CN202523703U - Chip - Google Patents
Chip Download PDFInfo
- Publication number
- CN202523703U CN202523703U CN2011204881132U CN201120488113U CN202523703U CN 202523703 U CN202523703 U CN 202523703U CN 2011204881132 U CN2011204881132 U CN 2011204881132U CN 201120488113 U CN201120488113 U CN 201120488113U CN 202523703 U CN202523703 U CN 202523703U
- Authority
- CN
- China
- Prior art keywords
- bonding line
- magnetic induction
- induction coil
- chip
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a chip. The chip comprises a magnetic induction coil and a bonding line, wherein the magnetic induction coil surrounds to form a magnetic induction coil surface; and the bonding line passes above the magnetic induction coil surface. The chip is characterized in that a shield is at least arranged between the bonding line and the magnetic induction coil surface for shielding interference of the bonding line signal to the magnetic induction coil; and when the bonding line leads out the signal and passes above the magnetic induction coil surface, the shield between the bonding line and the magnetic induction coil surface can shield the electric field around the bonding line, thus reducing the coupling of the signal from the bonding line from the magnetic induction coil, and reducing the interference of the bonding line signal to the magnetic induction coil to make the chip work properly.
Description
Technical field
The utility model relates to a kind of chip, comprising: magnetic induction coil, bonding line.
Background technology
Transaction is very important apart from i.e. distance control between card and the card reader in the modern mobile payment service.Present technology is closely to detect the system and method that combines the RF HF communication with a kind of low frequency alternating magnetic field, solves above-mentioned apart from control problem.This system utilizes low frequency alternating magnetic field, realizes the one-way communication of card reader to card, accomplishes distance control and authentication, utilizes the RF passage to realize the high speed communication between card reader and card again.The characteristics of this system only need to change the SIM/TF/SD card of terminal inner for need not to transform portable terminal, can realize reliable two-way range communication.
Magnetic flux letter chip in the prior art in the card must be responded to the low frequency alternating magnetic field signal through magnetic induction module, will respond to the resulting signal of telecommunication in back and carry out processing and amplifying.The implementation of magnetic induction module wherein just is included in the magnetic induction coil that adopts metal wire to form round the coiling of chip low frequency signal processing module in the magnetic flux letter chip.When in being employed in magnetic flux letter chip, adopting metal wire round magnetic induction coil that the coiling of chip low frequency signal processing module forms; In order to obtain enough signal strength signal intensities; The number of turn quantity of magnetic induction coil is bigger, so magnetic induction coil will occupy certain area in chip.Chip low frequency signal processing module is positioned at magnetic induction coil inside; After chip is encapsulated; The bonding line that is used to draw low frequency signal processing module electric signal interface will stride across magnetic coil; Signal on the bonding line will have part to be coupled to magnetic coil, thereby the operate as normal of magnetic chip is caused interference.
The utility model content
The technical problem underlying that the utility model will solve is, a kind of chip is provided, and can reduce signal on the bonding line to the interference of magnetic induction coil, thereby reduce its influence to the operate as normal of magnetic chip.
For solving the problems of the technologies described above, the utility model provides technical scheme following:
A kind of chip; Comprise: magnetic induction coil, bonding line; Said magnetic induction coil is around forming the magnetic induction coil face; The said magnetic induction coil face of said bonding line process top is characterized in that, between said bonding line and said magnetic induction coil face, is provided with at least to be used for the shield that mask-key zygonema signal disturbs magnetic induction coil.
Further, said shield is arranged on said magnetic induction coil face top, and said bonding line is positioned at said shield top.
Further, said shield is a screen.
Further, said shield is a housing, and said housing is wrapped in said magnetic induction coil outer surface and/or said bonding line outer surface.
Further, described polymeric barrier layer materials is a metal material.
Further, the material of said housing is a metal material.
Further, described screen is shaped as polygon, ellipse or circular.
Further, described screen is the inner metal screen layer that has the hole.
Further, described shield connects the fixed level in the said chip circuit or is in the unsettled state of current potential.
Further, the material of described screen is aluminium, silver, copper or aluminium copper.
The beneficial effect of the utility model is:
The utility model like screen, housing, comes the interference-shielded signal through between bonding line and magnetic induction coil, being provided for mask-key zygonema signal at least to the shield that magnetic induction coil disturbs.Derive signal and during through the magnetic induction coil top, the shield between bonding line and magnetic induction coil can mask from the signal on the bonding line, has reduced the coupling of magnetic induction coil when bonding line, make the chip can operate as normal.
Description of drawings
Fig. 1 is the chip structure sketch map of the utility model embodiment one.
Fig. 2 is the chip structure sketch map of the utility model embodiment two.
Fig. 3 is the chip structure sketch map of the utility model embodiment three.
Fig. 4 is the another kind of structural representation of the chip of the utility model embodiment three.
Fig. 5 is the chip structure sketch map of the utility model embodiment four.
Embodiment
The design of the utility model is; At least between bonding line and magnetic induction coil face, be provided for the shield that mask-key zygonema signal disturbs magnetic induction coil; This shield can be arranged on bonding line magnetic induction coil is disturbed the strongest position; Promptly be arranged on magnetic induction coil face top, bonding line is positioned at the top of this shield simultaneously.Shield can be screen or housing.
Combine accompanying drawing that the present invention is done further explain through embodiment below.
Embodiment one:
As shown in Figure 1, be the chip structure sketch map of the utility model embodiment one.Among Fig. 1; The chip of this execution mode; Comprise: magnetic induction coil, first bonding line 12, second bonding line 13, said magnetic induction coil be around forming magnetic induction coil face 11, and said first bonding line 12, second bonding line 13 are through said magnetic induction coil face 11 tops; Said shield is arranged on said magnetic induction coil face 11 tops, and said first bonding line 12, second bonding line 13 are positioned at said shield top.
Shield in the present embodiment is a screen 14.The material of screen 14 can be metal material, like aluminium, copper, silver or aluminium copper; The shape of screen 14 is unrestricted, can be rectangle, circle, trapezoidal, rhombus; Screen 14 can be complete also can be incomplete, as have the screen 14 of aperture; Screen 14 also can connect fixed level or be in the unsettled state of current potential.
When first bonding line 12 and second bonding line, 13 derivation signals and process magnetic induction coil face 11 tops; Screen 14 between magnetic induction coil face 11 and first bonding line 12, second bonding line 13; Shield the electric field around first bonding line 12, second bonding line 13; Thereby reduce the coupling of magnetic induction coil to the signal that comes from first bonding line 12, second bonding line 13; Weakened that signal makes the chip operate as normal to the interference of magnetic induction coil in first bonding line 12, second bonding line 13.
Embodiment two:
As shown in Figure 2, be the chip structure sketch map of present embodiment.Chip in this execution mode among Fig. 2 is similar with the chip of embodiment shown in Figure 1; Comprise: magnetic induction coil, first bonding line 12, second bonding line 13; Said magnetic induction coil is around forming magnetic induction coil face 11; Said first bonding line 12, second bonding line 13 are through said magnetic induction coil face 11 tops, and said shield is arranged on said magnetic induction coil face 11 tops, and said first bonding line 12, second bonding line 13 are positioned at said shield top.But uniquely different be, the shield in the present embodiment is first housing 15, and this housing is wrapped in the outer surface of embodiment one said magnetic induction coil.
When first bonding line 12, second bonding line 13 are derived signals and during through magnetic induction coil face 11 tops; First housing 15 that is wrapped in the magnetic induction loop outer surface will shield the electric field around first bonding line 12, second bonding line 13; Thereby reduce magnetic induction coil to coming from the signal coupling of first bonding line 12, second bonding line 13; Weakened that signal makes the chip operate as normal to the interference of magnetic induction coil in first bonding line 12, second bonding line 13.
Embodiment three:
As shown in Figure 3, be the chip structure sketch map of embodiment three.Chip in this execution mode among Fig. 3 such as above-mentioned embodiment are said; Comprise: magnetic induction coil, first bonding line 12, second bonding line 13; Said magnetic induction coil is around forming magnetic induction coil face 11; Said first bonding line 12, second bonding line 13 are through said magnetic induction coil face 11 tops, and said shield is arranged on said magnetic induction coil face 11 tops, and said first bonding line 12, second bonding line 13 are positioned at said shield top.But different is that the shield in the present embodiment is secondary shielding cover the 16, the 3rd housing 17.Secondary shielding cover 16 is wrapped in the outer surface of first bonding line 12, and the 3rd housing 17 is wrapped in the outer surface of second bonding line 13.The material of secondary shielding cover the 16, the 3rd housing 17 can be metal material, like aluminium, copper, silver or aluminium copper.
When first bonding line 12, second bonding line 13 are derived signals and during through magnetic induction coil face 11 tops; Be wrapped in secondary shielding cover the 16, the 3rd housing 17 on first bonding line 12, second bonding line, 13 outer surfaces respectively and will shield the electric field around first bonding line 12, second bonding line 13; Thereby reduce on the magnetic induction coil coupling to the signal that comes from first bonding line 12, second bonding line 13; Weakened signal in first bonding line 12, second bonding line 13 to the interference of magnetic induction coil, made the chip operate as normal.
As shown in Figure 4; According to the design of present embodiment a housing 18 can be set also and be wrapped in first bonding line 12 and second bonding line, 13 outer surfaces simultaneously; Two bonding lines are bundled together; Shield signal in these two bonding lines to the interference of magnetic induction coil; The housing 18 of the setting of chip shown in Fig. 4 is used for deriving signals and during through magnetic induction coil face 11 tops when first bonding line 12, second bonding line 13, shields the electric field around first bonding line 12, second bonding line 13, thereby reduces magnetic induction coil to coming from the signal coupling of first bonding line 12, second bonding line 13; Weakened that signal makes the chip operate as normal to the interference of magnetic induction coil in first bonding line 12, second bonding line 13.
Embodiment four:
As shown in Figure 5, be the chip structure sketch map of present embodiment.This execution mode chip and embodiment three chips are roughly the same among Fig. 5; Comprise: magnetic induction coil, first bonding line 12, second bonding line 13; Said magnetic induction coil is around forming magnetic induction coil face 11; Said first bonding line 12, second bonding line 13 are set to the outer surface that secondary shielding cover the 16, the 3rd housing 17 is wrapped in first bonding line 12 or second bonding line 13 respectively through said magnetic induction coil face 11 tops.The chip that different is among Fig. 5 has increased a housing on the basis of embodiment three, be wrapped in the magnetic induction coil outer surface, for example first housing 15 described in the embodiment two.Present embodiment is the comprehensive of embodiment two and embodiment three.The material of the housing that increases can be metal material, like aluminium, copper, silver or aluminium copper.
Chip as shown in Figure 5; When first bonding line 12, second bonding line 13 are derived signals and during through magnetic induction coil face 11 tops; Be wrapped on the magnetic induction coil outer surface with first bonding line 12, second bonding line, 13 outer surfaces on first housing 15, secondary shielding cover the 16, the 3rd housing 17; Can shielding first bonding line 12, the electric field around second bonding line 13; Thereby reduce the coupling of magnetic induction coil, weakened signal in first bonding line 12, second bonding line 13, make the chip operate as normal the interference of magnetic induction coil to the signal that comes from first bonding line 12, second bonding line 13.
Also can on the basis of embodiment one, increase a housing according to the thinking of present embodiment is wrapped in the outer surface of first bonding line and second bonding line or increases outer surface such as embodiment three described secondary shielding covers, the 3rd housing that two housings are wrapped in first bonding line, second bonding line respectively; Equally also can on the basis of embodiment two, increase the outer surface that a housing is wrapped in first bonding line and second bonding line, two bonding lines are bundled together.
Above content is the further explain that combines concrete the utility model to do, and can not assert that the practical implementation of the utility model is confined to these explanations.For the those of ordinary skill of technical field under the utility model, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be regarded as belonging to the protection range of utility model.
Claims (10)
1. chip; Comprise: magnetic induction coil, bonding line; Said magnetic induction coil is around forming the magnetic induction coil face; The said magnetic induction coil face of said bonding line process top is characterized in that, between said bonding line and said magnetic induction coil face, is provided with at least to be used for the shield that mask-key zygonema signal disturbs magnetic induction coil.
2. chip as claimed in claim 1 is characterized in that, said shield is arranged on said magnetic induction coil face top, and said bonding line is positioned at said shield top.
3. chip as claimed in claim 2 is characterized in that, said shield is a screen.
4. chip as claimed in claim 3 is characterized in that, the material of said screen is a metal material.
5. chip as claimed in claim 4 is characterized in that, the material of said metal screen layer is copper, aluminium, silver or aluminium copper.
6. chip as claimed in claim 3 is characterized in that, being shaped as of said screen: polygon, ellipse or circular.
7. chip as claimed in claim 4 is characterized in that, said metal screen layer inside has the hole.
8. like each described chip among the claim 1-7, it is characterized in that described shield connects fixed level or is in the unsettled state of current potential.
9. chip as claimed in claim 1 is characterized in that, said shield is a housing, and said housing is wrapped in said magnetic induction coil outer surface and/or said bonding line outer surface.
10. chip as claimed in claim 9 is characterized in that, the material of said housing is a metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204881132U CN202523703U (en) | 2011-11-30 | 2011-11-30 | Chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204881132U CN202523703U (en) | 2011-11-30 | 2011-11-30 | Chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202523703U true CN202523703U (en) | 2012-11-07 |
Family
ID=47106637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204881132U Expired - Lifetime CN202523703U (en) | 2011-11-30 | 2011-11-30 | Chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202523703U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163108A (en) * | 2015-04-10 | 2016-11-23 | 深圳市安特讯科技有限公司 | Circuit and preparation method thereof |
-
2011
- 2011-11-30 CN CN2011204881132U patent/CN202523703U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163108A (en) * | 2015-04-10 | 2016-11-23 | 深圳市安特讯科技有限公司 | Circuit and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121107 |