CN202434285U - Inductance structure - Google Patents

Inductance structure Download PDF

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Publication number
CN202434285U
CN202434285U CN 201220002974 CN201220002974U CN202434285U CN 202434285 U CN202434285 U CN 202434285U CN 201220002974 CN201220002974 CN 201220002974 CN 201220002974 U CN201220002974 U CN 201220002974U CN 202434285 U CN202434285 U CN 202434285U
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CN
China
Prior art keywords
folding
around
iron core
chip module
sheet
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Expired - Lifetime
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CN 201220002974
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Chinese (zh)
Inventor
叶秀发
陈品榆
吕航军
温震国
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Mag Layers Scientific Technics Co Ltd
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Mag Layers Scientific Technics Co Ltd
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Priority to CN 201220002974 priority Critical patent/CN202434285U/en
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Abstract

The utility model provides an inductance structure, which comprises an iron core main body and a conducting plate, wherein the iron core main body comprises a first iron core and a second iron core, the first iron core is provided with a hollow part, and the second iron core is fixedly arranged inside the hollow part of the first iron core; the conducting plate is sleeved with the second iron core of the iron core main body, the conducting plate is also provided with a spacing sheet, two diagonal ends of the spacing sheet are respectively bent to provide with a first bending winding sheet assembly and a second bending winding sheet assembly, one end of the first bending winding sheet assembly is bent and extends to provide with a first terminal part, and one end of the second bending winding sheet assembly is bent and extends to provide with a second terminal part; and the conducting plate is used for substituting a conventional coil, the thickness of the conducting plate can be greatly reduced, and one end of the first bending winding sheet assembly and one end of the second bendingwinding sheet assembly are respectively bent and extends to provide with the first terminal part and the second terminal part, so that the inductance structure is applicable to the surface-adhesion installation way, and the function for reducing the size and accelerating the installation can be realized.

Description

Induction structure
Technical field
This creation is a kind of induction structure, and You Zhike significantly dwindles the thickness of this conductive plate, simultaneously again applicable to the mounting means of surface adhering, and then can reach reduced volume and the induction structure that quick effect is installed.
Background technology
General induction structure; See also shown in Figure 1ly, it is made up of one first unshakable in one's determination 11,1 second 13 of 12 and one coils unshakable in one's determination, and wherein this is provided with hollow bulb 14 in first unshakable in one's determination 11; This second iron core 12 is fixedly arranged in these first 11 its hollow bulbs 14 unshakable in one's determination; This coil 13 is set around that this is second unshakable in one's determination 12, and these coil 13 two ends 131,132 extend respectively and pass outside this first iron core 11, and this coil 13 is an enamelled wire again; Be set around this second iron core 12 by its coil 13 of this inductance; And these coil 13 two ends 131,132 are extended respectively and are passed this outside first unshakable in one's determination 11; When electrically conducting in order to do being connected power supply with second end 132 when these coil 13 its first ends 131; This coil 13 can pass through because of the electric current of power supply to produce magnetic field, stores and the purpose that releases energy and this inductance can be reached through the principle of electromagnetic induction.
Please consult shown in Figure 1A, the induction structure that this is commonly used stores and the purpose that releases energy though can reach again; But because of this coil 13 is a round conductor; According to (cutting) area formula A (area)=π (circumference ratio) r (radius) square of circle, and the principle that is inversely proportional to of the sectional area of the resistance of lead and lead, in order to do when the withstanding current capability of this coil 13 and resistance must remain on certain numerical value or scope; Then the sectional area of lead also must be kept certain size; So the thickness H2 (being the radius of twice) of this coil 13 just can't effectively reduce, thereby can cause the overall inductance structural volume huge, is difficult to meet the compact trend of electronic product; In addition; Extend respectively because of these coil 13 two ends 131,132 again and pass outside this first iron core 11; And make this induction structure be only applicable to traditional artificial plug-in unit (Dual Inline Package, DIP) mounting means, but and be not suitable for surface adhering (the Surface Mount Device of automated job; SMD) mounting means, and then it is bulky and installation rate is slow to cause this induction structure commonly used; In addition; For the 13 unstable displacements of too little or coil are short-circuited because of spacing between the coil of avoiding winding the line 13; This coil 13 must adopt enamelled wire, and also promptly these coil 13 outer surfaces must coat or be coated with an insulating barrier 15, and this insulating barrier 15 also possesses fixing thickness H1 again; So will make the integral thickness of this coil 13 (is that H1 * 2+H2) more shape increases; The whole cost of this coil 13 is improved, and then cause the more huge and manufacturing cost raising of this its volume of induction structure commonly used, therefore improved necessity arranged in fact.
Therefore, how disappearance such as above-mentioned is forgone, be the place of the technical difficulties that this case creator institute desire solves.
Summary of the invention
Because existing induction structure; Bulky and installation rate is slow because of it; Therefore the purpose of this creation is to provide a kind of induction structure; Utilize this conductive plate to replace coil commonly used by this creation, and can significantly dwindle the thickness of this conductive plate, respectively bend extension around chip module one end and second folding around chip module one end by this first folding again simultaneously to be provided with the first terminal portion and second portion of terminal; And make the mounting means of this creation, and then make this creation can reach reduced volume and quick installation effect applicable to surface adhering.
For reaching the above object, this creation provides a kind of induction structure, and it comprises:
One body unshakable in one's determination, this iron core body still include first unshakable in one's determination and second iron core, and wherein this first iron core is provided with hollow bulb, and this second iron core is fixedly arranged in this first its hollow bulb unshakable in one's determination;
One conductive plate; This conductive plate is mutually sheathed with its second iron core of this iron core body; This conductive plate is provided with a spacing sheet; Its two diagonal angle ends of this spacing sheet bend respectively extend be provided with first folding around chip module and second folding around chip module, this first folding extends the first terminal portion that is provided with around the bending of chip module one end, this second folding is provided with one second portion of terminal around chip module one end bending extension;
This first folding still includes at least three first foldings around sheet around chip module, and this first folding connects around sheet with bending mode and the first adjacent folding around sheet.
Respectively this first folding is formed in one around sheet.
This second folding still includes at least three second foldings around sheet around chip module, and this second folding connects around sheet with bending mode and the second adjacent folding around sheet.
Respectively this second folding is formed in one around sheet.
This first folding is rightabout around the overbending direction and second folding of chip module around the overbending direction of chip module.
This first terminal portion contacts with the surface of this its first side unshakable in one's determination of iron core body respectively with second portion of terminal.
These first its hollow bulb two ends unshakable in one's determination all are open shape.
This first its hollow bulb one end unshakable in one's determination is open shape, and this hollow bulb other end is a closed.
Utilize this conductive plate to replace coil commonly used by this creation; And can significantly dwindle the thickness of this conductive plate; Simultaneously respectively bend extension with second folding around chip module one end around chip module one end by this first folding again and be provided with the first terminal portion and second portion of terminal; And make the mounting means of this creation, and then make this creation can reach reduced volume and quick installation effect applicable to surface adhering.
Description of drawings
Fig. 1 is decomposing schematic representation commonly used.
Figure 1A is the cross-sectional schematic of its coil thickness commonly used.
Fig. 2 is the decomposing schematic representation of this creation.
Fig. 3 is the combination sketch map of this creation.
Fig. 3 A is the combination sketch map of another embodiment of its conductive plate of this creation.
Fig. 4 is the cross-sectional schematic of its conductive plate thickness of this creation.
Fig. 5 is installed on the sketch map of circuit board for this creation.
Fig. 6 is the sketch map of another embodiment of its first iron core of this creation.
Description of reference numerals
11-first iron core; 12-second iron core; The 13-coil; 131-first end; 132-second end; The 14-hollow bulb; The 15-insulating barrier; 3-body unshakable in one's determination; 31-first iron core; The 311-hollow bulb; 32-second iron core; The 4-conductive plate; 41-spacing sheet; 42-first folding is around chip module; 421-first folding is around sheet; 422-the first terminal portion; 43-second folding is around chip module; 431-second folding is around sheet; 432-second portion of terminal; The 5-circuit board; H1-thickness; H2-thickness; H3-thickness.
Embodiment
For other features of making convenient simple and direct this creation of understanding of auditor and advantage and the effect reached thereof can more manifest, now with this creation conjunction with figs., detailed description as follows:
See also shown in Figure 2ly, this creation provides a kind of induction structure, and it comprises:
One body 3 unshakable in one's determination, this iron core body 3 still include first 31 and second iron core 32 unshakable in one's determination, and wherein this first iron core 31 is provided with hollow bulb 311; These first 31 its hollow bulb 311 two ends unshakable in one's determination all are open shape again; Or, please consult shown in Figure 6ly again, or these first 31 its hollow bulb 311 1 ends unshakable in one's determination can be open shape; And these hollow bulb 311 other ends are closed; This second iron core 32 is fixedly arranged in these first 31 its hollow bulbs 311 unshakable in one's determination, and in other embodiment, this second 32 and first iron core 31 unshakable in one's determination also can be formed in one;
One conductive plate 4; Please cooperate and consult shown in Figure 3ly, it is second unshakable in one's determination 32 mutually sheathed for this conductive plate 4 and this iron core body 3, and this conductive plate 4 is provided with a spacing sheet 41; These spacing sheet 41 its two diagonal angle ends bend respectively to extend and are provided with first folding and roll over around chip module 43 around chip module 42 and second; This first folding still includes at least three first foldings around sheet 421 around chip module 42, and this first folding rolls over bending mode and adjacent first around sheet 421 and connect around sheet 421, in the present embodiment; Respectively this first folding is formed in one around sheet 421; This first folding extends the first terminal portion 422 that is provided with around the bending of chip module 42 1 ends in addition, and this second folding still includes at least three second foldings around sheet 431 around chip module 43, and this second folding connects around sheet 431 with bending mode and the second adjacent folding around sheet 431; In the present embodiment; Respectively this second folding is formed in one around sheet 431, and this first folding is provided with one second portion of terminal 432 around chip module 43 1 ends bending extension in addition, and wherein this first folding is rightabout around the overbending direction and second folding of chip module 42 around the overbending direction of chip module 43; Please cooperate again consult shown in Figure 3; And this first terminal portion 422 contacts with the surface of these iron core body 3 its first 31 1 sides unshakable in one's determination respectively with second portion of terminal 432, please consults another embodiment that Fig. 3 A is depicted as its conductive plate 4 of this creation again, and wherein this first terminal portion 422 and second portion of terminal 432 are drawn by the hypotenuse direction of this spacing sheet 41 respectively.
See also Fig. 2, shown in Figure 3; Mutually sheathed by this conductive plate 4 with these iron core body 3 its second iron cores 32; And this first terminal portion 422 contacts with the surface of these iron core body 3 its first 31 1 sides unshakable in one's determination respectively with second portion of terminal 432; When electrically conducting in order to do being connected power supply with second portion of terminal 432 when these conductive plate 4 its first terminal portions 422; This conductive plate 4 can pass through because of the electric current of power supply to produce magnetic field, and then makes this creation can reach the purpose that stores and release energy through the principle of electromagnetic induction.
Please consult shown in Figure 4 again; Utilize this conductive plate 4 to replace coil 13 commonly used by this creation; According to conductive plate 4 its sectional area formula A (area)=W (width) D (thickness), therefore when sectional area immobilized, more greatly then D (thickness) was more little as if W (width); And make this creation can significantly dwindle the thickness H3 of this conductive plate 4, can significantly reduce in order to do the volume that makes this creation; Please consult shown in Figure 5 again; Respectively bend extension with second folding around chip module 43 1 ends around chip module 42 1 ends by this first folding again and be provided with the first terminal portion 422 and second portion of terminal 423; And make surface adhering (the Surface Mount Device that this creation can automation; SMD) mode is installed on the circuit board 5, and then can make this creation can reach reduced volume and quick installation effect; In addition; Respectively extend two diagonal angle ends being located at this spacing sheet 41 around the chip module 42 and second folding around chip module 43 by this first folding again; Thus; And make this first folding can form the misconstruction at diagonal angle around both positions of chip module 43 around the chip module 42 and second folding, also can make this first folding between sheet 431, have stable spacing, and can avoid this first to roll over to roll over around chip module 43 and contact and cause short circuit around chip module 42 and second around the sheet 421 and second folding; In order to do making these conductive plate 4 surfaces need not extra coating or be coated with insulating barrier 15, and then this creation is had concurrently can reach better reduced volume and cost-effective effect.
For making this creation show its progressive and practicality more, following with do commonly used one comparative analysis now:
Common technology:
1, coil thickness is thicker, and the overall inductance structural volume is bigger.
2, inapplicable surface adhering mounting means, installation rate is slow.
3, coil surface must be provided with insulating barrier, and manufacturing cost increases.
This creation advantage:
1, conductive plate thinner thickness, the overall inductance structural volume is less.
2, applicable surface adhering mounting means, installation rate is fast.
3, conductive plate surface need not be provided with insulating barrier, and manufacturing cost reduces.
More than be illustrative to the description of the utility model; And it is nonrestrictive; Those skilled in the art is understood, and within spirit that claim limits and scope, can carry out many modifications, variation or equivalence to it, but they will fall in the protection range of the utility model all.

Claims (9)

1. an induction structure is characterized in that, comprises:
One body unshakable in one's determination, this iron core body still include first unshakable in one's determination and second iron core, and wherein this first iron core is provided with hollow bulb, and this second iron core is fixedly arranged in this first its hollow bulb unshakable in one's determination;
One conductive plate; This conductive plate is mutually sheathed with its second iron core of this iron core body; This conductive plate is provided with a spacing sheet; Its two diagonal angle ends of this spacing sheet bend respectively extend be provided with first folding around chip module and second folding around chip module, this first folding extends the first terminal portion that is provided with around the bending of chip module one end, this second folding is provided with one second portion of terminal around chip module one end bending extension.
2. induction structure as claimed in claim 1 is characterized in that, this first folding still includes at least three first foldings around sheet around chip module, and this first folding connects around sheet with bending mode and the first adjacent folding around sheet.
3. induction structure as claimed in claim 2 is characterized in that, respectively this first folding is formed in one around sheet.
4. induction structure as claimed in claim 1 is characterized in that, this second folding still includes at least three second foldings around sheet around chip module, and this second folding connects around sheet with bending mode and the second adjacent folding around sheet.
5. induction structure as claimed in claim 4 is characterized in that, respectively this second folding is formed in one around sheet.
6. induction structure as claimed in claim 1 is characterized in that, this first folding is rightabout around the overbending direction and second folding of chip module around the overbending direction of chip module.
7. induction structure as claimed in claim 1 is characterized in that, this first terminal portion contacts with the surface of this its first side unshakable in one's determination of iron core body respectively with second portion of terminal.
8. induction structure as claimed in claim 1 is characterized in that, these first its hollow bulb two ends unshakable in one's determination all are open shape.
9. induction structure as claimed in claim 1 is characterized in that, this first its hollow bulb one end unshakable in one's determination is open shape, and this hollow bulb other end is a closed.
CN 201220002974 2012-01-05 2012-01-05 Inductance structure Expired - Lifetime CN202434285U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220002974 CN202434285U (en) 2012-01-05 2012-01-05 Inductance structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220002974 CN202434285U (en) 2012-01-05 2012-01-05 Inductance structure

Publications (1)

Publication Number Publication Date
CN202434285U true CN202434285U (en) 2012-09-12

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CN 201220002974 Expired - Lifetime CN202434285U (en) 2012-01-05 2012-01-05 Inductance structure

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515075A (en) * 2013-09-12 2014-01-15 上海查尔斯电子有限公司 Non-coil vertical type transformer
CN103515074A (en) * 2013-09-12 2014-01-15 上海查尔斯电子有限公司 Non-coil type electronic transformer
CN111192747A (en) * 2018-11-14 2020-05-22 华硕电脑股份有限公司 Inductor and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515075A (en) * 2013-09-12 2014-01-15 上海查尔斯电子有限公司 Non-coil vertical type transformer
CN103515074A (en) * 2013-09-12 2014-01-15 上海查尔斯电子有限公司 Non-coil type electronic transformer
CN111192747A (en) * 2018-11-14 2020-05-22 华硕电脑股份有限公司 Inductor and method for manufacturing the same

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CX01 Expiry of patent term

Granted publication date: 20120912

CX01 Expiry of patent term