CN202634885U - Transplant combination structure of circuit boards - Google Patents
Transplant combination structure of circuit boards Download PDFInfo
- Publication number
- CN202634885U CN202634885U CN 201220021686 CN201220021686U CN202634885U CN 202634885 U CN202634885 U CN 202634885U CN 201220021686 CN201220021686 CN 201220021686 CN 201220021686 U CN201220021686 U CN 201220021686U CN 202634885 U CN202634885 U CN 202634885U
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- CN
- China
- Prior art keywords
- circuit board
- contact site
- chimeric chamber
- shape
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Provided is a transplant combination structure of circuit boards, comprising a first circuit board and a second circuit board, wherein the first circuit board comprises a first contact portion, a second contact portion, and a third contact portion which is bending; the second circuit board comprises a first contact portion, a second contact portion, and a third contact portion which is protruding; the third contact portion of the first circuit board comprises a chimeric chamber; and the third contact portion of the second circuit board is embedded in the chimeric chamber to make the second circuit board be arranged upon the first circuit board in a detachable manner. The transplant combination structure of the utility model provides multiple connecting structures of the first circuit board and the second circuit board. When the damaged second circuit board is discovered, the user just needs to take out the third contact portion of the second circuit board from the chimeric chamber and the second circuit board can be taken out, and then the user can insert a new sub-circuit board into the chimeric chamber, thereby realizing the replacement of the second circuit board. The transplant combination structure of the utility model features simple structure, reliable connection, convenient operation, and low cost.
Description
Technical field
The utility model relates to field of circuit boards, particularly a kind of transplanting combining structure of circuit board.
Background technology
When the production of circuit board, need on a motherboard, contain the polylith daughter board usually, but have the daughter board that one or more has damaged in these daughter boards.For when consigning to the client, keep consistency of product and integrity, a kind of method of transplanting is arranged in the prior art, the daughter board that is about to damage is removed, and new daughter board is loaded onto in the position of the daughter board of this damage then.Yet there is inconvenient operation in motherboard of the prior art, is connected insecure problem with syndeton between the daughter board.
The utility model content
The utility model provide a kind of simple in structure, cost is low, connection is feasible, the transplanting combining structure of the circuit board being convenient to operate.
For solving the problems of the technologies described above, the utility model provides a kind of transplanting combining structure of circuit board, comprising: first circuit board and second circuit board; First circuit board comprises first contact site, second contact site and the 3rd crooked contact site, and first contact site is connected with second contact site through the 3rd contact site; Second circuit board comprises first contact site, second contact site and the 3rd outstanding contact site, and first contact site of second circuit board is connected with second contact site of second circuit board through the 3rd contact site of second circuit board; The 3rd contact site of first circuit board comprises chimeric chamber; The 3rd contact site of second circuit board embeds in the chimeric chamber so that second circuit board is removably disposed on the first circuit board; First contact site of first circuit board, second contact site and the 3rd contact site snugly are provided with first contact site, second contact site and the 3rd contact site of second circuit board respectively accordingly each other.
Further, first contact site of first circuit board and second contact site are arranged on respectively in two crossing planes.
Further, second contact site of first circuit board comprises the first arc connecting portion, and second contact site of second circuit board comprises the second arc connecting portion.
Further, first contact site of first circuit board and second contact site are arranged on respectively in the same plane.
Further, first contact site of first circuit board and second contact site are arranged in two planes that are parallel to each other respectively, perhaps are arranged on the same straight line.
Further, the 3rd contact site of first circuit board comprises a plurality of interconnective arc connecting portions, and a plurality of interconnective arc connecting portions form chimeric chamber, and the 3rd contact site of second circuit board has the shape that matches with chimeric chamber.
Further, the 3rd contact site of second circuit board is provided with opening.
Further, the 3rd contact site of first circuit board comprises a separated n shape connecting portion and the 2nd n shape connecting portion, and a n shape connecting portion of first circuit board is connected through first middle interconnecting piece with the 2nd n shape connecting portion; Chimeric chamber comprises chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape, and a n shape connecting portion and the 2nd n shape connecting portion form chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape respectively; The 3rd contact site of second circuit board have first insertion section and second insertion section of matching with chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape respectively and be connected first insertion section and second insertion section between second middle interconnecting piece.
Further, chimeric chamber comprises diapire, and the sidewall of the 3rd contact site of first circuit board connects through diapire; The 3rd contact site of second circuit board embeds in the chimeric chamber and the surface and the diapire of the 3rd contact site of second circuit board relatively are provided with.
Further, the thickness of the 3rd contact site of second circuit board matches with the degree of depth in chimeric chamber, and forms a step-like structure between the main body of the 3rd contact site of second circuit board and second circuit board.
The utility model provides the syndeton of multiple first circuit board and second circuit board; When finding the second circuit board that damages; Only need the 3rd contact site of second circuit board be extracted out in chimeric chamber, can second circuit board be taken off, in chimeric chamber, insert new sub-circuit board then; Thereby realized the replacing operation of second circuit board, had characteristics simple in structure, that connection is reliable, easy to operate, cost is low.
Description of drawings
Fig. 1 is the structural representation of the utility model first embodiment.
Fig. 2 is the structural representation of the utility model second embodiment.
Fig. 3 is the structural representation of the utility model the 3rd embodiment.
Fig. 4 is the structural representation of the utility model the 4th embodiment.
Fig. 5 is the structural representation of the utility model the 5th embodiment.
Fig. 6 is the structural representation of the utility model the 6th embodiment.
Fig. 7 is the structural representation of the utility model the 7th embodiment.
Fig. 8 is the structural representation of the utility model the 8th embodiment.
Fig. 9 is the syndeton between first, second circuit board of the prior art.
Figure 10 is the syndeton between first, second circuit board in the utility model.
Embodiment
Shown in Fig. 1-8, the transplanting combining structure of the circuit board in the utility model comprises: first circuit board 1 and second circuit board 2; First circuit board 1 comprises that first contact site 11, second contact site 12 and crooked the 3rd contact site 13, the first contact sites 11 are connected with second contact site 12 through the 3rd contact site 13; Second circuit board 2 comprises first contact site 21, second contact site 22 and the 3rd outstanding contact site 23, and first contact site 21 of second circuit board 2 is connected with second contact site 22 through the 3rd contact site 23.The 3rd contact site 13 of first circuit board 1 comprises chimeric chamber; The 3rd contact site 23 of second circuit board 2 embeds in the chimeric chamber so that second circuit board 2 is removably disposed on the first circuit board 1.First contact site 11 of first circuit board 1, second contact site 12 and the 3rd contact site 13 snugly are provided with first contact site 21, second contact site 22 and the 3rd contact site 23 of second circuit board 2 respectively accordingly each other.Thereby; First circuit board 1 can removably be connected through its 3rd contact site respectively with second circuit board 2; When finding the second circuit board that damages, only need the 3rd contact site of second circuit board be extracted out in chimeric chamber, can second circuit board be taken off; In chimeric chamber, insert new sub-circuit board then; And make the seamless identical state of maintenance between main circuit board (for example first circuit board) and the sub-circuit board (for example second circuit board), thus realized the replacing operation of second circuit board, have characteristics simple in structure, that connection is reliable, easy to operate, cost is low.
Preferably, shown in Fig. 1-2, first contact site 11 and second contact site 12 of first circuit board 1 are separately positioned in two crossing planes.Preferably, as shown in Figure 2, second contact site 12 of first circuit board 1 comprises the first arc connecting portion 121, and second contact site 22 of second circuit board 2 comprises the second arc connecting portion 221.
Preferably, shown in Fig. 3-4,7, first contact site 11 and second contact site 12 of first circuit board 1 are separately positioned in the same plane.Preferably, shown in Fig. 5-6, first contact site 11 and second contact site 12 of first circuit board 1 are separately positioned in two planes that are parallel to each other.
Preferably, as shown in Figure 4, the 3rd contact site 13 of first circuit board 1 has recess 131 ', and the 3rd contact site 23 of second circuit board 2 is provided with the recess 231 ' that cooperates with recess 131 '.
Preferably; As shown in Figure 6; The 3rd contact site 13 of first circuit board 1 comprises a separated n shape connecting portion 131 and the 2nd n shape connecting portion 132; The one n shape connecting portion 131 of first circuit board 1 is connected through first middle interconnecting piece 133 with the 2nd n shape connecting portion 132; Chimeric chamber comprises chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape; The one n shape connecting portion 131 and the 2nd n shape connecting portion 132 form chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape respectively, and the 3rd contact site 23 of second circuit board 2 has first insertion section 231 and second insertion section 232 of matching with chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape respectively, and is connected second middle interconnecting piece 233 between first insertion section 231 and second insertion section 232.
Preferably; As shown in Figure 7; The 3rd contact site 13 of first circuit board 1 comprises a plurality of interconnective arc connecting portions 134 (preferably; Be three arc connecting portions), a plurality of interconnective arc connecting portions 134 form chimeric chamber, and the 3rd contact site 23 of second circuit board 2 has the shape that matches with chimeric chamber.Preferably, the 3rd contact site 23 of second circuit board 2 is provided with opening 234.
Preferably; Like Fig. 1; Shown in 5,7, the interconnecting of the end that second contact site 12 and the 3rd contact site 13 first circuit board 1 of an end that is connected with the 3rd contact site 13 first circuit board 1 first contact site 11 of first circuit board 1 and first circuit board 1 is connected.Certainly, an end that is connected with the 3rd contact site 13 first circuit board 1 first contact site 11 and an end that is connected with the 3rd contact site 13 first circuit board 1 second contact site 12 also can be provided with spaced reciprocally.
Preferably; Shown in Fig. 2-4, the setting spaced reciprocally of the end that second contact site 12 and the 3rd contact site 13 first circuit board 1 of an end that is connected with the 3rd contact site 13 first circuit board 1 first contact site 11 of first circuit board 1 and first circuit board 1 is connected.Certainly, an end that is connected with the 3rd contact site 13 first circuit board 1 first contact site 11 and an end that is connected with the 3rd contact site 13 first circuit board 1 second contact site 12 also can be interconnective.
Preferably, above-mentioned first circuit board 1 can be respectively female circuit board and sub-circuit board with second circuit board 2, and certainly, first circuit board 1 also can be respectively sub-circuit board and female circuit board with second circuit board 2.
As shown in Figure 8, first contact site 11 and second contact site 12 of first circuit board 1 are arranged on the same straight line.
Fig. 9 shows the syndeton between first circuit board 1 of the prior art and the second circuit board 2.As shown in Figure 9; In the prior art, first circuit board 1 forms chimeric chamber through its 3rd crooked contact site 13, and second circuit board 2 has outstanding the 3rd contact site 23; The 3rd contact site 23 embeds in the 3rd contact site 13, thereby first, second circuit board is coupled together.Because the both sides in chimeric chamber of the prior art are penetrating; Therefore first, second circuit board does not have positioning element on the two thickness direction; Make first, second circuit board on the thickness direction of the two, can be moved, connect insecure problem thereby cause.For this reason, on the basis of above-mentioned each embodiment, the utility model provides a kind of syndeton that is used for first circuit board 1 and second circuit board 2 shown in figure 10.Shown in figure 10, the chimeric chamber of first circuit board 1 comprises diapire 100, and the sidewall of the 3rd contact site 13 of first circuit board 1 connects through diapire 100; The 3rd contact site 23 of second circuit board 2 embeds in the chimeric chamber and the surface and the diapire 100 of the 3rd contact site 23 of second circuit board 2 relatively are provided with.Further, the thickness of the 3rd contact site 23 of second circuit board 2 matches with the degree of depth in chimeric chamber, and forms a step-like structure (not shown) between the main body 200 of the 3rd contact site 23 of second circuit board 2 and second circuit board 2.Owing to adopted said structure, can make first, second circuit board on the thickness direction of the two, well locate with diapire 100 as positioning element, thereby improve the connection reliability of first, second circuit board.
The utility model provides the syndeton of multiple first circuit board and second circuit board; When finding the second circuit board that damages; Only need the 3rd contact site of second circuit board be extracted out in chimeric chamber, can second circuit board be taken off, in chimeric chamber, insert new sub-circuit board then; Thereby realized the replacing operation of second circuit board, had characteristics simple in structure, that connection is reliable, easy to operate, cost is low.
Claims (10)
1. the transplanting combining structure of a circuit board is characterized in that, comprising:
First circuit board and second circuit board;
Said first circuit board comprises first contact site, second contact site and the 3rd crooked contact site, and said first contact site is connected with said second contact site through said the 3rd contact site;
Said second circuit board comprises first contact site, second contact site and the 3rd outstanding contact site, and first contact site of said second circuit board is connected with second contact site of said second circuit board through the 3rd contact site of said second circuit board;
Said the 3rd contact site of said first circuit board comprises chimeric chamber;
Said the 3rd contact site of said second circuit board embeds in the said chimeric chamber so that said second circuit board is removably disposed on the said first circuit board;
First contact site of said first circuit board, second contact site and the 3rd contact site snugly are provided with first contact site, second contact site and the 3rd contact site of said second circuit board respectively accordingly each other.
2. transplanting combining structure as claimed in claim 1 is characterized in that, said first contact site and second contact site of said first circuit board are arranged on respectively in two crossing planes.
3. transplanting combining structure as claimed in claim 2 is characterized in that, second contact site of said first circuit board comprises the first arc connecting portion, and second contact site of said second circuit board comprises the second arc connecting portion.
4. transplanting combining structure as claimed in claim 1 is characterized in that, said first contact site and second contact site of said first circuit board are arranged on respectively in the same plane.
5. transplanting combining structure as claimed in claim 1 is characterized in that, said first contact site of said first circuit board and second contact site are arranged in two planes that are parallel to each other respectively, perhaps are arranged on the same straight line.
6. transplanting combining structure as claimed in claim 1; It is characterized in that; The 3rd contact site of said first circuit board comprises a plurality of interconnective arc connecting portions; Said a plurality of interconnective arc connecting portion forms said chimeric chamber, and the 3rd contact site of said second circuit board has the shape that matches with said chimeric chamber.
7. transplanting combining structure as claimed in claim 6 is characterized in that, the 3rd contact site of said second circuit board is provided with opening.
8. transplanting combining structure as claimed in claim 1; It is characterized in that; Said the 3rd contact site of said first circuit board comprises a separated n shape connecting portion and the 2nd n shape connecting portion, and a n shape connecting portion of said first circuit board is connected through first middle interconnecting piece with the 2nd n shape connecting portion; Said chimeric chamber comprises chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape, and a said n shape connecting portion and the 2nd n shape connecting portion form said chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape respectively; The 3rd contact site of said second circuit board has first insertion section and second insertion section of matching with said chimeric chamber of a n shape and the chimeric chamber of the 2nd n shape respectively and is connected second middle interconnecting piece between said first insertion section and second insertion section.
9. like each described transplanting combining structure among the claim 1-7, it is characterized in that said chimeric chamber comprises diapire, the sidewall of the 3rd contact site of said first circuit board connects through said diapire; The 3rd contact site of said second circuit board embeds in the said chimeric chamber and the surface of the 3rd contact site of said second circuit board and said diapire relatively are provided with.
10. the transplanting combining structure described in claim 9; It is characterized in that; The thickness of the 3rd contact site of said second circuit board matches with the degree of depth in said chimeric chamber, and forms a step-like structure between the main body of the 3rd contact site of said second circuit board and said second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220021686 CN202634885U (en) | 2012-01-17 | 2012-01-17 | Transplant combination structure of circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220021686 CN202634885U (en) | 2012-01-17 | 2012-01-17 | Transplant combination structure of circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202634885U true CN202634885U (en) | 2012-12-26 |
Family
ID=47388017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220021686 Expired - Fee Related CN202634885U (en) | 2012-01-17 | 2012-01-17 | Transplant combination structure of circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202634885U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104619130A (en) * | 2013-11-05 | 2015-05-13 | 健鼎（无锡）电子有限公司 | Circuit board transplanting structure and method for transplanting circuit board |
| TWI487449B (en) * | 2013-10-23 | 2015-06-01 | Tripod Technology Corp | Transplantation structure for circuit board and transplantation method for circuit board |
-
2012
- 2012-01-17 CN CN 201220021686 patent/CN202634885U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI487449B (en) * | 2013-10-23 | 2015-06-01 | Tripod Technology Corp | Transplantation structure for circuit board and transplantation method for circuit board |
| CN104619130A (en) * | 2013-11-05 | 2015-05-13 | 健鼎（无锡）电子有限公司 | Circuit board transplanting structure and method for transplanting circuit board |
| CN104619130B (en) * | 2013-11-05 | 2018-06-19 | 健鼎（无锡）电子有限公司 | Circuit board implantation structure and the method for transplanting circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: INNOQUICK ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHEN LIUHUI Effective date: 20140113 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 517000 HEYUAN, GUANGDONG PROVINCE TO: 629000 SUINING, SICHUAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140113 Address after: 629000 No. 3 South Canal Road, Chuangxin Industrial Park, Suining, Sichuan Patentee after: Innoquick Electronics Technology Co., Ltd. Address before: 517000 Guangdong province Yuancheng District of Heyuan City West three lane No. 16 Patentee before: Chen Liuhui |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20180117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |