CN202231056U - Improved integrally-packaged light-emitting diode (LED) module - Google Patents
Improved integrally-packaged light-emitting diode (LED) module Download PDFInfo
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- CN202231056U CN202231056U CN2011203519642U CN201120351964U CN202231056U CN 202231056 U CN202231056 U CN 202231056U CN 2011203519642 U CN2011203519642 U CN 2011203519642U CN 201120351964 U CN201120351964 U CN 201120351964U CN 202231056 U CN202231056 U CN 202231056U
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- frame
- resin glue
- polymer resin
- siloxane polymer
- component siloxane
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Abstract
The utility model relates to the technical field of light-emitting diodes (LEDs), in particular to an improved integrally-packaged LED module, which comprises a printed circuit board (PCB) substrate, an LED chip, a silica gel layer and a frame, and is characterized in that the frame is a one-component siloxane polymer resin glue frame coated on the PCB substrate according to a set graph, and the one-component siloxane polymer resin glue frame is in a geometric shape or an irregular shape. Compared with the prior art, the frame is easier to mold than a metal or macromolecule frame, thereby being capable of using a dispenser for molding, flexible and efficient in process and low in cost.
Description
Technical field
The utility model relates to the LED technical field, specifically a kind of improved integrated packaged LED module.
Background technology
During emerging white-light illuminating was used, single LEDs lumen number was lower, and lighting need carry out integrated through plurality of LEDs, so produced a kind of brand-new integrated packaging technology.This technology directly is fixed on the plurality of LEDs chip on the heat-radiating substrate, after being electrically connected through bonding wire realization chip chamber, and disposable silica gel and the baking-curing that is mixed with fluorescent material that pour into.Integrated encapsulated LED module heat dissipating performance is better; Present the area source characteristic, dazzle is lower; Because modularization, whole lamp assembling procedure is also simpler, is suitable for automated production.
In order to realize being electrically connected and having good heat-conducting, the circuit substrate PCB of metal or ceramic base material is generally adopted in integrated encapsulation.Encapsulating link in the LED encapsulation, in order to make final silica gel smooth, glue must have certain fluidity, and this just needs frame to retrain the zone that glue can arrive.But self does not contain frame the PCB substrate, must design and make in advance the frame of metal or macromolecular material according to the specification of integrating packaging module, and fitting through contraposition then is bonded on the PCB substrate.Special processing metal of this arts demand or macromolecule frame, cost is higher; When adjustment takes place in the design of integrating packaging module, must develop frame again, technological flexibility is relatively poor; The reflectivity of metal edge frame is often also lower, can the light efficiency of integrating packaging module be affected.
Summary of the invention
The purpose of the utility model is the deficiency that overcomes prior art, the frame that adopts one-component siloxane polymer resin glue to be solidified into certain viscosity, and system controlled by computer point gum machine capable of using with resin glue by the frame pattern layout of setting.
For realizing above-mentioned purpose; Design a kind of improved integrated packaged LED module; Comprise PCB substrate, led chip, silica gel layer, frame; It is characterized in that: the one-component siloxane polymer resin glue frame of described frame on the PCB substrate, being coated with by the figure of setting, described one-component siloxane polymer resin glue frame is geometric form or irregular shape.
When one-component siloxane polymer resin glue frame adopts the grid in the geometric form, be respectively equipped with the silica gel layer of different-colour in the different grid.
The utility model is compared with prior art, and this frame is more moulding more easily than metal or macromolecule frame, thereby it is moulding to use point gum machine to carry out, and technology is more flexible, efficient, and cost is low.
Description of drawings
Fig. 1 is the structural representation among the utility model embodiment 1.
Fig. 2 is the structural representation among the utility model embodiment 2.
Fig. 3 is the structural representation among the utility model embodiment 3.
Fig. 4 is the structural representation among the utility model embodiment 4.
Embodiment
Combine accompanying drawing that the utility model is done explanation further at present.
Choosing has the one-component of certain viscosity siloxane polymer resin glue, and described one-component siloxane polymer resin glue mainly is made up of hydroxyl-terminated injecting two methyl siloxane, methyl tributanoximo silane, methyl-silicone oil, gamma-amino propyl trimethoxy silicane and nanoparticle filler.The principle of one-component siloxane polymer resin glue moulding sealing mainly be utilize with air in trace steam reaction and solidify; Play the bonding forming effect with the reaction of PCB substrate surface, this one-component siloxane polymer resin glue has quick-setting characteristic under room temperature and air.Can adopt following components in weight percentage like one-component siloxane polymer resin glue: hydroxyl-terminated injecting two methyl siloxane 70%; Methyl tributanoximo silane 10%; Methyl-silicone oil 10%; Gamma-amino propyl trimethoxy silicane 5%; Nanoparticle filler 5%.Described nanoparticle filler can adopt white to use carbon black with titanium oxide microparticle or black, thereby the color of regulating one-component siloxane polymer resin glue is respectively white or black; After one-component siloxane polymer resin glue adds nanoparticle filler, can regulate the reflectivity of one-component siloxane polymer resin glue in addition, when adding titanium oxide microparticle, one-component siloxane polymer resin glue is rendered as white, and reflectivity is greater than 90%; When adding carbon black particle, one-component siloxane polymer resin glue is rendered as black, and reflectivity is less than 40%, and this prescription has excellent thermal endurance, resistance to ag(e)ing, moisture resistance and electrical insulating property, simultaneously easy-formation easy to use.
Below " one-component siloxane polymer resin glue " abbreviated as " resin glue "; Resin glue is packed in the syringe of point gum machine; Adopt micro-processor controlled point gum machine with resin glue according to predefined pattern application on the PCB substrate; Just curing molding when resin glue absorbs moisture in air after forms one-component siloxane polymer resin glue frame.Through the size of choice point plastic pin pipe diameter and the pressure in the syringe, the width of the one-component siloxane polymer resin glue frame of may command point gum forming and height.For height and the accurate one-component siloxane polymer of width requirement resin glue frame, in 0.1～0.5mm scope, also can adopt silk-screen printing technique that one-component siloxane polymer resin glue slurry is printed moulding by designed patterns like live width.
According to application need; Also can in resin glue, add a certain amount of nanoparticle filler and comprise titanium oxide etc. with high reflectance; Can obtain to have the frame of high reflectance; More than 90%, can be used for the manufacturing of the high efficiency White-light LED illumination module of planar package COB like the reflectivity of the visible light of 400～700nm scope.Also can in resin glue, add a certain amount of nanoparticle filler with high absorptance; Like carbon black etc.; The one-component siloxane polymer resin glue frame that obtains has high extinction characteristic; As at the absorptivity of the visible light of 400～700nm scope more than 60%, can be used for the manufacturing of the LED display modules of all kinds such as R, G, B of large tracts of land, high-resolution COB encapsulation.
As shown in Figure 1, PCB substrate 1 is a rectangle, and one-component siloxane polymer resin glue frame 2 also is a rectangle.The layout of one-component siloxane polymer resin glue frame 2 is imported in the control program of point gum machine in advance, and definite gluing starting point and route.When being coated with frame, point gum machine begins the one-component siloxane polymer resin glue of quick-setting white is applied to the surface of PCB substrate 1 according to preset data from starting point, finally accomplish whole pattern after, form one-component siloxane polymer resin glue frame 2.As required, the height of one-component siloxane polymer resin glue frame 2 can be controlled at 0.5～2.0mm scope.Play barrier effect in the transparent embedding of follow-up coating high fluidity during with silica gel, guarantee that embedding spreads formation silica gel layer in the zone that one-component siloxane polymer resin glue frame 2 is drawn a circle to approve equably with silica gel.
As shown in Figure 2, PCB substrate 1 is square, and one-component siloxane polymer resin glue frame 2 is circular.The layout of one-component siloxane polymer resin glue frame 2 is imported in the control program of point gum machine in advance, and definite gluing starting point and route.When being coated with frame, point gum machine begins quick-setting one-component siloxane polymer resin glue is applied to the surface of PCB substrate 1 according to preset data from starting point, finally accomplish whole pattern after, form one-component siloxane polymer resin glue frame 2.As required, the height of one-component siloxane polymer resin glue frame 2 can be controlled at 0.5～2.0mm scope.Play barrier effect in the transparent embedding of follow-up coating high fluidity during with silica gel, guarantee that embedding is evenly distributed in the zone that one-component siloxane polymer resin glue frame 2 drawn a circle to approve with silica gel, and form silica gel layer.
Embodiment 3
As shown in Figure 3; PCB substrate 1 adopts circular PCB substrate; " one-component siloxane polymer resin glue frame " abbreviates " frame " as and is made as grid, and frame 2 is imported in the control program of point gum machine in advance by designed patterns after, point gum machine is coated on one-component siloxane polymer resin glue on the surface of PCB substrate 1; Behind the whole pattern of final completion, form whole frame.As required, the rim height of the frame of grid can be at 0.2～1mm, and the outer rim height of the frame of grid can be at 0.5～2mm.
Adopt the fluorescent material of different proportionings can obtain the LED of different-colour.In this example with being separated into 9 blockages in the frame; Can pour into the embedding that is mixed with high colour temperature fluorescent material of 6500k and the low colour temperature fluorescent material of 2700k respectively respectively in the zone of mark a and b and use silica gel; Because the existence of rim; Two kinds of silica gel that contain different proportioning fluorescent material can not mix, and have guaranteed the accuracy of each regional colour temperature.After to the fluorescent material baking-curing, can optionally pour into embedding for the second time and use silica gel, because outer rim is higher than rim, embedding can be in the zone that outer rim limits with silica gel but cover rim, with each sub regions formation silica gel layer that is connected as a single entity.
This integrated packaged LED module has been because self comprised the submodule of two kinds of colour temperatures of height, and this two kinds of submodules can regulate respectively through external circuit, and the module whole colour temperature can realize from 2700k～6500k adjustable continuously.
Embodiment 4
As shown in Figure 4; PCB substrate 1 adopts rectangular PCB substrate; One-component siloxane polymer resin glue frame 2 also adopts square grid; The layout of one-component siloxane polymer resin glue frame 2 adopts silk screen seal technology or gluing process that quick-setting one-component siloxane polymer resin glue is applied to the surface of PCB substrate 1, finally accomplish whole pattern after, form one-component siloxane polymer resin glue frame 2.Added a certain amount of carbon black in this example in the used one-component siloxane polymer resin glue and constituted the one-component siloxane polymer resin glue of black with high absorptance; As required; The height of one-component siloxane polymer resin glue frame 2 can be controlled at 0.5～2.0mm scope, and the width of one-component siloxane polymer resin glue frame 2 can be controlled at 0.6～6mm.Play barrier effect in the transparent embedding of follow-up coating high fluidity during with silica gel, guarantee that silica gel is evenly distributed in the zone that housing limited of one-component siloxane polymer resin glue frame 2, and form silica gel layer.
One group of RGB three-color LED chip all is installed in each grid area of one-component siloxane polymer resin glue frame 2; Because the existence of dark border; The light of adjacent area can the phase mutual interference, and externally under the driving of drive circuit, the whole LED module can realize the demonstration of high-contrast.Through coating technique, the area of each grid can be littler than the common employing macromolecule of light-emitting diode display mold pressing barrier, thereby have higher resolution.
Claims (2)
1. improved integrated packaged LED module; Comprise PCB substrate, led chip, silica gel layer, frame; It is characterized in that: the one-component siloxane polymer resin glue frame of described frame on the PCB substrate, being coated with by the figure of setting, described one-component siloxane polymer resin glue frame is geometric form or irregular shape.
2. a kind of improved integrated packaged LED module as claimed in claim 1 is characterized in that: when one-component siloxane polymer resin glue frame adopts the grid in the geometric form, be respectively equipped with the silica gel layer of different-colour in the different grid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203519642U CN202231056U (en) | 2011-09-20 | 2011-09-20 | Improved integrally-packaged light-emitting diode (LED) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203519642U CN202231056U (en) | 2011-09-20 | 2011-09-20 | Improved integrally-packaged light-emitting diode (LED) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202231056U true CN202231056U (en) | 2012-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203519642U Expired - Lifetime CN202231056U (en) | 2011-09-20 | 2011-09-20 | Improved integrally-packaged light-emitting diode (LED) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202231056U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000875A1 (en) * | 2016-06-30 | 2018-01-04 | 广州兴森快捷电路科技有限公司 | Package substrate and manufacturing method therefor |
-
2011
- 2011-09-20 CN CN2011203519642U patent/CN202231056U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000875A1 (en) * | 2016-06-30 | 2018-01-04 | 广州兴森快捷电路科技有限公司 | Package substrate and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120523 |