CN202666994U - Integration electrostatic dust collecting device - Google Patents

Integration electrostatic dust collecting device Download PDF

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Publication number
CN202666994U
CN202666994U CN2012201458193U CN201220145819U CN202666994U CN 202666994 U CN202666994 U CN 202666994U CN 2012201458193 U CN2012201458193 U CN 2012201458193U CN 201220145819 U CN201220145819 U CN 201220145819U CN 202666994 U CN202666994 U CN 202666994U
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CN
China
Prior art keywords
circuit board
electrostatic dust
collecting device
high voltage
main body
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CN2012201458193U
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Chinese (zh)
Inventor
王宝柱
赵建洪
赵羽石
刘兴龙
郭奕文
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YUJIE NEW MATERIAL CO Ltd DONGGUAN CITY
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YUJIE NEW MATERIAL CO Ltd DONGGUAN CITY
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A50/00TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
    • Y02A50/20Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
    • Y02A50/2351Atmospheric particulate matter [PM], e.g. carbon smoke microparticles, smog, aerosol particles, dust

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Abstract

The utility model relates to the technical field of filter products, in particular to an integration electrostatic dust collecting device. The integration electrostatic dust collecting device comprises an outer frame and a main body sealed in the outer frame. The main body is composed of a plurality of gathered microcosmic electrostatic dust collecting units which are distributed in an array. Each microcosmic electrostatic dust collecting unit is provided with a straight line hole or a curved line hole used for passing of gas, wherein the upper wall and the lower wall of the hole is in asymmetric structure, and eudipleural fins are respectively distributed on the upper wall and the lower wall of the hole. Sealed conducting films exerting a high voltage electric field are arranged on the upper surface and the lower surface of each microcosmic electrostatic dust collecting unit. A high voltage power supply used to exert the high voltage electric field is sealed in the outer frame and supplies low voltage power to the outer frame through an external contact or a plug arranged on the outer frame. The integration electrostatic dust collecting device can be used as a particulate matter filter which can remove hidden dangers caused by interelectrode fire striking and usage of electric shock, is easy to clean, can be recycled for a long time, and has low wind resistance and high efficiency. The integration electrostatic dust collecting device is suitable for air purification devices used in families and industries.

Description

Integrated electrostatic dust-collecting device
Technical field:
The utility model relates to the filter product technical field, refer in particular to a kind of integrated electrostatic dust-collecting device, it is for the particle dust that purifies air, can be applicable to Household Air Purifier, central air-conditioning, vacuum cleaner, industrial environment cleaning equipment, be specially adapted to low windage, high efficiency demand occasion.When composite material used corrosion-resistant, resistant to elevated temperatures fluoroplastics, the utility model also can be used for the gas treatment occasion of burn into high temperature.
Background technology:
To airborne particle purifying technology, mainly contain dual mode at present:
One, the filter that adopts the non-woven fabrics fiber folded filter paper to consist of, take HEPA(High Efficiency Particulate Air filter high efficiency particle air filter) filter is as representative, block particle by modes such as screening, bridging plug, impact adhesion, the absorption of static electret fiber electric field, have simple in structure, efficient high, obtain extensively ripe application.The shortcoming of HEPA filter is:
1) larger windage needs more powerful blower fan by the air quantity of subscribing, and energy consumption is high, noise is large.
2) filter needs periodic replacement, and not reproducible use increases application cost.
Two, electrostatic precipitation mode is the electrostatic precipitation mode of representative with ESP (Eletrostatic Precipitator, electrostatic precipitator) corona-collection mode, with low, the renewable characteristics of its windage, equally also is widely used.But ESP has the shortcoming that is difficult to overcome equally:
1) corona discharge can produce ozone, although can use the control of ozone catalytic filter, but has the possibility that exceeds increasingly strict concentration control indication range, harm health of human body.
2) interelectrode slight sparking discharging sound is denounced by the user always, to the safety in utilization generation worry of product.
3) owing to be subject to the breakdown voltage limit of Open architecture, the single filtration efficient of EPS is lower.
4) need complicated high-voltage suppling power and high-voltage safety protection measure, increase equipment cost.
5) EPS structure, particularly the line plank frame is very fragile, and cleaning process causes damage easily.
For the deficiency of electrostatic precipitation formula clarifier, Chinese patent application number is: 00806175.0 patent application prospectus, and it discloses a kind of " air cleaning facility ", and this air cleaning facility adopts electrostatic precipitation formula cleaning equipment exactly.Its technical scheme that adopts is: a kind of array for removing particle deposition equipment that air-flow carries and comprise the hole that air-flow can relatively freely pass through, and hole provides between plastic wall; Be used for forcing air-flow to pass through the device of array, described plastic wall has the regions of conductive material that is in contact with it; And be used for alternately to the regions of conductive material of insulation apply high and electronegative potential being provided at the charging place of array, thereby from the device of air-flow collecting granules.
Proposed a series of structures and combination in the above-mentioned patent scheme, wherein the mode " electrode is laid on the two sides of plastic double-wall wave mode sheet material, and stack interlocks " is important embodiment, but still has many problems to be solved, and these problems comprise:
1, uses the AND DEWATERING FOR ORIFICE STRUCTURE of symmetrical inner wall smooth, because faraday cup effect, can not effectively capture neutral (neutrality) particle, need to rely on negative ion generating device or reduce the orifice plate height or with longer hole, the impact that this will bring series of negative comprises the problems such as windage increases, installation volume is excessive.
2, electrode exists at orifice plate in the situation of micropore injection moulding defective directly with the external contact of injection moulding orifice plate, may cause electrode to the discharge of air or corresponding inwall, and then produces peculiar smell.
3, for reaching the demand of waterproof and overall construction intensity, the adhesive that uses between orifice layer, particularly may use the dual-component binder to PP material binding better performances, the misoperation of adhesive may make filter have for a long time peculiar smell and then cause secondary air pollution.
4, the electret mode of mentioning in this patent scheme, for its mentioned plastic material, can not form can long term storage electric charge, these surface charges may will disappear after a couple of days or several weeks.
5, the structure of stack still can produce larger capacity plate antenna effect repeatedly, although used the electrode of high impedance or electrode tip to add bleeder resistance, exposed contact region still may have the possibility of electric shock in initial several seconds.
6, used with the identical external high pressure input mode of conventional ESP power supply mode, the same with the ESP working method, need complicated safety circuit.
7, the combination of non-closed structure, the possible ingress of air of electrode and aqueous vapor, aging, electric leakage is unfavorable for carrying out reusable water-washing process.
For the problems referred to above, the inventor proposes following solution through constantly research, experiment.
The utility model content:
Technical problem to be solved in the utility model just is to overcome the deficiency of present like product, and a kind of capture effect that improves is provided, and uses safe, simple to operate integrated electrostatic dust-collecting device.
For solving the problems of the technologies described above, the utility model has adopted following technical scheme to be: this device comprises: housing and the main body that is packaged in the housing, described main body is made of most microcosmic electrostatic precipitation unit sets that are array distribution, described microcosmic electrostatic precipitation unit has straight line or the curve hole that a supplied gas is passed through, the upper wall of hole and lower wall are unsymmetric structure, be distributed with symmetrical fin on upper wall and the lower wall, the upper and lower surface in microcosmic electrostatic precipitation unit is provided with the airtight conducting film that applies high voltage electric field; The high voltage source that is used for applying high voltage electric field is packaged in the housing, and the external contact by placing housing or plug are to its low-voltage power supply.
Furthermore, in the technique scheme, described microcosmic static integrated unit is shaped on the circuit board, and described main body is made of the stack of multilayer circuit board, and described circuit board is expanded material, forms lens-type or spindle microbubble in it.
Furthermore, in the technique scheme, described airtight conducting film is to form composite construction by membrane-electrode-film.
Furthermore, in the technique scheme, described electrode is the fish bone well pattern that is distributed with line edge and sharp-pointed prickle.
Furthermore, in the technique scheme, the overlay order of circuit board is in the described main body: circuit board-airtight conducting film-circuit board-airtight conducting film-circuit board, wherein the electrode edge in the airtight conducting film is reserved the distance of 0.5~1.5mm/Kv to the edge of circuit board.
Furthermore, in the technique scheme, described adjacent two circuit boards adopt staggered stack, stagger angle 1~30 degree.
Furthermore, in the technique scheme, be provided with one or several in main body and have the anion circuit board of built-in anion emission electrode, built-in anion emission electrode in the hole of this anion circuit board, and the hole of anion circuit board is the symmetrical holes structure, and the thread hairbrush emission electrode of being made by needle-like, prickle shape or use conductive carbon fibre is being installed near the position of port.
Furthermore, in the technique scheme, adopt PUR, polymer adhesive between the described two adjacent circuit boards, and the edge of two adjacent circuit boards uses hot melt fusion bonding, formation closed edge.
Furthermore, in the technique scheme, described high voltage source is installed in any side of the non-outlet and inlet face of main body, wherein the output of high voltage source is connected by compiling line with the high and low potential end of each airtight conducting film respectively, and the anion emission electrode in the negative high-voltage end of high voltage source and the anion circuit board is connected.
Furthermore, in the technique scheme, described housing carries out overall package by canning means to main body and high voltage source, namely is formed with encapsulated layer between housing and main body, is equipped with on the housing to socket or the contact of high voltage source power supply.
After the utility model adopted technique scheme, it had proposed a kind of integrated electrostatic dust-collecting device (Uni-ESP).With respect to present like product, the utlity model has following advantage:
1, the utility model thing is made of by array several microcosmic electrostatic precipitation unit, and each microcosmic electrostatic precipitation unit is a small-sized precipitator.
2, the upper and lower hole wall of the hole of the circuit board of formation low-light electrostatic precipitation unit adopts asymmetric design, and the above is distributed with fin structure.The use of unsymmetric structure has increased the internal surface area of hole, has shortened the distance between the inner wall surface, so that particle can contact with inwall in shorter stroke and then be captured, can use short as far as possible hole lengths, reaches high capture usefulness.
3, microcosmic electrostatic precipitation unit adopts unsymmetric structure in the utility model, and it is asymmetric that internal electric field is distributed, and can effectively capture not charged or is difficult for charged particle.
4, in the utility model, also can make the pore space structure array with curvilinear structures, when the gas with particle passed through, particle is easier to be contacted with hole wall, and then is captured.
5, the utility model can built-in negative ion emitter, and under airflow function, generating negative ions is diffused in the air, makes particle charged, further improves dust collecting effect.
Have more security for obtaining stronger electric field and using, the utility model has designed a kind of airtight conducting film of three-decker.The membrane structure of design forming in the utility model; make conducting film obtain sufficient insulation and protection; effectively prevented in the use procedure and the water that causes because of cleaning enters the Insulation Problems that causes, protected simultaneously conducting film in use to be difficult for occuring resistance change and the fracture that causes because wearing out.
The utility model has designed integrated structure, after the electrode of high electronegative potential confluxed respectively, access is positioned at the high voltage source that any side of non-outlet and inlet face is installed, then, use plastic cement or metal outer frame by the mode of fluid sealant embedding, form the electrostatic precipitation filter of integral structure, on housing, be equipped with for contact or socket to transformer-supplied, form the electrostatic precipitation filter (Uni-ESP) of integral structure.
Description of drawings:
Fig. 1 is main TV structure schematic diagram of the present utility model;
Fig. 2 is the pore space structure schematic diagram of circuit board in the utility model;
Fig. 3 is the structural representation of the airtight conducting film of the utility model;
Fig. 4 is electrode pattern schematic diagram in the airtight conducting film of the utility model;
Fig. 5 is circuit connection diagram of the present utility model;
Fig. 6 is the schematic diagram of anion circuit board of the present utility model;
Fig. 7 a-7c is the circuit board internal structure schematic diagram of other embodiment of the utility model;
Fig. 8 is the circuit board schematic diagram that adopts curve pore space structure embodiment in the utility model.
The specific embodiment:
Embodiment one
See shown in Fig. 1-5, the utility model is the electrostatic precipitation filter for electrostatic precipitation formula air cleaning facility, referring to Fig. 1, this filter comprises: consist of as the main body 1 of dust collect plant and the housing 3 that is used for package main body 1, wherein main body 1 is made of most microcosmic electrostatic precipitation unit 100 that are array distribution, and the upper and lower surface in microcosmic electrostatic precipitation unit 100 is provided with the airtight conducting film 20 that applies high voltage electric field.
Described microcosmic electrostatic precipitation unit 100 has straight line or the curve hole 110 that a supplied gas is passed through, and upper wall 111 and the lower wall 112 of hole 110 are unsymmetric structure, are distributed with symmetrical fin 113 on upper wall 111 and the lower wall 112.
Described microcosmic static integrated unit 100 is shaped on the circuit board 10, and described main body 1 is made of 10 stacks of multilayer circuit board, and each hole 110 consists of asymmetric microcosmic electrostatic precipitation described in the utility model unit 100.Airtight conducting film 20 is between circuit board 10.
Described circuit board 10 can adopt the PP(polypropylene), the PE(polyethylene), the PC(Merlon), the PVC(polyvinyl chloride), the PVDF(Kynoar), the PTFE(polytetrafluoroethylene (PTFE)) etc. have a material injection molding of electret performance.Simultaneously, can add therein the plastic cement micro-foaming material of electret and anion-generating material, magnetic material.In conjunction with Fig. 2, asymmetric microcosmic electrostatic dust-collecting device 100 is directly one-body molded by circuit board 10, its structure that adopts is: form the array straight line hole 110 that supplied gas is passed through at circuit board 10, adopt parallel hole 110 array structures in the present embodiment, the cross section of hole 110 is designed to rectangle, and upper and lower wall 111,112 asymmetric structures namely are distributed with symmetrical fin 113 at upper wall 111 and lower wall 112.
Present embodiment and after embodiment in, use the circuit board of this structure, parameter is as follows:
Material: PP material, isotacticity〉95%, proportion 0.9g/cm3
Thickness: 3mm
Weight: 290-320g/m2
Hole cross section: rectangle, width 5mm
Fin: height 1mm, bottom thickness 0.5mm, top 0.1mm
Fin distributes: upper wall: 1, and placed in the middle the distribution; 2 of bottoms, five equilibrium distributes.
Based on this, by adding different compositions and treatment process, consist of the circuit board 10 among the embodiment, the adding procedure of other materials or composition adopts general known technology and the method for Injection Industry.
Circuit board 10 adopts ejection formation, and moulding is by supercooling, and circuit board 10 becomes width 60mm with slitting, length 550mm rectangle flaky material.
Referring to shown in Figure 3, what airtight conducting film 20 adopted is film 210-electrode 220-film 210 composite constructions.Film 210 uses PP, PE, PET(PETG), the material such as PTFE film, hole film, the microporous barrier made; Electrode 220 forms on the skim in the pattern mode of setting therein by printing or vacuum coating, is undertaken compoundly by bonding, heat seal, the mode such as ultrasonic, forms membrane-electrode-membrane structure.Concrete preparation method can adopt: adopt the PP film of width 50mm, thickness 50um as film 210 materials of airtight conducting film 20, the resistance of printing width 40mm, length direction is 200~500M Ω/m electrically conductive ink thereon, as electrode 220.Use the PP material membrane of 25um as overlay film, form airtight conducting film 20 by the compound mode of heat.
In the utility model, electrode 220 also can adopt:
A, low-resistance self-healing vacuum plated aluminum film, resistance 0.1~100 Ω/m.Adopt the usefulness of this material to be that the aluminium film of breakdown point will be evaporated rapidly if the interpolar high voltage arc occurs, sparking point is because of the conductor termination of discharging that disappears, and spark phenomenon is ended.Subsequently, heal gradually at evaporating point, form the higher conducting film of impedance, recover electrode at the desired properties of Uni-ESP
But b, high resistance print film, it adopts metal oxide, carbon, macromolecule conducting material and binding material to consist of, and resistance is 10E7~10E10 Ω/m.Adopt the usefulness of this material to be, its electrically conducting manner is the dissipative type conduction, if the interpolar high voltage arc occurs, sparking point is because of the termination of discharging of electronics approach exhaustion, spark phenomenon is ended, and local arc discharge and the high temperature that can not continue have guaranteed use safety.
In addition, described high-resistance electrode prints in the mode of setting pattern, and as shown in Figure 4, the pattern of this electrode 220 is the fish bone well pattern 221 that is distributed with line edge and sharp-pointed prickle, and the coverage rate of its electrode part is 10%~90%.Fish bone well pattern 221 electrode structures that the utility model is designed, usefulness is most advanced and sophisticated and the edge can promote electric-field intensity, further, and the slight void between electrode 20 and circuit board 10 outer walls, can form the electromotive force structure of trap, strengthen the electric charge electret performance of circuit board.
Can find out from the above mentioned; the utility model adopts a kind of airtight conducting film 20 of three-decker; adopt this structural design; make the conducting film as electrode 220 obtain sufficient insulation and protection; effectively prevented in the use procedure and the water that causes because of cleaning enters the Insulation Problems that causes, guard electrode 220 in use is difficult for occuring the resistance change and the fracture that cause because wearing out simultaneously.Use another usefulness of airtight conducting film 20 to be, because of its high-insulativity, strike sparks between the electrode that has further prevented to cause because of the circuit board injection defect.
Described airtight conducting film 20 is positioned at the upper and lower surface of circuit board 10, is used for applying high voltage electric field.High voltage source 40 to 20 power supplies of airtight conducting film is closed in housing 3 inside, and the external contact 41 by placing housing 3 is to its low-voltage power supply.This high voltage source 40 is installed in any side of main body 1 non-outlet and inlet face.
The high voltage source 40 of powering in the utility model can be used conventional voltage multiplying rectifier high voltage source, particularly preferred use piezoelectric ceramic transformer power supply.Use the usefulness of piezoelectric ceramic transformer high voltage source to be that it can better mate the load characteristic of the utility model Uni-ESP, have simultaneously that volume is little, efficient is high, without advantages such as electromagnetic interference.Specific to present embodiment, high voltage source 40 power supplys use power is 2 watts ceramic transformer power supply, and the output high pressure can be adjusted in the scope of 6~12KV by input voltage.
Housing 3 adopts plastic cement or metal material, and it carries out overall package by canning means to main body 1 and high voltage source 40, namely is formed with encapsulated layer 2 between housing 3 and main body 1, is equipped with on the housing 3 to socket or the contact 41 of high voltage source 40 power supplies.
In the present embodiment, circuit board 10 adopts the pure material direct injection of PP, after cutting, with the stack that interlocks of prefabricated airtight conducting film 20, forms 49 24 pairs of electrode structures, and thickness is about 150mm.Adjacent two circuit boards 10 adopt and overlap.Certainly, it also can adopt the 10 staggered stacks of adjacent two circuit boards, stagger angle 1~30 degree, the benefit of staggered stack is: hole 110 channel direction of adjacent two circuit boards 10 are different, can further each different directions be entered like this particle collection in the hole 110.
As shown in Figure 6, the overlay order of circuit board 10 is in the described main body 1: the airtight conducting film 20-circuit board 10 of the airtight conducting film 20-circuit board 10-high potential of circuit board 10-electronegative potential, wherein the safe distance of 0.5~1.5mm/Kv is reserved at electrode 220 edges in the airtight conducting film 20 to the edge of circuit board 10, and the electret symbol polarity of circuit board 10 is corresponding with electrode potential.
The main body 1 that forms after circuit board 10 stacks uses hot melting way to carry out interlaminar bonding in ventilating surface, makes the edge of two adjacent circuit boards 10 form closed edge 50.Concrete adoptable mode comprises use: the modes such as flame, ultrasonic, the friction in surface, heated filament cutting, one of optimal way that hot melt merges is the heated filament cutting.Hot melt merges usefulness and is, can obtain firm, attractive in appearance fusion face, has overcome the problem that the PP material is difficult to bond.
In addition, between two adjacent circuit boards 10, adopt PUR, polymer adhesive.So airtight conducting film 20 just is completely enclosed between two circuit boards 10, can thoroughly prevent the intrusion of external water, realizes the function of being convenient to wash of the present utility model.
The electrode of the airtight conducting film 20 of high and low current potential compiles line 60 and sheet metal tandem by the power supply that adopts conducting resinl to consist of respectively, is connected with high voltage source 40 again, and the output of high voltage source 40 is set as 10KV.
Embodiment 2
Present embodiment 2 as different from Example 1, circuit board 10 has adopted foam process.
As shown in Figure 2, be added with in the material that circuit board 10 adopts: the pore foaming agent take nitrogen as little foamed gas, foaming ratio are 0.1~10%, and form lens-type or spindle microbubble 102 under the injection moulding stretching action.Present embodiment 2 adopts the known technology of Injection Industry, sneaks into 0.2% azo fine foamer in the PP raw material, carries out frothing injection.Circuit board 10 gas releases 5% that form, diameter 5-20um, foam form elliposoidal or lens shaped microbubble 102 under stretching action, and circuit board 10 thickness are about 3.1mm.
Present embodiment is on the basis of embodiment 1, in the plastic material of circuit board 10, be distributed with microbubble in a suitable manner, form PP hole film (Cellular PP) material, after charging by suitable mode, the macroscopical dipole that forms has static electret performance the strongest in the present known materials.The benefit that present embodiment produces is: to circuit board 10 processing of foaming, foaming forms microprotrusion at hole wall, has further increased the specific area of hole wall, is conducive to the collection of particle.Use foaming technique, can reduce the use amount of plastic material, meet the environmental protection demand, alleviate overall weight of the present utility model.
Embodiment 3
On the basis of embodiment 1, present embodiment is provided with the anion emission electrode.Shown in Fig. 1,6, be provided with one or several in the main body 1 of present embodiment and have the anion circuit board 30 of built-in anion emission electrode, built-in anion emission electrode in the hole 31 of this anion circuit board 30, and the hole 31 of anion circuit board 30 is the symmetrical holes structure, needle-like, the prickle shape that is made of metal W, Mo, stainless steel or the thread hairbrush emission electrode 310 that uses conductive carbon fibre to make are being installed near the position of port, and this emission electrode 310 goes out 1.0~1.5mm/KV distance apart from port.
Specific to present embodiment, it adopts is the anion circuit board 30 that adds the built-in anion emission electrode of one deck in the top layer of main body 1, what its emission electrode 310 adopted is to use conductive fiber, length 1.5mm, place the inner 5mm of each hole 31 air-out one side place, be connected with the negative pole of high voltage source 40.
Present embodiment is built-in negative ion emitter in one deck circuit board of main body 1, and under airflow function, the anion of generation is diffused in the air, makes particle charged, with further raising dust collecting effect.
Embodiment 4
See that shown in Fig. 7 a-7c, the structure of fin 113 can adopt various forms in the present embodiment, shown in monolateral formation column fin 113(Fig. 7 a); Hole wall 111,112 forms respectively shown in staggered wedge shape fin 113(Fig. 7 b up and down); Hole wall 111,112 forms respectively shown in staggered cylindricality fin 113(Fig. 7 c up and down).
In addition, as shown in Figure 8, hole 110 not only can adopt linear pattern, and it also can adopt shaped form.
Comprehensively the above the utility model proposes a kind of integrated asymmetric microcosmic electrostatic dust-collecting device (Uni-ESP).With respect to traditional product, the utlity model has following advantage:
1) as the supporting body of asymmetric microcosmic electrostatic precipitation unit 100, the one side that upper 111, the lower hole wall 112(of the rectangle hole of circuit board 10 lays electrode 220) be designed to asymmetrical, the above is distributed with fin 113 structures, the number of fins of inwall is unequal up and down, and the top of fin (with respect to the root that connects with hole 110 inwalls) is the structure of small curvature radius.Under the internal electric field effect, the top of small curvature radius can form the corona zone by electron emission, so that the particle that enters is charged.
2) built-in negative ion emitter, under airflow function, generating negative ions is diffused in the air, makes particle charged.Specifically see embodiment 3.
The unsymmetric structure hole 110 that the utility model uses, also can bring following benefit:
1) microcosmic electrostatic precipitation unit 100 adopts the use of unsymmetric structure, increased the internal surface area of hole 110, shortened the distance between the inner wall surface, so that particle can contact with inwall in shorter stroke and then be captured, can use short as far as possible hole lengths, reach high capture usefulness.
2) use of unsymmetric structure, it is asymmetric that internal electric field is distributed, and can effectively capture not charged or be difficult for charged particle.
3) in the utility model, also can make the pore space structure array with curvilinear structures, when the gas with particle passed through, particle is easier to be contacted with hole wall, and then is captured.
Certainly, the above only is embodiment of the present utility model, be not to limit the utility model scope, all equivalences of doing according to the described structure of the utility model claim, feature and principle change or modify, and all should be included in the utility model claim.

Claims (10)

1. integrated electrostatic dust-collecting device, this device comprises: housing (3) and be packaged in main body (1) in the housing (3), it is characterized in that: described main body (1) is made of most microcosmic electrostatic precipitation unit (100) set that are array distribution, described microcosmic electrostatic precipitation unit (100) has straight line or the curve hole (110) that a supplied gas is passed through, the upper wall (111) of hole (110) is unsymmetric structure with lower wall (112), be distributed with symmetrical fin (113) on upper wall (111) and the lower wall (112), the upper and lower surface in microcosmic electrostatic precipitation unit (100) is provided with the airtight conducting film (20) that applies high voltage electric field; The high voltage source (40) that is used for applying high voltage electric field is packaged in the housing (3), and the external contact (41) by placing housing (3) or plug are to its low-voltage power supply.
2. integrated electrostatic dust-collecting device according to claim 1, it is characterized in that: described microcosmic static integrated unit (100) is shaped on the circuit board (10), described main body (1) is made of multilayer circuit board (10) stack, described circuit board (10) is expanded material, forms lens-type or spindle microbubble (102) in it.
3. integrated electrostatic dust-collecting device according to claim 1, it is characterized in that: described airtight conducting film (20) is to form composite construction by film (210)-electrode (220)-film (210).
4. integrated electrostatic dust-collecting device according to claim 3 is characterized in that: described electrode (220) is the fish bone well pattern (221) that is distributed with line edge and sharp-pointed prickle.
5. according to claim 3 or 4 described integrated electrostatic dust-collecting devices, it is characterized in that: the overlay order of circuit board (10) is in the described main body (1): circuit board (10)-airtight conducting film (20)-circuit board (10)-airtight conducting film (20)-circuit board (10), wherein the distance of 0.5~1.5mm/Kv is reserved at electrode (220) edge in the airtight conducting film (20) to the edge of circuit board (10).
6. integrated electrostatic dust-collecting device according to claim 5 is characterized in that: the staggered stack of described adjacent two circuit boards (10) employing, stagger angle 1~30 degree.
7. the described integrated electrostatic dust-collecting device of any one according to claim 1-4, it is characterized in that: be provided with one or several in main body (1) and have the anion circuit board (30) of built-in anion emission electrode, built-in anion emission electrode in the hole (31) of this anion circuit board (30), and the hole (31) of anion circuit board (30) is the symmetrical holes structure, and the thread hairbrush emission electrode (310) of being made by needle-like, prickle shape or use conductive carbon fibre is being installed near the position of port.
8. integrated electrostatic dust-collecting device according to claim 2, it is characterized in that: adopt PUR, polymer adhesive between the described two adjacent circuit boards (10), and the edge of two adjacent circuit boards (10) uses hot melt to merge bonding, forms closed edge (50).
9. integrated electrostatic dust-collecting device according to claim 7, it is characterized in that: described high voltage source (40) is installed in any side of the non-outlet and inlet face of main body (1), wherein the output of high voltage source (40) is connected by compiling line (60) with the high and low potential end of each airtight conducting film (20) respectively, and the anion emission electrode in the negative high-voltage end of high voltage source (40) and the anion circuit board (30) is connected.
10. integrated electrostatic dust-collecting device according to claim 1, it is characterized in that: described housing (3) carries out overall package by canning means to main body (1) and high voltage source (40), namely between housing (3) and main body (1), be formed with encapsulated layer (2), be equipped with on the housing (3) to socket or contact (41) of high voltage source (40) power supply.
CN2012201458193U 2011-12-29 2012-04-06 Integration electrostatic dust collecting device Expired - Lifetime CN202666994U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107812612A (en) * 2016-09-14 2018-03-20 东莞市宇洁新材料有限公司 MCA particulate matter dust arrester, dust collecting method and preparation method thereof
CN114466701A (en) * 2019-10-15 2022-05-10 得康氧公司 Device for electronically filtering particles
CN115193584A (en) * 2021-04-08 2022-10-18 无锡凯漫科技有限公司 Low-wind-resistance air filter and preparation method and application thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107812612A (en) * 2016-09-14 2018-03-20 东莞市宇洁新材料有限公司 MCA particulate matter dust arrester, dust collecting method and preparation method thereof
CN107812612B (en) * 2016-09-14 2020-05-15 东莞市宇洁新材料有限公司 Particulate matter dust collector with micro-channel structure, dust collecting method and manufacturing method thereof
CN114466701A (en) * 2019-10-15 2022-05-10 得康氧公司 Device for electronically filtering particles
CN115193584A (en) * 2021-04-08 2022-10-18 无锡凯漫科技有限公司 Low-wind-resistance air filter and preparation method and application thereof

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