CN202231952U - Current-uniformly-distributed printed circuit board - Google Patents
Current-uniformly-distributed printed circuit board Download PDFInfo
- Publication number
- CN202231952U CN202231952U CN201120393049XU CN201120393049U CN202231952U CN 202231952 U CN202231952 U CN 202231952U CN 201120393049X U CN201120393049X U CN 201120393049XU CN 201120393049 U CN201120393049 U CN 201120393049U CN 202231952 U CN202231952 U CN 202231952U
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- CN
- China
- Prior art keywords
- circuit board
- current
- printed circuit
- double
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a current-uniformly-distributed printed circuit board. The printed circuit board comprises a double-sided metal unit and process edges, wherein a copper sheet and through-holes are arranged on the double-sided metal unit; the process edges are arranged at the periphery of the double-sided metal unit; the copper sheet is a latticed copper sheet; and the process edges are provided with copper points. The strong-current printed circuit board has a simple structure, and utilizes the latticed copper sheet in the double-sided metal unit to protect circuits and apertures in the board; and the copper points are added to the process edges at the periphery of the double-sided metal unit, so as to disperse current in the board, enable the current branch to be uniform, and avoid the phenomena of high current in the middle and low current at the periphery in the electroplating process; and the production cost is saved.
Description
Technical field
The utility model relates to a kind of printed circuit board, particularly relates to a kind of electric printed circuit board of robbing.
Background technology
In printed circuit board was made, circuit board need sink copper and plating aborning, the heavy copper in the wiring board production process with electroplate link, be in order to make the thick customer requirement that reaches of copper.
Existing circuit board is in electroplating process, and the circuit in the circuit board forms different distributions through regular meeting according to different designs, generally speaking; The place that circuit and copper face are intensive is arranged on the central area of plate mostly, and electroplating the interior current distributions of cylinder is middle high electric current, low current all around; When the copper of high electric current position is thick when reaching requirement, low current position copper is thick can not to satisfy customer requirement, if guarantee that low current position copper is thick up to standard; The copper of high electric current position is thick considerably beyond requiring; Cause that circuit is blocked up, situation such as difficult plug-in unit in the hole, finally cause scrapping, form the cost waste.
The utility model content
The purpose of the utility model is to provide a kind of electric printed circuit board of robbing, and reduces the problem of scrapping that line and aperture cause because of electric current is excessive
For solving this purpose problem, the utility model has adopted following technical scheme:
A kind ofly rob electric printed circuit board, comprise double-sided metal unit and technology limit, said double-sided metal unit is provided with copper sheet and through hole, and said technology limit is located at around the said double-sided metal unit, and said copper sheet is latticed copper sheet, and said technology limit is provided with the copper point.
Preferably as further improvement, in the utility model, the size of said latticed copper sheet is 0.2mm * 0.2mm.
Preferably as further improvement, in the utility model, the size of said copper point is 1.0mm * 1.0mm.
The utility model contrast prior art has following advantage: simple in structure; Utilize interior circuit of latticed copper sheet baffle and aperture in the unit; And the copper point is added on the technology limit around in the unit, but the interior electric current of dispersion plate like this makes CURRENT DISTRIBUTION even; Avoid the high electric current in centre of the formation in electroplating process, low current phenomenon all around, save production cost.
Description of drawings
Accompanying drawing 1 is the utility model structural representation.
Embodiment
Existing with reference to accompanying drawing, further explain the utility model.
As shown in Figure 1, a kind ofly rob electric printed circuit board, comprise double-sided metal unit 1 and technology limit 2, double-sided metal unit 1 is provided with copper sheet 10 and through hole 11, and technology limit 2 is located at around the double-sided metal unit 1, and copper sheet 10 is latticed copper sheet 10, and technology limit 2 is provided with copper point 20.
The size of latticed copper sheet 10 is 0.2mm * 0.2mm, and grid is too little can not to play shunting action, and is difficult on the technology accomplish, grid does not too greatly then meet customer requirement, has changed original requirement simultaneously.
In order to play the better protection effect; The size that copper points 20 are added on technology limit 2 is 1.0mm * 1.0mm, technology limit 2 be in the accessory process is installed and outside the auxiliary limit of increase, therefore; 2 add copper points 20 on the technology limit, can not produce any influence to the circuit of plate.
The utility model is simple in structure; Utilize interior circuit of latticed copper sheet 10 baffles and aperture in the unit; And copper points 20 are added on the technology limit around in the unit 2, but the interior electric current of dispersion plate like this makes that electric current branch is even; Be dispersed in the high electric current in centre of the formation in the electroplating process, low current phenomenon all around, save production cost.
Above-described the utility model execution mode does not constitute the qualification to the utility model protection range.The modification of being done within any spirit and principle at the utility model, be equal to replacement and improvement etc., all should be included within the claim protection range of the utility model.
Claims (3)
1. rob electric printed circuit board for one kind, comprise double-sided metal unit and technology limit, said double-sided metal unit is provided with copper sheet and through hole; Said technology limit is located at around the said double-sided metal unit; It is characterized in that said copper sheet is latticed copper sheet, said technology limit is provided with the copper point.
2. a kind of electric printed circuit board of robbing according to claim 1 is characterized in that the size of said latticed copper sheet is 0.2mm * 0.2mm.
3. a kind of electric printed circuit board of robbing according to claim 1 is characterized in that the size of said copper point is 1.0mm * 1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120393049XU CN202231952U (en) | 2011-10-14 | 2011-10-14 | Current-uniformly-distributed printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120393049XU CN202231952U (en) | 2011-10-14 | 2011-10-14 | Current-uniformly-distributed printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202231952U true CN202231952U (en) | 2012-05-23 |
Family
ID=46082521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120393049XU Expired - Fee Related CN202231952U (en) | 2011-10-14 | 2011-10-14 | Current-uniformly-distributed printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202231952U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103014799A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Electroplating process of circuit board of burning-resistant board |
| CN107278042A (en) * | 2017-08-07 | 2017-10-20 | 大连崇达电路有限公司 | A kind of circuit board VCP's accompanies plating plate |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
| CN110519929A (en) * | 2019-08-26 | 2019-11-29 | 广州兴森快捷电路科技有限公司 | The edges of boards graphical design method and wiring board of wiring board |
-
2011
- 2011-10-14 CN CN201120393049XU patent/CN202231952U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103014799A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Electroplating process of circuit board of burning-resistant board |
| CN103014799B (en) * | 2012-12-05 | 2015-12-02 | 深圳市兴达线路板有限公司 | A kind of circuit board plating process of burn-out-proof plate |
| CN107278042A (en) * | 2017-08-07 | 2017-10-20 | 大连崇达电路有限公司 | A kind of circuit board VCP's accompanies plating plate |
| CN107278042B (en) * | 2017-08-07 | 2023-09-12 | 大连崇达电路有限公司 | Accompanying plating board of circuit board VCP |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
| CN110519929A (en) * | 2019-08-26 | 2019-11-29 | 广州兴森快捷电路科技有限公司 | The edges of boards graphical design method and wiring board of wiring board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120523 Termination date: 20191014 |