CN202644927U - Solid wood parquet heat conducting floor board - Google Patents

Solid wood parquet heat conducting floor board Download PDF

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Publication number
CN202644927U
CN202644927U CN2012202415072U CN201220241507U CN202644927U CN 202644927 U CN202644927 U CN 202644927U CN 2012202415072 U CN2012202415072 U CN 2012202415072U CN 201220241507 U CN201220241507 U CN 201220241507U CN 202644927 U CN202644927 U CN 202644927U
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China
Prior art keywords
solid wood
matrix
heat conducting
floor board
heat
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Expired - Fee Related
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CN2012202415072U
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Chinese (zh)
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不公告发明人
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Individual
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Individual
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Priority to CN2012202415072U priority Critical patent/CN202644927U/en
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Publication of CN202644927U publication Critical patent/CN202644927U/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a solid wood parquet heat conducting floor board, which is characterized by comprising base blocks and conducting rubber, wherein the base blocks are full solid wood triangular and trapezoid blocks, three sides of each triangular block are respectively provided with grooves or wedge openings, and four edges of each trapezoid block are provided with grooves of wedge openings. The triangular base blocks and the trapezoid base blocks are spliced into a square base plate, round grooves which are 3-6mm in width are arranged on the surfaces of the square base plates at 4-8cm intervals with the centers of the square base plates serving as original points, and the conducting rubber is filled in the round grooves. The solid wood parquet heat conducting floor board is novel in design and reasonable in structure, particularly, the design of the concentric circle grooves effectively absorbs self-stress of wood, the conducting rubber in the round grooves not only stabilizes tensional force among the base blocks, but also has effects including fast and even heat conduction. When the solid wood parquet heat conducting floor board is applied to floor heating, not only characteristics including luxury, attractiveness and comfort of solid wood floor boards can be maintained, but also the solid wood parquet heat conducting floor board can be enabled not to have warping, looseness, cracks and swells, thereby being very ideal in using effect.

Description

Solid wood parquets heat conducting floor
Technical field
The utility model relates to wooden floor, particularly a kind of pure solid wood parquets heat conducting floor.
Background technology
The characteristics such as luxurious, attractive in appearance, comfortable and environmental protection that wooden floor has, but wooden floor is heated and humidity effect is yielding and produce distortion, loosening, crack and bulge phenomenon.At present, in senior decoration, it is floor heating that more and more employings laying heat pipe under the floor comes heating, this heating system can be with the low-temperature heat radiation heat supply, keep the comfortable of heating, efficient energy-saving, and in the laying on floor, how to solve luxurious, the attractive in appearance and comfortable characteristics that wooden floor should be arranged, making again it not produce distortion, loosening, crack and bulge phenomenon is the problem that is to be solved.
The utility model content
The purpose of this utility model is to carry common a kind of solid wood parquets heat conducting floor for the deficiencies in the prior art, this floor is used for luxurious, the attractive in appearance and comfortable characteristics that floor heating had both kept wooden floor, make again that it is non-warping, loosening, crack and bulge, result of use is ideal.
The purpose of this utility model is achieved in that
A kind of solid wood parquets heat conducting floor, characteristics are that this floor comprises matrix and heat-conducting glue, and described matrix is full solid wood triangle and trapezoid block, and its triangle matrix three limits have groove or wedge mouth, and trapezoidal matrix four limits have groove or wedge mouth; Triangle matrix and trapezoidal matrix assembly unit are square substrate, leave respectively the wide circular groove of several 3~6mm at the square substrate back side take the center as initial point interval 4~8cm; Heat-conducting glue is filled in the circular groove.
Splice with dual-cavity and double wedge joint between described triangle matrix and trapezoidal matrix; Splice with single groove and single wedge mouth between square substrate.
The utility model is novel in design, and rational in infrastructure, particularly the design of concentric groove has absorbed the stress of timber self effectively, and the pulling force that the heat-conducting glue in the circular groove is not only firm between each matrix has more the effect that heat conduction is fast, heat conduction is even; Because heat-conducting glue to the connection, the particularly splicing between matrix wedge mouth of each matrix, has absorbed the STRESS VARIATION of different directions timber effectively.The utility model is used for luxurious, the attractive in appearance and comfortable characteristics that floor heating had both kept wooden floor, makes again that it is non-warping, loosening, crack and bulge, and result of use is ideal.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the rear elevation of Fig. 1;
Fig. 3 is the A-A sectional view of Fig. 2;
Fig. 4 is the utility model triangular basis block structure schematic diagram;
The trapezoidal matrix structural representation of Fig. 5 the utility model;
Fig. 6 is the B-B sectional view of Fig. 5.
The specific embodiment
Consult Fig. 1, Fig. 2 and Fig. 3, the utility model comprises matrix and heat-conducting glue, and described matrix is full solid wood triangle and trapezoid block, and its triangle matrix 1 three limits have groove or wedge mouth, and trapezoidal matrix 2 four limits have groove or wedge mouth; Triangle matrix 1 is square substrate 3 with trapezoidal matrix 2 assembly units, opens respectively the wide circular groove of 3~6mm 4 at square substrate 3 back sides take the center as initial point interval 4~8cm, at circular groove 4 interior filling heat-conducting glues 5.
Consult Fig. 3 and Fig. 4, the setting of the utility model triangle matrix 1 groove and wedge mouth is that dual-cavity is opened on a limit, and a limit has double wedge joint, and single groove 8 or single wedge mouth 9 are opened in a limit.
Consult Fig. 4 and Fig. 5, the setting of trapezoidal matrix 2 grooves of the utility model and wedge mouth is that a trapezoidal waist is opened dual-cavity 6 or double wedge joint 7, and another waist is opened single groove or single wedge mouth; Open dual-cavity 6 or double wedge joint 7 at the bottom of two.
The utility model is such assembly unit:
At first, after a slice triangle matrix 1 and two trapezoidal substrates 2 are combined into a large triangle, four large triangles are combined into a square substrate 3, at the back side of square substrate 3 take the center as the center of circle, 4~8cm opens a width as radius and is the first circular groove of 3~6mm, open a width as the second circular groove of 3~6mm take concentric, 4~8cm * 2 as radius again, by that analogy, until the distance at outermost circle slot pitch square substrate 3 edges is basic identical only with the first radius of circle; Then heat-conducting glue 5 is filled in the different circular groove of each radius.
During use, take square substrate 3 as unit, mutually be assembled into integral body.

Claims (2)

1. a solid wood parquets heat conducting floor is characterized in that this floor comprises matrix and heat-conducting glue, and described matrix is full solid wood triangle and trapezoid block, and its triangle matrix three limits have groove or wedge mouth, and trapezoidal matrix four limits have groove or wedge mouth; Several piece triangle matrix and trapezoidal matrix assembly unit are square substrate, drive respectively several circular troughs at the square substrate back side take the center as initial point interval same distance; Heat-conducting glue is filled in the circular trough.
2. solid wood parquets heat conducting floor according to claim 1 is characterized in that between described triangle matrix and trapezoidal matrix with dual-cavity and double wedge joint splicing; Splice with single groove and single wedge mouth between square substrate.
CN2012202415072U 2012-05-28 2012-05-28 Solid wood parquet heat conducting floor board Expired - Fee Related CN202644927U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012202415072U CN202644927U (en) 2012-05-28 2012-05-28 Solid wood parquet heat conducting floor board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012202415072U CN202644927U (en) 2012-05-28 2012-05-28 Solid wood parquet heat conducting floor board

Publications (1)

Publication Number Publication Date
CN202644927U true CN202644927U (en) 2013-01-02

Family

ID=47414051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012202415072U Expired - Fee Related CN202644927U (en) 2012-05-28 2012-05-28 Solid wood parquet heat conducting floor board

Country Status (1)

Country Link
CN (1) CN202644927U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103821317A (en) * 2014-03-07 2014-05-28 上海新四合木业有限公司 Solid-wood composite square parquet floor and manufacturing method thereof
CN106364249A (en) * 2016-11-01 2017-02-01 苏州美瑞德建筑装饰有限公司 European style building space stone ground pattern integrated composite splicing structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103821317A (en) * 2014-03-07 2014-05-28 上海新四合木业有限公司 Solid-wood composite square parquet floor and manufacturing method thereof
CN103821317B (en) * 2014-03-07 2016-03-02 上海筑巢网络科技有限公司 A kind of solid wood compound square parquet and preparation method thereof
CN106364249A (en) * 2016-11-01 2017-02-01 苏州美瑞德建筑装饰有限公司 European style building space stone ground pattern integrated composite splicing structure
CN106364249B (en) * 2016-11-01 2021-12-28 苏州美瑞德建筑装饰有限公司 Integral composite splicing structure for ground patterns of European building space stone

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130102

Termination date: 20130528