CN202230429U - Heat radiating air channel structure and electronic device - Google Patents
Heat radiating air channel structure and electronic device Download PDFInfo
- Publication number
- CN202230429U CN202230429U CN2011203503184U CN201120350318U CN202230429U CN 202230429 U CN202230429 U CN 202230429U CN 2011203503184 U CN2011203503184 U CN 2011203503184U CN 201120350318 U CN201120350318 U CN 201120350318U CN 202230429 U CN202230429 U CN 202230429U
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- China
- Prior art keywords
- channel structure
- thermal source
- heat dissipation
- wind channel
- electronic installation
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Abstract
The utility model provides a heat radiating air channel structure which is used for cooling a heat source of an electronic device. The heat radiating air channel comprises a fan, a flexible channel and an air inlet, wherein the flexible channel is arranged on the heat source, one end of the flexible channel is connected with the fan, and the other end of the flexible channel faces the air inlet; the fan generates negative pressure, sucks cold air from the air inlet, and cools the heat source via the flexible channel. Therefore, in the heat radiating air channel structure, the rotating fan generates the negative pressure, sucks the cold air from the air inlet, and cools the heat source via the flexible channel; the flexible channel has a seal structure and is soft; and the heat emitted by the heat source is sucked when the cold air passes through the flexible channel, so that the temperature of the heat source is lowered, a user' s hand can not feel obvious burn sensation when touching the heat source area (mainly relating to a Touch Pad, and a touch board), and the comfort level of the hand is adapted.
Description
Technical field
The utility model relates to electronic product, relates in particular to a kind of heat dissipation wind channel structure of computer.
Background technology
People are when using electronic installation such as notebook computer; The maximum place of hand contact is hand rest, Touch Pad (Trackpad) and the keyboard of computer, and these local temperature just will directly influence people's comfort level, the Touch Pad of the notebook computer difficult processing of dispelling the heat usually; And the Touch Pad position radiating treatment method of existing notebook computer is: increase the distance of mainboard and Touch Pad and do not arrange that thermal source is below Touch Pad; But the temperature of Touch Pad generally still can reach about 40 °, gives a kind of scorching hot sensation of hand; Had a strong impact on the comfort level of staff; Simultaneously, also make the thickness of notebook computer increase, make the layout of thermal source be restricted owing to increase the distance of mainboard and Touch Pad.
The utility model content
The purpose of the utility model is to overcome the defective of prior art, and a kind of heat dissipation wind channel structure is provided, and the temperature that it can reduce Trackpad has reduced the thickness of electronic installation, and simultaneously, the pattern of heat sources may in the electronic installation also no longer receives any restriction.
The utility model is achieved in that a kind of heat dissipation wind channel structure, is used for the thermal source heat radiation of an electronic installation; It is characterized in that; Said heat dissipation wind channel structure comprises fan, soft passage and air inlet, and said soft passage is located on the said thermal source, and the one of which end connects said fan; The other end is facing to said air inlet, and said fan produces negative pressure and passes through said soft passage so that said thermal source is dispelled the heat from said air inlet suction cold air.
Further, said soft passage is that foam or sponge or colloid are processed.
Further, said heat dissipation wind channel structure also comprises facing to said fan to discharge the air outlet of hot-air.
Further, said soft passage is " ∩ " shape.
The utility model also provides a kind of electronic installation, comprises above-mentioned heat dissipation wind channel structure.
Further, said electronic installation also comprises the loam cake that mainboard cooperates with said mainboard, and said heat dissipation wind channel structure is located between said mainboard and the said loam cake.
Further, said electronic installation is notebook computer or panel computer or household electrical appliance.
Further, said thermal source is located on the said mainboard.
Further, said thermal source is hand rest and/or the keyboard and/or the Trackpad of notebook computer.
The utility model heat dissipation wind channel structure rotates to produce negative pressure through fan; And from said air inlet suck cold air through said soft passage so that said thermal source is dispelled the heat; Soft passage is hermetically-sealed construction and softer, and the heat that cold air is drawn in the said thermal source through said soft passage reduces its temperature to reach, and makes staff when touching this zone (being mainly Touch Pad, Trackpad) at thermal source place; Staff is imperceptible significantly scorching hot, to adapt to the comfort level of staff.Simultaneously, because the space of said soft passage institute layout is bigger, said thermal source can be distributed in this space arbitrarily, and the layout of said thermal source can not be affected; With in the prior art through increase between thermal source and mainboard distance with high-power electronic devices and components be not set below Touch Pad (Trackpad), compare; The utility model electronic installation utilizes said soft passage so that said thermal source is dispelled the heat; Needn't increase the distance between thermal source and mainboard, the slimming that utilizes said electronic installation is more arranged.
Description of drawings
Fig. 1 is the schematic top plan view of the utility model embodiment electronic installation.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Referring to Fig. 1; The utility model embodiment provides a kind of heat dissipation wind channel structure 11, is used for thermal source 12 heat radiations of an electronic installation 1, and said heat dissipation wind channel structure 11 comprises fan 111, soft passage 112 and air inlet 113; Said soft passage 112 is located on the said thermal source 12; The one of which end connects said fan 111, and the other end is facing to said air inlet 113, and said fan 111 produces negative pressure and passes through said soft passage 112 so that said thermal source 12 is dispelled the heat from said air inlet 113 suction cold airs.
Like this, heat dissipation wind channel structure 11 rotates the pressure that can make in the said electronic installation 1 less than ambient pressure, to produce negative pressure through fan 111; And from said air inlet 113 suction cold airs; The cold air said soft passage 112 of flowing through, so that the said thermals source 12 that are located at below the said soft passage 112 are dispelled the heat, said soft passage 112 is hermetically-sealed construction and softer; The heat that cold air is drawn in the said thermal source 12 through said soft passage 112 reduces its temperature to reach; Make staff when touching this zone (being mainly Touch Pad, Trackpad) at thermal source 12 places, staff is imperceptible significantly scorching hot, to adapt to the comfort level of staff.Simultaneously, because the space of 112 layouts of said soft passage is bigger, said thermal source 12 can be distributed in this space arbitrarily, and the layout of said thermal source 12 can not be affected; With in the prior art through increase between thermal source and mainboard distance with high-power electronic devices and components be not set below Touch Pad (Trackpad), compare; The utility model electronic installation utilizes said soft passage 112 so that said thermal source 12 is dispelled the heat; Needn't increase the distance of 13 of thermal source 12 and mainboards, the slimming that utilizes said electronic installation 1 is more arranged.
See also Fig. 1, a kind of specific embodiment of the heat dissipation wind channel structure 11 that provides as the utility model, said soft passage 112 is processed for foam or sponge or colloid.Said soft passage 112 is the shape that subsides, and shape roughly is " ∩ " shape, stick on the said thermal source 12, with corral from said fan 111 to this zone the said air inlet 113.The said soft passage 112 of present embodiment is preferably foam, is to paste convenient, advantages of cheap price because foam has.
Please again referring to Fig. 1, a kind of specific embodiment of the heat dissipation wind channel structure 11 that provides as the utility model, said heat dissipation wind channel structure 11 also comprises facing to said fan 111 to discharge the air outlet 114 of hot-air.The position of said air outlet 114 is arranged near the said fan 111; As long as reach the effect of discharging hot-air, the setting of said air outlet 114 has avoided said electronic installation 1 inside owing to hot-air row does not come out to cause heat too high to influence internal electronic element.
The utility model also provides a kind of electronic installation 1; Comprise above-mentioned heat dissipation wind channel structure 11, said in the present embodiment electronic installation 1 is a kind of notebook computer, certainly; Also can be computer or panel computer, the household electrical appliance etc. of other type, be all the scope that the utility model is protected.
Further, referring to Fig. 1, said electronic installation 1 also comprises the loam cake 14 that mainboard 13 cooperates with said mainboard 13, and said heat dissipation wind channel structure 11 is located between said mainboard 13 and the said loam cake 14.Said fan 111 is arranged near said air outlet 114 places, and with the convenient hot-air of discharging, said thermal source 12 is located on the said mainboard 13, and particularly, said thermal source is hand rest and/or the keyboard and/or the Trackpad of notebook computer.Need to prove; Actual at electronic installation 1 internal heat resource is some high-power electronic devices and components; Because the hand rest of computer, keyboard, Trackpad etc. are arranged on the electronic devices and components, can make hand rest, keyboard, the Trackpad of these computers be equivalent to a kind of indirect thermal source through the heat transmission.
The above is merely the utility model preferred embodiment; Its structure is not limited to the above-mentioned shape of enumerating; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (9)
1. heat dissipation wind channel structure; Be used for the thermal source heat radiation of an electronic installation, it is characterized in that said heat dissipation wind channel structure comprises fan, soft passage and air inlet; Said soft passage is located on the said thermal source; The one of which end connects said fan, and the other end is facing to said air inlet, and said fan produces negative pressure and passes through said soft passage so that said thermal source is dispelled the heat from said air inlet suction cold air.
2. heat dissipation wind channel structure as claimed in claim 1 is characterized in that: said soft passage is that foam or sponge or colloid are processed.
3. heat dissipation wind channel structure as claimed in claim 1 is characterized in that: also comprise facing to said fan to discharge the air outlet of hot-air.
4. heat dissipation wind channel structure as claimed in claim 1 is characterized in that: said soft passage is " ∩ " shape.
5. an electronic installation is characterized in that: comprise like each described heat dissipation wind channel structure in the claim 1 to 4.
6. electronic installation as claimed in claim 5 is characterized in that: also comprise the loam cake that mainboard cooperates with said mainboard, said heat dissipation wind channel structure is located between said mainboard and the said loam cake.
7. electronic installation as claimed in claim 5 is characterized in that: said electronic installation is notebook computer or panel computer or household electrical appliance.
8. electronic installation as claimed in claim 6 is characterized in that: said thermal source is located on the said mainboard.
9. like claim 7 or 8 described electronic installations, it is characterized in that: said thermal source is hand rest and/or the keyboard and/or the Trackpad of notebook computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203503184U CN202230429U (en) | 2011-09-19 | 2011-09-19 | Heat radiating air channel structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203503184U CN202230429U (en) | 2011-09-19 | 2011-09-19 | Heat radiating air channel structure and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202230429U true CN202230429U (en) | 2012-05-23 |
Family
ID=46081011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203503184U Expired - Fee Related CN202230429U (en) | 2011-09-19 | 2011-09-19 | Heat radiating air channel structure and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202230429U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103116391A (en) * | 2012-12-31 | 2013-05-22 | 联宝(合肥)电子科技有限公司 | Centralized heat dissipation method and cooling system of computer cooling system |
| CN103149992A (en) * | 2012-12-28 | 2013-06-12 | 联宝(合肥)电子科技有限公司 | Fan tandem type heat dissipation method and fan tandem type heat dissipation system |
| CN104656861A (en) * | 2015-03-02 | 2015-05-27 | 朱金凤 | High-sealing air suction type heat radiator |
| CN105116983A (en) * | 2015-10-02 | 2015-12-02 | 汪凯 | Novel heat dissipation module |
-
2011
- 2011-09-19 CN CN2011203503184U patent/CN202230429U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103149992A (en) * | 2012-12-28 | 2013-06-12 | 联宝(合肥)电子科技有限公司 | Fan tandem type heat dissipation method and fan tandem type heat dissipation system |
| CN103116391A (en) * | 2012-12-31 | 2013-05-22 | 联宝(合肥)电子科技有限公司 | Centralized heat dissipation method and cooling system of computer cooling system |
| CN103116391B (en) * | 2012-12-31 | 2016-05-04 | 联宝(合肥)电子科技有限公司 | The concentrated heat dissipating method of computer system and concentrated cooling system |
| CN104656861A (en) * | 2015-03-02 | 2015-05-27 | 朱金凤 | High-sealing air suction type heat radiator |
| CN104656861B (en) * | 2015-03-02 | 2017-10-10 | 朱金凤 | High sealing air-draft-type radiator |
| CN105116983A (en) * | 2015-10-02 | 2015-12-02 | 汪凯 | Novel heat dissipation module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120523 Termination date: 20120919 |