CN202275026U - Strength test device of welded ball - Google Patents

Abstract

A strength test device of a welded ball belongs to displacement and air pressure test devices and resolves the problem that smaller measuring elements are required to be manufactured in the existing contact type measuring method, and strength needs to be maintained. The strength test device of the welded ball comprises an air source, a booster pump, a left support, a screw, a nozzle, a nozzle platform deck, a grating ruler displacement sensor, an element platform deck, a right support, a base and a grating ruler support. Air and nitrogen of the strength test device of the welded ball are output through the nozzle to apply force on the welded ball. Compared with a contact type measuring device, the opening diameter of the nozzle can be larger than the diameter of the welded ball, so that a probe or a cutter with similar size with the welded ball and high strength is not required to be manufactured, damage to a measuring tool and error in actual measurement can be avoided, output pressure of the nozzle can be set, measuring flexibility and measuring range are larger, a measuring appliance can be effectively protected, and measuring result accuracy can be ensured. The strength test device is suitable for strength tests of micro electronic devices.

Description

Soldered ball strength test device

Technical field

The utility model belongs to displacement and gas pressure intensity proving installation, and particularly a kind of soldered ball strength test device is used for the micro-electron packaging device strength test.

Background technology

The intensity of solder joint is one of important indicator of weighing package reliability in the microelectronics Packaging components and parts.Mainly soldered ball intensity is tested at present through tension test, three point bending test, four-point bending test or shear test.This type test is the test on macro-scale, and when soldered ball diameter during less than 100 μ m, the intensity of soldered ball has been compared big gap with experimental data.For overcoming the defective of above metering system; Occurred tiny soldered balls is carried out the method that soldered ball intensity is measured in tension test; Its principle is for to fix pad or chip; Measuring sensor (probe, cutting knife) is to soldered ball motion, contact soldered ball and soldered ball is applied acting force be destroyed up to soldered ball, through sensor measurement acting force between soldered ball and the measuring sensor in a process.This measuring method the volume of soldered ball constantly reduce and chip on soldered ball density when increasing; The measuring sensor physical dimension reduces; Increased the manufacturing difficulty of processing; Simultaneously littler measuring sensor means lower intensity, and is yielding even destroy when soldered ball is tested, give testing tool and as a result accuracy cause harmful effect.

Summary of the invention

The utility model provides a kind of soldered ball strength test device, solves the problem that existing contact measurement method need be made the littler measuring sensor of processing and guarantee its intensity.

The soldered ball strength test device of the utility model comprises source of the gas, supercharge pump, left socle, screw mandrel, nozzle, nozzle microscope carrier, grating rule displacement sensor, element microscope carrier, right support, base and grating chi support; It is characterized in that:

Said source of the gas is connected through pipeline with supercharge pump; Said supercharge pump, left socle, right support, grating chi support are fixed on the base successively; The nozzle microscope carrier cooperates with the left socle upper end through screw mandrel, and said grating rule displacement sensor is made up of scale grating and grating reading head, and said scale grating is the level of state by grating chi stent support; Scale grating one end is connected with left socle, and grating reading head and said nozzle microscope carrier are connected; Said element microscope carrier is fixedly connected with the right support upper end, and element microscope carrier and nozzle microscope carrier are in same level height; Said nozzle is fixed on the said nozzle microscope carrier, is connected with said supercharge pump through flexible pipe.

Be installed in a pressure transducer on the element microscope carrier earlier before the actual measurement, move screw mandrel, the nozzle alignment pressure transducer; Distance is L between the two, and L=2～10mm, nozzle are jet to pressure transducer within the specific limits; Regulate supercharge pump; Record supercharge pump output gas pressure intensity, grating rule displacement sensor and pressure transducer are noted the displacement of nozzle and the pressure at pressure transducer place respectively, are the gas pressure intensity curve of L so just can collect apart from nozzle.The L scope choose a plurality of distance L 1, L2 ..., obtain the gas pressure intensity curve on a plurality of different distance, unload lower pressure sensor from the element microscope carrier.

During test, the pad or the chip of tape welding ball is fixed on the element microscope carrier, adjusts the position between element microscope carrier and the nozzle, the height of adjustment pad or chip moves screw mandrel, with the nozzle alignment soldered ball.Nozzle moves to the part apart from soldered ball L1 towards soldered ball; L1 within the L scope, the gas pressure intensity of ascending adjustment supercharge pump output, the gaseous tension that soldered ball receives increases gradually; Break away from from pad or chip until soldered ball; With distance L 1 substitution is surveyed in advance with supercharge pump output gas pressure intensity the distance and gas pressure intensity curve of this moment, just can obtain soldered ball from begin stressed when the disengaging pressure of soldered ball position, calculate the stressed of soldered ball by the lifting surface area of pressure and soldered ball; Sectional area by soldered ball solder joint place calculates shear stress again, thereby realizes the measurement to soldered ball intensity; Soldered ball supercharge pump output pressure numerical value and the residing distance L 1 of nozzle when pad or chip come off are the experimental datas that two needs are measured.

In test process since parameters such as nozzle output pressure numerical value that is provided with and position be not suitable for; Do not break away from or break away from comparatively fast such as soldered ball, can regulate the position of nozzle, within the L scope, select another distance L 2; The measurement gas output pressure is brought the gas pressure intensity curve into.

The utility model air or nitrogen apply acting force through nozzle output to soldered ball, compare with the measurement mechanism of contact; The bore of nozzle can be greater than the soldered ball diameter; Need not make processing and high-intensity probe or cutting knife close with size of solder ball, in actual measurement, also avoid the loss and the error of testing tool, the nozzle output pressure can be provided with; Dirigibility and the measurement range measured are bigger, can effectively protect surveying instrument and guarantee the accurate of measurement result.

Description of drawings

Fig. 1 is the front view of the utility model;

Fig. 2 is the vertical view of the utility model;

Fig. 3 is the gas pressure intensity curve synoptic diagram.

Embodiment

Below in conjunction with accompanying drawing the utility model is further specified.

Like Fig. 1, shown in Figure 2, the utility model comprises source of the gas 1, supercharge pump 2, left socle 3, screw mandrel 4, nozzle 5, nozzle microscope carrier 6, grating rule displacement sensor 7, element microscope carrier 9, right support 10, base 11 and grating chi support 12; Said source of the gas 1 and supercharge pump 2 are connected through pipeline; Said supercharge pump 2, left socle 3, right support 10, grating chi support 12 are fixed on the base 11 successively; Nozzle microscope carrier 6 cooperates with left socle 3 upper ends through screw mandrel 4, and said grating rule displacement sensor is made up of scale grating and grating reading head, and said scale grating is supported by grating chi support 12 and is the level of state; Scale grating one end is connected with left socle 3, and grating reading head and said nozzle microscope carrier 6 are connected; Said element microscope carrier 9 is fixedly connected with right support 10 upper ends, and element microscope carrier 9 is in same level height with nozzle microscope carrier 6; Said nozzle 5 is fixed on the said nozzle microscope carrier 6, is connected with said supercharge pump 2 through flexible pipe.

Source of the gas 1 can adopt steel cylinder dress pressurized air or nitrogen; The air boost pump of supercharge pump 2 Si Teke of the employing Shenzhen Pneumatic hydraulic GB60 of company limited models; The BTK 3210-2.6 screw mandrel of screw mandrel 4 employing Guangzhou glad mechanical company limited difficult to understand; Grating rule displacement sensor 7 adopts German Heidenhain LC 483 absolute type linear grating rule displacement sensors; Connect the digital display meter that matches; Pressure transducer adopts the ultra-thin shape pressure transducer of CYG512 type of Kunshan Shuangqiao Sensor monitoring and control Technology Co., Ltd; Stick on the inverted T shape fixed mount, be connected with supporting device for digit-displaying.

Shown in Figure 3 is the gas pressure intensity curve synoptic diagram, and among the figure, transverse axis is a supercharge pump output gas pressure intensity, and the longitudinal axis is the gas pressure intensity at pressure transducer place, has represented apart from nozzle to be two gas pressure intensity curves of 5mm and 7mm among the figure.

Claims (1)

1. a soldered ball strength test device comprises source of the gas, supercharge pump, left socle, screw mandrel, nozzle, nozzle microscope carrier, grating rule displacement sensor, element microscope carrier, right support, base and grating chi support; It is characterized in that:

Said source of the gas is connected through pipeline with supercharge pump; Said supercharge pump, left socle, right support, grating chi support are fixed on the base successively; The nozzle microscope carrier cooperates with the left socle upper end through screw mandrel, and said grating rule displacement sensor is made up of scale grating and grating reading head, and said scale grating is the level of state by grating chi stent support; Scale grating one end is connected with left socle, and grating reading head and said nozzle microscope carrier are connected; Said element microscope carrier is fixedly connected with the right support upper end, and element microscope carrier and nozzle microscope carrier are in same level height; Said nozzle is fixed on the said nozzle microscope carrier, is connected with said supercharge pump through flexible pipe.

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