CN202270840U - Boss forming die for semiconductor radiating sheets - Google Patents
Boss forming die for semiconductor radiating sheets Download PDFInfo
- Publication number
- CN202270840U CN202270840U CN201120357873XU CN201120357873U CN202270840U CN 202270840 U CN202270840 U CN 202270840U CN 201120357873X U CN201120357873X U CN 201120357873XU CN 201120357873 U CN201120357873 U CN 201120357873U CN 202270840 U CN202270840 U CN 202270840U
- Authority
- CN
- China
- Prior art keywords
- stripper plate
- forming punch
- moulding drift
- die
- fixed head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a boss forming die, in particular to a boss forming die for semiconductor radiating sheets. A small fixing board and a guide rod moving along with a forming punch are further connected onto the lower portion of a small base board, and the forming punch and the guide rod penetrate through the small fixing board along the perpendicular direction to be in clearance fit with the small fixing board. The forming punch penetrates through the small fixing board, so that the length of the forming punch is shortened virtually, and the forming punch cannot be broken off easily. Further the guide rod and the forming punch move together, only axial force exerts on the forming punch, and lateral force cannot exert on the forming punch easily, so that guiding accuracy can be ensured, and further the forming punch cannot be broken off easily. Additionally, a stripper plate insert is arranged on a stripper plate and can be demounted from the stripper plate, so that the forming punch can be taken out for replacing conveniently, and after being damaged, the forming punch can be demounted, replaced and maintained more easily.
Description
Technical field
The utility model relates to a kind of boss forming mould, particularly a kind of semiconductor heat-dissipating sheet boss forming mould.
Background technology
The semiconductor heat-dissipating sheet is meant the thermal component that is used to connect semiconductor integrated package inside chip and accurate semiconductor lead frame, simultaneously also as integrated package inside chip carrier.Some diameters that all can distribute on a lot of similar fin are about about 1.0 small boss or multistage moulding boss; Referring to Fig. 1; Fig. 1 is the structural representation of semiconductor heat-dissipating sheet, and the second order boss 11 on the fin is mainly used in the bonding strength of strengthening with framework, restriction lead frame height.At present fin is general mainly produces with the mould pressing, and mainly there are following problems in the mould structure of traditional similar multistage boss structure of moulding: 1) the moulding drift is elongated, and undercapacity fractures easily; 2) the moulding drift leans on the fixed head guiding, and precision is not enough, causes the moulding drift to be subject to side force, frangible; 3) the die structural design is unreasonable, is monoblock type, and adopts edm, causes surface smoothness restricted, and the discharge size also is difficult for assurance, so easy to wear, burst apart, putty causes moulding drift unfilled corner, and is crooked, unequal phenomenon; 4) it is extremely inconvenient to change maintenance after the moulding drift damages.
The utility model content
The purpose of the utility model is to overcome the deficiency of existing product, and not frangible and be convenient to change maintenance of a kind of moulding drift is provided, the semiconductor heat-dissipating sheet boss forming mould that die is difficult for that putty takes place and can produces high-quality fin.
The purpose of the utility model realizes through following technical scheme: semiconductor heat-dissipating sheet boss forming mould, comprise upper bolster, die shoe and moulding drift, and the bottom of upper bolster is provided with a upper padding plate; The upper padding plate bottom is connected with a small raft and stripper plate seat; Stripper plate seat bottom is connected with a stripper plate, and the moulding drift is locked on the small raft through screw, and die shoe is provided with lower bolster and curved lever pin; Lower bolster is provided with concave template; Concave template is provided with the die mold insert, and the die mold insert is provided with the little mold insert of die, it is characterized in that: the guide post that also is connected with little fixed head in the bottom of described small raft and goes together with the moulding drift; Moulding drift and guide post vertically pass little fixed head, with little fixed head matched in clearance.
As a kind of improvement of the utility model, described stripper plate is provided with stripper plate and inserts, and stripper plate is inserted and is locked on the stripper plate through screw, unclamps screw, and stripper plate is inserted and can be pulled down from stripper plate, thereby makes the moulding drift also can conveniently take out replacing.
The beneficial effect that the utility model is got: the semiconductor heat-dissipating sheet boss forming mould of the utility model, the guide post that also is connected with little fixed head in the bottom of described small raft and goes together with the moulding drift, moulding drift and guide post vertically pass little fixed head; With little fixed head matched in clearance, the moulding drift passes little fixed head, has shortened the length of moulding drift virtually; Moulding drift frangible not just, and guide post like this and moulding drift are gone together, and the moulding drift only receives axial force not to be subject to side force; Not only guaranteed guiding accuracy, and guaranteed further that also the moulding drift is not easy to be fractureed, in addition; Stripper plate is provided with stripper plate and inserts; Stripper plate is inserted and can be pulled down from stripper plate, thereby makes the moulding drift also can conveniently take out replacing, thereby it is easier to have guaranteed to change after the moulding drift damages maintenance.
Description of drawings
Fig. 1 is the structural representation of semiconductor heat-dissipating sheet;
Fig. 2 is the planar structure sketch map of the utility model.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is done further detailed elaboration:
Referring to Fig. 2, the semiconductor heat-dissipating sheet boss forming mould of the utility model comprises upper bolster 1, die shoe 2 and moulding drift 3; The bottom of upper bolster 1 is provided with a upper padding plate 4, and upper padding plate 4 bottoms are connected with a small raft 5 and stripper plate seat 6, and stripper plate seat 6 bottoms are connected with a stripper plate 7; Moulding drift 3 is locked on the small raft 5 through screw; Die shoe 2 is provided with lower bolster 8 and moulding push rod 9, and lower bolster 8 is provided with concave template 10, and concave template 10 is provided with die mold insert 11; Die mold insert 11 is provided with die and inserts 12 for a short time; It is characterized in that: also be connected with little fixed head 13 in the bottom of described small raft 5 and with moulding drift colleague's guide post 14, moulding drift 3 and guide post 14 vertically pass little fixing 13, with little fixed head 13 matched in clearance.
A kind of improvement as the utility model; Described stripper plate 7 is provided with stripper plate and inserts 15, and stripper plate is inserted and 15 is locked on the stripper plate 7 through screw 16, unclamps screw 16; Stripper plate is inserted and 15 can be pulled down from stripper plate 7, thereby makes moulding drift 3 also can conveniently take out replacing.
During use, strip 17 is placed on the concave template of die shoe 2, punch press is exercised upper bolster 1 down and is pressed down, and stripper plate 7 is pushed down strip 17 earlier; Upper bolster 1 is descending again, and moulding drift 3 and guide post 14 are together descending, and moulding drift 3 is pressed into strip 17 successively to press like die mold insert 11 and die and inserts for a short time in 12, meanwhile; The push rod 9 that resets presses down, and punch press is up then, and upper bolster 1 resets, and the push rod 9 that resets resets; Accomplish a punching press, constantly repeat this process, realize continuous production.
The semiconductor heat-dissipating sheet boss forming mould of the utility model, the guide post that also is connected with little fixed head in the bottom of described small raft and goes together with the moulding drift, moulding drift and guide post vertically pass little fixed head; With little fixed head matched in clearance, the moulding drift passes little fixed head, has shortened the length of moulding drift virtually; Moulding drift frangible not just, and guide post like this and moulding drift are gone together, and the moulding drift only receives axial force not to be subject to side force; Not only guaranteed guiding accuracy, and guaranteed further that also the moulding drift is not easy to be fractureed, in addition; Stripper plate is provided with stripper plate and inserts; Stripper plate is inserted and can be pulled down from stripper plate, thereby makes the moulding drift also can conveniently take out replacing, thereby it is easier to have guaranteed to change after the moulding drift damages maintenance.
According to the announcement and the instruction of above-mentioned specification, the utility model those skilled in the art can also carry out suitable change and modification to above-mentioned embodiment.Therefore, the specific embodiment that discloses and describe above the utility model is not limited to also should fall in the protection domain of claim of the present invention some modifications and the change of the utility model.In addition, although used some specific terms in this specification, these terms are explanation for ease just, the utility model is not constituted any restriction.
Claims (2)
1. semiconductor heat-dissipating sheet boss forming mould comprises upper bolster, die shoe and moulding drift, and the bottom of upper bolster is provided with a upper padding plate; The upper padding plate bottom is connected with a small raft and stripper plate seat; Stripper plate seat bottom is connected with a stripper plate, and the moulding drift is locked on the small raft through screw, and die shoe is provided with lower bolster and curved lever pin; Lower bolster is provided with concave template; Concave template is provided with the die mold insert, and the die mold insert is provided with the little mold insert of die, it is characterized in that: the guide post that also is connected with little fixed head in the bottom of described small raft and goes together with the moulding drift; Moulding drift and guide post vertically pass little fixed head, with little fixed head matched in clearance.
2. semiconductor heat-dissipating sheet boss forming mould as claimed in claim 1, described stripper plate is provided with stripper plate and inserts, and stripper plate is inserted and is locked on the stripper plate through screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120357873XU CN202270840U (en) | 2011-08-24 | 2011-08-24 | Boss forming die for semiconductor radiating sheets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120357873XU CN202270840U (en) | 2011-08-24 | 2011-08-24 | Boss forming die for semiconductor radiating sheets |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202270840U true CN202270840U (en) | 2012-06-13 |
Family
ID=46191226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120357873XU Expired - Fee Related CN202270840U (en) | 2011-08-24 | 2011-08-24 | Boss forming die for semiconductor radiating sheets |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202270840U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102764815A (en) * | 2012-07-19 | 2012-11-07 | 苏州吴中经济开发区搏宇模具加工厂 | Claw sheet bending and stamping die |
| CN102773342A (en) * | 2012-07-20 | 2012-11-14 | 苏州吴中经济开发区搏宇模具加工厂 | Notebook rear cover punching die |
-
2011
- 2011-08-24 CN CN201120357873XU patent/CN202270840U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102764815A (en) * | 2012-07-19 | 2012-11-07 | 苏州吴中经济开发区搏宇模具加工厂 | Claw sheet bending and stamping die |
| CN102773342A (en) * | 2012-07-20 | 2012-11-14 | 苏州吴中经济开发区搏宇模具加工厂 | Notebook rear cover punching die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120613 Termination date: 20140824 |
|
| EXPY | Termination of patent right or utility model |