CN202516790U - Back process chip collecting device - Google Patents
Back process chip collecting device Download PDFInfo
- Publication number
- CN202516790U CN202516790U CN2012200197266U CN201220019726U CN202516790U CN 202516790 U CN202516790 U CN 202516790U CN 2012200197266 U CN2012200197266 U CN 2012200197266U CN 201220019726 U CN201220019726 U CN 201220019726U CN 202516790 U CN202516790 U CN 202516790U
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- pipe
- chip
- processing procedure
- main line
- tedge
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Abstract
The utility model discloses a back process chip collecting device, which relates to an LED (light emitting diode) manufacture device, in particular to a back process hand sorting device and is used for preventing the problem of possibly generated damage caused when a chip enters a vacuum pump after the filter screen is broken. The technical scheme of the back process chip collecting device comprises a main path pipe and an ascending pipe connected with the main path pipe, wherein a connecting part of the main path pipe and the ascending pipe is also provided with a core outlet pipe, an outlet part of the core outlet pipe is downwards, a valve is arranged on the core outlet pipe, and the outlet part of the core outlet pipe is provided with a container used for receiving wafers. The wafers entering the core outlet pipe can be perfectly collected through the container, and when a filter screen is damaged, the chip enters a pipeline but cannot enter a high-position pipe and a vacuum pump along the pipeline. Through the structure, waste and old wafers can be collected, the collected wafers can be used as waste products to be sold, and the benefits are generated; and more importantly, the wasted chip cannot be absorbed into the vacuum pump, the equipment failure is avoided, and further, the equipment is protected.
Description
Technical field
The utility model relates to the device that a kind of LED makes, and particularly relates to the picking device of back processing procedure.
Background technology
Led chip scribing, expansion film need carry out picking after accomplishing, and the undesirable useless chip in surface is chosen.
Picking is chosen the device that sheet uses and is comprised vacuum WAND, and vacuum WAND is connected with vavuum pump through pipeline.Vacuum WAND is connected with the chip gatherer.Generally speaking, the useless chip of being drawn by vacuum WAND can be collected in the chip gatherer, can not get in the pipeline.
But because the corner of chip is sharper keen, the chip gatherer is its problem that interior screen pack can break or the mesh support is big in use for some time, and this directly causes a part of chip to get in the pipeline.
As shown in Figure 1, on operating desk 1,, get into the corner that main line pipe 2 and tedge 4 are piled up in the back in the pipeline by the chip that branch road operator 8 sucks, promptly form the long-pending heap 3 of low level.
After the long-pending heap 3 of low level is stacked into certain altitude; Can be that the main line pipe obviously narrows down, cause the suction value of being above standard in the pipeline, the chip that is deposited in the long-pending heap of low level 3 places can be drawn in the high-order pipe 5; Form high-order long-pending heap 7; Be deposited in the chip in the high-order pipe, minority can be taken advantage of a situation and got in the vavuum pump 6, vavuum pump 6 is constituted destroy.Because the breakage of the screen pack in the chip gatherer can not be monitored, the long-pending heap at main line pipe place also inconvenience is observed, and therefore, existing picking is chosen the mode of useless sheet and demanded urgently improving.
The utility model content
The technical problem that the utility model will solve provides a kind of back processing procedure chip gathering-device, be used to prevent the screen pack breakage after contingent chip get into the problem that vavuum pump damages.
For solving the problems of the technologies described above, the utility model proposes a kind of back processing procedure chip gathering-device, comprises main line pipe and the tedge that is connected with the main line pipe, and the junction of said main line pipe and said tedge also is provided with a knockout pipe, the knockout pipe go out mouth down;
On said knockout pipe, be equipped with valve;
Be provided with the container that is used to receive wafer in the exit of knockout pipe.
Preferably: the valve that is located on tedge and the knockout pipe is a hand-operated valve.
Preferably: said tedge is provided with valve.
Preferably: on the pipe of main line, be connected with the branch road operator, this branch road operator comprises vacuum WAND and chip gatherer;
Vacuum WAND is connected with the chip gatherer through flexible pipe, and the chip gatherer is connected with the main line pipe through flexible pipe.
Preferably: said vacuum WAND comprises hollow needle and the hollow tube that is connected the syringe needle rear portion, and hollow tube is connected with the chip gatherer through flexible pipe.
Preferably: said chip gatherer comprises cylindrical shell, is fixed on the screen pack of barrel, and screen pack cuts off the barrel space and forms filtration.
Preferably: said screen pack is fixed on the inwall of said cylindrical shell through two snap rings that are positioned at its front and back.
Preferably: the aperture of the front end of said syringe needle for tilting.
Preferably: said tedge, main line pipe are connected through a three-way pipe with the knockout pipe.
Preferably: said three-way pipe right angle T word pipe also can be the pipe of on-right angle.
The beneficial effect of the utility model:
When screen pack was broken, useless chip can be deposited in the knockout pipe, can chip be collected in the container after opening valve.Compare prior art, the utility model can well be collected the wafer that gets in the knockout pipe through container, even screen pack is damaged, chip gets into pipeline can not get into high-order pipe and vavuum pump along pipeline yet.This structure can be collected waste and old wafer, and the wafer of collection can be used as waste product and sells, and it is brought benefits; The more important thing is that useless chip can not be inhaled into vavuum pump, has avoided equipment fault, and then has protected equipment.
Description of drawings
Fig. 1 is the prior art constructions sketch map.
Fig. 2 is the structure chart of branch road operator.
Fig. 3 is the novel structural representation of this usefulness.
The specific embodiment
The utility model proposes a kind of back processing procedure chip gathering-device, comprises main line pipe and the tedge that is connected with the main line pipe, and manages on the main line and to be connected through a three-way pipe with tedge, and the 3rd port of three-way pipe down and be connected with a knockout pipe; On the knockout pipe, be equipped with valve; Be provided with the container that is used to receive wafer in the exit of knockout pipe.
Below through embodiment the utility model is described, but below embodiment as to the qualification of the utility model technical protection scope, the expansion scheme that any relevant the utility model can be known by inference is all in the protection domain of the utility model.
As shown in Figure 3, this back processing procedure chip gathering-device mainly is made up of branch road operator, main line pipe 200, tedge 400, high-order pipe 500 and vavuum pump 600 etc.
On tedge 400 and knockout pipe 10, be equipped with valve, promptly be located at first valve 9 on the tedge 400, be located at second valve 11 on the knockout pipe 10.First valve and second valve can be hand-operated valve, also can be control valve.
Be provided with the container 12 that is used to receive wafer in the exit of knockout pipe 10.Water or other liquid are housed in the container 12.If do not consider to reclaim chip, then can in container, place fine sand or sponge or the like dunnage, can what not put yet.
On main line pipe 200, be connected with the branch road operator, the structure of this branch road operator is referring to shown in Figure 2, and it comprises vacuum WAND and chip gatherer.Vacuum WAND is made up of syringe needle 80, hollow tube 81, and hollow tube 81 connects syringe needle portion after 80s; The chip gatherer comprises cylindrical shell 85, snap ring 84 and screen pack 83 compositions, and screen pack is fixed on barrel, and screen pack cuts off the barrel space and forms filtration, and screen pack 83 is fixed on the inwall of cylindrical shell through former and later two snap rings 84.
Vacuum WAND is connected with the chip gatherer through flexible pipe 82, and the chip gatherer is connected with the main line pipe through flexible pipe.The front end of syringe needle 80 is the aperture that is polished into band acupuncture.
High-order pipe 500 is for being located at the pipeline of eminence, and its caliber is managed 200 thick than the main line.Vavuum pump can substitute with exhaust fan.In the application of the utility model, vavuum pump can be the draft fan or the pump installation of Clean room.Tedge 400 pipeline for erectting is erect pipeline, the pipeline before the pump is located at high-order purpose is prevented that exactly chip from getting in the pump housing under gravity.
When using, close first valve 9, open second valve 11, the chip that is deposited in the second valve place falls into container naturally.
Said structure is that vavuum pump is the structure under the situation of room ventilation pump simultaneously.If vavuum pump is not that other function is shared, then can not establish first valve, close vavuum pump in the time of use, open second valve and can let chip fall into container naturally can to accomplish collection.The time interval of opening of second valve can judge rule of thumb that such as one hour or one day, this depended on the quantity of operating desk 1, operator's working condition and the length of knockout pipe or the like external condition.
Claims (10)
1. processing procedure chip gathering-device after a kind comprises main line pipe and the tedge that is connected with the main line pipe, and it is characterized in that: the junction of said main line pipe and said tedge also is provided with a knockout pipe, the knockout pipe go out mouth down;
On said knockout pipe, be equipped with valve;
Be provided with the container that is used to receive wafer in the exit of knockout pipe.
2. back according to claim 1 processing procedure chip gathering-device, it is characterized in that: the valve that is located on tedge and the knockout pipe is a hand-operated valve.
3. back according to claim 1 processing procedure chip gathering-device, it is characterized in that: said tedge is provided with valve.
4. back according to claim 1 processing procedure chip gathering-device, it is characterized in that: on the pipe of main line, be connected with the branch road operator, this branch road operator comprises vacuum WAND and chip gatherer;
Vacuum WAND is connected with the chip gatherer through flexible pipe, and the chip gatherer is connected with the main line pipe through flexible pipe.
5. back according to claim 4 processing procedure chip gathering-device, it is characterized in that: said vacuum WAND comprises hollow needle and the hollow tube that is connected the syringe needle rear portion, and hollow tube is connected with the chip gatherer through flexible pipe.
6. back according to claim 4 processing procedure chip gathering-device, it is characterized in that: said chip gatherer comprises cylindrical shell, is fixed on the screen pack of barrel, and screen pack cuts off the barrel space and forms filtration.
7. back according to claim 6 processing procedure chip gathering-device, it is characterized in that: said screen pack is fixed on the inwall of said cylindrical shell through two snap rings that are positioned at its front and back.
8. back according to claim 5 processing procedure chip gathering-device is characterized in that: the aperture of the front end of said syringe needle for tilting.
9. according to each described back processing procedure chip gathering-device of claim 1 to 8, it is characterized in that: said tedge, main line pipe are connected through a three-way pipe with the knockout pipe.
10. back according to claim 9 processing procedure chip gathering-device is characterized in that: said three-way pipe right angle T word pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200197266U CN202516790U (en) | 2012-01-17 | 2012-01-17 | Back process chip collecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200197266U CN202516790U (en) | 2012-01-17 | 2012-01-17 | Back process chip collecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202516790U true CN202516790U (en) | 2012-11-07 |
Family
ID=47099760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200197266U Expired - Lifetime CN202516790U (en) | 2012-01-17 | 2012-01-17 | Back process chip collecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202516790U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111703899A (en) * | 2020-08-12 | 2020-09-25 | 江西铭德半导体科技有限公司 | A tool for laser instrument chip chooses brilliant |
-
2012
- 2012-01-17 CN CN2012200197266U patent/CN202516790U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111703899A (en) * | 2020-08-12 | 2020-09-25 | 江西铭德半导体科技有限公司 | A tool for laser instrument chip chooses brilliant |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121107 |
|
| CX01 | Expiry of patent term |