CN202551272U - Miniature loudspeaker module - Google Patents
Miniature loudspeaker module Download PDFInfo
- Publication number
- CN202551272U CN202551272U CN2012201882068U CN201220188206U CN202551272U CN 202551272 U CN202551272 U CN 202551272U CN 2012201882068 U CN2012201882068 U CN 2012201882068U CN 201220188206 U CN201220188206 U CN 201220188206U CN 202551272 U CN202551272 U CN 202551272U
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- CN
- China
- Prior art keywords
- hot melt
- groove
- lid
- melt post
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a miniature loudspeaker module, which comprises a loudspeaker body and a plastic shell for containing and fixing the loudspeaker body, wherein the upper side of the shell is connected with a cover body in a covering mode, the cover body is provided with a concave groove recessing downwards, and a through hole is arranged in the groove; and a one-step formed hot melting column is arranged in the shell, the hot melting column is arranged corresponding to the groove, and the top of the hot melting column is arranged in a mode of penetrating through the through hole. According to the miniature loudspeaker module, the hot melting column after hot melting can enable the shell and the cover body to be combined firmly, and the height of the miniature loudspeaker module can not be increased after combination.
Description
Technical field
The utility model relates to the electroacoustic field, is specifically related to a kind of Microspeaker module.
Background technology
The Microspeaker module comprises loudspeaker monomer in the prior art, accommodates the housing of loudspeaker monomer, and lid is connected on the lid on the housing; Usually housing combines with the mode of lid through bonding, but the firmness that this combination combines is not enough, causes separating of housing and lid after product falls easily, and bonds with glue-line and may increase the height of Microspeaker module.Therefore, be necessary the Microspeaker module of this structure is improved, to avoid above-mentioned defective.
The utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of Microspeaker module, can make firm the combining of housing and lid, and can not increase the height of Microspeaker module after combining.
To achieve these goals; The utility model provides a kind of Microspeaker module; Comprise the housing of loudspeaker monomer and the plastic material of accommodating fixing said loudspeaker monomer, side cover is connected to lid on the said housing, wherein; Said lid is provided with the groove to lower recess, is provided with through hole in the said groove; Be provided with integrated hot melt post in the said housing, the corresponding said groove setting of said hot melt post, and said through hole setting is passed at the top of said hot melt post.
In addition, preferred scheme is that said lid is a metal material.
In addition, preferred scheme is that the height on top is not higher than the upper surface of said lid behind the said hot melt post hot melt.
In addition, preferably scheme is, the quantity of said groove is at least three, and is positioned at not on collinear position, and each groove is equipped with corresponding hot melt post.
In addition, preferred scheme is, the bottom of said hot melt post is provided with the location division, and the cross-sectional area of said location division horizontal direction is greater than the area of said through hole, and the top, location division contacts with the bottom surface of said groove and is used to support said lid.
In addition, preferred scheme is that said through hole is positioned at the center of said groove.
After adopting technique scheme, compare with traditional structure, the utility model is provided with the hot melt post on the housing of plastic material, and on lid, is provided with the through hole that the hot melt post is run through, and through hole is positioned at the groove of lid; The Microspeaker module of this structure can make housing and the firm combination of lid behind the hot melt post hot melt, and can not increase the height of Microspeaker module after combining.
Description of drawings
Through below in conjunction with accompanying drawing present embodiment being described, above-mentioned characteristic of the utility model and technological merit will become apparent and understand easily.
Fig. 1 is the three-dimensional decomposition texture sketch map of the utility model Microspeaker module.
Fig. 2 is the perspective view of the utility model Microspeaker module.
Fig. 3 is the vertical view of the utility model Microspeaker module.
Fig. 4 is the A-A cutaway view of Microspeaker module shown in Figure 3.
Fig. 5 is the cutaway view behind the utility model Microspeaker module hot melt post hot melt.
Fig. 6 is the structure for amplifying sketch map of B part shown in Figure 5.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is done further detailed description.
To shown in Figure 4, the Microspeaker module comprises loudspeaker monomer 3, accommodates the fixedly housing 2 of loudspeaker monomer 3 like Fig. 1, and lid is connected to the lid 1 on the housing 2; Housing 12 is a plastic material, and present embodiment lid 11 is a metal material, and the lid 11 of metal material helps reducing the height of product.
Wherein lid 1 is provided with downward groove 11, and like Fig. 1, Fig. 2 and shown in Figure 4, the center of groove 11 is provided with expects the through hole that forms.The inboard of housing 2 is provided with integrated hot melt post 21 over against the position of groove 11, and the through hole setting is passed on the top of hot melt post 21.After loudspeaker monomer 3, housing 2 and lid 1 assembling are accomplished, with hot melt post 21 hot melts, the structure behind hot melt post 21 hot melts such as Fig. 5 and shown in Figure 6.Behind the hot melt, the height on hot melt post 21 ' top is not higher than the height of lid 1 upper surface.
The Microspeaker module of this structure, through hot melt post 21 is set on housing 2, and hot melt post 21 passes the through hole setting on the lid 1, like this with making the firm combination of lid 1 and housing 2 behind hot melt post 21 hot melts.In addition, the height after groove 11 being set on the lid 1 and making hot melt post 21 hot melts is not higher than the design of lid 1 upper surface, can prevent to increase the height of Microspeaker module, has improved the consistency of Microspeaker module.
In addition; In order to increase the fastness of lid 1 and housing 2 combinations; Hot melt post 21 is at least not three points on same straight line with the binding site of groove 11; Both the quantity of groove 11 and hot melt post 21 was at least corresponding three of being provided with, and present embodiment is provided with the hot melt post 21 of five grooves 11 and five and groove 11 corresponding settings.
In addition, the bottom of hot melt post 21 is provided with location division 22, like Fig. 1 and shown in Figure 4; The cross-sectional area of location division 22 is greater than the area of through hole; And the top of location division 22 contacts with the bottom surface of groove 11, is used to support location division 22, and is extremely shown in Figure 6 like Fig. 4; Wherein the top of location division 22 all at grade, to guarantee the position of protecgulum 1.
Need to prove that lid 11 is not limited to metal material, also can be other structures such as plastics, all do not influence the enforcement of the utility model, all in the protection range of the utility model.
Under the above-mentioned instruction of the utility model; Those skilled in the art can be in his improvement of the basic enterprising Xingqi of the foregoing description and distortion; And these improvement and distortion all drop in the protection range of the utility model, and those skilled in the art should be understood that; Above-mentioned specific descriptions are just better explained the purpose of the utility model, and the protection range of the utility model is limited claim and equivalent thereof.
Claims (6)
1. Microspeaker module; Comprise the housing of loudspeaker monomer and the plastic material of accommodating fixing said loudspeaker monomer, side cover is connected to lid on the said housing, it is characterized in that; Said lid is provided with the groove to lower recess, is provided with through hole in the said groove; Be provided with integrated hot melt post in the said housing, the corresponding said groove setting of said hot melt post, and said through hole setting is passed at the top of said hot melt post.
2. Microspeaker module according to claim 1 is characterized in that, said lid is a metal material.
3. Microspeaker module according to claim 1 and 2 is characterized in that, the height on top is not higher than the upper surface of said lid behind the said hot melt post hot melt.
4. Microspeaker module according to claim 3 is characterized in that the quantity of said groove is at least three, and is positioned at not on collinear position, and each groove is equipped with corresponding hot melt post.
5. Microspeaker module according to claim 4; It is characterized in that; The bottom of said hot melt post is provided with the location division, and the cross-sectional area of said location division horizontal direction is greater than the area of said through hole, and the top, location division contacts with the bottom surface of said groove and is used to support said lid.
6. Microspeaker module according to claim 5 is characterized in that said through hole is positioned at the center of said groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012201882068U CN202551272U (en) | 2012-04-28 | 2012-04-28 | Miniature loudspeaker module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012201882068U CN202551272U (en) | 2012-04-28 | 2012-04-28 | Miniature loudspeaker module |
Publications (1)
Publication Number | Publication Date |
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CN202551272U true CN202551272U (en) | 2012-11-21 |
Family
ID=47171828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012201882068U Expired - Fee Related CN202551272U (en) | 2012-04-28 | 2012-04-28 | Miniature loudspeaker module |
Country Status (1)
Country | Link |
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CN (1) | CN202551272U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103391499A (en) * | 2013-07-24 | 2013-11-13 | 歌尔声学股份有限公司 | Loudspeaker module and manufacturing method thereof |
CN104902356A (en) * | 2015-03-31 | 2015-09-09 | 歌尔声学股份有限公司 | Speaker module |
CN110662154A (en) * | 2019-08-30 | 2020-01-07 | 厦门东声电子有限公司 | Sleeve type loudspeaker module and packaging process thereof |
-
2012
- 2012-04-28 CN CN2012201882068U patent/CN202551272U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103391499A (en) * | 2013-07-24 | 2013-11-13 | 歌尔声学股份有限公司 | Loudspeaker module and manufacturing method thereof |
CN104902356A (en) * | 2015-03-31 | 2015-09-09 | 歌尔声学股份有限公司 | Speaker module |
CN110662154A (en) * | 2019-08-30 | 2020-01-07 | 厦门东声电子有限公司 | Sleeve type loudspeaker module and packaging process thereof |
CN110662154B (en) * | 2019-08-30 | 2021-12-07 | 厦门东声电子有限公司 | Sleeve type loudspeaker module and packaging process thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121121 Termination date: 20210428 |