CN202238978U - Bonding wire drawing die frame - Google Patents

Bonding wire drawing die frame Download PDF

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Publication number
CN202238978U
CN202238978U CN2011203936015U CN201120393601U CN202238978U CN 202238978 U CN202238978 U CN 202238978U CN 2011203936015 U CN2011203936015 U CN 2011203936015U CN 201120393601 U CN201120393601 U CN 201120393601U CN 202238978 U CN202238978 U CN 202238978U
Authority
CN
China
Prior art keywords
wire drawing
drawing die
die frame
groove
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203936015U
Other languages
Chinese (zh)
Inventor
万军平
王一平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Chunshu Electronic Materials Co. Ltd.
Original Assignee
SUZHOU HEYE NEW MATERIALS TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU HEYE NEW MATERIALS TECHNOLOGY CO LTD filed Critical SUZHOU HEYE NEW MATERIALS TECHNOLOGY CO LTD
Priority to CN2011203936015U priority Critical patent/CN202238978U/en
Application granted granted Critical
Publication of CN202238978U publication Critical patent/CN202238978U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a bonding wire drawing die frame, which comprises a base, wherein the base is provided with a plurality of grooves, the bottoms of which are arc-shaped; the arc-shaped bottom of each groove is provided with a through hole; and the grooves are matched with the shapes of wire drawing dies. By using the grooves in the die frame, the wire drawing dies can be regularly placed, and cross contamination among the dies is reduced; through the through holes, the die pollution caused by lubricating oil is reduced, and the wire drawing dies are well stored; and the die frame is simple in structure and easy to use.

Description

Bonding line wire drawing die mould frame
Technical field
The utility model relates to a kind of mould, particularly a kind of bonding line wire drawing die mould frame.
Background technology
Commonly used to fine wire drawing die in the present industrial bonding line processing, nib is extremely tiny.Wire-drawing die is in when dress on equipment or when changing the back and preserving, and current all is to lie in random position, is easy to mutual pollution, causes nib to stop up, and also badly takes and recognizes different size.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of bonding line wire drawing die mould frame, and this die frame is simple in structure and be easy to preserve wire-drawing die, makes it not contaminated.
The utility model is realized through following technical scheme: a kind of bonding line wire drawing die mould frame; Comprise base, be provided with the groove that some bottom surfaces are circular arc above the said base, the circular arc bottom surface of said each groove is provided with through hole; Groove and wire-drawing die form fit; Make wire-drawing die uprightly to be inserted in just in the groove, the through hole in the groove makes the lubricating fluid on the mould flow down along through hole, reduces the pollution to mould.
As the further improvement of the utility model, said base is processed for the PC plastic processing, also can form with aluminium alloy compression casting.
The beneficial effect of the utility model is: this die frame utilizes groove to make the wire drawing die prodigiosin arrange placement in order, reduces the mutual pollution between the mould, and die frame amasss little with mould contact surface; When special around the die hole; Be in vacant state, can at utmost reduce pollution, through hole is set simultaneously reduces the pollution of lubricating oil mould; Well preserved wire-drawing die, simple in structure and be easy to use.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model structural upright sketch map;
Fig. 3 places the schematic perspective view behind the mould for the utility model structure.
The specific embodiment
In order to deepen understanding to the utility model, will combine embodiment and accompanying drawing that the utility model is done further to detail below, this embodiment only is used to explain the utility model, does not constitute the qualification to the utility model protection domain.
Show the specific embodiment of a kind of bonding line wire drawing die of the utility model mould frame like Fig. 1: comprise base 1, being provided with some bottom surfaces above the said base 1 is the groove 2 of circular arc, and the circular arc bottom surface of said each groove 2 is provided with through hole 3; Said base 1 is processed for the PC plastic processing, and groove 2 and wire-drawing die form fit make wire-drawing die can uprightly be inserted in the groove 2 just, and 2 through hole 3 makes the lubricating fluid on the mould flow down along through hole 3 in the groove, reduces the pollution to mould.

Claims (2)

1. bonding line wire drawing die mould frame, it is characterized in that: comprise base (1), be provided with the groove that some bottom surfaces are circular arc (2) above the said base (1), the circular arc bottom surface of said each groove (2) is provided with through hole (3).
2. bonding line wire drawing die mould frame according to claim 1, it is characterized in that: said base (1) is processed into for PC plastics or aluminium alloy.
CN2011203936015U 2011-10-17 2011-10-17 Bonding wire drawing die frame Expired - Fee Related CN202238978U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203936015U CN202238978U (en) 2011-10-17 2011-10-17 Bonding wire drawing die frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203936015U CN202238978U (en) 2011-10-17 2011-10-17 Bonding wire drawing die frame

Publications (1)

Publication Number Publication Date
CN202238978U true CN202238978U (en) 2012-05-30

Family

ID=46100281

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203936015U Expired - Fee Related CN202238978U (en) 2011-10-17 2011-10-17 Bonding wire drawing die frame

Country Status (1)

Country Link
CN (1) CN202238978U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506497B (en) * 2013-03-30 2015-11-01 Shenzhen O Film Tech Co Ltd Monolayer touch screen and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506497B (en) * 2013-03-30 2015-11-01 Shenzhen O Film Tech Co Ltd Monolayer touch screen and method for manufacturing the same

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180201

Address after: Suzhou City, Jiangsu Province, Kunshan City Development Zone, 215300 small and medium-sized garden plant No. 4 No. 179 road chapter

Patentee after: Jiangsu Chunshu Electronic Materials Co. Ltd.

Address before: Suzhou City, Jiangsu province 215300 Development Zone of Kunshan City Road No. 179 SMEs Park chapter

Patentee before: Suzhou Heye New Materials Technology Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120530

Termination date: 20181017