CN202331316U - Novel internal memory device - Google Patents
Novel internal memory device Download PDFInfo
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- CN202331316U CN202331316U CN2011204605147U CN201120460514U CN202331316U CN 202331316 U CN202331316 U CN 202331316U CN 2011204605147 U CN2011204605147 U CN 2011204605147U CN 201120460514 U CN201120460514 U CN 201120460514U CN 202331316 U CN202331316 U CN 202331316U
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- internal memory
- memory
- connection block
- memory device
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Abstract
The utility model discloses a novel internal memory device which comprises an internal memory connection seat for an internal memory to be inserted and fixed. The novel internal memory device further comprises an elastic part filled in a gap between the internal memory connection seat and the internal memory. An internal memory chip dustproof device is arranged on one side of the internal memory device close to a central processing unit (CPU) fan and composed of a dustproof board and a buckle, wherein a flanging is arranged on the upper side of the dustproof board and clamped at the upper edge of an internal memory chip from top to bottom, the lower side of the dustproof board is attached to the lateral side of an internal memory chip slot, protrusions are arranged at two ends of the dustproof board, fixing holes are arranged on the U-shaped buckle, the protrusions and the fixing holes are integrally buckled, and a vertical clamp groove is arranged on one end portion of the U-shaped buckle and clamped on vertical sides at two ends of the internal memory chip.
Description
Technical field
The utility model belongs to the electric connection structure field, relates to a kind of novel memory device.
Background technology
Computing machine deadlock, blue screen often appear or can't normally start, start after can't get into operating system; The reason that these faults occur is a lot; But major part is a memory failure, comprises that internal memory damages, connects between incompatible, internal memory Connection Block and the internal memory and go wrong.
Internal memory and mainboard are incompatible to be that such problem is found easily on the contrary and solved because internal memory itself determines that with mainboard itself initial stage of installing at computer can detect.
To go wrong be the modal form of memory failure in the daily life and connect between internal memory and the internal memory Connection Block, also is the factor that causes maintenance cost the highest.
The go wrong reason of the following aspects of connection between internal memory and the internal memory Connection Block:
One. the slot of internal memory Connection Block advances ash, causes the golden finger of internal memory and internal memory Connection Block elastic spring to be stained with dust.Have the performance that is electrically connected that can change internal memory and internal memory Connection Block after the dust between elastic spring on the internal memory Connection Block and the golden finger on the internal memory, cause computer to break down.And the internal memory Connection Block advance easily the ash main cause be: on the one hand; Internal memory Connection Block and CPU radiator fan are very approaching; The air flow of CPU Connection Block periphery has been accelerated in the rotation of CPU radiator fan, and along with the increase of rate of air circulation, dust entrained in the air is also more and more serious in internal memory periphery deposition; A large amount of dusts makes between internal memory and the internal memory Connection Block phenomenons such as loose contact or short circuit to occur attached to the junction of internal memory Connection Block and internal memory; In addition on the one hand; The louvre of the perforation upper end at the conductive reed place on the internal memory Connection Block is an opening; As shown in Figure 1, cause dust to be easy to get between memory bank and the internal memory through louvre and perforation, make between internal memory and the internal memory Connection Block phenomenons such as loose contact or short circuit to occur.
Two. internal memory is loosening, after internal memory is loosening, makes loose contact between the stitch of golden finger and internal memory Connection Block of internal memory to be electrically connected the performance reduction, gets muddled when having the process computer data in causing, fault such as cause occurring deadlock, blue screen, restart.
Three. the oxidation of internal memory golden finger; Because the elastic spring of internal memory Connection Block and the surface of internal memory golden finger all are exposed aerial; Can not do sufficient safeguard procedures (such as the spraying protective agent), can only be in its surface gold-plating, but the time has been grown the surface and has still understood slow oxidation; And repeatedly plug back Gold plated Layer also can be scratched, and oxidation also can be quickened.Golden finger or/and elastic spring oxidized after, can have a strong impact on and be electrically connected performance, influence data communication, thereby cause the instability of computer working and unreliable.Especially under the situation of maintenance lack of standardization; The dust of a lot of maintenance personals above hand wiping golden finger commonly used; And sweat is generally arranged on the staff, in the dust of finger on the wiping golden finger, also can sweat be remained on the golden finger, because contain a certain amount of salinity and water in the sweat; Can quicken the oxidizing process of golden finger on the one hand; Ion in the salinity also can change the electrical conductivity between golden finger and the reed on the other hand, causes being electrically connected performance and reduces, and makes the job stability of computing machine reduce greatly.
The utility model content
The existing internal memory that can not effectively solve becomes flexible problem to the utility model in the existing technology in order to solve; Perhaps prior art complicated problems too; The fastening method and apparatus of a kind of simple and effective internal memory has been proposed; This method and apparatus is based on present existing internal memory and internal memory Connection Block structure, and applicability is better.
The concrete technical scheme of the utility model is following:
The utility model is according to following principle design: a kind of novel memory device; Comprise the internal memory Connection Block that is used to peg graft with fixed memory; This memory device also comprises, elastomeric element, said elastomeric element are filled in the space between said internal memory Connection Block and the internal memory; Memory device is provided with the memory bar dust guard near cpu fan one side, and the memory bar dust guard is made up of dust excluding plate and buckle, and the top of dust excluding plate is provided with flange; Flange is stuck on the coboundary of memory bar from the top down, and the bottom of dust excluding plate pastes with the side of memory bar slot mutually, and the two ends of dust excluding plate are provided with convexity; The U-shaped buckle is provided with fixed orifice; Protruding and fixed orifice snaps together, and U-shaped buckle one end is provided with vertical clamping slot, and draw-in groove is stuck on the two ends vertical edges of memory bar.
Described memory device; Wherein, Said internal memory Connection Block comprises memory bank, be positioned at the groove arm of memory bank both sides, be positioned at the button arm at memory bank two ends and hinged and be used for fixing the hook fasteners of internal memory with said button arm; Said elastomeric element is arranged on the inner bottom part of said memory bank, is used to fill the inner bottom part of memory bank and the slit between the internal memory.
Described memory device, wherein, said elastomeric element is connected with the inner bottom part of said memory bank.
The utility model beneficial technical effects is:
1. through memory bank bottom elastic insulated rubber strip is set at the internal memory Connection Block; Under the situation that does not change original internal memory Connection Block and internal storage structure; Make between internal memory and the internal memory Connection Block impulsive force when existing an elastic stress, this elastic stress to offset interior existence vibration, guaranteed the fastness that is connected between internal memory and the internal memory Connection Block; Design ingenious, simple in structure, applied widely.
2. elastic insulated block rubber is set to be interrupted and to be distributed in the memory bank inner bottom part, the problem of effectively having avoided this elastic insulated block rubber in receiving thermal process, to expand and cause internal memory to get loose.
Description of drawings
Fig. 1 is the novel memory device front view of the utility model embodiment 1;
Fig. 2 is the lateral plan of the novel memory device of the utility model embodiment 1;
Fig. 3 is the vertical view of the novel memory device of the utility model embodiment 1;
Fig. 4 is the vertical view of the novel memory device of the utility model embodiment 2;
Fig. 5 is the front view of the novel memory device of the utility model embodiment 2;
Fig. 6 is the front view of the novel memory device of the utility model embodiment 3.
Embodiment
The utility model relates to a kind of novel memory device, and this novel memory device is an improved technology on present existing internal memory Connection Block basis.The ingenious part of the utility model is; Existing normalized internal memory Connection Block and internal storage structure are changed to realize the purpose of fastening internal memory; And for the cost that reaches this purpose is very low, but effect is very good, has very wide market outlook.
Specifically setting forth the utility model below in conjunction with specific embodiment is to solve the problems of the technologies described above the technical scheme that is adopted, and the utility model has proposed a kind of new novel memory device on the basis of original internal memory Connection Block, be specially:
Embodiment 1
Shown in Fig. 1-6, a kind of novel memory device comprises the internal memory Connection Block that is used to peg graft with fixed memory, and this memory device also comprises, elastomeric element, said elastomeric element are filled in the space between said internal memory Connection Block and the internal memory; Memory device is provided with the memory bar dust guard near cpu fan one side, and the memory bar dust guard is made up of dust excluding plate and buckle, and the top of dust excluding plate is provided with flange; Flange is stuck on the coboundary of memory bar from the top down, and the bottom of dust excluding plate pastes with the side of memory bar slot mutually, and the two ends of dust excluding plate are provided with convexity; The U-shaped buckle is provided with fixed orifice; Protruding and fixed orifice snaps together, and U-shaped buckle one end is provided with vertical clamping slot, and draw-in groove is stuck on the two ends vertical edges of memory bar.
A kind of novel memory device 1; The internal memory Connection Block that comprises be used to peg graft internal memory and fixed memory; Said internal memory Connection Block comprises memory bank 11, be positioned at the groove arm 12 of memory bank 11 both sides, be positioned at the button arm 13 at memory bank 11 two ends and the hook fasteners that be used for snapping internal memory 14 hinged with said button arm 13; Said novel memory device 1 also comprises elastomeric element 17, and said elastomeric element 17 is arranged on said memory bank bottom 111 and is connected with said memory bank bottom 111.
Said elastomeric element 17 is the insulation elastic rubber strip; Be tiled in said memory bank bottom 111, said elastomeric element 17 with internal memory 2 surface of contact be the plane, with memory bank bottom 111 joint faces also be the plane; Said elastomeric element 17 is bonding with the connected mode of said memory bank bottom 111; Do not have adhesives with the internal memory surface of contact, after internal memory 2 is pulled out from memory bank 11, can not be pulled out by related said elastomeric element 17 yet.
The width of said insulation elastic rubber strip is identical with the width of said memory bank; Length is identical with the length of memory bank; Thickness is about 3mm, and purpose is that the elastic force of the elastic rubber strip that after buckling hook fasteners, insulate simultaneously is unlikely to excessive for guarantee can also be with the internal memory into memory bank of pegging graft after being provided with the insulation elastic rubber strip; Memory bar is supported on the top, makes the wiring board distortion or the damage of memory bar.
In the process of design insulation elastic rubber strip, the designer should consider distance and the elasticity coefficient of insulation elastic rubber strip between the distortion power that wiring board bore, internal memory and the memory bank of internal memory etc., the thickness of design flexibility electro-insulating rubber bar.
In the foregoing description 1, the insulation elastic rubber strip not only need be under the state of internal memory heating fastening internal memory, also need under the normal temperature state, play the effect of fastening internal memory; And the insulation elastic rubber strip certain thermal expansivity is arranged, when the fastening power between internal memory under the normal temperature state and internal memory Connection Block very strong, under febrile state; Volumetric expansion, more a step increases fastening power between internal memory and the internal memory Connection Block, when volumetric expansion is excessive; Can internal memory jack-up be come; Can make the memory bar distortion, thereby influence the job stability of internal memory, even can damage internal memory.Increase at insulation elastic rubber strip its volume after expanded by heating simultaneously; And the clamping connection of memory bank has limited this elastic insulated rubber strip lateral expansion; So when insulating elastic rubber strip after expanded by heating arrives certain degree; It can arch upward at a certain fragment position place, so also can be memory bar distortion or displacement.For fear of the generation of this phenomenon, the coefficient of thermal expansion of said insulation elastic rubber strip is 0 ~ 20%.
On this embodiment basis; In order to reduce elastomeric element that thermal expansion the brings acting force with the outside jack-up of internal memory, shown in Fig. 4-8, the insulation elastic rubber strip among the embodiment 1 is divided into some little insulation elastic block rubbers 18; Said a plurality of insulation elastic block rubber 18 is interrupted the inner bottom part 111 that is distributed in said memory bank 11; There is the space between the said insulation elastic block rubber 18, under the situation of insulation elastic block rubber, receives the extruding of internal memory and internal memory Connection Block like this in thermal expansion; Its deformation meeting is laterally carried out along being parallel to the memory bank inner bottom part, and thickness does not receive much the influence.
Said insulation elastic block rubber 18 is right cylinder or square body, and more excellent is the employing right cylinder shown in present embodiment, and the upper bottom surface that contacts with internal memory is a circular flat, the groove arm contact of this cylindrical face of cylinder and said memory bank both sides.
Embodiment 3
On the basis of embodiment 2, internal memory is because the jack-up of elastomeric element, upwards ejection hook fasteners; The acting force of internal memory and said hook fasteners is increased, and friction force is also along with increase, so when computing machine is shaken, be not easy to make hook fasteners to unclamp to the both sides of memory bank; And on the other hand, said internal memory and hook fasteners are plastics, and its friction force is still too little; In order to increase friction force, protect internal memory injury-free simultaneously, as shown in Figure 6; With " hooked hand " 141 bottoms of bayonet socket 211 clampings of said internal memory 2 elastomeric pad 19 is set in said hook fasteners 14 and is connected with " hooked hand " 141 of this hook fasteners 14, connected mode is bonding.This elastomeric pad 19 with can obviously increase the friction force between internal memory and the hook fasteners after the bayonet socket 211 of said internal memory 2 contacts, can also protect the bayonet socket 211 of internal memory 2 not damaged simultaneously by hook fasteners.So said novel memory device 1 also comprises this elastomeric pad 19, the shape of the bottom surface that " hooked hand " 141 of the flat shape of said elastomeric pad 19 and said hook fasteners 14 contacts with internal memory is identical, and thickness is 0.5 ~ 1mm.In the time of in internal memory 2 is pegged graft the slot 11 that advances the internal memory Connection Block fully; The front view of the syndeton of internal memory 2 and internal memory Connection Block 1 is as shown in Figure 3; " hooked hand 141 " of the hook fasteners 14 on the internal memory Connection Block and lower end 2111 snappings of the top bayonet socket 211 at internal memory wiring board 21 two ends, said internal memory wiring board 21 lower ends contact with the bottom 111 of said slot 11;
In the present embodiment, elastomeric element and elastomeric pad are set not only increases the friction force between hook fasteners and the internal memory afterwards, makes internal memory avoid getting loose, and also makes between internal memory and the internal memory Connection Block not have the slit, so can effectively solve the loosening problem of internal memory.
Novel memory device related in the foregoing description can be arranged on the common computer motherboard, and the mainboard with this novel memory device also can cooperate with common internal memory, is arranged on the common computing machine.
The those skilled in the art that need to prove this area can also expect other technical scheme easily to the above embodiments; As long as these technical schemes are in the concept of the utility model; The technical scheme that should be equal to this patent belongs to the protection domain of this patent.
Should be understood that, concerning those of ordinary skills, can improve or conversion, and all these improvement and conversion all should belong to the protection domain of the utility model accompanying claims according to above-mentioned explanation.
Claims (3)
1. a novel memory device is characterized in that, comprises the internal memory Connection Block that is used to peg graft with fixed memory, and this memory device also comprises, elastomeric element, said elastomeric element are filled in the space between said internal memory Connection Block and the internal memory; Memory device is provided with the memory bar dust guard near cpu fan one side, and the memory bar dust guard is made up of dust excluding plate and buckle, and the top of dust excluding plate is provided with flange; Flange is stuck on the coboundary of memory bar from the top down, and the bottom of dust excluding plate pastes with the side of memory bar slot mutually, and the two ends of dust excluding plate are provided with convexity; The U-shaped buckle is provided with fixed orifice; Protruding and fixed orifice snaps together, and U-shaped buckle one end is provided with vertical clamping slot, and draw-in groove is stuck on the two ends vertical edges of memory bar.
2. memory device according to claim 1; It is characterized in that; Said internal memory Connection Block comprises memory bank, be positioned at the groove arm of memory bank both sides, be positioned at the button arm at memory bank two ends and hinged and be used for fixing the hook fasteners of internal memory with said button arm; Said elastomeric element is arranged on the inner bottom part of said memory bank, is used to fill the inner bottom part of memory bank and the slit between the internal memory.
3. memory device according to claim 2 is characterized in that, said elastomeric element is connected with the inner bottom part of said memory bank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204605147U CN202331316U (en) | 2011-11-18 | 2011-11-18 | Novel internal memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204605147U CN202331316U (en) | 2011-11-18 | 2011-11-18 | Novel internal memory device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202331316U true CN202331316U (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204605147U Expired - Fee Related CN202331316U (en) | 2011-11-18 | 2011-11-18 | Novel internal memory device |
Country Status (1)
| Country | Link |
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| CN (1) | CN202331316U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762431A (en) * | 2018-08-15 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of device and method for preventing memory from aoxidizing |
| CN109189177A (en) * | 2018-10-12 | 2019-01-11 | 宋健 | A kind of electric automatization control memory bar dustproof construction |
| CN111562822A (en) * | 2020-05-06 | 2020-08-21 | 杭州克赋科技有限公司 | Computer memory bank fixing device based on air thermal expansion |
-
2011
- 2011-11-18 CN CN2011204605147U patent/CN202331316U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762431A (en) * | 2018-08-15 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of device and method for preventing memory from aoxidizing |
| CN108762431B (en) * | 2018-08-15 | 2024-04-19 | 郑州云海信息技术有限公司 | Device and method for preventing memory from oxidation |
| CN109189177A (en) * | 2018-10-12 | 2019-01-11 | 宋健 | A kind of electric automatization control memory bar dustproof construction |
| CN111562822A (en) * | 2020-05-06 | 2020-08-21 | 杭州克赋科技有限公司 | Computer memory bank fixing device based on air thermal expansion |
| CN111562822B (en) * | 2020-05-06 | 2022-08-09 | 湛江华青科技有限公司 | Computer memory bank fixing device based on air thermal expansion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20121118 |