CN202658748U - Expandable polyphenyl particle insulation board with low heat conductivity coefficient - Google Patents
Expandable polyphenyl particle insulation board with low heat conductivity coefficient Download PDFInfo
- Publication number
- CN202658748U CN202658748U CN 201220198989 CN201220198989U CN202658748U CN 202658748 U CN202658748 U CN 202658748U CN 201220198989 CN201220198989 CN 201220198989 CN 201220198989 U CN201220198989 U CN 201220198989U CN 202658748 U CN202658748 U CN 202658748U
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- Prior art keywords
- polyphenyl particle
- expandable
- expansion polyphenyl
- insulation board
- insulating layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an expandable polyphenyl particle insulation board with low heat conductivity coefficient. The expandable polyphenyl particle insulation board with low heat conductivity coefficient comprises an expandable polyphenyl particle insulating layer, wherein the surface of the expandable polyphenyl particle insulating layer is provided with a mica sheet layer. The insulation board disclosed by the utility model is manufacted by arranging the mica sheet layer on the expandable polyphenyl particle insulating layer, so that not only can low-cost advantage of the expendable polyphenyl particle material be highlighted, but also the heat conductivity coefficient of the insulation board is reduced by utilizing the mica sheet layer.
Description
Technical field
The utility model patent belongs to expansion polyphenyl particle heat-insulating plate field, is specifically related to a kind of novel low thermal conductivity expansion polyphenyl particle heat-insulating plate.
Background technology
The granular polystyrene material has been widely used in the industry-by-industries such as building, the energy.Simple EPS material (expansion polyphenyl particle) is with its good effect of heat insulation, the lower line style coefficient of expansion, is widely used in fields such as liquefied natural gas, liquefied ethylene, liquefied petroleum gas storage transportation and building heat preservation are heat insulation.Yet, its coefficient of thermal conductivity of EPS material still can't with the poly-fulminuric acid fat of PIR(), PUR(polyurethane) etc. compare.
In some special applications, the coefficient of thermal conductivity of EPS material is had relatively high expectations.Therefore the expansion polyphenyl particle heat-insulating plate that needs a kind of low thermal conductivity of design.
The utility model content
The purpose of this utility model is to provide a kind of novel low thermal conductivity expansion polyphenyl particle heat-insulating plate.
The purpose of this utility model is achieved through the following technical solutions:
A kind of low thermal conductivity expansion polyphenyl particle heat-insulating plate, it comprises the expansion polyphenyl particulate insulating layer, its surface that is described expansion polyphenyl particulate insulating layer is provided with mica splittings.
Above-mentioned low thermal conductivity expansion polyphenyl particle heat-insulating plate, it is that the thickness of described expansion polyphenyl particulate insulating layer is 30mm-500mm, the thickness of described mica splittings is 0.2mm-1mm.
Above-mentioned low thermal conductivity expansion polyphenyl particle heat-insulating plate, it is that described mica splittings adopts mode and expansion polyphenyl particulate insulating layer gluing or that apply to be bonded together.
The beneficial effects of the utility model:
The utility model arranges mica splittings on expansion polyphenyl particulate insulating layer surface and makes warming plate, both given prominence to the low-cost advantage of expansion polyphenyl granular material, utilize again mica splittings to reduce the coefficient of thermal conductivity of warming plate, make its coefficient of thermal conductivity reach 0.03 w/ (mk) ~ 0.035 w/ (mk).
Description of drawings
Fig. 1 is the three-dimensional structure diagram of low thermal conductivity expansion polyphenyl particle heat-insulating plate.
Fig. 2 is the elevation of low thermal conductivity expansion polyphenyl particle heat-insulating plate.
The specific embodiment
Low thermal conductivity expansion polyphenyl particle heat-insulating plate as shown in Figure 1, it comprises expansion polyphenyl particulate insulating layer 1, the surface of described expansion polyphenyl particulate insulating layer 1 is provided with mica splittings 2.The thickness of described expansion polyphenyl particulate insulating layer 1 is 30mm-500mm, and the thickness of described mica splittings 2 is 0.2mm-1mm.Described mica splittings 2 adopts mode and expansion polyphenyl particulate insulating layer 1 gluing or that apply to be bonded together.The density of expansion polyphenyl granular material is 20-40 kg/m3.
Claims (3)
1. low thermal conductivity expansion polyphenyl particle heat-insulating plate, it comprises expansion polyphenyl particulate insulating layer (1), it is characterized in that the surface of described expansion polyphenyl particulate insulating layer (1) is provided with mica splittings (2).
2. low thermal conductivity expansion polyphenyl particle heat-insulating plate according to claim 1, the thickness that it is characterized in that described expansion polyphenyl particulate insulating layer (1) is 30mm-500mm, the thickness of described mica splittings (2) is 0.2mm-1mm.
3. low thermal conductivity expansion polyphenyl particle heat-insulating plate according to claim 1 and 2 is characterized in that described mica splittings (2) adopts mode and expansion polyphenyl particulate insulating layer (1) gluing or that apply to be bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220198989 CN202658748U (en) | 2012-05-06 | 2012-05-06 | Expandable polyphenyl particle insulation board with low heat conductivity coefficient |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220198989 CN202658748U (en) | 2012-05-06 | 2012-05-06 | Expandable polyphenyl particle insulation board with low heat conductivity coefficient |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202658748U true CN202658748U (en) | 2013-01-09 |
Family
ID=47453662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220198989 Expired - Fee Related CN202658748U (en) | 2012-05-06 | 2012-05-06 | Expandable polyphenyl particle insulation board with low heat conductivity coefficient |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202658748U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418867A (en) * | 2016-11-08 | 2019-11-05 | 瓦克技术股份公司 | Vacuum insulation board |
-
2012
- 2012-05-06 CN CN 201220198989 patent/CN202658748U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418867A (en) * | 2016-11-08 | 2019-11-05 | 瓦克技术股份公司 | Vacuum insulation board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20180506 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |