CN202394972U - Schottky rectifier bridge - Google Patents
Schottky rectifier bridge Download PDFInfo
- Publication number
- CN202394972U CN202394972U CN2011205412669U CN201120541266U CN202394972U CN 202394972 U CN202394972 U CN 202394972U CN 2011205412669 U CN2011205412669 U CN 2011205412669U CN 201120541266 U CN201120541266 U CN 201120541266U CN 202394972 U CN202394972 U CN 202394972U
- Authority
- CN
- China
- Prior art keywords
- schottky
- rectifier bridge
- utility
- material sheet
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model belongs to the field of electronic discrete devices, and in particular relates to a rectifier bridge adopting Schottky core grains. The Schottky rectifier bridge comprises a first frame material sheet and a second fame material sheet which are symmetrically arranged. The Schottky rectifier bridge is characterized by further comprising Schottky core grains connected between the first material sheet and the second fame material sheet, and a packaging main for protecting the Schottky core grains. The utility model provides the Schottky rectifier bridge adopting the Schottky core grains. The Schottky rectifier bridge has the advantages of short reverse recovery time, good performance and better reliability.
Description
Technical field
The utility model belongs to electronics discrete device field, particularly a kind of rectifier bridge that adopts Schottky core grain.
Background technology
The frequency of utilization height very of Switching Power Supply in our household electrical appliance used in everyday, and rectifier bridge is one of requisite electronic devices and components in the Switching Power Supply.Rising steadily of global energy price makes all trades and professions have to think better of problem of energy saving.In various power-economizing methods, the efficient that improves Switching Power Supply is important means.
Along with switching frequency is increasingly high, switching loss has been very important factor, and common rectifier bridge reaches more than the 1000ns reverse recovery time, can not satisfy the needs of high efficiency switch power supply.And be the charge and discharge time of Schottky barrier electric capacity the reverse recovery time of Schottky, is different from the reverse recovery time of PN junction fully.Because the QRR of Schottky is considerably less, so switching speed is very fast, switching loss is also especially little, is particularly suitable for frequency applications.
Summary of the invention
To above-mentioned technical problem, the utility model provides a kind of Schottky rectifier bridge that adopts Schottky core grain, the utlity model has weak point reverse recovery time, and performance is good, the advantage of better reliability.
The utility model is realized through following technical scheme:
The Schottky rectifier bridge, it comprises the symmetrically arranged first framework tablet and the second framework tablet, it is characterized in that: also comprise the Schottky core grain that is connected between the first framework tablet and the second framework tablet, and the encapsulation main body that Schottky core grain is protected.
The material of described encapsulation main body is an epoxy-plastic packaging material.
In sum; The utility model has been replaced traditional general homogeneous tube core and switching tube tube core through utilization Schottky core grain; It is little that the rectifier bridge of employing Schottky core grain has reverse recovery time; And the forward voltage values of Schottky rectifier bridge and reverse voltage value are all smaller, so that the described Schottky rectifier bridge of the utility model is compared with traditional rectifier bridge performance is better, and better reliability.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the partial sectional view of the utility model;
Among the figure, 1 is the first framework tablet, and 2 is encapsulation main body, and 3 is the second framework tablet, and 4 is Schottky core grain.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is further specified.
Schottky rectifier bridge as depicted in figs. 1 and 2; It comprises the symmetrically arranged first framework tablet 1 and the second framework tablet 2; Also comprise the Schottky core grain that is connected between the first framework tablet 1 and the second framework tablet 2, and the encapsulation main body 2 that Schottky core grain is protected.
The material of described encapsulation main body 2 is an epoxy-plastic packaging material.
The production technology of the utility model is following: earlier the second framework tablet is positioned in the welding boat, puts point gum machine point glue then; The prewelding screen tray branch of Schottky core grain with the aluminum cure process is positioned in the prewelding boat to (the P face is turned into same direction all) well; Loose and go up corresponding weld tabs, be put into and carry out prewelding in the continuous tunnel furnace; The Schottky core grain (the prewelding face is presented on same direction fully) that prewelding is good is transferred to accomplish on the second good framework tablet of a glue with the suction pen and is shelved; The patrix that then will weld boat is overlapping with counterdie carefully, and horizontal ends is put, and waits for the stove welding; Carry out compression molding after welding is good; At last the pipe of forming is electroplated the finished product that forms the Schottky rectifier bridge.
In sum; The utility model has been replaced traditional general homogeneous tube core and switching tube tube core through utilization Schottky core grain; It is little that the rectifier bridge of employing Schottky core grain has reverse recovery time; And the forward voltage values of Schottky rectifier bridge and reverse voltage value are all smaller, so that the described Schottky rectifier bridge of the utility model is compared with traditional rectifier bridge performance is better, and better reliability.
Claims (2)
1. Schottky rectifier bridge; It comprises the symmetrically arranged first framework tablet and the second framework tablet; It is characterized in that: also comprise the Schottky core grain that is connected between the first framework tablet and the second framework tablet, and the encapsulation main body that Schottky core grain is protected.
2. Schottky rectifier bridge according to claim 1 is characterized in that: the material of described encapsulation main body is an epoxy-plastic packaging material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205412669U CN202394972U (en) | 2011-12-22 | 2011-12-22 | Schottky rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205412669U CN202394972U (en) | 2011-12-22 | 2011-12-22 | Schottky rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202394972U true CN202394972U (en) | 2012-08-22 |
Family
ID=46669877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205412669U Expired - Lifetime CN202394972U (en) | 2011-12-22 | 2011-12-22 | Schottky rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202394972U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108109983A (en) * | 2017-12-14 | 2018-06-01 | 常州星海电子股份有限公司 | A kind of automobile specified rectifier diode structure |
-
2011
- 2011-12-22 CN CN2011205412669U patent/CN202394972U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108109983A (en) * | 2017-12-14 | 2018-06-01 | 常州星海电子股份有限公司 | A kind of automobile specified rectifier diode structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161227 Address after: 1, Tianmu Lake Road, Xinbei District, Jiangsu, Changzhou Patentee after: Changzhou Star Sea Electronics Co., Ltd. Address before: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Patentee before: Changzhou Star Sea Electronics Co., Ltd. Patentee before: Changzhou Star Sea Technolgy Co.,Ltd. |
|
| CP03 | Change of name, title or address |
Address after: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Patentee after: Changzhou Xinghai Electronic Limited by Share Ltd Address before: 1, Tianmu Lake Road, Xinbei District, Jiangsu, Changzhou Patentee before: Changzhou Star Sea Electronics Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120822 |
|
| CX01 | Expiry of patent term |