CN202692410U - Semiconductor heat pump heater utilizing heat liquid source - Google Patents
Semiconductor heat pump heater utilizing heat liquid source Download PDFInfo
- Publication number
- CN202692410U CN202692410U CN 201220324468 CN201220324468U CN202692410U CN 202692410 U CN202692410 U CN 202692410U CN 201220324468 CN201220324468 CN 201220324468 CN 201220324468 U CN201220324468 U CN 201220324468U CN 202692410 U CN202692410 U CN 202692410U
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- heat pump
- heat
- heated body
- thermoelectric heat
- hydrothermal
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Abstract
The utility model discloses a semiconductor heat pump heater utilizing heat liquid source. The semiconductor heat pump heater comprises a semiconductor heat pump arranged on the outer wall of the bottom of a heated body, a heat liquid heat exchanger, a temperature detector, a controller and power system, wherein the surface of a heated surface of the semiconductor heat pump is contacted with the bottom of the heated body, the surface of a refrigeration surface of the semiconductor heat pump is contacted with the heat liquid heat exchanger, the temperature detector is contacted with the bottom of the heated body, the controller is connected with the temperature detector and the power system, the power system is connected with the semiconductor heat pump, and an inlet end of the heat liquid heat exchanger is communicated with a waste heat liquid source. The semiconductor heat pump heater provided by the utility model has the advantages that the structure is simple, waste heat liquid generated by heat recovery is fully utilized, an air source heat pump obtains low-energy-consumption hot water, the heating efficiency is high, the energy source is saved, and the discharge is reduced.
Description
Technical field
The utility model relates to heater, particularly relates to hydrothermal sources thermoelectric heat pump heater.
Background technology
Because people are also more and more to the demand of resource now, but tellurian resource is limited, because country and individual become the top priority of energy-saving and emission-reduction to the recycling of waste water and used heat.At present in the kitchen as boil water or heat soup stock etc. and the liquid such as the water heated body (such as the pot body) in or other soup stocks need to be boiled or heat and all need to use coal gas or use electromagnetic oven, heat energy heating heated body during with gas-fired perhaps uses electric energy conversion as magnetic energy and with electromagnetic oven heating.The efficiency of heating surface is lower like this, and energy consumption is higher, and can not be with used heat liquid, takes full advantage of such as the comprehensive a large amount of hot water that reclaim the low cost recovery such as air-conditioning, refrigerator, solar water heater in the used heat liquid in kitchen in water for industrial use and the family, the energy saving building.
Now when catering trade is carried out energy-saving and emission-reduction, utilize the technology such as water resource heat pump, can high efficiency the heat recovery of the occasions such as refrigerator-freezer, ice machine, air-conditioning, sewage recuperation of heat be produced a large amount of high temperature 70 degree hot water, how to utilize these hot water to realize the cooking of food is heated, have very large energy-conservation, reduction of discharging and be worth.
The Energy Efficiency Ratio of the heat pump of employing compressor is very high at present, be up to more than 11.2, but general output temperature is also not high, can only reach about 70 degree, and during therefore a lot of energy-saving and emission-reduction heat recovery application, it is narrower to produce a large amount of hot water application surfaces.The thermoelectric heat pump technology has the ability of " moving " heat equally, and operating temperature range is wider.About 60 degree of the temperature difference that thermoelectric heat pump can produce, but Energy Efficiency Ratio is lower, about 0.5.Therefore, use thermoelectric heat pump, can under the prior art condition, with the hot water application expansion of multiple recycling, just can be used for being incubated, stewing, boil such as the kitchen tools industry, greatly reduce energy consumption.
Summary of the invention
The utility model is finished in order to solve deficiency of the prior art, that the purpose of this utility model provides is simple in structure, can take full advantage of used heat liquid, reclaim hot water, air-source hot water, solar water, the thermal source cost is low, and energy consumption is low, the efficiency of heating surface is higher, save the energy, reduce the hydrothermal sources thermoelectric heat pump heater that discharges.
Hydrothermal sources thermoelectric heat pump heater of the present utility model, comprise the thermoelectric heat pump, hydrothermal solution heat exchanger, thermal detector, controller and the power-supply system that are arranged on the heated body bottom outer wall, the heating face surface of described thermoelectric heat pump contacts with the heated body bottom, the chill surface surface of described thermoelectric heat pump contacts with the hydrothermal solution heat exchanger, described thermal detector contacts with the heated body bottom, described controller is connected with power-supply system with thermal detector, described power-supply system is connected with described thermoelectric heat pump, and described hydrothermal solution heat exchanger entrance point communicates with useless hydrothermal sources.
Hydrothermal sources thermoelectric heat pump heater of the present utility model can also be:
Described thermoelectric heat pump is sheet, and at least one chip semiconductor heat pump sheet is set on the described heated body bottom outer wall.
Described thermoelectric heat pump evenly is arranged on described heated body bottom.
Described hydrothermal solution heat exchanger or be arranged on the chill surface of described thermoelectric heat pump, the outer wall of described hydrothermal solution heat exchanger contacts with the chill surface of described thermoelectric heat pump.
Hydrothermal sources thermoelectric heat pump heater of the present utility model, because it comprises thermoelectric heat pump, hydrothermal solution heat exchanger, thermal detector, controller and the power-supply system that is arranged on the heated body bottom outer wall, the heating face of described thermoelectric heat pump contacts with the heated body bottom, the chill surface surface of described thermoelectric heat pump contacts with the hydrothermal solution heat exchanger, described thermal detector contacts with the heated body bottom, described controller is connected with power-supply system with thermal detector, described power-supply system is connected with described thermoelectric heat pump, and described hydrothermal solution heat exchanger entrance point communicates with useless hydrothermal sources.Like this, thermoelectric heat pump is delivered to the heat conduction of the Btu utilization self in the used heat liquid in the hydrothermal solution heat exchanger first heated body bottom and the further liquid of heat exchange to the heated body, heating liquid in the heated body is extremely consistent with the used heat liquid temp or approaching, then controller control power-supply system is to semiconductor electric heating pump power supply and in running order, in semi-conductor electricity heat pump heating time itself, continues " pump " and send or conduct transfer heat, with the heating liquid in the heated body to target temperature, such as 100 ℃.
Description of drawings
Fig. 1 the utility model hydrothermal sources thermoelectric heat pump heater embodiment schematic diagram.
The figure number explanation
1 ... heated body 2 ... thermoelectric heat pump 3 ... the hydrothermal solution heat exchanger
4 ... liquid
The specific embodiment
Fig. 1 below in conjunction with accompanying drawing is described in further detail hydrothermal sources thermoelectric heat pump heater of the present utility model and the method for utilizing this heater to heat.
Hydrothermal sources thermoelectric heat pump heater of the present utility model, please refer to Fig. 1, comprise the thermoelectric heat pump 2 that is arranged on heated body 1 bottom outer wall, hydrothermal solution heat exchanger 3, thermal detector, controller and power-supply system, the heating face of described thermoelectric heat pump 2 contacts with heated body 1 bottom, chill surface surface and hydrothermal solution heat exchanger 3 close contacts of described thermoelectric heat pump 2, described thermal detector contacts with heated body 1 bottom, described controller is connected with power-supply system with thermal detector, described power-supply system is connected with described thermoelectric heat pump 2, and described hydrothermal solution heat exchanger 3 entrance points communicate with useless hydrothermal sources.Like this, thermoelectric heat pump 2 conducts to the heat in the used heat liquid in the hydrothermal solution heat exchanger 3 first heated body 1 bottom and the further liquid 4 of heat exchange to the heated body 1 naturally, be heated to heated body 1 interior liquid 4 consistent with the used heat liquid temp or approach, then controller control power-supply system is to semiconductor electric heating pump power supply and in running order, in semi-conductor electricity heat pump heating time itself, continues " pump " and send and conduct transfer heat, and the liquid 4 in the heated body 1 is heated to target temperature such as 100 ℃.Advantage with respect to prior art is that the efficiency of heating surface is high, takes full advantage of waste heat and used heat liquid, reduces energy consumption, energy-saving and emission-reduction.
Hydrothermal sources thermoelectric heat pump heater of the present utility model please refer to Fig. 1, and on the basis of technical scheme, further preferred technical scheme is that described thermoelectric heat pump 2 is sheet, on described heated body 1 bottom outer wall at least one chip semiconductor heat pump 2 is set in front.Certainly the number of thermoelectric heat pump 2 is more, and the efficient of the heat conduction in the whole used heat liquid is just higher, and the efficiency of heating surface is higher.If but number is too many, cost also has corresponding increase so.Further preferred technical scheme is that described thermoelectric heat pump 2 evenly is arranged on described heated body 1 bottom.The thermal conduction effect of thermoelectric heat pump 2 is more even like this, can evenly heat heated body 1, and heating effect is higher, and it is faster to heat up.Can also be described hydrothermal solution heat exchanger 3 or be arranged on the chill surface of described thermoelectric heat pump 2 that the outer wall of described hydrothermal solution heat exchanger contacts with the chill surface of described thermoelectric heat pump.Like this hydrothermal solution heat exchanger 3 and thermoelectric heat pump 2 around all contact, the heat of thermal wastewater that can hydrothermal solution heat exchanger 3 is interior is as much as possible to be conducted to heated body 1 bottom by thermoelectric heat pump 2 heated body 1 interior liquid 4 is heated.Guarantee taking full advantage of of the interior heat of used heat liquid, improve the utilization ratio of used heat liquid.
The invention also discloses the method for utilizing above-mentioned hydrothermal sources thermoelectric heat pump heater that the kitchen tools in the kitchen are heated, with reference to figure 1, it may further comprise the steps:
A. temperature is met or exceeded 60-70 ℃ used heat liquid from hydrothermal sources input hydrothermal solution heat exchanger 3, in the lower situation of heated body 1 temperature, heat in the hydrothermal solution in the hydrothermal solution heat exchanger 3 is converted to thermoelectric heat pump 2, thermoelectric heat pump 2 as a heat carrier with this part heat delivery to heated body 1 bottom, so that liquid 4 heat exchange in heat and the heated body 1, liquid 4 in the heated body 1 heats up, and the hydrothermal solution temperature in the hydrothermal solution heat exchanger 3 reduces and discharges from hydrothermal solution heat exchanger 3 ports of export simultaneously;
B. thermal detector is measured the temperature in the bottom of a pan in real time, when cooking bottom temperature reaches or during near the used heat liquid temp, controller control thermoelectric heat pump 2 starts heating and " heat pump " function, when itself generates heat, the heat " pump " of hydrothermal solution heat exchanger 3 is delivered to heated body 1 bottom liquid 4 temperature in the heated body 1 are risen to target temperature, such as 100 ℃.
Like this, heated body 1 bottom be warming up to or near the used heat liquid temp before, heat conducts the heat that comes from the used heat liquid to heated body by the semiconductor heat pump installation, and when temperature reach or near the used heat liquid temp after, origin of heat is in himself heating and continue the heat that conduction is carried.Efficient is higher like this, sends identical heat, but can the low 25-60% of loss-rate common electrical mode of heating.Heating efficiency is high, and takes full advantage of used heat liquid and kitchen residual heat liquid, air heat source, and heating efficiency is high, saves the energy, and new discharges heat is few, energy-saving and emission-reduction.
Above-mentionedly only several specific embodiments in the utility model are illustrated; but can not be as protection domain of the present utility model; every equivalence variation of having done according to the design spirit in the utility model or modification or equal proportion zoom in or out etc., all should think to fall into protection domain of the present utility model.
Claims (4)
1. hydrothermal sources thermoelectric heat pump heater, it is characterized in that: comprise the thermoelectric heat pump, hydrothermal solution heat exchanger, thermal detector, controller and the power-supply system that are arranged on the heated body bottom outer wall, the heating face surface of described thermoelectric heat pump contacts with the heated body bottom, chill surface surface and the hydrothermal solution heat exchanger close contact of described thermoelectric heat pump, described thermal detector contacts with the heated body bottom, described controller is connected with power-supply system with thermal detector, described power-supply system is connected with described thermoelectric heat pump, and described hydrothermal solution heat exchanger entrance point communicates with useless hydrothermal sources.
2. hydrothermal sources thermoelectric heat pump heater according to claim 1, it is characterized in that: described thermoelectric heat pump is sheet, and at least one chip semiconductor heat pump is set on the described heated body bottom outer wall.
3. hydrothermal sources thermoelectric heat pump heater according to claim 2 is characterized in that: described thermoelectric heat pump evenly is arranged on described heated body bottom.
4. according to claim 1 and 2 or 3 described hydrothermal sources thermoelectric heat pump heaters, it is characterized in that: described hydrothermal solution heat exchanger is arranged on the chill surface of described thermoelectric heat pump, and the outer wall of described hydrothermal solution heat exchanger contacts with the chill surface of described thermoelectric heat pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220324468 CN202692410U (en) | 2012-07-06 | 2012-07-06 | Semiconductor heat pump heater utilizing heat liquid source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220324468 CN202692410U (en) | 2012-07-06 | 2012-07-06 | Semiconductor heat pump heater utilizing heat liquid source |
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| Publication Number | Publication Date |
|---|---|
| CN202692410U true CN202692410U (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220324468 Expired - Fee Related CN202692410U (en) | 2012-07-06 | 2012-07-06 | Semiconductor heat pump heater utilizing heat liquid source |
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| Country | Link |
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| CN (1) | CN202692410U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721176A (en) * | 2012-07-06 | 2012-10-10 | 苟仲武 | Hydrotherm source semiconductor heat pump heater and heating method utilizing same |
-
2012
- 2012-07-06 CN CN 201220324468 patent/CN202692410U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721176A (en) * | 2012-07-06 | 2012-10-10 | 苟仲武 | Hydrotherm source semiconductor heat pump heater and heating method utilizing same |
| CN102721176B (en) * | 2012-07-06 | 2014-08-13 | 苟仲武 | Hydrotherm source semiconductor heat pump heater and heating method utilizing same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Sun Yifei Document name: Notification of Passing Examination on Formalities |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20180706 |
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| CF01 | Termination of patent right due to non-payment of annual fee |