CN202631124U - Stratigraphic temperature fine measurement recording apparatus for thermal response system - Google Patents

Stratigraphic temperature fine measurement recording apparatus for thermal response system Download PDF

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Publication number
CN202631124U
CN202631124U CN201220148764.1U CN201220148764U CN202631124U CN 202631124 U CN202631124 U CN 202631124U CN 201220148764 U CN201220148764 U CN 201220148764U CN 202631124 U CN202631124 U CN 202631124U
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CN
China
Prior art keywords
thermal response
response system
chip
chip microcomputer
stratigraphic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201220148764.1U
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Chinese (zh)
Inventor
于建水
林黎
孙宝成
孙世文
田光辉
姚木申
刘九龙
李麟
程万庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TIANJIN HAOHONG TECHNOLOGY DEVELOPMENT Co Ltd
TIANJIN DESIGN INST OF GEOTHERMAL PROSPECT AND DEVELOPMENT
Original Assignee
TIANJIN HAOHONG TECHNOLOGY DEVELOPMENT Co Ltd
TIANJIN DESIGN INST OF GEOTHERMAL PROSPECT AND DEVELOPMENT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by TIANJIN HAOHONG TECHNOLOGY DEVELOPMENT Co Ltd, TIANJIN DESIGN INST OF GEOTHERMAL PROSPECT AND DEVELOPMENT filed Critical TIANJIN HAOHONG TECHNOLOGY DEVELOPMENT Co Ltd
Priority to CN201220148764.1U priority Critical patent/CN202631124U/en
Application granted granted Critical
Publication of CN202631124U publication Critical patent/CN202631124U/en
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Expired - Fee Related legal-status Critical Current

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Abstract

Provided is a stratigraphic temperature fine measurement recording apparatus for a thermal response system, which employs a direct digital temperature value output chip, an interface M-BUS of which is in connection with an AT89S52 one-chip microcomputer; the AT89S52 one-chip microcomputer is in connection with an industrial control PC, wherein a data transmission line is a common copper lead. The advantages of the utility model lie in that calculation of temperature compensating wire length calculation of each sensor is not needed; debugging is not needed; the apparatus is plug-and-play and has the advantages of long data transmission and low costs of a composition system.

Description

The warm layer by layer meticulous survey record device in the ground of thermal response system
Technical field:
The utility model belongs to field of sensing technologies, specifically relates to the warm layer by layer meticulous survey record device in ground of a kind of thermal response system.
Background technology:
Traditional temperature measurement system is because of adopting PT100; PT1000 resistance-type temperature-measurement principle, the distance of carrying with transducing signal is different, must calculate the temperature compensation line length configuration of each sensor; Bring very big inconvenience for Installation and Debugging and data transmission, it is high to form system cost.
The utility model content
The purpose of the utility model provides the warm layer by layer meticulous survey record device in ground of a kind of thermal response system.The use that solves original measurement mechanism is inconvenient, the problem that cost is high.
The particular content of the utility model is:
The warm layer by layer meticulous survey record device in ground of a kind of thermal response system; It is characterized in that: this device adopts the chip (1) of the Direct Digital temperature value output of little silicon wafer; The chip interface M-BUS of its Direct Digital temperature value output connects AT89S52 single-chip microcomputer (2); AT89S52 single-chip microcomputer (2) connects industry control PC (3), and wherein data line is the ordinary copper lead.
Measuring process is: by the chip of AT89S552 operation thermometric start-up routine to the Direct Digital temperature value output of little silicon wafer; The chip of the Direct Digital temperature value output of little silicon wafer is carried out the thermometric order; And the Temperature numerical of measuring is sent to the AT89S52 single-chip microcomputer, the AT89S52 single-chip microcomputer is sent to industrial computer with the Temperature numerical of measuring and shows this numerical value and set up the warm database of layer.Data line is the ordinary copper lead.
The utility model has the advantages that the warm layer by layer meticulous survey record device in ground of this thermal response system, need not calculate the temperature compensation line length configuration of each sensor, need not debug, plug and play, data transmission is far away, and it is low to form system cost.
Description of drawings
Fig. 1 is the warm layer by layer meticulous survey record device block diagram in the ground of thermal response system.
Embodiment
The warm layer by layer meticulous survey record device in ground of as shown in Figure 1 a kind of thermal response system; This device adopts the chip (1) of the Direct Digital temperature value output of little silicon wafer; The chip interface M-BUS of its Direct Digital temperature value output connects AT89S52 single-chip microcomputer (2); AT89S52 single-chip microcomputer (2) connects industry control PC (3), and wherein data line is the ordinary copper lead.
Illustrate the application of the utility model, give an example and do not influence the further protection of this patent.
Measuring process is: by the chip of AT89S552 operation thermometric start-up routine to the Direct Digital temperature value output of little silicon wafer; The chip of the Direct Digital temperature value output of little silicon wafer is carried out the thermometric order; And the Temperature numerical of measuring is sent to the AT89S52 single-chip microcomputer, the AT89S52 single-chip microcomputer is sent to industrial computer with the Temperature numerical of measuring and shows this numerical value and set up the warm database of layer.Data line is the ordinary copper lead.
Technical parameter:
Measurement range:--35 ℃---150 ℃
Measurement Resolution: 0.1 ℃
Measuring accuracy: 0.5%
Measuring Time: 50mS
Fed distance: 200m
Database function is set up at the scene, cooperates hot corresponding experiment to use.

Claims (1)

1. the warm layer by layer meticulous survey record device in the ground of a thermal response system; It is characterized in that: this device adopts the chip (1) of the Direct Digital temperature value output of little silicon wafer; The chip interface M-BUS of its Direct Digital temperature value output connects AT89S52 single-chip microcomputer (2); AT89S52 single-chip microcomputer (2) connects industrial computer (3), and wherein data line is the ordinary copper lead.
CN201220148764.1U 2012-04-10 2012-04-10 Stratigraphic temperature fine measurement recording apparatus for thermal response system Expired - Fee Related CN202631124U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201220148764.1U CN202631124U (en) 2012-04-10 2012-04-10 Stratigraphic temperature fine measurement recording apparatus for thermal response system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201220148764.1U CN202631124U (en) 2012-04-10 2012-04-10 Stratigraphic temperature fine measurement recording apparatus for thermal response system

Publications (1)

Publication Number Publication Date
CN202631124U true CN202631124U (en) 2012-12-26

Family

ID=47384315

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201220148764.1U Expired - Fee Related CN202631124U (en) 2012-04-10 2012-04-10 Stratigraphic temperature fine measurement recording apparatus for thermal response system

Country Status (1)

Country Link
CN (1) CN202631124U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121226

Termination date: 20190410