CN202587719U - Radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding - Google Patents
Radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding Download PDFInfo
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- CN202587719U CN202587719U CN 201220135380 CN201220135380U CN202587719U CN 202587719 U CN202587719 U CN 202587719U CN 201220135380 CN201220135380 CN 201220135380 CN 201220135380 U CN201220135380 U CN 201220135380U CN 202587719 U CN202587719 U CN 202587719U
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- power amplifier
- frequency power
- radio
- heat dissipation
- pcb board
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Abstract
The utility model discloses a radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding. The apparatus comprises a heat dissipation pedestal, a PCB board and a U-shaped fixed seat, wherein the PCB board is tightly arranged on an upper surface layer of the heat dissipation pedestal and the PCB board is provided with mesopore where the radio frequency power amplifier is placed; a shape of the mesopore is matched with a packaging outline structure of the radio frequency power amplifier; a pair of input and output pin pads and a pair of grounding pads are arranged along a surrounding edge of the mesopore; the U-shaped fixed seat comprises a U-shaped seat body located on a central section; upper two sides of the U-shaped seat body are provided with end ears; an inner groove of the U-shaped seat body provides a fixed position for the power amplifier; the end ears on the two sides are provided with fixed holes. Connection of the U-shaped fixed seat, the PCB board and the heat dissipation pedestal is realized through a screw or a bolt. By using the installation apparatus, a power amplifier installation method with low cost can be provided and grounding and heat dissipation performance of the power amplifier can be ensured to be good. A performance consistency is increased, which is convenient for production and assembling.
Description
Technical field
The utility model relates to communication equipment field, in particular, relates to a kind of communication equipment radio-frequency power amplifier erecting device.
Background technology
Radio-frequency power amplifier is the important component part of various transmitting sets, in emission system, the radio-frequency power amplifier power output can be greatly to hundreds of watts.So the impedance ground of radio-frequency power amplifier and radiating effect have determined the reliability and the cost of whole amplifier work, and its installation and fixing means are just extremely crucial.
Radio-frequency power amplifier is selected special-purpose power amplifier module for use; Ground connection effect and heat dispersion are all secure; But cost is higher, and each special power amplifier module all needs specific mounting structure to cooperate, and brings than limitations for the overall construction design of equipment.The general radio frequency amplifier tube that use cost is lower comes the designed for greater reliability amplifier, has important use to be worth.
Usually ready-made power amplifier module all is the power amplifier manufacturers design and makes, and is directly to be welded on radio-frequency power amplifier on the heat dispersion substrate, and heat dispersion substrate internally is connected with power amplifier.When mounted, radiating copper sheet directly contacts with the ground connection Copper Foil of pcb board, and lower impedance ground is arranged, and the soft cushioning that adds heat conduction between radiating copper sheet and the heat dissipation base is to improve the heat dispersion of power amplifier.This mode is that power amplifier module is special-purpose, and the device purchase cost is higher, and structural design receives the power amplifier module shape limits, and is dumb.
The utility model content
The purpose of the utility model provides a kind of radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection; Utilize it fixedly to lay radio-frequency power amplifier; The installation method of power amplifier cheaply not only can be provided; And can guarantee power amplifier ground connection and heat radiation well, improve consistency of performance, and be convenient to produce assembling.
For realizing above-mentioned purpose, the utility model adopts following technical scheme:
A kind of heat radiation and radio-frequency power amplifier erecting device of ground connection taken into account has a heat dissipation base, has the confession power amplifier groove into that crouches at the upper surface of heat dissipation base;
One pcb board; Tightly be overlying on the upper epidermis of heat dissipation base; Have on this pcb board and can supply radio-frequency power amplifier to be positioned at mesopore wherein, the packaging appearance structure of the shape of this mesopore and radio-frequency power amplifier is mated each other, and the surrounding edge of this mesopore is furnished with an assembly welding dish in the pcb board upper edge; This assembly welding dish comprises a pair of input, output pin pad and a pair of ground pad; Also offer a pair of connection on the pcb board and use fixing hole, described a pair of ground pad is used to supply the connection of radio-frequency power amplifier ground pin, and described input, output pin pad are used to supply the connection of radio-frequency power amplifier input, output pin;
One U-shaped holder comprises the U-shaped pedestal at a middle part, and the last both sides of U-shaped pedestal have the end ear, and the inner groovy of this U-shaped pedestal is that radio-frequency power amplifier provides fixed bit, has fixing hole on the end ear of both sides;
Realize that through screw or bolt U-shaped holder, pcb board are connected with the heat dissipation base three's, wherein, the two ends ear of said U-shaped holder is separately fixed on the ground pad on the pcb board, and this U-shaped holder is processed by conductive heat conducting material.
The U-shaped pedestal wall thickness of the U-shaped holder of said radio-frequency power amplifier erecting device reaches the thickness of not deformation of material at least; But the thickness of slab of two side ends ear is the thickness of deformation; This U-shaped pedestal wall thickness is greater than 3 millimeters; Two side ends ear deformability is greater than 0.2 millimeter.
Said radio-frequency power amplifier erecting device is characterized in that: described U-shaped holder is processed by conductive heat conducting material.
Fixed bit area size in the U-shaped pedestal of said radio-frequency power amplifier fixture is suitable with the ground plane gross area size of the power amplifier of being installed, and said power amplifier is welded on this fixed bit.
Have the vertical fixing through hole of up/down perforation on the U-shaped pedestal both sides longitudinal wall of the said U-shaped holder of taking into account the heat radiation and the radio-frequency power amplifier erecting device of ground connection, U-shaped holder and heat dissipation base are fastenedly connected through the screw that passes this vertical fixing through hole.
The concave surface of the said U-shaped pedestal of taking into account the heat radiation and the radio-frequency power amplifier erecting device of ground connection is concordant with the ground plane of said radio-frequency power amplifier, two end ears of said U-shaped pedestal belong to plane and said radio-frequency power amplifier input, to export signal pins concordant.
Said taking into account in heat radiation and the radio-frequency power amplifier erecting device of ground connection, even coated with thermally conductive silica gel layer in heat dissipation base is laid the groove of U-shaped holder.
The installation of radio-frequency power amplifier is the difficult problem that cost and performance are difficult to balance, and the utility model provides a kind of good earth for a long time and can take into account the erecting device and the installation method of heat radiation.
The utility model has the advantages that:
1) cost is lower, and the cost price of the radio-frequency power amplifier that heat radiation of the utility model handle and ground connection are packaged together is below half of other prepackaged power amplifiers;
2) simple in structure, be easy to produce;
Easy operating 3) is installed simply;
When 4) guaranteeing good heat radiating, because reasonable installation steps cleverly, receive distortional stress hardly after making the power amplifier pin be welded to PCB, serviceability is more stable;
5) pad of ground pin is welded on the sidewall of PCB; Make the innovation welding method that the radio-frequency power amplifier ground pin is direct and PCB sidewall ground pad welds; Strengthened the heat-sinking capability of radio-frequency power amplifier; And impedance ground is little, and has avoided traditional contact ground connection because of the imperfect earth phenomenon that the contact-making surface oxidation causes, has guaranteed permanent good ground connection.
Description of drawings
Fig. 1 is existing radio-frequency power amplifier structural representation.
Fig. 2 is the utility model radio-frequency power amplifier erecting device one example structure sketch map.
Fig. 3 is the vertical view (radio-frequency power amplifier is not installed) of Fig. 2.
Fig. 4 is a U-shaped fixed seat structure sketch map (overlooking).
Below in conjunction with accompanying drawing and specific embodiment the utility model is done in detail and to be further specified.
Embodiment
Shown in Figure 1 is the structural representation of existing radio-frequency power amplifier 2, and it comprises radio-frequency power amplifier body and input, output pin pin two 1,22 and the ground pin 23,24 at middle part.
Fig. 2 shows the structure of the utility model radio-frequency power amplifier fixture one embodiment.Also provide radio-frequency power amplifier among the figure and be placed on corresponding position signal on the pcb board.Among this embodiment, the radio-frequency power amplifier fixture mainly is made up of heat dissipation base 6, pcb board 3 and U-shaped holder 1.U-shaped holder 1 is connected with pcb board 3 realizations through pair of adjustment screw group 4 at least, also can add one group of reinforced set screw group 5.The input of radio-frequency power amplifier tube 2, output pin are welded on respectively on the pad of pcb board 3.
Referring to Fig. 2 to Fig. 3; Pcb board 3 among this embodiment is close to the upper epidermis of heat dissipation base 6; Have on this pcb board 3 and can supply power amplifier to be positioned at mesopore wherein, the packaging appearance structure of the shape of this mesopore and radio-frequency power amplifier tube is mated each other, is furnished with an assembly welding dish along the surrounding edge of this mesopore; This assembly welding dish comprises a pair of input, output pin pad and a pair of ground pad, also offers a pair of connection on the pcb board and uses screw hole.
Fig. 4 shows the structure of U-shaped holder and relevant position on pcb board; Fig. 8 shows the structure of U-shaped holder intuitively; The U-shaped pedestal 11 that comprises a middle part, the last both sides of U-shaped pedestal have end ear 12, and the inner groovy of this U-shaped pedestal is that radio-frequency power amplifier provides fixed bit; This U-shaped holder is the metal material of conductive and heat-conductive; The part (end ear) of extending to both sides is provided with fixing hole (screw through-hole) 13; The corresponding screw hole that on pcb board 3 and heat dissipation base 6, also is provided with correspondence position is used for radio-frequency power amplifier 2, pcb board 3 and heat dissipation base 6 are fixed together; Also be provided with reinforced screw through-hole 14 on the longitudinal wall of U-shaped pedestal 11, the end ear that is used for fixing the U-shaped holder on the pcb board 3 is not hinder weldering.Said heat-dissipating casing is provided with the groove that the U-shaped holder is installed.Groove surface is used to weld radio-frequency power amplifier: radio-frequency power amplifier is kept flat the kerve that heat dissipation base 6 is welded on the U-shaped holder; The input and output pin is towards both sides; The sidewall of ground pin and U-shaped holder directly joins; Weld solid welding with scolding tin, U-shaped holder 1 recess is installed on the heat dissipation base 6 up, and fixes with screw.
The utility model also has the technological innovation of a key; Be that U-shaped pedestal 11 (groove part of U-shaped holder) is designed thicklyer and is difficult for deformation; And be provided with screw through-hole 14 on the two ends longitudinal side wall of groove; Can directly groove part directly be fixed on the heat dissipation base 6 through set screw group 5, guaranteed the U-shaped holder fully the docking of base portion and heat dissipation base 6; To extension, both sides (end ear) and design thin is prone to deformation, can after on the pcb board, utilize deformation to guarantee good ground connection through screw 4 is urgent, and solve the problem that fixing back, both sides kerve upwards arches upward well.Design reaches not deformation of material thickness at least with the vertical wall thickness of U-shaped pedestal side of U-shaped holder and the thickness of slab of two side ends ear is reached and can reach deformation thickness and can not given unnecessary details by existing techniques in realizing here.
In the present embodiment: the material of U-shaped holder 1 is a conductive heat conducting material, and like copper, anti-oxidation processing is done on the surface.For reducing distortion, U-shaped pedestal wall thickness is greater than 3 millimeters whiles, and fixed screw is directly beaten on vertical wall, also can reduce modification; The part of picking up the ears requires mutability, picks up the ears can overcome machining tolerance well through modification, requires deformability greater than 0.2 millimeter.The technical scheme characteristics of present embodiment are: radio-frequency power amplifier is pressed on the heat dissipation base; And radio-frequency power amplifier does not receive tension force and external pressure; Can protect radio-frequency power amplifier well, can not damage radio-frequency power amplifier, when having guaranteed good heat radiating because of pressure is excessive; Because reasonable installation steps cleverly, receive deformational stress hardly after making the radio-frequency power amplifier pin be welded to PCB.
Claims (8)
1. a radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection has a heat dissipation base, it is characterized in that:
Have one at the upper surface of heat dissipation base and supply the radio-frequency power amplifier groove into that crouches;
One pcb board; Tightly be overlying on the upper epidermis of heat dissipation base; Have on this pcb board and can supply radio-frequency power amplifier to be positioned at mesopore wherein, the packaging appearance structure of the shape of this mesopore and radio-frequency power amplifier is mated each other, and the surrounding edge of this mesopore is furnished with an assembly welding dish in the pcb board upper edge; This assembly welding dish comprises a pair of input, output pin pad and a pair of ground pad; Also offer a pair of connection on the pcb board and use fixing hole, described a pair of ground pad is used to supply the connection of radio-frequency power amplifier ground pin, and described input, output pin pad are used to supply the connection of radio-frequency power amplifier input, output pin;
One U-shaped holder comprises the U-shaped pedestal at a middle part, and the last both sides of U-shaped pedestal have the end ear, and the inner groovy of this U-shaped pedestal is that radio-frequency power amplifier provides fixed bit, has fixing hole on the end ear of both sides;
Realize that through screw or bolt U-shaped holder, pcb board are connected with the heat dissipation base three's, wherein, the two ends ear of said U-shaped holder is separately fixed on the ground pad on the pcb board.
2. the radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection according to claim 1, it is characterized in that: the pad of described ground pin is welded on the sidewall of PCB mesopore.
3. the radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection according to claim 1, it is characterized in that: the U-shaped pedestal wall thickness of said U-shaped holder reaches the thickness of not deformation of material at least; But the thickness of slab of two side ends ear is the thickness of deformation.
4. the radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection according to claim 3, it is characterized in that: said U-shaped pedestal wall thickness is greater than 3 millimeters; Said two side ends ear deformability is greater than 0.2 millimeter.
5. the radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection according to claim 1; It is characterized in that: the fixed bit area size in the said U-shaped pedestal is suitable with the ground plane gross area size of the radio-frequency power amplifier of being installed, and said radio-frequency power amplifier is welded on this fixed bit.
6. the radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection according to claim 1; It is characterized in that: have the vertical fixing through hole of up/down perforation on the U-shaped pedestal both sides longitudinal wall of said U-shaped holder, U-shaped holder and heat dissipation base are fastenedly connected through the screw that passes this vertical fixing through hole.
7. the radio-frequency power amplifier erecting device of taking into account heat radiation and ground connection according to claim 1; It is characterized in that: the concave surface of said U-shaped pedestal is concordant with the ground plane of said radio-frequency power amplifier, and the plane, two end ear places of said U-shaped pedestal is concordant with input, the output signal pins of said radio-frequency power amplifier.
8. the heat radiation and the radio-frequency power amplifier erecting device of ground connection taken into account according to claim 1 is characterized in that: even coated with thermally conductive silica gel layer in heat dissipation base is laid the groove of U-shaped holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220135380 CN202587719U (en) | 2012-04-01 | 2012-04-01 | Radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220135380 CN202587719U (en) | 2012-04-01 | 2012-04-01 | Radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202587719U true CN202587719U (en) | 2012-12-05 |
Family
ID=47257064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220135380 Expired - Fee Related CN202587719U (en) | 2012-04-01 | 2012-04-01 | Radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202587719U (en) |
-
2012
- 2012-04-01 CN CN 201220135380 patent/CN202587719U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20150401 |
|
| EXPY | Termination of patent right or utility model |