CN202655194U - Dispensing mechanism of light emitting diode (LED) solid crystal machine - Google Patents
Dispensing mechanism of light emitting diode (LED) solid crystal machine Download PDFInfo
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- CN202655194U CN202655194U CN2012202648462U CN201220264846U CN202655194U CN 202655194 U CN202655194 U CN 202655194U CN 2012202648462 U CN2012202648462 U CN 2012202648462U CN 201220264846 U CN201220264846 U CN 201220264846U CN 202655194 U CN202655194 U CN 202655194U
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- power source
- rotating shaft
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- screw mandrel
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Abstract
The utility model discloses a dispensing mechanism of a light emitting diode (LED) solid crystal machine. A first power source of a lifting drive component acts on a screw rod through an output shaft. When the screw rod rotates, a lifting seat is driven to finish lifting movement along a guide rail on a screw rod seat. Therefore, the lifting movement in dispensing is finished by the screw rod so that positional accuracy of the dispensing along a lifting direction is improved and quality of the dispensing is ensured.
Description
Technical field
The utility model relates to LED manufacturing technology field, relates in particular to a kind of glue applying mechanism of LED die bond machine.
Background technology
Along with the development of light emitting diode (Lighting Emitting Diode, LED) technology, LED has been widely used in the fields such as illumination, signal demonstration, and also development thereupon of LED manufacturing technology such as LED die bond technology.
General, the glue applying mechanism of LED die bond machine generally comprises the Glue dripping head assembly, is connected with the Glue dripping head assembly and drives the rotary drive assembly of described Glue dripping head assembly rotation, and, be movably set with described rotary drive assembly and drive the lifting driven unit part that it does elevating movement, and the lifting driven unit directly adopts power source driving rotary drive assembly to finish elevating movement along guide rail.During the controlled driving rotary drive assembly motion of the output shaft of power source, its control accuracy does not reach requirement, makes invocation point glue positioning accuracy inadequate, and then the some colloid measures less than guarantee.
The utility model content
The utility model embodiment technical problem to be solved is, a kind of glue applying mechanism of LED die bond machine is provided, to improve some glue positioning accuracy and guarantee point colloid amount.
The further technical problem to be solved of the utility model embodiment is to provide a kind of glue applying mechanism of LED die bond machine, comprise the Glue dripping head assembly, be connected with described Glue dripping head assembly and drive the rotary drive assembly of described Glue dripping head assembly rotation, and, be movably set with described rotary drive assembly and drive the lifting driven unit that it does elevating movement, described lifting driven unit comprises:
The first power source;
Be located on the output shaft of described the first power source and be driven by it the screw mandrel of rotation;
Be equipped with the screw rodb base of described screw mandrel;
Be fixed on the described screw rodb base and be parallel to the guide rail that described screw mandrel arranges;
And, being sheathed on the described screw mandrel and being slidedly arranged on the described guide rail to finish the elevating bracket of elevating movement when the described screw mandrel rotation, described elevating bracket and described rotary drive assembly are connected.
Further, be fixed with the first photoelectricity sheet on the described elevating bracket, described screw rodb base is fixed with first a power source(-)holder for fixing described the first power source, is fixed with the first inductor of described the first photoelectricity sheet being responded to control described the first power source on described the first power source(-)holder.
Further, described screw rodb base two ends rotatably are fixed in by the screw mandrel bearing in described screw mandrel two ends, and the output shaft of described the first power source is fixed by the end of shaft coupling and described screw mandrel.
Further, described rotary drive assembly comprises:
The second power source;
Be located on described the second power source output shaft and be driven by it the eccentric wheel of rotation;
Be fixed with described the second power source and be provided with the second power source(-)holder of the through hole that rotates for described eccentric wheel;
Be fixed in the rotating shaft bearing on described the second power source(-)holder;
With the rotating shaft that ring in the described rotating shaft bearing fixes, described Glue dripping head assembly is located at described rotating shaft one end;
And an end tightens described rotating shaft, the other end and described eccentric eccentric shaft butt to be subjected to described eccentric shaft to drive the rotating shaft STATEMENT OF FEDERALLY SPONSORED that realizes swing.
Further, described rotating shaft STATEMENT OF FEDERALLY SPONSORED comprises:
One end is by the universal driving shaft bearing sleeve is connected on the described rotating shaft, the other end is connected in an extension spring one end the first STATEMENT OF FEDERALLY SPONSORED;
And, tighten the second STATEMENT OF FEDERALLY SPONSORED that described rotating shaft, the other end are connected in the described extension spring other end with the stacked setting of described the first STATEMENT OF FEDERALLY SPONSORED and an end,
Be socketed with capacity eccentric bearing on the described eccentric eccentric shaft, described capacity eccentric bearing is encircled and tightened to described the first STATEMENT OF FEDERALLY SPONSORED and the second STATEMENT OF FEDERALLY SPONSORED.
Further, be fixed with the second photoelectricity sheet on the described eccentric wheel, be fixed with the second inductor of described the second photoelectricity sheet being responded to control described the second power source on described the second power source(-)holder.
The beneficial effect of the utility model embodiment is:
By a kind of glue applying mechanism of LED die bond machine is provided, the first power source acts on screw mandrel by output shaft in its lifting driven unit, drive elevating bracket during the screw mandrel rotation and finish lifting action along the guide rail on the screw rodb base, like this, lifting action when utilizing screw mandrel to finish glue has improved the positioning accuracy of some glue on the lifting direction, has guaranteed some colloid amount.
Description of drawings
Fig. 1 is the stereogram of glue applying mechanism of the LED die bond machine of the utility model embodiment.
Fig. 2 is the exploded view of glue applying mechanism of the LED die bond machine of the utility model embodiment.
Fig. 3 is the exploded view of rotary drive assembly 20 in the glue applying mechanism of LED die bond machine of the utility model embodiment.
Fig. 4 is the exploded view of lifting driven unit 30 in the glue applying mechanism of LED die bond machine of the utility model embodiment.
The specific embodiment
Need to prove, in the situation that do not conflict, embodiment and the feature among the embodiment among the application can mutually combine, and below in conjunction with the drawings and specific embodiments the utility model are described in further detail.
To shown in Figure 2, the glue applying mechanism of the LED die bond machine of the utility model embodiment mainly comprises such as Fig. 1:
Glue dripping head assembly 10, general Glue dripping head assembly 10 comprises swing arm unit 101 and Glue dripping head 102, swing arm unit 101 1 ends are used for the rotating shaft 201 on the fixing following rotary drive assembly 20, other end set-point glue 102, thus Glue dripping head 102 is finished rotational positioning under the turning effort of rotating shaft 201.Certainly, Glue dripping head assembly 10 can also only be Glue dripping head 102, thus following rotating shaft 201 can be directly and Glue dripping head 102 be connected and finish the rotation of Glue dripping head 102.
Like this, the second power source 202 output shafts 203 rotate, band movable eccentric wheel 204 is in through hole 205 interior spinning movements, thereby and the eccentric shaft 208 of eccentric wheel 204 swings rotating shaft STATEMENT OF FEDERALLY SPONSORED 209 with rotating shaft STATEMENT OF FEDERALLY SPONSORED 209 1 end in contact, because rotating shaft STATEMENT OF FEDERALLY SPONSORED 209 other ends chucking rotating shaft 201, thereby rotating shaft 201 can rotate because of the swing effect of rotating shaft STATEMENT OF FEDERALLY SPONSORED 209, and then drives 10 rotations of Glue dripping head assembly, thereby finishes Glue dripping head assembly 10 location in the horizontal direction.Like this, the second power source 202 acts on eccentric wheel 204 by output shaft 203, and eccentric wheel 204 driven rotary axle STATEMENT OF FEDERALLY SPONSORED 209 swing, thereby drive rotating shaft 201 rotations, thereby have improved some glue positioning accuracy in the horizontal direction, have guaranteed some colloid amount.
Rotating shaft STATEMENT OF FEDERALLY SPONSORED 209, can further comprise when specific implementation: an end is by the first STATEMENT OF FEDERALLY SPONSORED 212 that bearing 210 is socketed on the rotating shaft 201, the other end is connected in an extension spring 211 1 ends that links, and, be connected in the second STATEMENT OF FEDERALLY SPONSORED 213 of extension spring 211 other ends with the 212 stacked settings of the first STATEMENT OF FEDERALLY SPONSORED and end chucking rotating shaft 201, the other end, be socketed with capacity eccentric bearing 214, the first STATEMENT OF FEDERALLY SPONSORED 212 and the second STATEMENT OF FEDERALLY SPONSORED 213 on the eccentric shaft 208 of eccentric wheel 204 and encircle and tighten capacity eccentric bearing 214.Like this, eccentric shaft 208 is when through hole 205 interior spinning movement, because capacity eccentric bearing 214 is encircled and is tightened by the first STATEMENT OF FEDERALLY SPONSORED 212 and the second STATEMENT OF FEDERALLY SPONSORED 213, capacity eccentric bearing 214 can order about rotating shaft STATEMENT OF FEDERALLY SPONSORED 209 and swing, thereby driven rotary axle 201 rotation, thus further improved some glue in the horizontal direction positioning accuracy and guaranteed some colloid amount.
The second inductive component is fixed with on the second photoelectricity sheet 215, the second power source(-)holders 206 at eccentric wheel 204 and is fixed with the second inductor 216 of the second photoelectricity sheet 215 being responded to control the second power source 202.Like this, the state that rotatablely moves of rotary drive assembly 20 is in time fed back, guarantee the normal operation of mechanism.
Lifting driven unit 30, it is movably set with rotary drive assembly 20 and drives it does elevating movement.General, as shown in Figure 4, lifting driven unit 30 includes the first power source 301, be located on the output shaft 302 of the first power source 301 and be driven by it the screw mandrel 303 of rotation, be equipped with the screw rodb base 304 of screw mandrel 303, be fixed on the screw rodb base 304 and be parallel to the guide rail 305 that screw mandrel 303 arranges, and, be sheathed on the screw mandrel 303 and be slidedly arranged on the guide rail 305 to finish the elevating bracket 306 of elevating movement when screw mandrel 303 rotation, elevating bracket 306 is connected with rotary drive assembly 20.
Like this, the first power source 301 output shafts 302 rotate, drive screw mandrel 303 in screw rodb base 304 interior spinning movements, and because the restriction effect of guide rail 305, elevating bracket 306 can be finished lifting action along guide rail 305 under the helicoid effect of screw mandrel 303, and then by 10 liftings of rotary drive assembly 20 drive Glue dripping head assemblies, thereby finish the location of Glue dripping head assembly 10 on the lifting direction.Like this, the lifting action when utilizing screw mandrel 303 to finish glue has improved the positioning accuracy of some glue on the lifting direction, has guaranteed some colloid amount.
The first inductive component, be fixed with the first photoelectricity sheet 307 at elevating bracket 306, screw rodb base 304 is fixed with one for being fixed with the first inductor 309 of the first photoelectricity sheet 307 being responded to control the first power source 301 on the first power source(-)holder 308, the first power source(-)holders 308 of fixing the first power source 301.Like this, the state that moves up and down of rotary drive assembly 20 is in time fed back, guarantee the normal operation of mechanism.Certainly, the first photoelectricity sheet 307 can also be fixed on the screw rodb base 304, equally can finish above-mentioned induction action.
Screw rodb base 304 two ends rotatably are fixed in by screw mandrel bearing 310 in screw mandrel 303 two ends, and the output shaft 302 of the first power source 301 is fixed by shaft coupling 311 and the end of screw mandrel 303.
As a kind of embodiment, above-mentioned rotary drive assembly 20 can also adopt following structure: directly be affixed to Glue dripping head assembly 10 by the second power source 202 output shafts 203 and be connected and drive Glue dripping head assembly 10 rotation.
As a kind of embodiment, above-mentioned the first power source 301 or the second power source 202 can be motor or other power take-off mechanisms.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that do not break away from principle of the present utility model and spirit can be carried out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is limited by claims and equivalency range thereof.
Claims (6)
1. the glue applying mechanism of a LED die bond machine, comprise the Glue dripping head assembly, be connected with described Glue dripping head assembly and drive the rotary drive assembly of described Glue dripping head assembly rotation, and, be movably set with described rotary drive assembly and drive the lifting driven unit that it does elevating movement, it is characterized in that, described lifting driven unit comprises:
The first power source;
Be located on the output shaft of described the first power source and be driven by it the screw mandrel of rotation;
Be equipped with the screw rodb base of described screw mandrel;
Be fixed on the described screw rodb base and be parallel to the guide rail that described screw mandrel arranges;
And, being sheathed on the described screw mandrel and being slidedly arranged on the described guide rail to finish the elevating bracket of elevating movement when the described screw mandrel rotation, described elevating bracket and described rotary drive assembly are connected.
2. the glue applying mechanism of LED die bond machine as claimed in claim 1, it is characterized in that, be fixed with the first photoelectricity sheet on the described elevating bracket, described screw rodb base is fixed with first a power source(-)holder for fixing described the first power source, is fixed with the first inductor of described the first photoelectricity sheet being responded to control described the first power source on described the first power source(-)holder.
3. the glue applying mechanism of LED die bond machine as claimed in claim 1 is characterized in that, described screw rodb base two ends rotatably are fixed in by the screw mandrel bearing in described screw mandrel two ends, and the output shaft of described the first power source is fixed by the end of shaft coupling and described screw mandrel.
4. the glue applying mechanism of LED die bond machine as claimed in claim 1 is characterized in that, described rotary drive assembly comprises:
The second power source;
Be located on described the second power source output shaft and be driven by it the eccentric wheel of rotation;
Be fixed with described the second power source and be provided with the second power source(-)holder of the through hole that rotates for described eccentric wheel;
Be fixed in the rotating shaft bearing on described the second power source(-)holder;
With the rotating shaft that ring in the described rotating shaft bearing fixes, described Glue dripping head assembly is located at described rotating shaft one end;
And an end tightens described rotating shaft, the other end and described eccentric eccentric shaft butt to be subjected to described eccentric shaft to drive the rotating shaft STATEMENT OF FEDERALLY SPONSORED that realizes swing.
5. the glue applying mechanism of LED die bond machine as claimed in claim 4 is characterized in that, described rotating shaft STATEMENT OF FEDERALLY SPONSORED comprises:
One end is by the universal driving shaft bearing sleeve is connected on the described rotating shaft, the other end is connected in an extension spring one end the first STATEMENT OF FEDERALLY SPONSORED;
And, tighten the second STATEMENT OF FEDERALLY SPONSORED that described rotating shaft, the other end are connected in the described extension spring other end with the stacked setting of described the first STATEMENT OF FEDERALLY SPONSORED and an end,
Be socketed with capacity eccentric bearing on the described eccentric eccentric shaft, described capacity eccentric bearing is encircled and tightened to described the first STATEMENT OF FEDERALLY SPONSORED and the second STATEMENT OF FEDERALLY SPONSORED.
6. the glue applying mechanism of LED die bond machine as claimed in claim 4, it is characterized in that, be fixed with the second photoelectricity sheet on the described eccentric wheel, be fixed with the second inductor of described the second photoelectricity sheet being responded to control described the second power source on described the second power source(-)holder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012202648462U CN202655194U (en) | 2012-06-06 | 2012-06-06 | Dispensing mechanism of light emitting diode (LED) solid crystal machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012202648462U CN202655194U (en) | 2012-06-06 | 2012-06-06 | Dispensing mechanism of light emitting diode (LED) solid crystal machine |
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CN202655194U true CN202655194U (en) | 2013-01-09 |
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CN2012202648462U Expired - Fee Related CN202655194U (en) | 2012-06-06 | 2012-06-06 | Dispensing mechanism of light emitting diode (LED) solid crystal machine |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
CN104889017A (en) * | 2015-06-15 | 2015-09-09 | Tcl显示科技(惠州)有限公司 | Silver dropping machine |
CN106992238A (en) * | 2017-05-09 | 2017-07-28 | 深圳市佳思特光电设备有限公司 | A kind of LED dropping glue of die bonder lowering or hoisting gear |
CN107262333A (en) * | 2017-08-01 | 2017-10-20 | 深圳市新益昌自动化设备有限公司 | A kind of two point plastic structure of LED bonders |
WO2020237498A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Novel wafer bonding device of led wafer bonding machine and wafer bonding method therefor |
-
2012
- 2012-06-06 CN CN2012202648462U patent/CN202655194U/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
CN104889017A (en) * | 2015-06-15 | 2015-09-09 | Tcl显示科技(惠州)有限公司 | Silver dropping machine |
CN104889017B (en) * | 2015-06-15 | 2018-03-20 | 华显光电技术(惠州)有限公司 | The silver-colored machine of point |
CN106992238A (en) * | 2017-05-09 | 2017-07-28 | 深圳市佳思特光电设备有限公司 | A kind of LED dropping glue of die bonder lowering or hoisting gear |
CN107262333A (en) * | 2017-08-01 | 2017-10-20 | 深圳市新益昌自动化设备有限公司 | A kind of two point plastic structure of LED bonders |
WO2020237498A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Novel wafer bonding device of led wafer bonding machine and wafer bonding method therefor |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20150606 |
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EXPY | Termination of patent right or utility model |