CN202475955U - Equipment for printing solder paste on circuit board - Google Patents
Equipment for printing solder paste on circuit board Download PDFInfo
- Publication number
- CN202475955U CN202475955U CN2012200389374U CN201220038937U CN202475955U CN 202475955 U CN202475955 U CN 202475955U CN 2012200389374 U CN2012200389374 U CN 2012200389374U CN 201220038937 U CN201220038937 U CN 201220038937U CN 202475955 U CN202475955 U CN 202475955U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- equipment
- tin cream
- printed circuit
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The utility model relates to equipment for printing solder paste on a circuit board, which is used in the through hole plugin assembly technology. The equipment comprises a lower plate and steel meshes, wherein the lower plate is used for fixing a printed circuit board; and the steel meshes are arranged above the lower plate and are fit with the printed circuit board. The equipment has the following beneficial effects that the solder paste is printed on the printed circuit board which is put below the steel meshes and is fixed on the lower plate by utilizing the principle that the mesh openings of the steel meshes leak the solder paste while the non-mesh-opening parts do not leak the solder paste; and as the openings on the steel meshes are arranged according to the position of the pad of the circuit board and the best coating weight of the solder paste, the coating weight of the solder paste in the printing process can not be changed, thus solving the problem that the coating weight of the solder paste in the tubular printing technology of the current through hole plugin circuit boards is not easy to control.
Description
Technical field
The utility model relates to the production of electronic components technical field, relates to a kind of equipment of printed circuit board (PCB) tin cream in particular.
Background technology
Printed circuit board is the carrier of electronic devices and components, and electronic devices and components are through surface mounting technology or jack technology, then the technology and firm being connected of circuit board through reflow soldering.
Reflow Soldering is called reflow welding again, thereby the tin cream that is placed in advance on the printed circuit board through refuse forms solder joint, in welding process, need not add a kind of welding method of any extra solder.The main composition key element of the reflow soldering process of through hole plug in circuit card is: paste solder printing, part plug-in mounting, reflow soldering, optical detection can be found out by above key element also to comprise the printing of tin cream and the plug-in mounting operation of part before the reflow soldering.
The paste solder printing operation of present through hole plug in circuit card generally adopts the tubulose typography, and promptly tin cream is applied on the pad that is fixed in the circuit board on the lower bolster through the tiny pore that is installed on the cope match-plate pattern.
The tin cream amount that adopts the tubulose typography to be applied on the circuit board receives the time of staying of pore above the printed circuit board pad and the influence of pore tin cream flow size; The tin cream of extruding and being applied on the circuit board by pore is teardrop shaped; Tin cream has subsiding to a certain degree after on being applied to pad; If the tin cream coating weight is too big; Then cause the generation that connects weldering easily, can cause the insecure easy appearance of welding to become flexible or loose contact again but coating weight is too little, the size of tin cream coating weight is difficult to accurately grasp in process of production.
How to develop a kind of equipment of printed circuit board (PCB) tin cream, this equipment is used in the middle of the through hole plug-in unit assembly technology, and in the paste solder printing process, can accurately control coating weight, is the technical problem that present those skilled in the art need solution badly.
The utility model content
In view of this, the purpose of the utility model provides a kind of equipment of printed circuit board (PCB) tin cream, with the coating weight of accurate control tin cream on board pads.
For solving the problems of the technologies described above; The utility model provides a kind of equipment of printed circuit board (PCB) tin cream; Comprise the lower bolster that is used for fixing circuit board; Be arranged at lower bolster top and with the adaptive steel mesh of pad of circuit board to be printed, said steel mesh Height Adjustable, an end contact with said steel mesh and with said steel mesh the scraper of angle are arranged.
Preferably, said lower bolster is Height Adjustable.
Preferably, the height of said scraper saves with itself and the adjustable included angle of said steel mesh.
Preferably, offer the groove that is used for fixing circuit board in the said lower bolster.
Preferably, the groove side of said lower bolster is provided with because the elasticity thimble of fixing circuit board.
Preferably, said lower bolster is provided with the clamp structure that is used for fixing circuit board.
Preferably, said lower bolster is provided with the pilot pin that is used for fixing circuit board.
Can find out the equipment of the through hole plug in circuit card paste solder printing that the utility model provides by above technical scheme; Adopt the steel mesh printing technology to substitute present tubulose print solder paste technology; Because the mesh of described steel mesh is that the optimal amount that is coated with tin cream is as required offered, therefore when scraper was scraped mesh, fix from the tin cream that mesh drains on the circuit board; The speed of this and scraper speed and scraper are irrelevant in the time of staying at mesh place; Therefore efficiently solve the uppity problem of the present coating weight of tubulose print solder paste technology tin cream on circuit board, simultaneously, because the perforate of steel mesh design is what to be offered according to the optimal value of tin cream coating weight; Thereby can effectively practice thrift the consumption of tin cream, significantly reduce production costs.
Description of drawings
The equipment side structural representation of the printed circuit board (PCB) tin cream that Fig. 1 is provided for the utility model embodiment;
The tin cream coating sketch map of the equipment of the printed circuit board (PCB) tin cream that Fig. 2 is provided for the utility model embodiment;
The equipment side structural representation of the printed circuit board (PCB) tin cream that Fig. 3 is provided for another embodiment of the utility model.
Wherein, 1 is scraper, and 2 is steel mesh, and 3 is circuit board, and 4 is lower bolster, and 5 is tin cream, and 6 is pilot pin.
Embodiment
The core of the utility model provides a kind of equipment of printed circuit board (PCB) tin cream, and tin cream is leaked at the mesh place of this equipment utilization steel mesh but not mesh-structured basic principle steel mesh typography of not leaking tin cream prints solder paste onto on the circuit board.
In order to make those skilled in the art person understand the utility model scheme better, the utility model is done further to specify below in conjunction with accompanying drawing and embodiment.
Please refer to Fig. 1, the equipment side structural representation of the printed circuit board (PCB) tin cream that Fig. 1 present embodiment provides.
The equipment of the printed circuit board (PCB) tin cream that the utility model provided comprises the lower bolster 4 that is used for fixing circuit board; Be arranged at lower bolster 4 tops and the steel mesh 2 adaptive with circuit board to be printed; Steel mesh 2 Height Adjustable, an end contact with steel mesh 2 and with steel mesh 2 scraper 1 of angle are arranged.
On the lower bolster 4 that in the middle of the process of printing circuit board 3 is fixed in; And regulate steel mesh 2 highly; It is contacted with circuit board 3 and aim at the pad locations on the circuit board 3; Tin cream 5 is positioned over an end of steel mesh 2, scraper 1 promote tin cream 5 and move to the other end from steel mesh 2 one ends, tin cream 5 will be filled in the mesh of steel mesh 2 in the process along with scraper 1 motion and on the circuit board 3 that sticks at.
Because the mesh on the steel mesh 2 is to offer according to the tin cream optimum coating weight that Theoretical Calculation and practical experience draw; And no matter scraper moves fast and slow; Or be the long and weak point of time that scraper stops above mesh; Can not change tin cream circuit board on the size of coating weight, the tin cream amount of coating on the board pads is the fixed value of design, its coating effect is as shown in Figure 2.This shows; The equipment of the printed circuit board (PCB) tin cream that the utility model provided can effectively solve the unmanageable problem of present tin cream coating weight, simultaneously, because coating weight has reached optimal value; Thereby the use amount of not only having saved tin cream, also significantly improve the product quality of circuit board simultaneously.
In order further to improve the operability of the equipment of the printed circuit board (PCB) tin cream that the utility model provided; The height of the lower bolster 4 in the present embodiment also can be regulated; Simultaneously, the height of scraper 1 with itself and the angle of steel mesh 2 also be designed to adjustablely, in the process of printing, can adjust the height of steel mesh 2 and lower bolster 4 simultaneously; 3 contacts of the steel mesh 2 that makes and circuit board are also accurately corresponding with pad on it; Regulate the height and the angle of scraper 1 then, make the pressure of itself and steel mesh 2 get into zone of reasonableness, thereby increase work efficiency and product quality.
In order further to optimize the performance of the equipment of the printed circuit board (PCB) tin cream in the present embodiment, scraper 1 is 45-60 ° with the angle of steel mesh 2 in this instance, adopts 60 ° more specifically.
For fixing circuit board; In lower bolster 4, offered the location that groove is used for circuit board 3 in the present embodiment; Please refer to accompanying drawing 1,, also be provided with the side elastic thimble that is used for fixing circuit board in the present embodiment in the groove side of lower bolster 4 for further fixing circuit board 3 and conveniently stripped; Like this in knockout course; The elasticity thimble can hold out against the side with groove with circuit board, and circuit board can move along with moving of lower bolster, and the height of adjusting lower bolster also takes out circuit board 3 and can realize the demoulding.Also disclose other two kinds of fixed forms in the utility model simultaneously, the clamp structure has been set on the lower bolster 4 that is included in and the position that pilot pin 6 fixes circuit board is set on lower bolster 4, please refer to accompanying drawing 3; In the mode of pilot pin; Before the fixing circuit board, on counterdie 4, glue double faced adhesive tape in advance, when circuit board 3 is fixed in the groove of lower bolster 4; Itself and groove also are connected as a single entity, and in knockout course, only adjust counterdie 4 height and can take out circuit board 3.The lower bolster fixed form that wherein has groove generally is used for the circuit board of circuit board 3 sizes below 50mm*50mm, and the lower bolster of clamp structure and pilot pin structure generally is used for the situation of circuit board 3 sizes more than 50mm*50mm.
More than the equipment of the printed circuit board (PCB) tin cream that the utility model provided has been carried out detailed introduction.Used concrete example among this paper the principle and the execution mode of the utility model are set forth, the explanation of above embodiment just is used to help to understand the method and the core concept thereof of the utility model.Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (7)
1. the equipment of a printed circuit board (PCB) tin cream; Be used for through hole plug-in unit assembly technology; It is characterized in that, comprise the lower bolster (4) that is used for fixing circuit board, be arranged at said lower bolster (4) top and with the adaptive steel mesh (2) of pad of circuit board to be printed; Said steel mesh (2) Height Adjustable, an end contact with said steel mesh (2) and with said steel mesh (2) scraper (1) of angle are arranged.
2. the equipment of printed circuit board (PCB) tin cream according to claim 1 is characterized in that, said lower bolster (4) Height Adjustable.
3. the equipment of printed circuit board (PCB) tin cream according to claim 1 is characterized in that, the height of said scraper (1) saves with itself and the adjustable included angle of said steel mesh (2).
4. the equipment of printed circuit board (PCB) tin cream according to claim 1 is characterized in that, said lower bolster offers the groove that is used for fixing circuit board (3) in (4).
5. the equipment of printed circuit board (PCB) tin cream according to claim 4 is characterized in that, the groove side of said lower bolster (4) is provided with because the elasticity thimble of fixing circuit board (3).
6. the equipment of printed circuit board (PCB) tin cream according to claim 1 is characterized in that, said lower bolster (4) is provided with the clamp structure that is used for fixing circuit board (3).
7. the equipment of printed circuit board (PCB) tin cream according to claim 1 is characterized in that, said lower bolster (4) is provided with the pilot pin (6) that is used for fixing circuit board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200389374U CN202475955U (en) | 2012-02-07 | 2012-02-07 | Equipment for printing solder paste on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200389374U CN202475955U (en) | 2012-02-07 | 2012-02-07 | Equipment for printing solder paste on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202475955U true CN202475955U (en) | 2012-10-03 |
Family
ID=46924074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200389374U Expired - Fee Related CN202475955U (en) | 2012-02-07 | 2012-02-07 | Equipment for printing solder paste on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202475955U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874320A (en) * | 2012-12-17 | 2014-06-18 | 纬创资通股份有限公司 | Circuit board and manufacturing method thereof |
| CN112804829A (en) * | 2021-01-25 | 2021-05-14 | 苏州汇川联合动力系统有限公司 | Missing printing template, solder paste printing device, electronic component packaging equipment and process |
| CN113597135A (en) * | 2021-06-29 | 2021-11-02 | 联宝(合肥)电子科技有限公司 | Welding process and equipment based on steel mesh pre-laying tin |
-
2012
- 2012-02-07 CN CN2012200389374U patent/CN202475955U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874320A (en) * | 2012-12-17 | 2014-06-18 | 纬创资通股份有限公司 | Circuit board and manufacturing method thereof |
| CN103874320B (en) * | 2012-12-17 | 2017-02-01 | 纬创资通股份有限公司 | Circuit board and manufacturing method thereof |
| CN112804829A (en) * | 2021-01-25 | 2021-05-14 | 苏州汇川联合动力系统有限公司 | Missing printing template, solder paste printing device, electronic component packaging equipment and process |
| CN113597135A (en) * | 2021-06-29 | 2021-11-02 | 联宝(合肥)电子科技有限公司 | Welding process and equipment based on steel mesh pre-laying tin |
| CN113597135B (en) * | 2021-06-29 | 2023-03-31 | 联宝(合肥)电子科技有限公司 | Welding process and equipment based on steel mesh pre-laying tin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20150207 |
|
| EXPY | Termination of patent right or utility model |