CN202676326U - Low power consumption heat meter - Google Patents
Low power consumption heat meter Download PDFInfo
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- CN202676326U CN202676326U CN 201220364101 CN201220364101U CN202676326U CN 202676326 U CN202676326 U CN 202676326U CN 201220364101 CN201220364101 CN 201220364101 CN 201220364101 U CN201220364101 U CN 201220364101U CN 202676326 U CN202676326 U CN 202676326U
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Abstract
The utility model relates to a low power consumption heat meter. The traditional heat meters have the problem of high power consumption. According to the low power consumption heat meter, a Wiegand signal acquisition module is used for acquiring flow information in a pipeline, and an output end has a signal connection with an I/O (Input/Output) port of an MCU (Microprogrammed Control Unit) processing control module; a temperature measurement module is used for respectively acquiring inlet water temperature and return water temperature, and an output end has a signal connection with the I/O port of the MCU processing control module; an output end of a key control module and an input end of a liquid crystal display module have signal connections with the I/O port of the MCU processing control module; a storage module, a valve control module, a reading and writing card module and an infrared communication module respectively have a signal connection with the I/O port of the MCU processing control module; and the key control module comprises a key K1, and the reading and writing card module or the infrared communication module is respectively enabled through confirming the pressing numbers of times of the key K1. After a 32-bit singlechip with a Cortex-M3 kernel design is adopted, the power consumption is lower.
Description
Technical field
The utility model belongs to the technology of instrument and meter field, relates to a kind of low-power consumption calorimeter.
Background technology
At the beginning of 21 century, eight ministries and commissions such as Minstry of Housing and Urban-Rural Development of People Republic of China (MOHURD) have proposed new heat metering method, the relatively more concentrated city of heating is used the system of single household heat charging, but until today, calorimeter does not have large tracts of land and popularizes and to come, trace it to its cause and mainly contain two aspects: at first the measurement of heat metering is accurately low, and the secondth, the core of calorimeter-computer circuits power consumption is excessive.The serviceable life of calorimeter is not long.Present domestic calorimeter generally all adopts U.S. MSP430CPU to make computer circuits, and computer circuits is the core of calorimeter, and its power consumption when static state needs 10-20 μ A, and power consumption will reach 40-50 μ A during the general work state.And the CJ-128-2007 standard code, the one joint disposable lithium cell life-span of employing must be greater than 6 years.The precision of a lot of calorimeter producers can only reach national 2-3 grade standard, even can reach 2 grade standard precision when part producer dispatches from the factory, spent several years after, cross high reason owing to the loss of battery own and counter power consumption, electronic circuit can't be in under-voltage lower normal operation.Thereby cause measuring accuracy can't guarantee accurately.
Summary of the invention
The utility model is for the deficiencies in the prior art, adopted and announced first in the world Norway's " Geko " MCU--EFM32 microprocessor chip up-to-date, that processing capacity is strong, fastest, the most least in power-consuming, invented the computer circuits of low-power consumption calorimeter.Be applicable to ultrasound wave and Prepayment Heat Meter.
The technical scheme that the utility model technical solution problem is taked is:
The utility model comprises power module, key control module, memory module, valve control module, read-write card module, infrared communication module, MCU processing and control module, Wiegand signal acquisition module, temperature-measuring module and LCD MODULE.
The Wiegand signal acquisition module gathers ducted flow information, and the output terminal of Wiegand signal acquisition module is connected with the I/O mouth signal of MCU processing and control module; The temperature-measuring module collection gathers respectively inflow temperature and return water temperature; The output terminal of key control module is connected with the I/O mouth signal of MCU processing and control module; The input end of LCD MODULE is connected with the I/O mouth signal of MCU processing and control module; Temperature-measuring module, memory module, valve control module, read-write card module are connected with infrared communication module with the I/O mouth signal of MCU processing and control module and are connected; Power module provides power supply for key control module, valve control module, read-write card module, MCU processing and control module and Wiegand signal acquisition module.
Described key control module comprises button K1, enables respectively to read and write card module or infrared communication module by the number of times of pressing of confirming button K1.
The beneficial effects of the utility model: after adopting 32 single-chip microcomputers of Cortex-M3 core design, stronger than 430 traditional single-chip microcomputer processing poweies, power consumption is lower, wakeup time is shorter under the low-power consumption mode, greatly lowered the power consumption of circuit, static working current is less than 4 μ A, and the general work electric current is less than 12 μ A, prolong the serviceable life of battery, reached energy-saving effect.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is power module circuitry figure in the utility model;
Fig. 3 is valve control module circuit diagram in the utility model;
Fig. 4 is Wiegand signal acquisition module circuit diagram in the utility model;
Fig. 5 is temperature-measuring module circuit diagram in the utility model;
Fig. 6 is key control module circuit diagram in the utility model;
Fig. 7 is memory module circuit diagram in the utility model;
Fig. 8 is LCD MODULE circuit diagram in the utility model;
Fig. 9 is MCU processing and control module circuit diagram in the utility model;
Figure 10 is infrared communication module circuit diagram in the utility model;
Figure 11 is read-write card module module circuit diagram in the utility model.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, the present embodiment comprises power module 1, key control module 2, memory module 3, valve control module 4, read-write card module 5, infrared communication module 6, MCU processing and control module 7, Wiegand signal acquisition module 8, temperature-measuring module 9 and LCD MODULE 10.
The Wiegand signal acquisition module gathers ducted flow information, and the output terminal of Wiegand signal acquisition module is connected with the I/O mouth signal of MCU processing and control module; The temperature-measuring module collection gathers respectively inflow temperature and return water temperature; The output terminal of key control module is connected with the I/O mouth signal of MCU processing and control module; The input end of LCD MODULE is connected with the I/O mouth signal of MCU processing and control module; Temperature-measuring module, memory module, valve control module, read-write card module are connected with infrared communication module with the I/O mouth signal of MCU processing and control module and are connected; Power module provides power supply for key control module, valve control module, read-write card module, MCU processing and control module and Wiegand signal acquisition module.
As shown in Figure 2, power module comprises Voltage stabilizing module and detection of power loss module, and the voltage of outside input is exported 3.0V voltage behind Voltage stabilizing module, and when the voltage of outside input was lower than 2.0V, the detection of power loss module sent a signal to the MCU processing and control module.
Described Voltage stabilizing module comprises the first connector J1, the first diode D1, farad capacitor E1, the first electrochemical capacitor E2, the first capacitor C 1, the second capacitor C 2, the 3rd capacitor C 3, the 4th capacitor C 4, the 5th capacitor C 5, the 6th capacitor C 6, voltage stabilizing chip U2.
The 1 pin ground connection of the first connector J1, the anode of the first diode D1 connect external input voltage by 2 pin of the first connector J1; The negative electrode of the first diode D1 is connected with the positive pole of farad capacitor E1,3 pin of voltage stabilizing chip U2 respectively, and 2 pin of voltage stabilizing chip U2 connect the positive pole of the first electrochemical capacitor E2, this pin output 3.0V voltage; The equal ground connection of negative pole of 1 pin of the negative pole of farad capacitor E1, voltage stabilizing chip U2, the first electrochemical capacitor E2.
The first capacitor C 1, the second capacitor C 2, the 3rd capacitor C 3, the 4th capacitor C 4, the 5th capacitor C 5 and the 6th capacitor C 6 are connected in parallel between 2 pin and ground of the second voltage stabilizing chip U2; Described voltage stabilizing chip U2 model is BL8064-3.0.
Described detection of power loss module comprises detection of power loss chip U3, and 2 pin of detection of power loss chip U3 connect the voltage of outside input, the 3 pin ground connection of detection of power loss chip U3, and 1 pin of detection of power loss chip U3 connects 13 pin of MCU chip U1; The model of described detection of power loss chip U3 is BL8506-2.0.
As shown in Figure 3, valve control module comprises the second connector J2, the first resistance R 1, the second resistance R 2, the 3rd resistance R 3, the 4th resistance R 4, the 5th resistance R 5, the 6th resistance R 6, the first metal-oxide-semiconductor Q1, the second metal-oxide-semiconductor Q2, the 3rd metal-oxide-semiconductor Q3, the 4th metal-oxide-semiconductor Q4, the 5th metal-oxide-semiconductor Q5, the 7th capacitor C 7 and the 8th capacitor C 8.
One end of the first resistance R 1 is connected with 19 pin of MCU chip U1, and the other end of the first resistance R 1 is connected with the grid of the first metal-oxide-semiconductor Q1, the grid of the 3rd metal-oxide-semiconductor Q3 respectively.
One end of the second resistance R 2 is connected with 32 pin of MCU chip U1, and the other end of the second resistance R 2 is connected with the grid of the second metal-oxide-semiconductor Q2, the grid of the 4th metal-oxide-semiconductor Q4 respectively.
The source ground of the source electrode of the 3rd metal-oxide-semiconductor Q3, the 4th metal-oxide-semiconductor Q4, the drain electrode of the 3rd metal-oxide-semiconductor Q3 is connected with the drain electrode of the first metal-oxide-semiconductor Q1, and the drain electrode of the 4th metal-oxide-semiconductor Q4 is connected with the drain electrode of the second metal-oxide-semiconductor Q2; The source electrode of the first metal-oxide-semiconductor Q1 is connected with the source electrode of the second metal-oxide-semiconductor Q2, the source electrode of the 5th metal-oxide-semiconductor Q5, an end of the 5th resistance R 5, an end of the 6th resistance R 6 respectively, the other end of the 5th resistance R 5 is connected with 28 pin of MCU chip U1 by 3 pin of the second connector J2, and the other end of the 6th resistance R 6 is connected with 29 pin of MCU chip U1 by 2 pin of the second connector J2.
The grid of the 5th metal-oxide-semiconductor Q5 is connected with an end of the 4th resistance R 4, one end of the drain electrode of the 5th metal-oxide-semiconductor Q5, the 3rd resistance R 3 all connects 3.0V voltage, one end of the other end of the other end of the 4th resistance R 4, the 3rd resistance R 3, the 7th capacitor C 7 all is connected with 18 pin of MCU chip U1, the other end ground connection of the 7th capacitor C 7.
One end of the 8th capacitor C 8 is connected with the drain electrode of the drain electrode of the 3rd metal-oxide-semiconductor Q3, the first metal-oxide-semiconductor Q1, and the other end of the 8th capacitor C 8 is connected with the drain electrode of the 4th metal-oxide-semiconductor Q4, the drain electrode of the second metal-oxide-semiconductor Q2; The drain electrode of the drain electrode of the 3rd metal-oxide-semiconductor Q3, the first metal-oxide-semiconductor Q1 also is connected with an input end of direct current generator by 5 pin of the second connector J2, the drain electrode of the drain electrode of the 4th metal-oxide-semiconductor Q4, the second metal-oxide-semiconductor Q2 also is connected with another input end of direct current generator by 4 pin of the second connector J2, the 1 pin ground connection of the second connector J2, described direct current generator is used for driving the switch of valve, and its model is RF-300.
As shown in Figure 4, the Wiegand signal acquisition module comprises the 3rd connector J3, the 9th capacitor C 9, the tenth capacitor C 10, the 11 capacitor C 11, the 12 capacitor C 12, the 7th resistance R 7, the 8th resistance R 8, the 9th resistance R 9, the tenth resistance R 10, the 11 resistance R 11, the first triode Q6 and the second triode Q7.
The 1 pin ground connection of the 3rd connector J3, an end of an end of the 9th capacitor C 9, the 8th resistance R 8, an end of the 11 capacitor C 11 are connected with an output terminal of Wiegand sensor by 2 pin of the 3rd connector J3.
The other end ground connection of the 8th resistance R 8, the other end of the 9th capacitor C 9 respectively with an end of the 7th resistance R 7, the base stage of the first triode Q6 connects, the emitter of the other end of the 7th resistance R 7, the first triode Q6 connects 3.0V voltage; The collector of the first triode Q6 is connected the other end ground connection of the other end of the 9th resistance R 9, the tenth capacitor C 10 with an end of the 9th resistance R 9, an end of the tenth capacitor C 10,38 pin of MCU chip U1 respectively.
The other end of the 11 capacitor C 11 is connected with the base stage of the second triode Q7, an end of the 11 resistance R 11 respectively, the equal ground connection of the other end of the emitter of the second triode Q7, the 11 resistance R 11, one end of the collector of the second triode Q7, the tenth resistance R 10, an end of the 12 capacitor C 12 are connected with 37 pin of MCU chip U1, another termination 3.0V voltage of the tenth resistance R 10, the other end ground connection of the 12 capacitor C 12.
As shown in Figure 5, temperature-measuring module comprises the 4th connector J4, the 5th connector J5, the 12 resistance R 12, the 13 resistance R 13 and the second electrochemical capacitor E3.
1 pin of the 4th connector J4 with are connected pin and are connected with the output terminal of the platinum resistance PT1000 of water inlet respectively, 1 pin of the 5th connector J5 with are connected pin and are connected with the output terminal of the platinum resistance PT1000 at water return outlet place respectively; 2 pin of the 4th connector J4 also are connected with 46 pin of MCU chip U1,1 pin of the 5th connector J5 also is connected with 47 pin of MCU chip U1,1 pin of the 4th connector J4 also is connected with 2 pin of the 5th connector J5, an end of the 12 resistance R 12, an end of the 13 resistance R 13, the positive pole of the second electrochemical capacitor E3 respectively, 22 pin of another termination MCU chip U1 of the 12 resistance R 12,36 pin of another termination MCU chip U1 of the 13 resistance R 13, the minus earth of the second electrochemical capacitor E3.
As shown in Figure 6, key control module comprises button K1 and the 14 resistance R 14, and the end of button K1, an end of the 14 resistance R 14 are connected with 21 pin of MCU chip U1, the other end ground connection of button K1, another termination 3.0V voltage of the 14 resistance R 14.
As shown in Figure 7 and Figure 8, memory module comprises storage chip U4, the 15 resistance R 15, the 16 resistance R 16 and the 13 capacitor C 13.
1 pin of storage chip U4,2 pin, 3 pin and 4 pin ground connection, 5 pin of storage chip U4, an end of the 16 resistance R 16 are connected with 34 pin of MCU chip U1,6 pin of storage chip U4, an end of the 15 resistance R 15 are connected with 35 pin of MCU chip U1,7 pin of storage chip U4, an end ground connection of the 13 capacitor C 13, the other end of 8 pin of storage chip U4, the other end of the 13 capacitor C 13, the 15 resistance R 15, the other end of the 16 resistance R 16 all are connected with 31 pin of MCU chip U1; The model of described storage chip U4 is 24C16.Described LCD MODULE is selected 4 * 23 totally 92 sections LCD.
As shown in Figure 9, the MCU processing and control module comprises MCU chip U1, the 14 capacitor C 14, the 15 capacitor C 15, the 16 capacitor C 16, crystal oscillator Y1 and jtag interface J7.
One end of the 15 capacitor C 15, the end of crystal oscillator Y1 is connected with 15 pin of MCU chip U1, one end of the 16 capacitor C 16, the other end of crystal oscillator Y1 is connected with 16 pin of MCU chip U1, the other end of the 15 capacitor C 15, the other end ground connection of the 16 capacitor C 16, one end of the 14 capacitor C 14 is connected with 40 pin of MCU chip U1, the other end ground connection of the 14 capacitor C 14,1 pin of jtag interface J7 connects 3.0V voltage, 4 pin connect 48 pin of MCU chip U1,6 pin connect 20 pin of MCU chip U1,7 pin connect 49 pin of MCU chip U1,9 pin connect 50 pin of MCU chip U1,8 pin and 10 pin ground connection, and other pin is unsettled; The model of MCU chip U1 is EFM32TG840F32, referring to Fig. 8.
As shown in figure 10, infrared communication module comprises infrared receiving terminal U5, the 17 resistance R 17, the 18 resistance R 18, the 19 resistance R 19, the 20 resistance R 20, the 21 resistance R 21, the 22 resistance R 22, the 17 capacitor C 16, the 3rd triode Q8, the 4th triode Q9 and infrared sending tube D2,1 pin of infrared receiving terminal U5 connects an end of the 22 resistance R 22,3 pin of infrared receiving terminal U5, one end of the other end of the 22 resistance R 22 and the 17 capacitor C 16 all is connected with 33 pin of MCU chip U1, the other end ground connection of the 17 capacitor C 16, the 2 pin ground connection of infrared receiving terminal U5; The model of described infrared receiving terminal U5 is HS-0038.
One end of the 17 resistance R 17, an end of the 18 resistance R 18 all are connected with 24 pin of MCU chip U1, the emitter of the other end of the 17 resistance R 17, the 3rd triode Q8 all is connected with 33 pin of MCU chip U1, and the other end of the 18 resistance R 18 is connected with the base stage of the 3rd triode Q8.
One end of the 19 resistance R 19, an end of the 20 resistance R 20 all are connected with 30 pin of MCU chip U1, the other end of the 19 resistance R 19 is connected with the base stage of the 4th triode Q9, the other end of the 20 resistance R 20 is connected with 33 pin of MCU chip U1, the emitter of the 4th triode Q9 connects and is connected with the collector of the 3rd triode Q8, the collector of the 4th triode Q9 is connected with an end of the 21 resistance R 21, the other end of the 21 resistance R 21 and the anodic bonding of infrared sending tube D2, the plus earth of infrared sending tube D2.
As shown in figure 11, the read-write card module comprises the power supply detection module of swiping the card, frequency division module, swipe the card induction module and signal amplification module, the power supply detection module of swiping the card is other module for power supply, and frequency division module provides reference frequency signal to the induction module of swiping the card, and the induction module of swiping the card connects the signal amplification module.
The described power supply detection module of swiping the card comprises the 33 resistance R 33, the 34 resistance R 34, the 24 capacitor C 24 and the 6th metal-oxide-semiconductor Q13, one end of one end of the 33 resistance R 33, an end of the 34 resistance R 34, the 24 capacitor C 24 all is connected with 17 pin of MCU chip U1, the other end ground connection of the 24 capacitor C 24, the source electrode of the other end of the 33 resistance R 33 and the 6th metal-oxide-semiconductor Q13 is connected with 3.0V voltage.
Described frequency division module comprises frequency division chip U6, the 5th triode Q10, the 23 resistance R 23, the 24 resistance R 24, the 25 resistance R 25, the 18 capacitor C 18, the 19 capacitor C 19 and crystal oscillator Y2.
4 pin of frequency division chip U6 are connected with 12 pin of frequency division chip U6,5 pin of frequency division chip U6 are connected with the emitter of the 5th triode Q10, an end of the 24 resistance R 24 respectively, the base stage of the 5th triode Q10 is connected with an end of the 23 resistance R 23, the other end of the 23 resistance R 23 is connected with 14 pin of MCU chip U1, the grounded collector of the 5th triode Q10; 10 pin of frequency division chip U6 are connected with the end of crystal oscillator Y2, an end of the 25 resistance R 25, an end of the 18 capacitor C 18 respectively, 11 pin of frequency division chip U6 are connected with the other end of crystal oscillator Y2, an end of the 25 resistance R 25, an end of the 19 capacitor C 19 respectively, the other end ground connection of the other end of the 18 capacitor C 18, the 19 capacitor C 19, the drain electrode of the 6th metal-oxide-semiconductor Q13 in 16 pin of frequency division chip U6 and the power supply detection module of swiping the card is connected, other pin of frequency division chip U6 is unsettled, and the model of described frequency division chip U6 is 74HC4060.
The described induction module of swiping the card comprises the 6th triode Q11, the 7th triode Q12, inductance L 1, the 20 capacitor C 20, the 21 capacitor C 21, the 22 capacitor C 22, the 27 capacitor C 27, the 26 resistance R 26 and the second diode D3; The base stage of the 6th triode Q11, the base stage of the 7th triode Q12 all is connected with the other end of the 24 resistance R 24 in the frequency division module, the drain electrode of the 6th metal-oxide-semiconductor Q13 in the collector of the 6th triode Q11 and the power supply detection module of swiping the card is connected, the emitter of the 6th triode Q11, the emitter of the 7th triode Q12 is connected with an end of inductance L 1, the collector of the 7th triode Q12, one end of the 21 capacitor C 21, one end of the 26 resistance R 26, one end ground connection of the 27 capacitor C 27, the other end of inductance L 1 respectively with an end of the 20 capacitor C 20, the anodic bonding of the second diode D3, the other end of the 20 capacitor C 20 is connected with the other end of the 21 capacitor C 21; The negative electrode of the second diode D3 is connected with the other end of the 26 resistance R 26, the other end of the 27 capacitor C 27, an end of the 22 capacitor C 22 respectively.
Described signal amplification module comprises signal amplification chip U7, the 27 resistance R 27, the 28 resistance R 28, the 29 resistance R 29, the 30 resistance R 30, the 31 resistance R 31, the 32 resistance R 32 and the 23 capacitor C 23,1 pin of signal amplification chip U7 is connected with an end of the 23 capacitor C 23,2 pin of signal amplification chip U7 respectively with an end of the 27 resistance R 27, one end of the 28 resistance R 28, one end of the 29 resistance R 29 connects, the other end of the 27 resistance R 27, the other end of the 22 capacitor C 22 in 3 pin of signal amplification chip U7 and the induction module of swiping the card is connected 4 pin of signal amplification chip U7, the other end ground connection of the 29 resistance R 29; 5 pin of signal amplification chip U7 are connected with the other end of the 23 capacitor C 23, an end of the 30 resistance R 30 respectively, 6 pin of signal amplification chip U7 are connected with the other end of the 30 resistance R 30, an end of the 31 resistance R 31, an end of the 32 resistance R 32 respectively, the other end ground connection of the 32 resistance R 32; 7 pin of signal amplification module are connected with 2 pin and as the output terminal of signal amplification module, 8 pin of the other end of the 28 resistance R 28, signal amplification module and the other end of the 31 resistance R 31 all are connected with the drain electrode of the 6th metal-oxide-semiconductor Q13 in the power supply detection module of swiping the card, and the model of described signal amplification chip U7 is LM358.
The course of work of the present utility model is: system powers on rear first by output 3.0V voltage behind the Voltage stabilizing module, when the voltage of outside input is lower than 2.0V, the detection of power loss module sends a signal to the MCU processing and control module, and the MCU processing and control module is sent the low-voltage warning by LCD MODULE.At voltage under normal circumstances, system carries out initialization, reads prepayment information in the table, and the table tool information in the memory module also shows.After finishing above-mentioned work, this table enters the metering state, reads respectively flow signal and two temperature signals by Wiegand signal acquisition module, temperature-measuring module, and is as follows according to above-mentioned three signals metering heat:
Wherein
QThe heat that the expression system discharges or absorbs, unit is J;
q m The flow through mass rate of water of heat energy meter of expression, unit is kg/h;
q v The flow through volumetric flow rate of water of heat energy meter of expression, unit is m
3/ h;
ρThe flow through density of water of heat energy meter of expression, unit is kg/m
3Δ
hThe enthalpy that is illustrated in water under heat-exchange system import and the outlet temperature is poor, and unit is J/kg;
τThe expression time, unit is h.According to the heat that accumulation obtains, bales catch, drives direct current generator by valve control module and closes pipeline when the expense on the account is zero except the expense on the account.
This table also arranges key control module, is used for realizing the switching of table function, mainly contains to start read-write card program, infrared communication program, is realized by read-write card module and infrared communication module respectively.Be in respectively dormant state in these two modules at ordinary times, detect through authoritative institution, quiescent dissipation reaches the 3-4 microampere, and power consumption 10-12 microampere under the general work state is no matter all hang down 3/4 than the U.S.'s 430 chips power consumption under static state or duty.Such joint 2.5Ah disposable lithium cell normal operation life-span can greater than more than 10 years, guarantee the low-power consumption of table tool effectively.When key control module has detected push button signalling; start corresponding read-write card module and infrared communication module; the prepaid card in the read-write card module perception external world; then the information of prepaid card is read in; after the MCU processing and control module is processed; the state that will block again internal information will write back the card the inside; user's prepaid card is only stored user's information; do not store user's dealing money, when the user need to supplement with money, directly supplemented with money by the Mbus mode by Thermoenergy Corp., take separate mode by this account; avoided when subscriber card is lost; the remaining sum of calorimeter can not lost, and only need to make up a card and get final product, and has reached the interests of Protection of consumer.And infrared communication module mainly is the distant control function of realization table tool.
Above-mentioned embodiment is used for explaining the utility model; rather than utility model limited; in the protection domain of spirit of the present utility model and claim, any modification and change to the utility model is made all fall into protection domain of the present utility model.
Claims (1)
1. low-power consumption calorimeter, comprise power module, key control module, memory module, valve control module, read-write card module, infrared communication module, MCU processing and control module, Wiegand signal acquisition module, temperature-measuring module and LCD MODULE, it is characterized in that: the Wiegand signal acquisition module gathers ducted flow information, and the output terminal of Wiegand signal acquisition module is connected with the I/O mouth signal of MCU processing and control module; The temperature-measuring module collection gathers respectively inflow temperature and return water temperature; The output terminal of key control module is connected with the I/O mouth signal of MCU processing and control module; The input end of LCD MODULE is connected with the I/O mouth signal of MCU processing and control module; Temperature-measuring module, memory module, valve control module, read-write card module are connected with infrared communication module with the I/O mouth signal of MCU processing and control module and are connected; Power module provides power supply for key control module, valve control module, read-write card module, MCU processing and control module and Wiegand signal acquisition module;
Described key control module comprises button K1, enables respectively to read and write card module or infrared communication module by the number of times of pressing of confirming button K1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220364101 CN202676326U (en) | 2012-07-25 | 2012-07-25 | Low power consumption heat meter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220364101 CN202676326U (en) | 2012-07-25 | 2012-07-25 | Low power consumption heat meter |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257002A (en) * | 2013-05-07 | 2013-08-21 | 沈阳市航宇星仪表有限责任公司 | Ultra-low-power-consumption intelligent-control high-precision ultrasonic heat meter |
| CN104634483A (en) * | 2015-01-24 | 2015-05-20 | 安徽水联水务科技有限公司 | Method for electricity saving of heat meter and circuit board thereof by discontinuous working |
-
2012
- 2012-07-25 CN CN 201220364101 patent/CN202676326U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257002A (en) * | 2013-05-07 | 2013-08-21 | 沈阳市航宇星仪表有限责任公司 | Ultra-low-power-consumption intelligent-control high-precision ultrasonic heat meter |
| CN104634483A (en) * | 2015-01-24 | 2015-05-20 | 安徽水联水务科技有限公司 | Method for electricity saving of heat meter and circuit board thereof by discontinuous working |
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