CN202307895U - TFT (Thin film transistor) array substrate and liquid crystal display - Google Patents
TFT (Thin film transistor) array substrate and liquid crystal display Download PDFInfo
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- CN202307895U CN202307895U CN2011204034795U CN201120403479U CN202307895U CN 202307895 U CN202307895 U CN 202307895U CN 2011204034795 U CN2011204034795 U CN 2011204034795U CN 201120403479 U CN201120403479 U CN 201120403479U CN 202307895 U CN202307895 U CN 202307895U
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- conductive adhesive
- metal lead
- array substrate
- line layer
- tft array
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Abstract
The embodiment of the utility model provides a TFT (thin film transistor) array substrate and a liquid crystal display, relates to the manufacturing field of liquid crystal displays and is used for solving the problem of poor binding in a solder pad area caused by metal section difference between a grid layer and a data layer. The TFT array substrate comprises a grid line layer, a first insulating layer, a data line layer, a second insulating layer and a transparent conductive layer; the solder pad area of the TFT array substrate comprises a metal lead in a data line layer and a first conductive binding area connected with the metal lead, as well as a metal lead in the grid line layer; the metal lead in the grid lien layer is connected with a second conductive binding area in the data layer; and the second conductive binding area is not contacted with the metal lead in the data layer and the first conductive binding area. The TFT array substrate is used for manufacture of the liquid crystal display.
Description
Technical field
The utility model relates to the manufacturing field of LCD, relates in particular to a kind of tft array substrate and LCD.
Background technology
At TFT-LCD (Thin Film Transistor-Liquid Crystal Display; The TFT LCD) in the manufacturing process; Tft array substrate need carry out bondingly with integrated circuit or flexible PCB, and drive signal is transferred to the substrate viewing area.
During present TFT-LCD made, owing to reducing of substrate size, the space of outer peripheral areas wiring was more and more littler, gradually adopted grid, data double layer of metal line transmission drive signal then.As shown in Figure 1, the weld pad zone 11 of TFT substrate 10 is provided with: grid line layer metal lead wire 12, grid line layer metal pickup district 13; Data Layer metal lead wire 14 and conductive adhesive district 15.But it is as shown in Figure 2; When tft array substrate 10 and integrated circuit or flexible PCB 20 carry out when bonding; Because grid line layer metal pickup district 13 and conductive adhesive district 15 are positioned at different layers, the difference of its structural thickness makes that formation section easily is poor in the adhesion technique process, causes conducting resinl particle 30 and grid line layer metal pickup district 13 to be prone to produce loose contact; Make drive signal can not be transferred to the substrate viewing area, produce the bad phenomenon of picture.
The utility model content
The embodiment of the utility model provides a kind of tft array substrate and LCD, to solve on the weld pad zone, because of the poor bonding bad problem that causes of the section of grid, data double layer of metal.
For achieving the above object, the embodiment of the utility model adopts following technical scheme:
A kind of tft array substrate is provided, comprises grid line layer, first insulating barrier, data line layer, second insulating barrier and transparency conducting layer successively; The weld pad zone of said tft array substrate comprises data Layer metal lead wire that is positioned at data line layer and the first conductive adhesive district that is connected with said data Layer metal lead wire; And the grid line layer metal lead wire that is positioned at grid line layer; It is characterized in that; The weld pad zone also comprises the second conductive adhesive district that is positioned at data line layer; Said grid line layer metal lead wire is electrically connected with the second conductive adhesive district of said data Layer, and wherein, the said second conductive adhesive district does not contact with the said data Layer metal lead wire and the first conductive adhesive district.
First insulating barrier, second insulating barrier of said grid line layer metal lead wire top are provided with first via hole that exposes said grid line layer metal lead wire;
Said second insulating barrier of top, the said second conductive adhesive district is provided with second via hole that exposes the said second conductive adhesive district;
Said first via hole is connected through said transparency conducting layer with said second via hole.
Said first conductive adhesive district and the said second conductive adhesive district top all is coated with said transparency conducting layer.
Said first conductive adhesive district and the said second conductive adhesive district all have at least a part not cover said transparency conducting layer.
First insulating barrier of said grid line layer metal lead wire top is provided with the via hole that exposes said grid line layer metal lead wire;
The said second conductive adhesive district covers said via hole, is connected with said grid line layer metal lead wire through said via hole.
Provide a kind of LCD to comprise above-described tft array substrate.
Tft array substrate that the utility model embodiment provides and LCD; On substrate weld pad zone; The grid line layer metal lead wire is connected with the second conductive adhesive district; Make the adhesion area-second conductive adhesive district of this grid line layer metal lead wire, be positioned at same one deck with the adhesion area-first conductive adhesive district of data Layer metal lead wire, thereby solved the bonding bad problem that grid, data double layer of metal cause because of the section difference; Thereby make drive signal normal transmission arrive the substrate viewing area, avoid producing the bad phenomenon of picture.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiment of the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The spot area sketch map of the tft array substrate that Fig. 1 provides for prior art;
Fig. 2 is the sectional view of Fig. 1 in the A-A direction;
The spot area sketch map of the tft array substrate that Fig. 3 provides for the utility model embodiment;
Fig. 4 is the sectional view of Fig. 3 in the B-B direction;
Fig. 5 is the sectional view of Fig. 3 in the C-C direction;
The spot area sketch map of the tft array substrate that Fig. 6 provides for another embodiment of the utility model;
Fig. 7 is the sectional view of Fig. 6 in the D-D direction.
Symbol description
10, tft array substrate; 11, weld pad zone; 12, grid line layer metal lead wire; 14, data Layer metal lead wire; 15, the first conductive adhesive district; 16, the second conductive adhesive district; 17, first insulating barrier; 18, second insulating barrier; 19, transparency conducting layer; 20, integrated circuit or flexible PCB; 30, conducting resinl particle; 131, via hole; 132, via hole; 133, via hole; 134, via hole.
Embodiment
To combine the accompanying drawing among the utility model embodiment below, the technical scheme among the utility model embodiment is carried out clear, intactly description, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
The tft array substrate that provides with Fig. 3,4, the 5 couples of the utility model embodiment below describes.Wherein, the weld pad area schematic of the tft array substrate that provides for the utility model embodiment of Fig. 3; Fig. 4 is the sectional view of the B-B direction of Fig. 3; Fig. 5 is the sectional view of Fig. 3 in the C-C direction.
As shown in Figure 3, tft array substrate 10 comprises grid line layer, first insulating barrier, data line layer, second insulating barrier and transparency conducting layer successively.The weld pad zone 11 of this tft array substrate 10 comprises data Layer metal lead wire 14 that is positioned at data line layer and the first conductive adhesive district 15 that is connected with data Layer metal lead wire 14; And the grid line layer metal lead wire 12 that is positioned at grid line layer; The weld pad zone also comprises the second conductive adhesive district 16 that is positioned at data line layer; Wherein, The grid line layer metal lead wire 12 that is positioned at grid line layer is electrically connected with being positioned at the data Layer second conductive adhesive district 16, and this second conductive adhesive district 16 does not contact with the data Layer metal lead wire 14 and the first conductive adhesive district 15.
Wherein, the top transparency conducting layer 19 that all is coated with in this first conductive adhesive district 15 and this second conductive adhesive district 16, so all can the section of preventing poor through transparency conducting layer 19.Certainly poor for the section of preventing, all some does not cover said transparency conducting layer can to make said first conductive adhesive district and the said second conductive adhesive district yet.Like this; As shown in Figure 4; When tft array substrate 10 carries out adhesion technique with integrated circuit or flexible PCB 20,, promptly all be positioned on first insulating barrier 17 because the first conductive adhesive district 15 and the second conductive adhesive district 16 are positioned at same one deck; Have identical structural thickness, it is poor therefore to have eliminated the section that forms because of structural thickness is different.At this moment, conducting resinl particle 30 can contact with the first conductive adhesive district 15 and the second conductive adhesive district 16 well, has avoided the appearance of bonding bad phenomenon, guarantees that drive signal can be transferred to the substrate viewing area.
Grid line layer metal lead wire 12 is connected with the second conductive adhesive district 16, specifically can be as shown in Figure 5, and utilize the composition PROCESS FOR TREATMENT when forming tft array zone grid line, on the weld pad zone 11 of tft array substrate 10, to form grid line layer metal lead wire 12.Coating first insulating barrier (gate insulation layer) 17 on tft array substrate 10.Utilize the composition PROCESS FOR TREATMENT when forming tft array area data line, on the weld pad zone 11 of tft array substrate 10, to form the second conductive adhesive district 16.Coating second insulating barrier (passivation layer) 18 on tft array substrate 10.Expose the via hole 132 in this second conductive adhesive district 16 in 16 formation of the second conductive adhesive district, and the via hole 131 that exposes grid line layer metal lead wire 12 parts.Utilize the composition PROCESS FOR TREATMENT when forming tft array area pixel electrode, on the via hole 131,132 on the weld pad zone 11 of tft array substrate 10, to form transparency conducting layer 19.Like this, the grid line layer metal lead wire 12 that is positioned at grid line layer is just realized being connected with the second conductive adhesive district 16 that is positioned at data line layer.
At this moment, this transparency conducting layer 19 has not only played the effect that connects the grid line layer metal lead wire 12 and the second conductive adhesive district 16, has also played the effect of protecting the second conductive adhesive district 16, and it can not corroded.
Another tft array substrate of providing of 6, the 7 pairs of the utility model describes with reference to the accompanying drawings.The weld pad area schematic of the tft array substrate that Fig. 6 provides for present embodiment; Fig. 7 is the sectional view of the D-D direction of Fig. 6.The board structure of the board structure of present embodiment and a last embodiment is basic identical, and just grid line layer metal lead wire 12 is different with the second conductive adhesive district, 16 connected modes.
Concrete, utilize the composition PROCESS FOR TREATMENT when forming tft array zone grid line, on the weld pad zone 11 of tft array substrate 10, to form grid line layer metal lead wire 12.Coating first insulating barrier (gate insulation layer) 17 on tft array substrate 10.On this first insulating barrier 17, form the via hole 133 that exposes grid line layer metal lead wire 12 part zones.Utilize the composition PROCESS FOR TREATMENT when forming tft array area data line, on the weld pad zone 11 of tft array substrate 10, to form the second conductive adhesive district 16; This second conductive adhesive district 16 covers via hole 133, is connected with grid line layer metal lead wire 12 through this via hole 133.Coating second insulating barrier (passivation layer) 18 on tft array substrate 10.Expose the via hole 134 in this second conductive adhesive district 16 in 16 formation of the second conductive adhesive district.Utilize the composition PROCESS FOR TREATMENT when forming tft array area pixel electrode, on the via hole 14 on the weld pad zone 11 of tft array substrate 10, to form transparency conducting layer 19.
At this moment, mainly be the effect in the protection second conductive adhesive district 16, it can not corroded.
The tft array substrate that the utility model embodiment provides; On substrate weld pad zone; The grid line layer metal lead wire is connected with the second conductive adhesive district; Make the adhesion area-second conductive adhesive district of this grid line layer metal lead wire, be positioned at same one deck with the adhesion area-first conductive adhesive district of data Layer metal lead wire, thereby solved the bonding bad problem that grid, data double layer of metal cause because of the section difference; Thereby make drive signal normal transmission arrive the substrate viewing area, avoid producing the bad phenomenon of picture.
Need to prove that the weld pad zone 11 of above embodiment both can be the data wire spot area, also can be the grid line spot area.
The LCD that the utility model embodiment provides can comprise the tft array substrate among above arbitrary embodiment.And the concrete structure of this substrate is same as the previously described embodiments.
The above; Be merely the embodiment of the utility model; But the protection range of the utility model is not limited thereto; Any technical staff who is familiar with the present technique field can expect changing or replacement in the technical scope that the utility model discloses easily, all should be encompassed within the protection range of the utility model.Therefore, the protection range of the utility model should be as the criterion with the protection range of said claim.
Claims (6)
1. a tft array substrate comprises grid line layer, first insulating barrier, data line layer, second insulating barrier and transparency conducting layer successively; The weld pad zone of said tft array substrate comprises data Layer metal lead wire that is positioned at data line layer and the first conductive adhesive district that is connected with said data Layer metal lead wire; And the grid line layer metal lead wire that is positioned at grid line layer; It is characterized in that; The weld pad zone also comprises the second conductive adhesive district that is positioned at data line layer; Said grid line layer metal lead wire is electrically connected with the second conductive adhesive district of said data Layer, and wherein, the said second conductive adhesive district does not contact with the said data Layer metal lead wire and the first conductive adhesive district.
2. tft array substrate according to claim 1 is characterized in that,
First insulating barrier, second insulating barrier of said grid line layer metal lead wire top are provided with first via hole that exposes said grid line layer metal lead wire;
Said second insulating barrier of top, the said second conductive adhesive district is provided with second via hole that exposes the said second conductive adhesive district;
Said first via hole is connected through said transparency conducting layer with said second via hole.
3. tft array substrate according to claim 2 is characterized in that,
Said first conductive adhesive district and the said second conductive adhesive district top all is coated with said transparency conducting layer.
4. tft array substrate according to claim 1 is characterized in that, said first conductive adhesive district and the said second conductive adhesive district all have at least a part not cover said transparency conducting layer.
5. tft array substrate according to claim 1 is characterized in that,
First insulating barrier of said grid line layer metal lead wire top is provided with the via hole that exposes said grid line layer metal lead wire;
The said second conductive adhesive district covers said via hole, is connected with said grid line layer metal lead wire through said via hole.
6. a LCD is characterized in that, said LCD comprises the arbitrary described tft array substrate of claim 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204034795U CN202307895U (en) | 2011-10-21 | 2011-10-21 | TFT (Thin film transistor) array substrate and liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204034795U CN202307895U (en) | 2011-10-21 | 2011-10-21 | TFT (Thin film transistor) array substrate and liquid crystal display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202307895U true CN202307895U (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204034795U Expired - Lifetime CN202307895U (en) | 2011-10-21 | 2011-10-21 | TFT (Thin film transistor) array substrate and liquid crystal display |
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| CN (1) | CN202307895U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015089892A1 (en) * | 2013-12-20 | 2015-06-25 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method thereof and display device |
| CN110147017A (en) * | 2019-04-29 | 2019-08-20 | 深圳市华星光电半导体显示技术有限公司 | A kind of display panel |
| CN111552129A (en) * | 2020-05-25 | 2020-08-18 | Tcl华星光电技术有限公司 | Liquid crystal display panel |
-
2011
- 2011-10-21 CN CN2011204034795U patent/CN202307895U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015089892A1 (en) * | 2013-12-20 | 2015-06-25 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method thereof and display device |
| CN110147017A (en) * | 2019-04-29 | 2019-08-20 | 深圳市华星光电半导体显示技术有限公司 | A kind of display panel |
| CN111552129A (en) * | 2020-05-25 | 2020-08-18 | Tcl华星光电技术有限公司 | Liquid crystal display panel |
| CN111552129B (en) * | 2020-05-25 | 2023-10-13 | Tcl华星光电技术有限公司 | Liquid crystal display panel having a light shielding layer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150716 Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150716 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150716 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176, No. 8, Middle West Road, Beijing economic and Technological Development Zone, Beijing Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |