CN202671644U - Vacuum sputtering jig specific for EMI (electro-magnetic interference) - Google Patents
Vacuum sputtering jig specific for EMI (electro-magnetic interference) Download PDFInfo
- Publication number
- CN202671644U CN202671644U CN 201220317725 CN201220317725U CN202671644U CN 202671644 U CN202671644 U CN 202671644U CN 201220317725 CN201220317725 CN 201220317725 CN 201220317725 U CN201220317725 U CN 201220317725U CN 202671644 U CN202671644 U CN 202671644U
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- emi
- vacuum sputtering
- product
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- jig
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Abstract
The utility model discloses a vacuum sputtering jig specific for EMI (electro-magnetic interference), which comprises an upper cover and a base, wherein a positioning block matched with a product is arranged on the base; and the upper cover comprises covering blocks, the covering blocks are connected with one another by bridges, and the bridges are connected with an upper cover body. The base and the upper cover of the vacuum sputtering jig are respectively formed into a whole body by aluminum alloy, the covering blocks which are further away from the edge of the upper cover are connected by arranging the bridges on the upper cover, a product and the base are fixed and a non-sputtering region is covered by the covering blocks, and when the vacuum sputtering jig is used for the vacuum sputtering of the product, the jig per se is higher in mechanical strength compared with the PC material or the common aluminum; due to the manner of the bridges and the covering blocks, the non-sputtering region can be maximally covered and the sputtering region can be exposed, and a pressing and covering region of the product can be reduced due to the design of the covering blocks, so that the scratching of the product can be maximally avoided; and the jig can be repeatedly used, so that the vacuum sputtering jig is high in sputtering precision, and the cost investment can be reduced.
Description
Technical field
The utility model relates to a kind of EMI Special vacuum sputtering jig.
Background technology
Electromagnetic interference (EMI) is the electronic noise that disturbs cable signal and reduce the signal integrity, and EMI produces such as motor and machine usually by the electromagnetic radiation generating source.EMI has two kinds of conducted interference and radiation interference, in PCB and system design, the pin of high-frequency signal line, unicircuit, all kinds of connectors etc. all may become the radiation interference source with antenna performance, and the energy emitting electromagnetic wave also affects other system or the normal operation of interior other subsystems of native system.
Electronic consumer products, such as notebook computer, mobile phone, navigating instrument etc., all produce easily the EMI radiativity, traditional method is by methods such as plating, sprayings, be covered with one deck conducting metal on the surface of product, but traditional method efficient is low, cost is high, seriously polluted, and vacuum splashing and plating plates conducting metal on the electronic product top layer, make hertzian wave be absorbed or reflect by conducting metal, adopt vacuum sputtering method to have economy, efficient, free of contamination advantage.In vacuum splashing and plating technique, but can prevent that the regional precisely batch circulation of, sputter indeformable by the plastic parts of sputter from using and the tool of protection plastic parts is most important.In the prior art, the tool that useful PC material is made, the protection precision, intensity is not high, recoverability is not strong, does not reach Reusability; The tool that common aluminium is made into, it is more to add the man-hour difficulty, such as the materials processing distortion, the more and difficult cleaning of finished product burr etc.
The utility model content
For solving the problems of the technologies described above, the utility model provides a kind of EMI Special vacuum sputtering jig, reaches the protection precision to product with intensity, the Reusability that improves tool itself, guarantees the sputter zone precisely, and prevents deformation of products.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of EMI Special vacuum sputtering jig comprises loam cake and base, is provided with the preset pieces supporting with product on the described base; Described loam cake comprises shielding block, and described shielding block connects by building bridge, and described bridge company is connected to the main body of described loam cake.
Preferably, described shielding block and the up and down two-layer three-dimensional arrangement of formation of building bridge.
Preferably, described shielding block is positioned at lower floor, and described bridge formation is positioned at the upper strata.
Preferably, the groove of the described shielding block corresponding product of lower floor and non-sputter district.
Preferably, it is one-body molded that described loam cake and base adopt respectively aluminum alloy material.
Pass through technique scheme, the EMI Special vacuum sputtering jig that the utility model provides, it adopts aluminum alloy material processing base and loam cake, and in the loam cake setting by build bridge connecting the shielding block far away apart from cover rim, by shielding block fixed product and base and cover non-sputter district, when being used for the vacuum splashing and plating of product, it has following advantage:
1. it is one-body molded that loam cake and base adopt respectively aluminum alloy material, so that tool itself has higher physical strength compared to PC material or common aluminium, and accessory is few, and is easy to assembly during application, only needs directly product to be stuck between loam cake and the base to get final product;
2. by building bridge and the mode of shielding block, can maximizedly cover non-sputter district and expose the sputter district, and reduce gland district to product by the shielding block design and maximize the protection product and do not scratch;
But 3. aluminum alloy material tool Reusability, not only the sputter precision is high and reduced the cost input.
Description of drawings
In order to be illustrated more clearly in the technical scheme among the utility model embodiment, the accompanying drawing of required use was done to introduce simply during the below will describe embodiment.
Fig. 1 is the superstructure synoptic diagram of the disclosed EMI Special vacuum of embodiment sputtering jig;
Fig. 2 is the understructure synoptic diagram of the disclosed EMI Special vacuum of embodiment sputtering jig;
Fig. 3 is loam cake and the base combination structural representation of the disclosed EMI Special vacuum of embodiment sputtering jig.
Numeral among the figure:
13. shielding blocks, 21. bases, 22. preset piecess 11. loam cake 12. is built bridge
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described.
According to Fig. 1 to 3, the EMI Special vacuum sputtering jig that the utility model provides comprises loam cake 11 and base 21, is provided with the preset pieces 22 supporting with product on the base 21; Loam cake 11 comprises shielding block 13, and shielding block 13 is by 12 connections of building bridge, and bridge formation 12 is connected to the main body of loam cake 11.Wherein, shielding block 13 and the up and down two-layer three-dimensional arrangement of 12 formations of building bridge, shielding block 13 is positioned at groove and the non-sputter district of lower floor and corresponding product, and bridge formation 12 is positioned at the upper strata.Have higher physical strength in order to ensure EMI Special vacuum sputtering jig, its loam cake 11 and base 21 adopt respectively aluminum alloy material one-body molded.
The EMI Special vacuum sputtering jig that the utility model provides; its base 21 and loam cake 11 adopt respectively aluminum alloy material one-body molded; and arrange by building bridge at loam cake 11 and 12 to connect the shielding block 13 far away apart from loam cake 11 edges; by shielding block 13 fixed product and base 21 and cover non-sputter district; when being used for the vacuum splashing and plating of product; not only has higher physical strength; and can maximizedly cover non-sputter district and expose the sputter district; and having reduced gland district to product by shielding block 13 design maximizes the protection product and does not scratch; but and tool Reusability; not only the sputter precision is high, and has reduced the cost input.
Multiple modification to above-described embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can in the situation that does not break away from spirit or scope of the present utility model, realize in other embodiments.
Claims (5)
1. an EMI Special vacuum sputtering jig comprises loam cake and base, is provided with the preset pieces supporting with product on the described base, it is characterized in that described loam cake comprises shielding block, and described shielding block connects by building bridge, and described bridge company is connected to the main body of described loam cake.
2. EMI Special vacuum sputtering jig according to claim 1 is characterized in that, described shielding block and the up and down two-layer three-dimensional arrangement of formation of building bridge.
3. EMI Special vacuum sputtering jig according to claim 2 is characterized in that described shielding block is positioned at lower floor, and described bridge formation is positioned at the upper strata.
4. EMI Special vacuum sputtering jig according to claim 3 is characterized in that, the groove of the described shielding block corresponding product of lower floor and non-sputter district.
5. EMI Special vacuum sputtering jig according to claim 1 is characterized in that, described loam cake and base adopt respectively aluminum alloy material one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220317725 CN202671644U (en) | 2012-07-03 | 2012-07-03 | Vacuum sputtering jig specific for EMI (electro-magnetic interference) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220317725 CN202671644U (en) | 2012-07-03 | 2012-07-03 | Vacuum sputtering jig specific for EMI (electro-magnetic interference) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202671644U true CN202671644U (en) | 2013-01-16 |
Family
ID=47492559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220317725 Expired - Fee Related CN202671644U (en) | 2012-07-03 | 2012-07-03 | Vacuum sputtering jig specific for EMI (electro-magnetic interference) |
Country Status (1)
| Country | Link |
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| CN (1) | CN202671644U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104593736A (en) * | 2014-12-31 | 2015-05-06 | 上海释欣实业有限公司 | Vacuum discontinuous sputtering coating technology |
| CN104593741A (en) * | 2014-12-31 | 2015-05-06 | 上海释欣实业有限公司 | Vacuum discontinuous sputtering coating method |
| CN106319452A (en) * | 2016-09-30 | 2017-01-11 | 铜陵市超越电子有限公司 | Partial blocking evaporation drum |
| CN109468593A (en) * | 2018-12-04 | 2019-03-15 | 京东方科技集团股份有限公司 | A kind of preparation method of display panel, display panel and evaporation coating device |
-
2012
- 2012-07-03 CN CN 201220317725 patent/CN202671644U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104593736A (en) * | 2014-12-31 | 2015-05-06 | 上海释欣实业有限公司 | Vacuum discontinuous sputtering coating technology |
| CN104593741A (en) * | 2014-12-31 | 2015-05-06 | 上海释欣实业有限公司 | Vacuum discontinuous sputtering coating method |
| CN106319452A (en) * | 2016-09-30 | 2017-01-11 | 铜陵市超越电子有限公司 | Partial blocking evaporation drum |
| CN109468593A (en) * | 2018-12-04 | 2019-03-15 | 京东方科技集团股份有限公司 | A kind of preparation method of display panel, display panel and evaporation coating device |
| US11495625B2 (en) | 2018-12-04 | 2022-11-08 | Ordos Yuansheng Optoelectronics Co., Ltd. | Method for preparing array substrate, display panel and evaporation apparatus |
| US11688746B2 (en) | 2018-12-04 | 2023-06-27 | Ordos Yuansheng Optoelectronics Co., Ltd. | Method for preparing array substrate, display panel and evaporation apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130116 Termination date: 20150703 |
|
| EXPY | Termination of patent right or utility model |