CN202586893U - Resonator of surface mounted devices (SMD) - Google Patents

Resonator of surface mounted devices (SMD) Download PDF

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Publication number
CN202586893U
CN202586893U CN 201220203182 CN201220203182U CN202586893U CN 202586893 U CN202586893 U CN 202586893U CN 201220203182 CN201220203182 CN 201220203182 CN 201220203182 U CN201220203182 U CN 201220203182U CN 202586893 U CN202586893 U CN 202586893U
Authority
CN
China
Prior art keywords
electrode
lead
back side
wire
auxiliary electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220203182
Other languages
Chinese (zh)
Inventor
马东文
田新武
林维东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN XINTIANYUAN ELECTRONIC CO Ltd
Original Assignee
SHENZHEN XINTIANYUAN ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN XINTIANYUAN ELECTRONIC CO Ltd filed Critical SHENZHEN XINTIANYUAN ELECTRONIC CO Ltd
Priority to CN 201220203182 priority Critical patent/CN202586893U/en
Application granted granted Critical
Publication of CN202586893U publication Critical patent/CN202586893U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a resonator of surface mounted devices (SMD). The resonator comprises a base and a chip arranged on the base, wherein the front side of the chip is provided with a front side electrode, a front side electrode lead and a front side auxiliary electrode; the front side electrode is connected with the front side auxiliary electrode through the front side electrode lead; the front side electrode lead and the front side auxiliary electrode are arranged on the right side of the chip; the back side of the chip is provided with a back side electrode, a back side electrode lead and a back side auxiliary electrode; the back side electrode is connected with the back side auxiliary electrode though the back side electrode lead; the back side electrode lead and the back side auxiliary electrode are arranged on the left side of the chip; the front side electrode lead is arranged in the center of the side of the front side electrode; and the back side electrode lead is arranged in the center of the side of the back side electrode. By the resonator of the SMD, the chip and the base are combined firmly, and the reliability is strengthened.

Description

A kind of SMD resonator
Technical field
The utility model relates to a kind of SMD resonator.
Background technology
The SMD resonator mainly is made up of pedestal and quartz wafer; Be widely used in communication system, supervisory control system, warning system aspect in telecommunications such as intercom, PDA, mobile phone, radio telephone, VCD, DVD, computer, TV, satellite, automobile audio, vehicle radio station, automobile burglar, digital product, remote control system and the electron trade; It is one of core component of these products; Image is likened human heart to, and importance is only second to IC.SMD refers to the abbreviation of Surface Mounted Devices, means: surface mount device.
Existing SMD resonator, structure is as shown in Figure 2, and each electrode only has a contact conductor, and poor stability is unfavorable for that also wafer is fixed on the pedestal.
The utility model content
The utility model technical problem to be solved provides a kind of SMD resonator, and wafer in this SMD resonator and pedestal combine more firm, good reliability.
The technical solution of utility model is following:
A kind of SMD resonator comprises pedestal and is arranged on the wafer on the pedestal; The front of wafer is provided with front electrode, front electrode lead-in wire and front auxiliary electrode, and front electrode is connected with the front auxiliary electrode through the front electrode lead-in wire, and front electrode lead-in wire and front auxiliary electrode all are arranged on the right-hand of wafer;
The back side of wafer is provided with backplate, backplate lead-in wire and back side auxiliary electrode; Backplate is connected with back side auxiliary electrode through the backplate lead-in wire, and backplate lead-in wire and back side auxiliary electrode all are arranged on the left of wafer.
The front electrode lead-in wire is arranged on the place, center of front electrode sidepiece; The backplate lead-in wire is arranged on the place, center of backplate sidepiece.
Beneficial effect:
The SMD resonator of the utility model, owing to one in front electrode lead-in wire, one of front auxiliary electrode and one in backplate lead-in wire, one of back side auxiliary electrode, and branch is located at relative both sides; Therefore; Electrical property is more balanced, and contact conductor and auxiliary electrode be in and be convenient to be provided with the glue application region territory, thereby all there is the strong point left and right sides of wafer; Anti-dropping capability strengthens, finally make the SMD resonator more reliably, more stable.
Description of drawings
Fig. 1 is the structural representation of the SMD resonator of the utility model;
Fig. 2 is the structural representation of existing SMD resonator;
Label declaration: 1-pedestal, 2-backplate lead-in wire, 3-wafer, 4-front electrode, 5-front electrode lead-in wire, 6-glue application region territory, 7-back side auxiliary electrode, 8-front auxiliary electrode.
Embodiment
Below will combine accompanying drawing and specific embodiment that the utility model is explained further details:
Embodiment 1:
As shown in Figure 1, a kind of SMD resonator comprises pedestal and is arranged on the wafer on the pedestal; The front of wafer is provided with front electrode, front electrode lead-in wire and front auxiliary electrode, and front electrode is connected with the front auxiliary electrode through the front electrode lead-in wire, and front electrode lead-in wire and front auxiliary electrode all are arranged on the right-hand of wafer;
The back side of wafer is provided with backplate, backplate lead-in wire and back side auxiliary electrode; Backplate is connected with back side auxiliary electrode through the backplate lead-in wire, and backplate lead-in wire and back side auxiliary electrode all are arranged on the left of wafer.
The front electrode lead-in wire is arranged on the place, center of front electrode sidepiece; The backplate lead-in wire is arranged on the place, center of backplate sidepiece.
Because one in front electrode lead-in wire, one of front auxiliary electrode and one in backplate lead-in wire, one of back side auxiliary electrode; And divide and to be located at relative both sides, therefore 2 contact conductors and auxiliary electrode can be provided with 4 glue application region territories, some glue and colloid solidified after; All there is adhesive spots (being the strong point) left and right sides of wafer on pedestal; Only have the strong point and be different from existing SMD resonator in a side, thereby the anti-dropping capability enhancing, reliability also can significantly improve.

Claims (2)

1. a SMD resonator is characterized in that, comprises pedestal and is arranged on the wafer on the pedestal; The front of wafer is provided with front electrode, front electrode lead-in wire and front auxiliary electrode, and front electrode is connected with the front auxiliary electrode through the front electrode lead-in wire, and front electrode lead-in wire and front auxiliary electrode all are arranged on the right-hand of wafer;
The back side of wafer is provided with backplate, backplate lead-in wire and back side auxiliary electrode; Backplate is connected with back side auxiliary electrode through the backplate lead-in wire, and backplate lead-in wire and back side auxiliary electrode all are arranged on the left of wafer.
2. SMD resonator according to claim 1 is characterized in that, the front electrode lead-in wire is arranged on the place, center of front electrode sidepiece; The backplate lead-in wire is arranged on the place, center of backplate sidepiece.
CN 201220203182 2012-05-09 2012-05-09 Resonator of surface mounted devices (SMD) Expired - Fee Related CN202586893U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220203182 CN202586893U (en) 2012-05-09 2012-05-09 Resonator of surface mounted devices (SMD)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220203182 CN202586893U (en) 2012-05-09 2012-05-09 Resonator of surface mounted devices (SMD)

Publications (1)

Publication Number Publication Date
CN202586893U true CN202586893U (en) 2012-12-05

Family

ID=47256252

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220203182 Expired - Fee Related CN202586893U (en) 2012-05-09 2012-05-09 Resonator of surface mounted devices (SMD)

Country Status (1)

Country Link
CN (1) CN202586893U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121205

Termination date: 20150509

EXPY Termination of patent right or utility model