CN202614711U - Sensitive element of planar oxygen sensor - Google Patents
Sensitive element of planar oxygen sensor Download PDFInfo
- Publication number
- CN202614711U CN202614711U CN 201220283556 CN201220283556U CN202614711U CN 202614711 U CN202614711 U CN 202614711U CN 201220283556 CN201220283556 CN 201220283556 CN 201220283556 U CN201220283556 U CN 201220283556U CN 202614711 U CN202614711 U CN 202614711U
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- heating
- signal
- heating resistor
- substrate
- oxygen sensor
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Abstract
The utility model discloses a sensitive element of a planar oxygen sensor. The sensitive element of the planar oxygen sensor comprises a signal outer electrode, a signal inner electrode and a heating resistor. The signal outer electrode and the signal inner electrode are coated and printed on the front side and the back side of a signal substrate, the heating resistor is coated and printed on the heating substrate, a cavity substrate and an intermediate substrate are arranged between the signal inner electrode and the heating resistor, the heating resistor comprises a heating zone and a lead, the heating zone of the heating resistor is two parallel wave-shaped heating wires, space between the outer sides of the two parallel wave-shaped heating wires of the heating zone is less than space between the inner sides of the wave-shaped heating wires, and width of the lead is 3-4 times of that of the heating wires. The pattern at the heating head of the heating resistor on the substrate is two longitudinal wave-shaped heating wires, longer heating wires are arranged in the heating zone, the heating resistor is even in heating, and damage to the sensitive element due to thermal stress can be reduced. The space between the outer sides of the wave-shaped heating wires is slightly less than the space between the inner sides of the wave-shaped heating wires, and uneven heating caused by outside heat dissipation can be eliminated.
Description
Technical field
The utility model relates to a kind of heating resistor of chip oxygen sensor, belongs to the chip oxygen sensor technical field.
Background technology
Lambda sensor is very important sensor in the Hyundai Motor, is used for detecting motor vehicle emission tail gas oxygen content.Existing automotive oxygen sensor mainly is divided into tubular type lambda sensor and chip oxygen sensor, and their sensitive element need be heated to 700 degrees centigrade of ability operate as normal.Wherein the decomposition texture of chip oxygen sensor sensitive element is as shown in Figure 1, and electrode 3 and heating resistor 6 are coated respectively on signal substrate 2 and heated substrate 7 in signal external electrode 1, the signal, and which floor substrate overlaps together the back sintering and forms.Heating resistor directly is produced on sensitive element inside like this, and chip oxygen sensor is fast with regard to heat temperature raising, can start working in the short period of time.
Usually the heating resistor pattern that on chip oxygen sensor, is coated with seal is as shown in Figure 2, if increase the ratio that the resistance of head heating region 61 accounts for whole resistance, the efficiency of heating surface of head can be higher, and it is faster to heat up.But the inhomogeneous sensitive element that also can make of this heating resistor pattern heating receives thermal stress damage.
Summary of the invention
The utility model technical matters to be solved provides a kind of sensitive element that can make the effective heating region of the heating resistor head that is coated with seal on the sensitive element heat up sooner, generate heat evenly, reduce the chip oxygen sensor of thermal stress impact.
The technical scheme of the utility model is:
A kind of sensitive element of chip oxygen sensor; Comprise electrode and heating resistor in signal external electrode, the signal; Coated heating resistor is coated on heated substrate on the positive and negative two sides of signal substrate for electrode in the signal external electrode, signal, also comprises cavity substrate and intermediate between electrode and the heating resistor in the signal; Heating resistor comprises heating region and lead-in wire, and the heating region of heating resistor is two waveform heating lines arranged side by side.
The spacing in the waveforms heating lines outside that two of heating region are arranged side by side is less than the inboard spacing of waveform heating line, the width of lead-in wire be the heating line width 3-4 doubly.
Beneficial effect: the utility model changes the pattern that is coated with the heating head that is imprinted on heating resistor on the substrate; Change two lines of waveform heating longitudinally into by original four vertical end to end heating lines, in heating region, arranged like this than longer in the past heating line.The spacing of the gap ratio inboard in the waveform heating line outside is smaller, can eliminate the uneven influence of heating that outside heat radiation brings.The wide lead-in wire of heating resistor is slowly to attenuate to carry out the transition to thin heating line, prevents that the temperature stepped change is to the damage of heated substrate on the heating resistor.Can improve the efficiency of heating surface and the programming rate of chip oxygen sensor, the heating resistor heating evenly can reduce the damage of thermal stress to sensitive element.
Description of drawings
Fig. 1 is the decomposition texture synoptic diagram of chip oxygen sensor sensitive element;
Fig. 2 is traditional chip oxygen sensor heating resistor pattern synoptic diagram;
Fig. 3 is the chip oxygen sensor heating resistor pattern synoptic diagram of the utility model;
Fig. 4 is the partial schematic diagram of the chip oxygen sensor heating resistor of the utility model.
Among the figure: electrode, 4-cavity substrate, 5-intermediate, 6-heating resistor, 7-heated substrate, 61-heating region, 62-lead-in wire in 1-signal external electrode, 2-signal substrate, the 3-signal.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
A kind of sensitive element of chip oxygen sensor; Comprise electrode 3 and heating resistor 6 in signal external electrode 1, the signal; Electrode 3 is coated on the positive and negative two sides of signal substrate 2 in signal external electrode 1, the signal, and heating resistor 6 is coated on heated substrate 7, also comprises cavity substrate 4 and intermediate 5 in the signal between electrode 3 and the heating resistor 6; Heating resistor 6 comprises heating region 61 and lead-in wire 62, and the heating region 61 of heating resistor 6 is two waveform heating lines arranged side by side.
Spacing a outside two waveform heating lines arranged side by side of heating region 61 is less than the inboard spacing b of waveform heating line, and the width d of lead-in wire 62 is 3-4 times of heating line width c.
As shown in Figure 3, the heating line in heating region 61 adopts two train wave shape waves, and this section waveform line length has increased more than 20% than the line length in the heating region among Fig. 2 61.After the chip oxygen sensor sinter molding, record the shared resistance ratio of heating region under the normal temperature and bring up to more than 80% by original 60%.
As shown in Figure 4, consider the influence of heating region 61 outsides heat radiations, the spacing a in the wave outside spacing b more inboard than wave is little.Though waveform heating line can dispel the heat laterally like this, outside heating is also more.For reducing the ratio that heating resistor lead-in wire 62 accounts for whole heating resistor 6, the width d of heating resistor lead-in wire 62 is 3-4 times of heater wire width c, and lead-in wire and heater wire junction are that live width reduces gradually.
Apply the voltage heating for the chip oxygen sensor finished product, the time ratio that records 700 ℃ of chip arrival had shortened half originally, and did not have chip to receive the phenomenon of high temperature impact cracking.
Claims (2)
1. the sensitive element of a chip oxygen sensor; Comprise electrode (3) and heating resistor (6) in signal external electrode (1), the signal; The coated positive and negative two sides of electrode (3) in signal external electrode (1), the signal at signal substrate (2); Heating resistor (6) is coated on heated substrate (7); Also comprise cavity substrate (4) and intermediate (5) between electrode (3) and the heating resistor (6) in the signal, said heating resistor (6) comprises heating region (61) and lead-in wire (62), it is characterized in that: the heating region (61) of said heating resistor (6) is two waveform heating lines arranged side by side.
2. the sensitive element of chip oxygen sensor according to claim 1; It is characterized in that: the spacing (a) outside two waveform heating lines arranged side by side of said heating region (61) is less than the inboard spacing (b) of waveform heating line, and the width (d) of lead-in wire (62) is 3-4 a times of heating line width (c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220283556 CN202614711U (en) | 2012-06-17 | 2012-06-17 | Sensitive element of planar oxygen sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220283556 CN202614711U (en) | 2012-06-17 | 2012-06-17 | Sensitive element of planar oxygen sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202614711U true CN202614711U (en) | 2012-12-19 |
Family
ID=47348400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220283556 Expired - Lifetime CN202614711U (en) | 2012-06-17 | 2012-06-17 | Sensitive element of planar oxygen sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202614711U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706926A (en) * | 2012-06-17 | 2012-10-03 | 无锡隆盛科技股份有限公司 | Sensitive element of chip oxygen sensor |
| CN107583200A (en) * | 2017-09-06 | 2018-01-16 | 深圳丽之健电子科技有限公司 | A kind of foot's physical therapy apparatus |
| CN108957991A (en) * | 2017-05-17 | 2018-12-07 | 佳能株式会社 | Image heater, image forming apparatus and heater |
-
2012
- 2012-06-17 CN CN 201220283556 patent/CN202614711U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706926A (en) * | 2012-06-17 | 2012-10-03 | 无锡隆盛科技股份有限公司 | Sensitive element of chip oxygen sensor |
| CN108957991A (en) * | 2017-05-17 | 2018-12-07 | 佳能株式会社 | Image heater, image forming apparatus and heater |
| CN107583200A (en) * | 2017-09-06 | 2018-01-16 | 深圳丽之健电子科技有限公司 | A kind of foot's physical therapy apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121219 |