CN202421553U - Assembly fixing structure for light-guide fiber of optoelectronic device - Google Patents
Assembly fixing structure for light-guide fiber of optoelectronic device Download PDFInfo
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- CN202421553U CN202421553U CN2011205623706U CN201120562370U CN202421553U CN 202421553 U CN202421553 U CN 202421553U CN 2011205623706 U CN2011205623706 U CN 2011205623706U CN 201120562370 U CN201120562370 U CN 201120562370U CN 202421553 U CN202421553 U CN 202421553U
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Abstract
The utility model discloses an assembly fixing structure for light-guide fiber of an optoelectronic device. The optoelectronic device comprises a tube shell, wherein the tube shell is provided with a tail tube protruding outwards; one end of the light-guide fiber is provided with a coupling structure; the light-guide fiber comprises a fiber core and a cladding which is made of the same material as the fiber core and is coated on the fiber core; a coating layer is coated outside the cladding at one end away from the coupling structure; a bare light-guide fiber consisting of a fiber core and a cladding is formed at one end of the light-guide fiber close to the coupling structure, and a basic light-guide fiber consisting of a fiber core, a cladding and a coating layer is formed at the other end of the light-guide fiber; the light-guide fiber passes through the tail tube; and the bare light-guide fiber of the light-guide fiber is fixed to the tail tube in a soldering manner through glass solder. The assembly fixing structure for the light-guide fiber of the optoelectronic device has the advantages of simple structure and process, low time consumption, low cost and high use reliability when meeting the requirement on air tightness.
Description
Technical field
The relevant a kind of optoelectronic device of the utility model, be meant especially a kind of impermeability good fibre-optic optoelectronic device is installed.
Background technology
The optoelectronic device of optical communication field comprises optical transmitting set, multiple passive type devices such as multiple active types of devices such as photo-detector, image intensifer and photo-coupler, OWDM/demodulation multiplexer, optoisolator, optical filter.As shown in Figure 1, utilize a kind of light transmitting fiber 110 to carry out the conduction of light between all kinds of optoelectronic devices 100 and the external world, to realize the transmission of light signal and luminous energy between extraneous and the optoelectronic device 100 with certain standard specification more.The installation shell of optoelectronic device 100 is also claimed shell, generally covers 130 two parts by body 120 with pipe and forms.Body 120 can be butterfly type, the dual-in-line type of cubic shaped, or the polytype such as coaxial of cylindrical shape, and material can be and can cut down (iron cobalt nickel alloy), stainless steel, tungsten copper or other metal.Have one or more through hole on the body 120, be made into the tubular metal structure usually, be called tail pipe 140.Light transmitting fiber 110 carries out optically-coupled through tail pipe 140 and the photoelectric functional unit 101 that is installed in the body 120, and realizes light transmitting fiber 110 installing and fixing by means of tail pipe 140.Wherein photoelectric functional unit 101 can comprise various elements and their combinations such as optical transmitting set chip, photo detector chip, image intensifer chip, chip of light waveguide, optical lens, light transmitting fiber, collimating apparatus, electronic chip, cushion block, fixed support.Be typically provided with substrate 102 in the shell of optoelectronic device 100 in addition, this photoelectric functional unit 101 is installed on this substrate 102.Light transmitting fiber 110 installing and fixing part and need reach certain impermeability requirement in tail pipe 140 to prevent that surrounding materials such as external water vapour from entering into device inside and causing the infringement to function element, guarantees that optoelectronic device can work long-term and stably.Usually after the coupling of the installation of inner member and light transmitting fiber 110 and fixing completion; Entire device will place the inert gas environment (like nitrogen) of a low steam to accomplish the capping to body 120; Be about to the airtight welding that pipe covers 130 realizations and body 120; Make inner formation of entire device satisfy the totally enclosed environment that certain impermeability requires, so far the basic manufacturing process of device promptly accomplishes.
Fig. 2 a is depicted as the cross-sectional structure synoptic diagram of the basic light transmitting fiber 200 of the normally used quartz substrate of industry, and it comprises fibre core 201, is coated on the covering 202 of fibre core 201 and is coated on the coat 203 of covering 202.Wherein fibre core 201 is quartzy material with covering 202, constitutes bare photoconductive fibre 230, and shown in Fig. 2 c, its nominal outer diameter is generally 125 microns; The material of coat 203 is Acrylate (acrylic ester), and nominal outer diameter is generally 250 microns.The fibre cores 201 that comprise that 203 pairs of coats are very thin and fragile play main protective effect with covering 202 at interior bare photoconductive fibre 230, and the basic light transmitting fiber 200 that makes formation is difficult for taking place fracture or damage under situation such as crooked, as to reverse, axially pull.In the middle of the production and use of optoelectronic device; Owing to need to carry out various operations to light transmitting fiber continually, and product can be among the various risky environments for use, therefore for resisting the damage that the external world possibly cause coat 203; And have influence on protection to inner quartz fibre; And the consideration that improves the various mechanical strength properties of light transmitting fiber self, outside coat 203, add a protection jacket layer 204 usually again, such as Fig. 2 b signal.The external diameter specification a kind of commonly used of protection jacket layer 204 is 0.9 millimeter.According to its addition manner, protection jacket layer 204 can be divided into tight cover and two types in pine cover.Tight cover light transmitting fiber 210 is on the basis of aforementioned basic light transmitting fiber 200; Secondary applies to form should protect jacket layer 204, and its material can be Hytrel (vibrin), PVC (PVC), Nylon (polyamide fibre), Polyimide various polymkeric substance such as (polyimide).220 of light transmitting fibers of pine cover are to produce a protection jacket layer (pipe) 204 separately; And then it is added on the basic light transmitting fiber 200 with mechanical mode; Therefore pine is overlapped the protection jacket layer 204 of light transmitting fiber 220, and its internal diameter is bigger slightly than the external diameter of the coat 203 of basic light transmitting fiber 200.The material of pine cover protection jacket layer 204 can be ETFE materials such as (ethylene tetrafluoroethylene copolymers).
Shown in Figure 3 for adopting the typical structure of the metallization optical fiber unit 300 that tight cover light transmitting fiber 210 processes.Wherein, tightly overlap an end of light transmitting fiber 210 and peel off a segment protect jacket layer 204 and coat 203, expose the bare photoconductive fibre 230 that typically has a diameter from 125 microns; The all surfaces of one metal sleeve 310 is gold-plated, and planform also can be other shape shown in figure, and the one of which end is for only can hold the tubule 311 that bare photoconductive fibre 230 passes through, and the other end is for making the extra heavy pipe 312 of tight cover light transmitting fiber 210 entering.Bare photoconductive fibre 230 penetrates from extra heavy pipe 312 1 ends of metal sleeve 310, is passed by tubule 311 1 ends, and the tight cover light transmitting fiber 210 at rear portion is arranged in the extra heavy pipe 312 of metal sleeve 310.Gold-plated metalized will be done in advance in bare photoconductive fibre 230 surfaces, uses brazing metal 320 that the bare photoconductive fibre 230 of surface gold-plating is welded together with metal sleeve 310 hermetically in the port of the tubule 311 of metal sleeve 310 then.The extra heavy pipe 312 of metal sleeve 310 inwardly is filled with fixing glue 330 along its inside pipe wall, makes strong bond between tight cover light transmitting fiber 210 and the metal sleeve 310.Extra heavy pipe 312 at metal sleeve 310 has side opening 313 near the position with tubule 311 junctions, air when effect is filling glue in the vent pipe and the situation of observing the glue filling.The coupled structure 340 that is used for optically-coupled is then processed or be made into to the end of bare photoconductive fibre 230; Coupled structure 340 can be the light transmitting fiber self on plane or inclined-plane for end face; Also can be light transmitting fiber lens, collimating apparatus, optical lens, each class component such as fixed support and their combination.The other end of tight cover light transmitting fiber 210 then is equipped with standard connection adaptor 350, and like standard adapter types such as SC, LC, MU, ST, the object that is used for having with other corresponding adapter port is connected.
Shown in Figure 4 then is that this tight metallization optical fiber unit 300 typical case in body 120 who overlaps light transmitting fiber 210 installs and fixes situation.Wherein photoelectric functional unit 101 is positioned in a certain installation substrate 102 of body 120, and tail pipe 140 inside surfaces of body 120 are gold-plated.Metallization optical fiber unit 300 penetrates body 120 from tail pipe 140; After realizing being coupled and aligned of coupled structure 340 and photoelectric functional unit 101; Coupled structure 340 can be fixed in installs in the substrate 102; Fixed form can be multiple modes such as gluing, laser bonding, scolder welding, and the metal sleeve 310 of the optical fiber unit 300 that metallizes then uses brazing metals 150 to weld together hermetically with the tail pipe of body 120 140; Perhaps, the fixing of coupled structure 340 can be directly through using the airtight welding of brazing metal 150 to realize simultaneously between metal sleeve 310 and the tail pipe 140.
To the metallization of basic light transmitting fiber 200 and welded and installed thereof are fixing can be referring to above-mentioned Fig. 3, Fig. 4 situation to tight cover light transmitting fiber 210, its key distinction is, will tightly overlap light transmitting fiber 210 and replace to basic light transmitting fiber 200.Remove in addition, this moment, the other end of basic light transmitting fiber 200 generally no longer was equipped with standard connection adaptor 350, was connected but will carry out direct melting welding by another part light transmitting fiber that uses the client to be used for existing with client's product.The purpose of this type use occasion is in order to reduce light transmitting fiber and to interconnect shared spatial volume.Because the light transmitting fiber under such occasion only is present in product inside, be not used in outside use, therefore can use basic light transmitting fiber 200, and need not it is added protection jacket layer 204.
Above-mentioned fibre-optic metallization and the technology that installs and fixes on body thereof are in industry generally used, and characteristics are that impermeability is good, and shortcoming is structure, complex process, and cost is high, length consuming time.Along with the fast development that optical communication technique is used, increasingly high to the cost requirement of optoelectronic device, the fibre-optic cost problem that metallizes is also more and more outstanding.Remove in addition; Adopt the fixing technology of metallization light transmitting fiber and brazing metal welded and installed; The thermal stress of metal and scolder welding thereof might cause the position of coupled structure 340 to be moved under variation of ambient temperature, also possibly cause very fragile bare photoconductive fibre 230 places of structure to be ruptured under the extreme case.Require in the increasingly high new product in some couplings, this problem has begun to manifest outstanding, and existing this fibre-optic technology that installs and fixes has been difficult to continue to be suitable for.
The utility model content
In view of this, the fundamental purpose of the utility model is that a kind of structure is provided and technology is simple, cost is low and the fibre-optic mount fixing structure of service-strong optoelectronic device.
For achieving the above object, the utility model provides a kind of fibre-optic mount fixing structure of optoelectronic device, and this optoelectronic device includes shell; Be provided with substrate in this shell; The photoelectric functional unit is installed in this substrate, and said shell is provided with outwards outstanding tail pipe, it is characterized in that; Said light transmitting fiber one end is provided with coupled structure; This light transmitting fiber includes fibre core and the covering that is coated on fibre core that comes from the fibre core same material, is coated with coat away from the covering of this coupled structure one end, and this light transmitting fiber forms the bare photoconductive fibre of being made up of fibre core and covering near an end of this coupled structure; This light transmitting fiber forms the basic light transmitting fiber of being made up of fibre core, covering and coat away from the other end of this coupled structure; This light transmitting fiber is placed through said tail pipe, and this coupled structure is positioned at the inner and corresponding said photoelectric functional unit of said shell, and is fixing through the glass solder welding between this fibre-optic bare photoconductive fibre and the said tail pipe.
Said bare photoconductive fibre is coated with coat near the segment section of said coupled structure, and this section forms basic light transmitting fiber, and is fixing through said glass solder welding between bare photoconductive fibre that exposes outside this this light transmitting fiber of segment base and said tail pipe.
The outside tail pipe place of said shell is provided with joint sleeve; This joint sleeve one end is sheathed on said tail pipe; The other end is installed with a said fibre-optic basically end that is positioned at outside the said tail pipe, is injected with filling glue between said joint sleeve and the said tail pipe and between said joint sleeve and the basic light transmitting fiber that is installed with.
Said joint sleeve is provided with side opening.
The inside of said tail pipe is provided with a stepped hole; This stepped hole is managed in a side of said shell forms this tail pipe thin; This stepped hole is the thick interior pipe of this tail pipe of side formation of said shell dorsad; Be formed in said stepped hole and said tail pipe thin and place said glass solder on the step between the pipe; Should hold said bare photoconductive fibre in thin interior the pipe, hold a said fibre-optic basically end in the pipe in this is thick, be injected with filling glue between this slightly interior pipe and basic light transmitting fiber that wherein holds and the said glass solder away from said coupled structure.
Said thick interior pipe is provided with side opening.
Preferably, be coated with the protection jacket layer away from the said basic light transmitting fiber of said coupled structure, this basic light transmitting fiber and this protection jacket layer form the jacket layer light transmitting fiber, and this jacket layer light transmitting fiber is provided with the standard connection adaptor away from an end of said coupled structure.
The outside tail pipe place of said shell is provided with joint sleeve; This joint sleeve one end is sheathed on said tail pipe; The other end is installed with the fibre-optic end of the said jacket layer that is positioned at outside the said tail pipe, is injected with filling glue between said joint sleeve and the said tail pipe and between said joint sleeve and the jacket layer light transmitting fiber that is installed with.
Said joint sleeve is provided with side opening.
The inside of said tail pipe is provided with a stepped hole; This stepped hole is managed in a side of said shell forms this tail pipe thin; This stepped hole is the thick interior pipe of this tail pipe of side formation of said shell dorsad; Be formed in said stepped hole and said tail pipe thin and place said glass solder on the step between the pipe; Should hold said bare photoconductive fibre in thin interior the pipe, hold the fibre-optic end of said jacket layer in the pipe in this is thick, be injected with filling glue between this slightly interior pipe and jacket layer light transmitting fiber that wherein holds and the said glass solder.
Said thick interior pipe is provided with side opening.
Said tail pipe is the kovar alloy material.
Here, for industry quartz substrate light transmitting fiber commonly used, the bare photoconductive fibre in the utility model is to have removed the bare photoconductive fibre 230 of coat 203 with protection jacket layer 204 layers such as outer protection such as grade, and its normal diameter is generally 125 microns; Add the basic light transmitting fiber 200 that coat 203 constitutes by this bare photoconductive fibre 230, its normal diameter is generally 250 microns; Outside this basic light transmitting fiber 200, add the jacket layer light transmitting fiber that protection jacket layer 204 forms, promptly tightly overlap light transmitting fiber 210 or pine cover light transmitting fiber 220, its external diameter standard commonly used is 0.9 millimeter.What related glass solder was special in the utility model is low temperature glass solder, and it is mainly the potpourri with glassy state characteristic that is formed with certain proportioning by multiple metal and nonmetal oxide, and softening point is generally between 280oC to 400oC; Its Main Ingredients and Appearance is a massicot, and through adding other composition and regulating the low temperature glass solder material that proportioning obtains different physical indexs, its related physical index comprises softening point, viscosity, thermal expansivity, surface wettability etc.As required, low temperature glass solder can be made into the shape of various different geometric shapes in advance, is called the preform glass solder, glass solder circle 160 as shown in Figure 6.Low temperature glass solder with quartzy or other possibly be used for can forming good airtight welding between the bare photoconductive fibre of fibre-optic glass material and contact; Simultaneously kovar alloy also has thermal expansivity low, that be close with glass material, so low temperature glass solder can realize that also good airtight welding contacts with can cutting down between the tail pipe that material processes.
The fibre-optic mount fixing structure of the optoelectronic device that the utility model proposes; Need not adopt the technology that installs and fixes of fibre-optic metallization and brazing metal thereof welding; Its structure and technology are simple; Therefore consuming time few, cost is low, and having overcome thermal stress factor that this existing fibre-optic metallization and brazing metal welded and installed technique for fixing thereof brought simultaneously maybe be to the be coupled influence of reliability of optoelectronic device.For industry quartz substrate light transmitting fiber commonly used; In the fibre-optic mount fixing structure of the utility model optoelectronic device; Owing to use very little and mutual approaching bare photoconductive fibre and the low temperature glass solder of thermal expansivity; And with the welded structure that can cut down the material tail pipe; Therefore the impermeability of this mount fixing structure will be guaranteed under the variation of environment temperature, can realize and existing fibre-optic metallization and the identical airtight level of brazing metal welded and installed technique for fixing thereof, and possess the better reliability like the influence of adverse environmental factors such as anti-humidity.Simultaneously, under the fibre-optic mount fixing structure of the optoelectronic device that the utility model proposes, light transmitting fiber will possess various enough mechanical strength properties and protective capability equally, therefore can be applicable to the use occasion of various optoelectronic devices.
Description of drawings
Fig. 1 is the synoptic diagram of the basic mount fixing structure of light transmitting fiber in optoelectronic device;
Fig. 2 a is the synoptic diagram of the industry fibre-optic basically cross-sectional structure of quartz substrate commonly used;
Fig. 2 b is the synoptic diagram that the industry basic light transmitting fiber of quartz substrate commonly used adds the cross-sectional structure of protection jacket layer;
Fig. 2 c is the synoptic diagram of the cross-sectional structure of industry its interior bare photoconductive fibre of the basic light transmitting fiber of quartz substrate commonly used;
Fig. 3 is that available technology adopting is tightly overlapped the synoptic diagram that light transmitting fiber is processed the typical structure of metallization optical fiber unit;
Fig. 4 is the synoptic diagram of the typical mount fixing structure of available technology adopting metallization tight cover optical fiber unit in optoelectronic device;
Fig. 5 a is the synoptic diagram of a kind of non-metallic optical fiber unit structure used in the utility model;
Fig. 5 b is the synoptic diagram of the another kind of non-metallic optical fiber unit structure used in the utility model;
Fig. 6 is the synoptic diagram of the 3D shape of a kind of preform low temperature glass solder material of using in the utility model;
Fig. 7 a is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of a kind of concrete structure of embodiment one;
Fig. 7 b is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of the another kind of concrete structure of embodiment one;
Fig. 8 a is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of the supplementing structure of concrete structure shown in Fig. 7 a of embodiment one;
Fig. 8 b is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of the supplementing structure of concrete structure shown in Fig. 7 b of embodiment one;
Fig. 9 a is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of a kind of concrete structure of embodiment two;
Fig. 9 b is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of the simplified structure of concrete structure shown in Fig. 9 a of embodiment two;
Figure 10 is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of a kind of variations of its foregoing description.
Embodiment
For ease of structure of the utility model and the effect that reaches are had further understanding, combine accompanying drawing to develop simultaneously the preferred embodiment detailed description as follows at present.
For industry quartz substrate light transmitting fiber commonly used; The utility model adopts the optical fiber unit 500 shown in Fig. 5 a; Wherein the part that links to each other with coupled structure 340 of light transmitting fiber is a bare photoconductive fibre 230; The part that links to each other with standard connection adaptor 350 is the jacket layer light transmitting fiber, promptly tightly overlaps light transmitting fiber 210 or pine cover light transmitting fiber 220.It is compared with the employed metallization optical fiber unit 300 of prior art, for having removed the non-metallic optical fiber unit that comprises metal sleeve 310, comprises that gold-plated metalized is no longer done on the surface of bare photoconductive fibre 230.Perhaps; The utility model adopts the non-metallic optical fiber unit 600 shown in Fig. 5 b; It is compared with above-mentioned non-metallic optical fiber unit 500; Difference is that the part that light transmitting fiber links to each other with coupled structure 340 is the basic light transmitting fiber 200 that remains with coat 203, only at the jacket layer light transmitting fiber of this basic light transmitting fiber 200 with opposite side, promptly tightly overlaps between light transmitting fiber 210 or the pine cover light transmitting fiber 220 and exposes one section bare photoconductive fibre 230.
Shown in Fig. 7 a, Fig. 7 b, it is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of embodiment one, and it comprises above-mentioned non-metallic optical fiber unit 500/600.Wherein, shown in Fig. 7 a, produce a stepped hole 141A, the preform low temperature glass solder 160 of the corresponding size of tubular shape as shown in Figure 6 is positioned in this stepped hole 141A at the mouth of pipe place of the tail pipe 140A of body 120; Perhaps, shown in Fig. 7 b, process the chamfering 141B that dehisces at the mouth of pipe place of the tail pipe 140B of body 120, the preform low temperature glass solder 160 of the corresponding size of tubular shape as shown in Figure 6 is positioned over this chamfering dehisces on the 141B.Non-metallic optical fiber unit 500/600 passes tail pipe 140A/140B and low temperature glass solder circle 160, and makes the part of the bare photoconductive fibre 230 of non-metallic optical fiber unit 500/600 be positioned among the low temperature glass solder circle 160 and certain position, front and back.When the coupling of the coupled structure 340 of accomplishing non-metallic optical fiber unit 500/600 and/or fixing after; 140A/140B heats to tail pipe; As use the ERW type of heating commonly used under the prior art, or induction heating mode, make low temperature glass solder 160 fusings; The glass solder of fusing enters into the space between bare photoconductive fibre 230 and tail pipe 140A/140B and fills, and after the cooled and solidified bare photoconductive fibre 230 is weldingly fixed on tail pipe 140A/140B hermetically.
Wherein, Be made as the situation of stepped hole 141A for the mouth of pipe place of the tail pipe 140A shown in Fig. 7 a; To being placed on the preform low temperature glass solder 160 in the stepped hole 141A; Both can take tail pipe 140A is the form of horizontal positioned, also can take the form (tail pipe vertically place vial body 120 with tail pipe 140A up mode place) of tail pipe 140A for vertically placing, and makes its heat fused; It wherein is the situation of horizontal positioned for tail pipe 140A; Under the design of the internal diameter of suitable tail pipe 140A; The low temperature glass solder 160 of fusing can form required airtight welding in all spaces of still filling equably under the effect of capillary effect between bare photoconductive fibre 230 and the tail pipe 140A inwall.Be processed into the dehisce situation of 141B of chamfering for the mouth of pipe place of the tail pipe 140B shown in Fig. 7 b, because of need placing preform low temperature glass solder 160 as shown in Figure 6 at the chamfering 141B place of dehiscing, so tail pipe 140B need take the form of placing into vertically.
Accomplish between bare photoconductive fibre 230 and the tail pipe 140A/140B of non-metallic optical fiber unit 500/600 with the welding of low temperature glass solder 160 fixing after; One joint sleeve 170 is connected to tail pipe 140A/140B through the tight cover of non-metallic optical fiber unit 500/600 outside tail pipe 140A/140B or the loose light transmitting fiber coupling of overlapping, and pine cover light transmitting fiber coupling was connected the other end of joint sleeve 170 with should tightly overlapping perhaps.Look concrete application need, this joint sleeve 170 possibly be enclosed within on the tight cover light transmitting fiber 210 or pine cover light transmitting fiber 220 of non-metallic optical fiber unit 500/600 in advance; Corresponding with it, the standard connection adaptor 350 of non-metallic optical fiber unit 500/600 possibly also possibly be assemblied on its tight cover light transmitting fiber 210 or the pine cover light transmitting fiber 220 in advance afterwards.
Then; Between joint sleeve 170 and tail pipe 140A/140B; And inject between the tight cover of joint sleeve 170 and non-metallic optical fiber unit 500/600 or the fibre-optic coupling connecting portion of pine cover and fill glue 180, accomplish their each other fixing.
For the foregoing description, also can on joint sleeve 170, produce side opening 173, shown in Fig. 8 a, Fig. 8 b, inject when conveniently installing and fixing and fill glue 180.
Shown in Fig. 9 a, it is the fibre-optic mount fixing structure of the utility model optoelectronic device, the synoptic diagram of embodiment two, and it comprises aforesaid non-metallic optical fiber unit 500/600.Wherein, at the internal production of the tail pipe 140C of body 120 one stepped hole 141C is arranged, this stepped hole is tube portion in a side of body 120 forms tail pipe 140C thin, and a side of body 120 forms the thick interior tube portion of tail pipe 140C dorsad; The main finger-type of step is formed in the step between the pipe in stepped hole 141C and tail pipe 140C thin; Preform low temperature glass solder 160 with the corresponding size of placing tubular shape as shown in Figure 6; And can not have step just like the step shown in the figure between the thick interior pipe of stepped hole 141C and tail pipe 140C yet; Stepped hole 141C effective tight cover light transmitting fiber 210 or pine cover light transmitting fiber 220 in the tail pipe 140C that forms of body 120 1 sides thick dorsad wherein to hold non-metallic optical fiber unit 500/600.Low temperature glass solder circle 160, pipe in the tail pipe 140C shown in the figure thick is managed on the step that joins in being placed to stepped hole 141C and tail pipe 140C thin; Non-metallic optical fiber unit 500/600 passes tail pipe 140C and low temperature glass solder circle 160, and makes the part of the bare photoconductive fibre 230 of non-metallic optical fiber unit 500/600 be positioned among the low temperature glass solder circle 160 and certain position, front and back.When the coupling of the coupled structure 340 of accomplishing non-metallic optical fiber unit 500/600 and/or fixing after; 140C heats to tail pipe; Make low temperature glass solder 160 fusings; The glass solder of fusing enters into space and the filling between pipe in bare photoconductive fibre 230 and tail pipe 140C thin, after the cooled and solidified bare photoconductive fibre 230 is weldingly fixed on tail pipe 140C hermetically.
The embodiment situation that is made as stepped hole 141A with the mouth of pipe place of aforementioned tail pipe 140A shown in Fig. 7 a, Fig. 8 a is identical; The situation that stepped hole 141C is arranged for the internal production of tail pipe 140C under this embodiment; To being placed on the thin interior preform low temperature glass solder 160 of managing the step place that joins of this stepped hole 141C and tail pipe 140C; It is the form of horizontal positioned that tail pipe 140C both can take tail pipe; Also can take the form of tail pipe 140C, make the low temperature glass solder heat fused that is positioned at this place, form the airtight welding between bare photoconductive fibre 230 and the thin inner tube wall of tail pipe 140C for vertically placing.
Wherein, stepped hole 141C dorsad in the tail pipe 140C that forms of body 120 1 sides thick pipe be provided with side opening 143.After the welding with low temperature glass solder 160 in completion bare photoconductive fibre 230 and tail pipe 140C are thin between pipe is fixing; At tight cover that is arranged in the thick pipe of tail pipe 140C or pine cover light transmitting fiber; And between this part tail pipe and the low temperature glass solder 160; Glue 180 is filled in mouth of pipe injection through this side opening 143 on thick interior pipe of tail pipe 140C or tail pipe 140C, and the perhaps loose cover light transmitting fiber 220 of tight cover light transmitting fiber 210 of non-metallic optical fiber unit 500/600 is fixed in tail pipe 140C.
Shown in Fig. 9 b, as a kind of possible simplified structure of Fig. 9 a illustrated embodiment, the side opening 143 of above-mentioned tail pipe 140C can be cancelled, and forms the tail pipe 140D of no side opening.The tight cover light transmitting fiber 210 of non-metallic optical fiber unit 500/600 or pine are overlapped light transmitting fiber 220 fixing in this tail pipe 140D, and the mouth of pipe that only passes through tail pipe 140D injects fills glue 180 realizations.
The situation in aforesaid the utility model described in the employed non-metallic optical fiber unit 500/600 of fibre-optic mount fixing structure and above-mentioned each embodiment; Special; In employed non-metallic optical fiber unit 500/600; Tight cover light transmitting fiber 210 that links to each other with standard connection adaptor 350 or pine cover light transmitting fiber 220 also can be basic light transmitting fibers 200; This part basic light transmitting fiber 200 generally no longer assembled with standard connection adaptor 350 and was connected this moment, was connected but carry out direct melting welding with another part light transmitting fiber.Wherein special; For coupled structure 340 sizes of non-metallic optical fiber unit 500/600 situation greater than the tail pipe 140A/140B/140C/140D internal diameter of body 120; The light transmitting fiber part that the outside in order to body 120 of non-metallic optical fiber unit 500/600 is connected at first need adopt the form of this basic light transmitting fiber 200, and the light transmitting fiber of non-metallic optical fiber unit 500/600 can be passed through tail pipe 140A/140B/140C/140D from the inside of body 120; After this,, can on this basic light transmitting fiber 200, put protection jacket layer 204, form pine cover light transmitting fiber 220 according to the needs of using, and the assembling of the standard of completion connection adaptor 350.
Except that above explanation, special, the fibre-optic mount fixing structure of the optoelectronic device that the utility model proposed, its tail pipe 140A/140B/140C/140D, joint sleeve 170 can be the tubular structure of circle, rectangle or other shape of cross section.The fibre-optic mount fixing structure of the optoelectronic device that the utility model proposed; Comprise a fibre-optic situation that installs and fixes; Also comprise the many fibre-optic situations that install and fix; Its installing and fixing method is identical with fibre-optic installing and fixing method among above-mentioned each embodiment, and embodiment is consistent.
The fibre-optic mount fixing structure of the optoelectronic device that the utility model proposed; The body that its shell comprised and pipe lid are a relative notion; Promptly for arbitrary practical implementation structure; Pipe lid (perhaps possibly the be called pipe cap) part that it comprised also can become the body portion of the fibre-optic mount fixing structure in the utility model, and the body that it comprised (perhaps possibly be called base) part also can become the pipe cover of the fibre-optic mount fixing structure in the utility model.Certain concrete structure situation shown in figure 10, that it exists for the fibre-optic mount fixing structure according to the optoelectronic device that the utility model proposed; It comprises a pipe cap 420 and a base 430; Wherein pipe cap 420 comprises a tail pipe 440; Joint sleeve 470 is arranged outside the tail pipe 440; The mouth of pipe place of tail pipe 440 is manufactured with a stepped hole 441, and the bare photoconductive fibre 230 that the low temperature glass solder of placing in it 160 will pass the non-metallic optical fiber unit 500/600 of tail pipe 440 is weldingly fixed on tail pipe 440 hermetically, at joint sleeve 470 and tail pipe 440; And between the tight cover of joint sleeve 470 and non-metallic optical fiber unit 500/600 or the fibre-optic coupling connecting portion of pine cover the glue 180 of filling is arranged, form their each other fixing.Obviously this situation belongs to the fibre-optic mount fixing structure institute restricted portion of optoelectronic device that the utility model proposes.
The above is merely the preferred embodiment of the utility model, is not the protection domain that is used to limit the utility model.
Claims (12)
1. the fibre-optic mount fixing structure of an optoelectronic device; This optoelectronic device includes shell, is provided with substrate in this shell, and the photoelectric functional unit is installed in this substrate; Said shell is provided with outwards outstanding tail pipe; It is characterized in that said light transmitting fiber one end is provided with coupled structure, this light transmitting fiber includes fibre core and the covering that is coated on fibre core that comes from the fibre core same material; Covering away from this coupled structure one end is coated with coat; This light transmitting fiber forms the bare photoconductive fibre of being made up of fibre core and covering near an end of this coupled structure, and this light transmitting fiber forms the basic light transmitting fiber of being made up of fibre core, covering and coat away from the other end of this coupled structure, and this light transmitting fiber is placed through said tail pipe; This coupled structure is positioned at the inner and corresponding said photoelectric functional unit of said shell, and is fixing through the glass solder welding between this fibre-optic bare photoconductive fibre and the said tail pipe.
2. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 1; It is characterized in that; Said bare photoconductive fibre is coated with coat near the segment section of said coupled structure; This section forms basic light transmitting fiber, and is fixing through said glass solder welding between bare photoconductive fibre that exposes outside this this light transmitting fiber of segment base and said tail pipe.
3. according to claim 1 or claim 2 the fibre-optic mount fixing structure of optoelectronic device; It is characterized in that; The outside tail pipe place of said shell is provided with joint sleeve; This joint sleeve one end is sheathed on said tail pipe, and the other end is installed with a said fibre-optic basically end that is positioned at outside the said tail pipe, is injected with filling glue between said joint sleeve and the said tail pipe and between said joint sleeve and the basic light transmitting fiber that is installed with.
4. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 3 is characterized in that, said joint sleeve is provided with side opening.
5. according to claim 1 or claim 2 the fibre-optic mount fixing structure of optoelectronic device; It is characterized in that; The inside of said tail pipe is provided with a stepped hole, and this stepped hole is pipe in a side of said shell forms this tail pipe thin, and this stepped hole side of said shell dorsad forms in this tail pipe thick and manages; Be formed in said stepped hole and said tail pipe thin and place said glass solder on the step between the pipe; Should hold said bare photoconductive fibre in thin interior the pipe, hold a said fibre-optic basically end in the pipe in this is thick, be injected with filling glue between this slightly interior pipe and basic light transmitting fiber that wherein holds and the said glass solder away from said coupled structure.
6. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 5 is characterized in that, said thick interior pipe is provided with side opening.
7. according to claim 1 or claim 2 the fibre-optic mount fixing structure of optoelectronic device; It is characterized in that; Said basic light transmitting fiber away from said coupled structure is coated with the protection jacket layer; This basic light transmitting fiber and this protection jacket layer form the jacket layer light transmitting fiber, and this jacket layer light transmitting fiber is provided with the standard connection adaptor away from an end of said coupled structure.
8. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 7; It is characterized in that; The outside tail pipe place of said shell is provided with joint sleeve; This joint sleeve one end is sheathed on said tail pipe, and the other end is installed with the fibre-optic end of the said jacket layer that is positioned at outside the said tail pipe, is injected with filling glue between said joint sleeve and the said tail pipe and between said joint sleeve and the jacket layer light transmitting fiber that is installed with.
9. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 8 is characterized in that, said joint sleeve is provided with side opening.
10. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 7; It is characterized in that; The inside of said tail pipe is provided with a stepped hole, and this stepped hole is pipe in a side of said shell forms this tail pipe thin, and this stepped hole side of said shell dorsad forms in this tail pipe thick and manages; Be formed in said stepped hole and said tail pipe thin and place said glass solder on the step between the pipe; Should hold said bare photoconductive fibre in thin interior the pipe, hold the fibre-optic end of said jacket layer in the pipe in this is thick, be injected with filling glue between this slightly interior pipe and jacket layer light transmitting fiber that wherein holds and the said glass solder.
11. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 10 is characterized in that, said thick interior pipe is provided with side opening.
12. the fibre-optic mount fixing structure of optoelectronic device as claimed in claim 1 is characterized in that, said tail pipe is the kovar alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205623706U CN202421553U (en) | 2011-12-29 | 2011-12-29 | Assembly fixing structure for light-guide fiber of optoelectronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205623706U CN202421553U (en) | 2011-12-29 | 2011-12-29 | Assembly fixing structure for light-guide fiber of optoelectronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202421553U true CN202421553U (en) | 2012-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205623706U Expired - Lifetime CN202421553U (en) | 2011-12-29 | 2011-12-29 | Assembly fixing structure for light-guide fiber of optoelectronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202421553U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102436045A (en) * | 2011-12-29 | 2012-05-02 | 武汉电信器件有限公司 | Installation and fixation structure of light-guide fiber of photoelectronic device |
| CN104678517A (en) * | 2015-03-02 | 2015-06-03 | 武汉电信器件有限公司 | Integrated semiconductor optical device |
-
2011
- 2011-12-29 CN CN2011205623706U patent/CN202421553U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102436045A (en) * | 2011-12-29 | 2012-05-02 | 武汉电信器件有限公司 | Installation and fixation structure of light-guide fiber of photoelectronic device |
| WO2013097449A1 (en) * | 2011-12-29 | 2013-07-04 | 武汉电信器件有限公司 | Mounting and fixing structure for optical fibre of photoelectron device |
| CN104678517A (en) * | 2015-03-02 | 2015-06-03 | 武汉电信器件有限公司 | Integrated semiconductor optical device |
| CN104678517B (en) * | 2015-03-02 | 2016-09-28 | 武汉电信器件有限公司 | A kind of integrated semiconductor optical device |
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Granted publication date: 20120905 |