CN202213143U - Photoelectric switch shell injection mould - Google Patents

Photoelectric switch shell injection mould Download PDF

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Publication number
CN202213143U
CN202213143U CN2011203053360U CN201120305336U CN202213143U CN 202213143 U CN202213143 U CN 202213143U CN 2011203053360 U CN2011203053360 U CN 2011203053360U CN 201120305336 U CN201120305336 U CN 201120305336U CN 202213143 U CN202213143 U CN 202213143U
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CN
China
Prior art keywords
plate
fixed
mould
moving
ejector
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203053360U
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Chinese (zh)
Inventor
郎志伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DALIAN YONGTAI PRECISION INDUSTRY Co Ltd
Original Assignee
DALIAN YONGTAI PRECISION INDUSTRY Co Ltd
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Priority to CN2011203053360U priority Critical patent/CN202213143U/en
Application granted granted Critical
Publication of CN202213143U publication Critical patent/CN202213143U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A photoelectric switch shell injection mould comprises a positioning ring, a sprue bush, a fixed mould bottom plate, a movable mould bottom plate, a fixed mould plate, a movable mould plate, a fixed mould insert, a movable mould insert, a guide post and a guide sleeve. The fixed mould plate is fixed onto the fixed mould bottom plate, the movable mould plate is used for fixing a movable mould support plate, a mould leg and the movable mould bottom plate together through bolts, the fixed mould insert and the movable mould insert are fixed onto the fixed mould plate and the movable mould plate respectively, the guide post is mounted in the guide sleeve and respectively fixed onto the fixed mould bottom plate and the movable mould bottom plate, an ejector retainer plate and an ejector plate are mounted in the mould leg, an ejector pin and a reset lever are mounted on the ejector plate, a bottom plate guide sleeve is mounted on the ejector plate and the ejector retainer plate, a bottom plate guide post is mounted in the bottom plate guide sleeve and fixed onto the movable mould bottom plate, the ejector retainer plate vertically slides along the bottom plate guide post, the sprue bush and the positioning ring are fixed onto the movable mould bottom plate, and quick change water nozzles connected with a cooling water channel are arranged on both the fixed mould insert and the movable mould insert. The photoelectric switch shell injection mould is high in production efficiency, less in loss on defective products, high in product precision and low in cost.

Description

A kind of optoelectronic switch housing injection mold
Technical field
The utility model relates to the plastic products injection mold, particularly relates to a kind of optoelectronic switch housing injection mold.
Background technology
Optoelectronic switch housing volume is little, and wall thickness is very high to mould design and processing request.The accurate poor location of injection mold in the past, heat-insulating property difference cause fills difficulty, and goods are peeked many people for cutting off the error of goods cast gate in the mould in addition, cause loss due to spoiled work high, and productivity ratio is low, increases cost of manufacture.
The utility model content
The technical problem that the utility model will solve, it is accurate to provide a kind of mold position, reduces the mold heat loss, and the goods yield rate is high, and goods separate with runner automatically enhances productivity, and reduces the optoelectronic switch housing injection mold of cost of manufacture.
The technical scheme that adopts is:
A kind of optoelectronic switch housing injection mold comprises locating ring, sprue bush, fixed clamping plate, moving clamping plate, solid plate, moving platen, cover half thermal insulation board, dynamic model thermal insulation board, fixed die insert, moving die insert, guide pillar, guide pin bushing.Described solid plate is fixed on the fixed clamping plate, and moving platen is fixed together dynamic model gripper shoe, mould leg and moving clamping plate through bolt.Fixed die insert is fixed on the solid plate, and moving die insert is fixed on the moving platen.Guide pillar is contained in and is separately fixed in the guide pin bushing on fixed clamping plate and the moving platen.In the said mould leg Ejector Retainer Plate and ejector retainner plate are housed, ejector retainner plate is fixed on the Ejector Retainer Plate, and thimble and release link are housed on the ejector retainner plate; Be set with buffer spring on its release link, the base plate guide pin bushing is housed on ejector retainner plate and the Ejector Retainer Plate, dress base plate guide pillar in the base plate guide pin bushing; The base plate guide pillar is fixed on the moving clamping plate; When pushing Ejector Retainer Plate, Ejector Retainer Plate and ejector retainner plate slide up and down along the base plate guide pillar, and ejector retainner plate is provided with limited post.Be installed with support column on the moving clamping plate, its support column passes Ejector Retainer Plate and ejector retainner plate withstands on the dynamic model gripper shoe.Be fixed with locating ring and sprue bush on the said fixed clamping plate, the sprue bush upper end is communicated with locating ring, and the lower end is communicated with injection molding channel.Be equipped with the quick change water nozzle that is connected the cooling water channel passage on said fixed die insert and the moving die insert.
Cover half thermal insulation board and dynamic model thermal insulation board are housed respectively on above-mentioned fixed clamping plate and the moving clamping plate outer surface.
The rubbish that draws that is fixed on the moving clamping plate is housed between above-mentioned Ejector Retainer Plate and the moving clamping plate to be followed closely.
Above-mentioned fixed die insert and moving die insert die joint are equipped with bolster stake.
Above-mentioned decide to insert and moving die insert four sides are provided with fine positioning assembly and locked mode plate.
The utility model adopts thermal insulation board to guarantee to have higher mold temperature, smoothly the filled articles die cavity.The fine positioning assembly has guaranteed the accurate location of goods die cavities, and yield rate is high, and is little to product volume; The many characteristics of mould peek adopt the injection molding channel charging of hiding, in ejecting the goods process; Goods separate with runner automatically, save the step of cutting off runner, have improved production efficiency; The loss due to spoiled work of avoiding the human operational error to cause has reduced cost.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Fig. 2 is A-A cutaway view of Fig. 1.
Fig. 3 is that the M of Fig. 1 is to view.
Fig. 4 is that the H of Fig. 1 is to view.
Fig. 5 is that the K of Fig. 2 is to partial view.
The specific embodiment
A kind of optoelectronic switch housing injection mold comprises locating ring 1, sprue bush 2, fixed clamping plate 19, moving clamping plate 11, solid plate 18, moving platen 17, cover half thermal insulation board 20, dynamic model thermal insulation board 10, cover half panelling 21, moving die insert 22, guide pillar 5, guide pin bushing 4.Described solid plate 18 is fixed on the fixed clamping plate 19, and moving platen 17 is fixed together dynamic model gripper shoe 16, mould leg 15 through bolt with moving clamping plate 11.Fixed die insert 21 is fixed on the solid plate 18, and moving die insert 22 is fixed on the moving platen 17.The die joint of fixed die insert 21 and moving die insert 22 all is equipped with bolster stake 25, and cover half thermal insulation board 20 and dynamic model thermal insulation board 10 are housed respectively on fixed clamping plate 19 and moving clamping plate 11 outer surfaces.Guide pillar 5 is contained in the guide pin bushing 4, is separately fixed on fixed clamping plate 19 and the moving platen 17.Ejector Retainer Plate 13 and ejector retainner plate 14 are housed in the said mould leg 15, and ejector retainner plate 14 is fixed on the Ejector Retainer Plate 13, and thimble 7 and release link 9 are housed on the ejector retainner plate 14; Be set with buffer spring 8 on its release link 9, on ejector retainner plate 14 and the Ejector Retainer Plate 13 base plate guide pin bushing 24 be housed, dress base plate guide pillars 23 in the base plate guide pin bushing 24; Base plate guide pillar 23 is fixed on the moving clamping plate 11; When pushing Ejector Retainer Plate 13, Ejector Retainer Plate and ejector retainner plate slide up and down along base plate guide pillar 23, and ejector retainner plate 14 is provided with limited post 26.Be installed with support column 27 on the moving clamping plate 11, its support column 27 passes Ejector Retainer Plate 13 and withstands on the dynamic model gripper shoe 16 with ejector retainner plate 14, the rubbish that draws that is fixed on the moving clamping plate 11 is housed between Ejector Retainer Plate 13 and the moving clamping plate 11 follows closely 12.Be fixed with locating ring 1 and sprue bush 2 on the said fixed clamping plate 19, sprue bush 2 upper ends are communicated with locating ring 1, and the lower end is communicated with injection molding channel.Be equipped with quick change water nozzle 3,6, four sides that are connected the cooling water channel passage on said fixed die insert 21 and the moving die insert 22 and be provided with fine positioning assembly 29 and locked mode plate 28, constitute a kind of optoelectronic switch housing injection mold.

Claims (5)

1. optoelectronic switch housing injection mold; Comprise locating ring (1), sprue bush (2), fixed clamping plate (19), moving clamping plate (11), solid plate (18), moving platen (17), fixed die insert (21), moving die insert (22), guide pillar (5), guide pin bushing (4); It is characterized in that described solid plate (18) is fixed on the fixed clamping plate (19), moving platen (17) is fixed together dynamic model gripper shoe (16), mould leg (15) through bolt with moving clamping plate (11), and fixed die insert (21) is fixed on the solid plate (18); Moving die insert (22) is fixed on the moving platen (17); Guide pillar (5) is contained in and is separately fixed in the guide pin bushing (4) on fixed clamping plate (19) and the moving platen (17), and Ejector Retainer Plate (13) and ejector retainner plate (14) are housed in the said mould leg (15), and ejector retainner plate (14) is fixed on the Ejector Retainer Plate (13); Thimble (7) and release link (9) are housed on the ejector retainner plate (14); Be set with buffer spring (8) on its release link (9), on ejector retainner plate (14) and the Ejector Retainer Plate (13) base plate guide pin bushing (24) be housed, dress base plate guide pillar (23) in the base plate guide pin bushing (24); Base plate guide pillar (23) is fixed on the moving clamping plate (11); When pushing Ejector Retainer Plate, Ejector Retainer Plate and ejector retainner plate slide up and down along base plate guide pillar (23), and ejector retainner plate is provided with limited post (26); Be installed with support column (27) on the moving clamping plate (11); Its support column (27) passes Ejector Retainer Plate (13) and ejector retainner plate (14) withstands on the dynamic model gripper shoe (16), is fixed with locating ring (1) and sprue bush (2) on the fixed clamping plate (19), and sprue bush (2) upper end is communicated with locating ring (1); The lower end is communicated with injection molding channel, is equipped with quick change water nozzle (3), (6) that are connected the cooling water channel passage on fixed die insert (21) and the moving die insert (22).
2. a kind of optoelectronic switch housing injection mold according to claim 1 is characterized in that on described fixed clamping plate (19) and moving clamping plate (11) outer surface cover half thermal insulation board (20) and dynamic model thermal insulation board (10) being housed respectively.
3. a kind of optoelectronic switch housing injection mold according to claim 1 is characterized in that being equipped with between described Ejector Retainer Plate (13) and the moving clamping plate (11) rubbish that draws that is fixed on the moving clamping plate (11) and follows closely (12).
4. a kind of optoelectronic switch housing injection mold according to claim 1 is characterized in that moving die insert (22) die joint of described fixed die insert (21) is equipped with bolster stake (25).
5. according to claim 1 or 4 described a kind of optoelectronic switch housing injection molds, it is characterized in that described fixed die insert (21) and moving die insert (22) four sides are provided with fine positioning assembly (29) and locked mode plate (28).
CN2011203053360U 2011-08-22 2011-08-22 Photoelectric switch shell injection mould Expired - Fee Related CN202213143U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203053360U CN202213143U (en) 2011-08-22 2011-08-22 Photoelectric switch shell injection mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203053360U CN202213143U (en) 2011-08-22 2011-08-22 Photoelectric switch shell injection mould

Publications (1)

Publication Number Publication Date
CN202213143U true CN202213143U (en) 2012-05-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203053360U Expired - Fee Related CN202213143U (en) 2011-08-22 2011-08-22 Photoelectric switch shell injection mould

Country Status (1)

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CN (1) CN202213143U (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689421A (en) * 2012-06-14 2012-09-26 洛阳力诺模具有限公司 Secondary ejection mechanism of connector shell mould for aerospace
CN103009507A (en) * 2012-10-22 2013-04-03 苏州市吴中区木渎华利模具加工店 Moulding plastic mould for forward-acting door cover of washing machine
CN103101159A (en) * 2013-02-21 2013-05-15 昆山科海模具有限公司 Plastic injection mold base
CN103407068A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Zinc alloy injection mold
CN103407089A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Improved hot-nozzle and hot-runner injection mold
CN103407064A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Hot nozzle injection mold
CN103407070A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Improved hot-nozzle injection mold
CN103921404A (en) * 2014-05-08 2014-07-16 昆山腾宇鑫金属制品有限公司 Relay switch mold
CN104354265A (en) * 2014-10-27 2015-02-18 苏州广型模具有限公司 Injection compression mould for aspheric plastic lenses
CN109435146A (en) * 2018-12-31 2019-03-08 欣灵电气股份有限公司 Optoelectronic switch and its production technology and corresponding production mould

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689421A (en) * 2012-06-14 2012-09-26 洛阳力诺模具有限公司 Secondary ejection mechanism of connector shell mould for aerospace
CN103009507A (en) * 2012-10-22 2013-04-03 苏州市吴中区木渎华利模具加工店 Moulding plastic mould for forward-acting door cover of washing machine
CN103101159A (en) * 2013-02-21 2013-05-15 昆山科海模具有限公司 Plastic injection mold base
CN103407068A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Zinc alloy injection mold
CN103407089A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Improved hot-nozzle and hot-runner injection mold
CN103407064A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Hot nozzle injection mold
CN103407070A (en) * 2013-07-14 2013-11-27 太仓市上阳机械有限公司 Improved hot-nozzle injection mold
CN103921404A (en) * 2014-05-08 2014-07-16 昆山腾宇鑫金属制品有限公司 Relay switch mold
CN104354265A (en) * 2014-10-27 2015-02-18 苏州广型模具有限公司 Injection compression mould for aspheric plastic lenses
CN109435146A (en) * 2018-12-31 2019-03-08 欣灵电气股份有限公司 Optoelectronic switch and its production technology and corresponding production mould
CN109435146B (en) * 2018-12-31 2023-04-25 欣灵电气股份有限公司 Photoelectric switch and production process thereof and corresponding production die

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120509

Termination date: 20130822