CN202262034U - Radiating support plate of LED light-emitting unit - Google Patents
Radiating support plate of LED light-emitting unit Download PDFInfo
- Publication number
- CN202262034U CN202262034U CN2011203276443U CN201120327644U CN202262034U CN 202262034 U CN202262034 U CN 202262034U CN 2011203276443 U CN2011203276443 U CN 2011203276443U CN 201120327644 U CN201120327644 U CN 201120327644U CN 202262034 U CN202262034 U CN 202262034U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- support plate
- luminescence unit
- led luminescence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004020 luminiscence type Methods 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 6
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005395 radioluminescence Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a LED luminous unit heat dissipation support plate, which comprises a circuit board for mounting an LED luminous unit and an electronic element, wherein a device area and a heat dissipation area for mounting the LED luminous unit and the electronic element are arranged on the surface of one side of the circuit board; and the heat dissipation area is provided with a heat conduction layer. The beneficial effects of the utility model reside in that through set up device district and radiating area separately on the circuit board surface to set up the structure of heat-conducting layer in the radiating area that does not install LED luminescence unit and electronic component, utilize the support plate to participate in the heat dissipation in finite structure, thereby make the heat energy that LED luminescence unit produced faster be taken out and then play the radiating action under the operational aspect that does not influence circuit board surface device.
Description
Technical field
The utility model relates to a kind of PCB circuit board, refers in particular to a kind of LED luminescence unit heat radiation support plate.
Background technology
LED had obtained using widely as the green light source of high conversion efficiency in the last few years.Though yet the conversion efficiency of LED exceeds much than incandescent lamp; But it is the same with conventional light source; LED (semiconductor light emitting diode) also can produce heat during operation; Power up outside under the energy, the radiation recombination generation electroluminescence in electronics and hole, semiconductor medium and encapsulation medium that near the light that PN junction, radiates also need pass through chip (chip) itself just can arrive at external world's (air).Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, chip exterior light take out efficient etc.; Finally probably have only the input electric energy of 30-40% to be converted into luminous energy, the form of the lattice vibration that the energy of all the other 60-70% mainly takes place with non-radiation recombination transforms heat energy.Along with the rising of chip temperature, can further strengthen non-radiation recombination, and the next meeting of high temperature produces the effect that slackens to the luminous efficiency of LED.As if untimely heat is led away, a large amount of heat can cause more problems in the LED use.But dispel the heat as if LED is all lumped together finned or fan; A lot of situation can be subject to the structure of product again, for example popular at present LED portable electric torch, and its encapsulating structure is just very limited; But the demand of high brightness makes it often arrange in pairs or groups than high-power LED again; Therefore, how the cooperated with LED luminous power cooperates the radiator structure of proper volume, for needing the scheme of solution in the industry badly.
The utility model content
The purpose of the utility model is to have overcome above-mentioned defective, and a kind of LED luminescence unit heat radiation support plate that has heat sinking function concurrently is provided.
The purpose of the utility model is achieved in that a kind of LED luminescence unit heat radiation support plate; It comprises the circuit board that is used to install LED luminescence unit and electronic component, and said circuit board one side surface is provided with device region and the radiating area that is used to be equipped with LED luminescence unit and electronic component; Said radiating area is provided with heat-conducting layer;
In the said structure, said circuit board opposite side surface coverage has heat-conducting layer;
In the said structure, said circuit board is provided with through hole, is coated with the Heat Conduction Material of connection circuit plate both side surface heat-conducting layer on the through hole;
In the said structure, said heat-conducting layer is the copper coating;
In the said structure, said heat-conducting layer surface is provided with fin.
The beneficial effect of the utility model is through set up device region and radiating area separately at circuit board surface; Thereby the structure of heat-conducting layer is set at the radiating area that LED luminescence unit and electronic component are not installed; In limit structure is arranged, utilize support plate to participate in heat radiation, thereby the heat energy that under the working condition that does not influence the circuit board surface device, makes the LED luminescence unit produce is taken and then is risen out of thermolysis faster.
Description of drawings
Concrete structure below in conjunction with detailed description of the drawings the utility model:
Fig. 1 is the Facad structure sketch map of the utility model;
Fig. 2 is the A-A direction cutaway view of Fig. 1.
The 1-circuit board; The 2-heat-conducting layer; The 3-through hole; The 4-LED luminescence unit; The 301-Heat Conduction Material.
Embodiment
By the technology contents, the structural feature that specify the utility model, realized purpose and effect, know clearly below in conjunction with execution mode and conjunction with figs. and give explanation.
See also Fig. 1 and Fig. 2; The utility model relates to a kind of LED luminescence unit heat radiation support plate, and it comprises circuit board 1, and the surface of circuit board 1 one sides is provided with device region and radiating area; LED luminescence unit and electronic component are installed on the device region; And radiating area is provided with heat-conducting layer 2, and is preferable, also is coated with heat-conducting layer 2 on the opposite side surface of circuit board 1; The positive and negative side surface that is circuit board 1 is equipped with heat-conducting layer 2; And be provided with device region and radiating area one side surface at circuit board 1, be further to strengthen area of dissipation, institute is useful on LED luminescence unit 4 and electronic component surface in addition are installed; Be that heat-conducting layer 2 does not only cover LED luminescence unit 4 and electronic component; What need particularly point out is that heat-conducting layer 2 should not link to each other with the pin that LED luminescence unit 4 and electronic component are connected on the circuit board here, and with the short circuit problem of avoiding bringing because of heat-conducting layer 2, heat-conducting layer 2 can adopt the copper coat structure in the circuit common plate technology thus; Convenient production makes that product can be through utilizing support plate to participate in heat radiation in limited structure space simultaneously again, and the heat energy that under the working condition that does not influence the circuit board surface device, makes LED luminescence unit 4 produce is taken and then reach out of the effect of auxiliary heat dissipation faster.
The utility model one is among the embodiment, on circuit board 1, also is provided with through hole 3, is coated with the Heat Conduction Material 301 of connection circuit plate 1 positive and negative side surface heat-conducting layer 2 on the through hole 3; Heat Conduction Material 301 is generally materials such as metal such as copper; But through the heat of Heat Conduction Material balancing circuitry plate 1 positive and negative side surface heat-conducting layer 2 in this through hole 3, strengthen radiating effect, this accessibke porosity can make that air advanced; And then take away heat, improve radiating effect.
Among another embodiment of the utility model, the also best fin stereochemical structure that is similar to fin that is carved with on the surface of said heat-conducting layer 2, thus strengthen area of dissipation, reach better radiating effect.
The above is merely the embodiment of the utility model; Be not thus the restriction the utility model claim; Every equivalent structure transformation that utilizes the utility model specification and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the utility model.
Claims (5)
1. LED luminescence unit heat radiation support plate, it comprises the circuit board that is used to install LED luminescence unit and electronic component, it is characterized in that: said circuit board one side surface is provided with device region and the radiating area that is used to be equipped with LED luminescence unit and electronic component; Said radiating area is provided with heat-conducting layer.
2. LED luminescence unit heat radiation support plate as claimed in claim 1, it is characterized in that: said circuit board opposite side surface coverage has heat-conducting layer.
3. LED luminescence unit heat radiation support plate as claimed in claim 2, it is characterized in that: said circuit board is provided with through hole, is coated with the Heat Conduction Material of connection circuit plate both side surface heat-conducting layer on the through hole.
4. LED luminescence unit heat radiation support plate as claimed in claim 1, it is characterized in that: said heat-conducting layer is the copper coating.
5. like any described LED luminescence unit heat radiation support plate of claim 1-4, it is characterized in that: said heat-conducting layer surface is provided with fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203276443U CN202262034U (en) | 2011-09-02 | 2011-09-02 | Radiating support plate of LED light-emitting unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203276443U CN202262034U (en) | 2011-09-02 | 2011-09-02 | Radiating support plate of LED light-emitting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202262034U true CN202262034U (en) | 2012-05-30 |
Family
ID=46123207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203276443U Expired - Fee Related CN202262034U (en) | 2011-09-02 | 2011-09-02 | Radiating support plate of LED light-emitting unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202262034U (en) |
-
2011
- 2011-09-02 CN CN2011203276443U patent/CN202262034U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20130902 |