CN202464502U - Chip sleeve - Google Patents
Chip sleeve Download PDFInfo
- Publication number
- CN202464502U CN202464502U CN201120545011XU CN201120545011U CN202464502U CN 202464502 U CN202464502 U CN 202464502U CN 201120545011X U CN201120545011X U CN 201120545011XU CN 201120545011 U CN201120545011 U CN 201120545011U CN 202464502 U CN202464502 U CN 202464502U
- Authority
- CN
- China
- Prior art keywords
- chip
- utility
- model
- interlayer
- leather sheath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Treatment And Processing Of Natural Fur Or Leather (AREA)
Abstract
The utility model relates to a chip sleeve, comprising a leather sleeve for packaging a chip, and an interlayer for containing the chip. The chip is buckled in the interlayer. According to the chip sleeve provided by the utility model, silicon rubber is used as a material, so that the chip sleeve has the advantages of good toughness, high temperature resistance, low manufacturing cost, cost conversation and the like. Meanwhile, the information chip is prevented from damaging and information weakening caused by impacting and squeezing.
Description
Technical field
The utility model relates to a kind of chip carrier, a kind of specifically chip cover.
Background technology
According to the doff technological process of production; Manufacturing line can be produced N kind simultaneously; Can carry out the thermal finalization processing (temperature 100 degree) of postorder according to the client to Different products to different product performance demands doff operation, and last delivering to according to different cultivars mail to different clients after corresponding yarn outlet is packed by the operative employee, in view of more than require the information must be accurate, sensitive; The chip cover reusable edible of carries chips, the high temperature resistant life-span is long.
And the problem that the chip information carrier that uses at present exists:
1, chip overlaps the material embrittlement, the damage amount is big, and cost has high input.
2, chip must use screw to be fixed on chip to put, influence reading of information, and accuracy rate is low, and product mixes the hidden danger of quality of yarn easily.
3, the screw of fixed chip exists screw to fall into the hidden danger that product causes downstream client's product quality problems.
Summary of the invention
In order to overcome the deficiency of prior art, the purpose of the utility model provides a kind of chip cover.
The technical scheme of the utility model is: the chip cover comprises being used to pack the leather sheath of chip and the interlayer of ccontaining chip that chip card is buckled in the interlayer.
It is the silica gel material that the utility model has also designed described leather sheath.
The utility model has also designed described leather sheath for circular or oval.
The utility model has also designed the center that described interlayer is arranged on leather sheath.
The utility model has also designed outside leather sheath, to be equipped with and has been used for and other object bonded assembly holes.
The beneficial effect of the utility model is: the utility model adopts silica gel as material, good toughness, high temperature resistant, cheap, practice thrift advantage such as cost, can protect problems such as damage that information chip avoids clashing into, extruding causes and information weaken simultaneously.
Description of drawings
Fig. 1 is the utility model chip nested structure scheme drawing.
The specific embodiment
The chip cover is characterized in that: comprise being used to pack the leather sheath 2 of chip 1 and the interlayer 3 of ccontaining chip 1, chip 1 is buckled in the interlayer 3.
The utility model has also designed described leather sheath 2 and has been the silica gel material.
The utility model has also designed described leather sheath 2 for circular or oval.
The utility model has also designed the center that described interlayer 3 is arranged on leather sheath.
The utility model has also designed outside leather sheath 2, to be equipped with and has been used for and other object bonded assembly holes 4.
The beneficial effect of the utility model is: the utility model adopts silica gel as material, good toughness, high temperature resistant, cheap, practice thrift advantage such as cost, can protect problems such as damage that information chip avoids clashing into, extruding causes and information weaken simultaneously.
Claims (5)
1. chip cover is characterized in that: comprise the leather sheath (2) that is used to pack chip (1) and the interlayer (3) of ccontaining chip (1), chip (1) is buckled in the interlayer (3).
2. chip cover according to claim 1 is characterized in that: described leather sheath (2) is the silica gel material.
3. chip cover according to claim 1 and 2 is characterized in that: described leather sheath (2) is for circular or oval.
4. chip cover according to claim 1 and 2 is characterized in that: described interlayer (3) is arranged on the center of leather sheath.
5. chip cover according to claim 3 is characterized in that: outside leather sheath (2), be equipped with and be used for and other object bonded assembly holes (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120545011XU CN202464502U (en) | 2011-12-23 | 2011-12-23 | Chip sleeve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120545011XU CN202464502U (en) | 2011-12-23 | 2011-12-23 | Chip sleeve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202464502U true CN202464502U (en) | 2012-10-03 |
Family
ID=46912685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120545011XU Expired - Fee Related CN202464502U (en) | 2011-12-23 | 2011-12-23 | Chip sleeve |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202464502U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109059974A (en) * | 2018-07-19 | 2018-12-21 | 安徽奕衡温控科技有限公司 | A kind of rubber pad for chip protection |
-
2011
- 2011-12-23 CN CN201120545011XU patent/CN202464502U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109059974A (en) * | 2018-07-19 | 2018-12-21 | 安徽奕衡温控科技有限公司 | A kind of rubber pad for chip protection |
| CN109059974B (en) * | 2018-07-19 | 2020-12-04 | 安徽奕衡温控科技有限公司 | Rubber pad for chip protection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20121223 |