) | 2012-04-13 | 2012-04-13 | Circuit protection module |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR200487209Y1 (en) |
| CN (1) | CN202697037U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276402A (en) * | 2014-07-22 | 2016-01-27 | 玉晶光电股份有限公司 | Lamp with overheat protection mechanism |
| CN107683019A (en) * | 2017-09-30 | 2018-02-09 | 奇酷互联网络科技（深圳）有限公司 | Circuit board, circuit board manufacturing method, temperature checking method and electronic equipment |
| KR20190037266A (en) * | 2016-08-02 | 2019-04-05 | 보우린스, 인크. | Connector with Integrated Resettable Thermal Fuse |
| CN110636689A (en) * | 2019-09-26 | 2019-12-31 | 上海长园维安电子线路保护有限公司 | Protection plate suitable for pasting and mounting over-current protection device PTC |
| CN113097985A (en) * | 2021-04-01 | 2021-07-09 | 上海维安电子有限公司 | Protection module with overcurrent quick response |
| CN114143956A (en) * | 2021-10-21 | 2022-03-04 | 华为技术有限公司 | Packaging structure, preparation method thereof, packaging module and electronic device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3439276B2 (en) * | 1994-12-21 | 2003-08-25 | ニチコン株式会社 | Ceramic heater |
| JP5707710B2 (en) * | 2010-03-08 | 2015-04-30 | Tdk株式会社 | Multilayer chip parts |
-
2012
- 2012-04-13 CN CN2012201578744U patent/CN202697037U/en not_active Expired - Lifetime
-
2013
- 2013-04-12 KR KR2020130002845U patent/KR200487209Y1/en active IP Right Grant
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276402A (en) * | 2014-07-22 | 2016-01-27 | 玉晶光电股份有限公司 | Lamp with overheat protection mechanism |
| CN105276402B (en) * | 2014-07-22 | 2018-01-12 | 玉晶光电股份有限公司 | Light fixture with overtemperature protection mechanism |
| KR20190037266A (en) * | 2016-08-02 | 2019-04-05 | 보우린스, 인크. | Connector with Integrated Resettable Thermal Fuse |
| EP3494581A4 (en) * | 2016-08-02 | 2020-07-08 | Bourns, Inc. | Connector with integrated resettable thermal fuse |
| US11456565B2 (en) | 2016-08-02 | 2022-09-27 | Bourns, Inc. | Connector with integrated resettable thermal fuse |
| KR102449996B1 (en) | 2016-08-02 | 2022-09-30 | 보우린스, 인크. | Connector with integrated resettable thermal fuse |
| CN107683019A (en) * | 2017-09-30 | 2018-02-09 | 奇酷互联网络科技（深圳）有限公司 | Circuit board, circuit board manufacturing method, temperature checking method and electronic equipment |
| CN107683019B (en) * | 2017-09-30 | 2021-03-30 | 奇酷互联网络科技（深圳）有限公司 | Circuit board, circuit board manufacturing method, temperature detection method and electronic equipment |
| CN110636689A (en) * | 2019-09-26 | 2019-12-31 | 上海长园维安电子线路保护有限公司 | Protection plate suitable for pasting and mounting over-current protection device PTC |
| CN113097985A (en) * | 2021-04-01 | 2021-07-09 | 上海维安电子有限公司 | Protection module with overcurrent quick response |
| CN114143956A (en) * | 2021-10-21 | 2022-03-04 | 华为技术有限公司 | Packaging structure, preparation method thereof, packaging module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200487209Y1 (en) | 2018-08-21 |
| KR20130006140U (en) | 2013-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Xuhui District Caohejing Development Zone of Shanghai City, Qinzhou road 200233 No. 307 Patentee after: Shanghai Li Tao Electronics Co., Ltd. Address before: Xuhui District Caohejing Development Zone of Shanghai City, Qinzhou road 200233 No. 307 Patentee before: Ruikan Electronics (Shanghai) Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |
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| CX01 | Expiry of patent term |