CN202462656U - Guide wheel for silicon wafer cutting machine - Google Patents
Guide wheel for silicon wafer cutting machine Download PDFInfo
- Publication number
- CN202462656U CN202462656U CN2012200165104U CN201220016510U CN202462656U CN 202462656 U CN202462656 U CN 202462656U CN 2012200165104 U CN2012200165104 U CN 2012200165104U CN 201220016510 U CN201220016510 U CN 201220016510U CN 202462656 U CN202462656 U CN 202462656U
- Authority
- CN
- China
- Prior art keywords
- guide wheel
- urceolus
- silicon wafer
- cutting machine
- wafer cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a guide wheel for a silicon wafer cutting machine, which is provided with an outer barrel and an end flange fixedly connected with the outer barrel, wherein the outer barrel is made of a carbon fiber material; and the surface of the outer barrel is coated with polyurethane. The guide wheel is light in weight, high in corrosion resistance and strength, small in thermal deformation, convenient in processing, high in wear resistance and low in production cost.
Description
Technical field
The utility model relates to the technical field of guide wheel, relates in particular to a kind of silicon wafer cutting machine and uses guide wheel.
Background technology
Guide wheel generally comprises urceolus and the end flanges that is fixedly connected with urceolus in the existing silicon chip slicer, and wherein urceolus is to adopt steel material to process mostly, obviously the Heavy Weight of the urceolus of steel; And corrosion resistance is poor, in organic solvent, acid, alkali, is easy to be corroded for a long time, and fatigue performance is also relatively poor; The thermal deformation that in cutting silicon chip process, caused by the steel wire friction is very big; Because thermal deformation is big, need use the cutting fluid cooling often in processing, process inconvenience very.
Because the wear-resistant ability of urceolus is relatively poor,, guide wheel just can only guide wheel be scrapped the obvious like this production cost that improved greatly after using a period of time wearing and tearing simultaneously.
The utility model content
The technical problem that the utility model will solve is: in order to solve the problem of mentioning in the above-mentioned background technology, the utility model provides a kind of silicon wafer cutting machine to use guide wheel, it in light weight; Corrosion resistance is strong, and intensity is high, and thermal deformation is little; Easy to process, wearability is strong, and production cost is low.
The utility model solves the technical scheme that its technical problem adopted: a kind of silicon wafer cutting machine is used guide wheel, has urceolus and the end flanges that is fixedly connected with urceolus, and urceolus adopts carbon fibre material to process, and the surfaces coated of urceolus is covered with polyurethane.
The beneficial effect of the utility model: this silicon wafer cutting machine has the following advantages with guide wheel:
One, urceolus adopts carbon fibre material to process: make the in light weight of urceolus, weight be same model steel guide wheel 4; Have good corrosion resistance, can insolublely in organic solvent, acid, alkali for a long time not expand; It is high axially to reach radial strength, no creep, and fatigue durability is good, when the cutting silicon chip, can bear the radial pull of 4 tons on steel wire net for a long time; Specific heat and electric conductivity are between nonmetal and metal, and thermal coefficient of expansion is little, and the thermal deformation that in the process of cutting silicon chip, caused by the steel wire friction is very little, guarantees that effectively the slot pitch of guide wheel is invariable; Be convenient to processing, thermal deformation is very little, adds to need not to use the cutting fluid cooling man-hour.
Two, the surfaces coated of urceolus is covered with polyurethane: after guide wheel uses a period of time wearing and tearing, as long as fall the polyurethane car, wrap one deck polyurethane again and just can continue to use, guide wheel can be used repeatedly, reduced production cost.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the structural representation of the utility model.
Among the figure 1, urceolus, 2, end flanges.
The specific embodiment
Silicon wafer cutting machine as shown in Figure 1 is used guide wheel, has urceolus 1 and the end flanges 2 that is fixedly connected with urceolus 1, and urceolus 1 adopts carbon fibre material to process, make the in light weight of urceolus 1, weight be same model steel guide wheel 4; Have good corrosion resistance, can insolublely in organic solvent, acid, alkali for a long time not expand; It is high axially to reach radial strength, no creep, and fatigue durability is good, when the cutting silicon chip, can bear the radial pull of 4 tons on steel wire net for a long time; Specific heat and electric conductivity are between nonmetal and metal, and thermal coefficient of expansion is little, and the thermal deformation that in the process of cutting silicon chip, caused by the steel wire friction is very little, guarantees that effectively the slot pitch of guide wheel is invariable; Be convenient to processing, thermal deformation is very little, adds to need not to use the cutting fluid cooling man-hour.The surfaces coated of urceolus 1 is covered with polyurethane, after guide wheel uses a period of time wearing and tearing, as long as fall the polyurethane car, wraps one deck polyurethane again and just can continue to use, and guide wheel can be used repeatedly, has reduced production cost.
What wherein urceolus 1 and end flanges 2 adopted is freezing assembling: the value of interference fit that increases end flanges 2 and urceolus 1 according to the principle of expanding with heat and contract with cold increases torsion, can easily import during assembling, and is convenient and quick, can not be damaged to guide wheel; Between urceolus 1 and end flanges 2, squeeze into a plurality of pins, increased torsion, guide wheel can transmit enough moments of torsion when the cutting silicon chip, guarantees the normal operation of slice systems, and safe, easy to process, product quality guarantees easily; This guide wheel learns through torsional test, and torsion is guide wheel 5 times of torsion when normally moving, the safety factor and the service life of having improved guide wheel.
Claims (1)
1. a silicon wafer cutting machine is used guide wheel, has urceolus (1) and the end flanges (2) that is fixedly connected with urceolus (1), it is characterized in that: described urceolus (1) adopts carbon fibre material to process, and the surfaces coated of urceolus (1) is covered with polyurethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200165104U CN202462656U (en) | 2012-01-14 | 2012-01-14 | Guide wheel for silicon wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200165104U CN202462656U (en) | 2012-01-14 | 2012-01-14 | Guide wheel for silicon wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202462656U true CN202462656U (en) | 2012-10-03 |
Family
ID=46910848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200165104U Expired - Fee Related CN202462656U (en) | 2012-01-14 | 2012-01-14 | Guide wheel for silicon wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202462656U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105108816A (en) * | 2015-09-16 | 2015-12-02 | 张家港市宝华利高分子材料制品有限公司 | Guide wire wheel for polycrystalline silicon cutting wires and preparation process thereof |
| CN106985295A (en) * | 2017-04-07 | 2017-07-28 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of guide roller of multi-line cutting machine |
-
2012
- 2012-01-14 CN CN2012200165104U patent/CN202462656U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105108816A (en) * | 2015-09-16 | 2015-12-02 | 张家港市宝华利高分子材料制品有限公司 | Guide wire wheel for polycrystalline silicon cutting wires and preparation process thereof |
| CN106985295A (en) * | 2017-04-07 | 2017-07-28 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of guide roller of multi-line cutting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20130114 |