CN202213069U - Device for reducing pollution of iron powder impurities on surface of cut silicon wafer - Google Patents
Device for reducing pollution of iron powder impurities on surface of cut silicon wafer Download PDFInfo
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- CN202213069U CN202213069U CN2011203323124U CN201120332312U CN202213069U CN 202213069 U CN202213069 U CN 202213069U CN 2011203323124 U CN2011203323124 U CN 2011203323124U CN 201120332312 U CN201120332312 U CN 201120332312U CN 202213069 U CN202213069 U CN 202213069U
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Abstract
The utility model discloses a device for reducing the pollution of iron powder impurities on the surface of a cut silicon wafer. The device comprises a mortar cylinder; and magnets are arranged on the inner side and the outer side of the same position of the mortar cylinder, and are positioned at parts close to the bottom surface of the mortar cylinder. Compared with the prior art, the utility model has the advantages that the structure is simple, the operation is easy, the cost is low, the pollution to the silicon wafer due to metallic impurities can be reduced, the physical property of the surfaces of the silicon wafer is ensured, and the production yield is improved.
Description
Technical field
The utility model relates to the solar silicon wafers processing industry, specifically relates to a kind of device that reduces cutting back silicon chip surface iron powder impurity.
Background technology
In the solar silicon wafers processing industry, what adopt during the cutting silicon ingot is the steel wire cutting method at present, cuts silicon ingot to obtain the silicon chip of respective thickness through the high-speed friction of steel wire and silicon ingot.Because steel wire and the long high-speed friction of silicon ingot make the steel wire surface also receive heavy wear, ferrous powder granules can mix in the mortar; Continuous circulation along with mortar; Make cutting back silicon chip surface adhere to iron powder impurity, the pollution of iron powder impurity is easy to make silicon chip to form short circuit and opens circuit, and influences the formation of its geometric properties; The silicon chip performance brought seriously influence very much, reduce its service life greatly.
The utility model content
Goal of the invention: in order to solve the deficiency of prior art, the utility model provides a kind of reduction simple in structure, easy to use to cut the device of back silicon chip surface iron powder impurity, and this device can reduce the pollution of metal impurities to silicon chip.
Technical scheme: in order to realize above purpose, the device of the described reduction cutting of the utility model back silicon chip surface iron powder impurity comprises the mortar cylinder, is provided with magnet in the inboard and the outside of the same position of mortar cylinder.
Described magnet preferably is located at the mortar cylinder and is located near the bottom surface, because metal impurities density is bigger, can accumulate in mortar cylinder bottom portion, so near the magnet adsorption effect bottom is better.
In order to guarantee that magnet has the ability of carrying very strong absorption ferrous powder granules, and can use for a long time, described magnet is preferably the permanent magnetism rigid magnet.
In order to guarantee that magnet has ferromagnetism, described magnet is cylindrical.
In order to make magnet obtain the effect of best absorption metal impurities, said magnet is provided with 5～6 pairs, is evenly distributed on the same circumference of mortar cylinder.
Beneficial effect: the utility model compared with prior art has the following advantages: simple in structure, processing ease, cost are low, can reduce the pollution of metal impurities to silicon chip, guarantee its geometrical performance, improve the production yields.
Description of drawings
Fig. 1 is the front view of the utility model;
Fig. 2 is the vertical view of the utility model.
The specific embodiment:
Below in conjunction with accompanying drawing and specific embodiment; Further illustrate the utility model; Should understand these embodiment only be used to the utility model is described and be not used in the restriction the utility model scope; After having read the utility model, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the various equivalents or the modification of the utility model.
Like Fig. 1, shown in 2; The device of the described reduction cutting of the utility model back silicon chip surface iron powder impurity; Comprise mortar cylinder 1, be provided with mixer 3 and paddle 4 in this mortar cylinder 1, be provided with internal magnet 21 in the inboard of the same position of mortar cylinder 1; The outside is provided with external magnet 22, thereby fixes through the effect that these pair of magnet 2 the two poles of the earth attract each other.Wherein, magnet 2 is the permanent magnetism rigid magnet, for cylindrical, is provided with 5 pairs altogether, is located at mortar cylinder 1 near the place, bottom surface, is evenly distributed on the same circumference of mortar cylinder 1.
The utility model starts mixer 3 in use, drives paddle 4 and stirs mortar, and the iron tramp in the mortar is along with stirring can be adsorbed on the internal magnet 21.When adopting the heavy 50kg steel wire of length 480km to cut, the steel wire diameter before the cutting is 130 μ m, and cutting back steel wire diameter is 120 μ m, and through calculating, wearing and tearing back steel wire weight is 120
2/ 130
2* 50=42.5kg, the weight of iron tramp is about 7.5kg.After adopting this device, absorption impurity weight is 5kg nearly, and adsorption rate is about 70%, and is very obvious to the effect that reduces the iron powder contaminating impurity.After finishing using, external magnet 22 is drawn back, internal magnet 21 drops naturally, and it is simple to disassemble convenience for washing.
The foregoing description only is the technical conceive and the characteristics of explanation the utility model, its objective is to let to be familiar with the also enforcement according to this of content that these those skilled in the art can understand the utility model, can not limit the protection domain of the utility model with this.All equivalents or modifications of having done according to the utility model spirit all should be encompassed within the protection domain of the utility model.
Claims (6)
1. a device that reduces cutting back silicon chip surface iron powder impurity comprises mortar cylinder (1), it is characterized in that: the inboard and the outside at the same position of said mortar cylinder (1) are provided with magnet (2).
2. the device of reduction cutting according to claim 1 back silicon chip surface iron powder impurity, it is characterized in that: described magnet (2) is located at mortar cylinder (1) and is located near the bottom surface.
3. the device of reduction cutting according to claim 1 and 2 back silicon chip surface iron powder impurity, it is characterized in that: described magnet (2) is the permanent magnetism rigid magnet.
4. the device of reduction cutting according to claim 1 and 2 back silicon chip surface iron powder impurity, it is characterized in that: described magnet (2) is for cylindrical.
5. the device of reduction cutting according to claim 1 back silicon chip surface iron powder impurity, it is characterized in that: said magnet (2) is provided with 5～6 pairs.
6. the device of reduction cutting according to claim 5 back silicon chip surface iron powder impurity, it is characterized in that: said magnet (2) is evenly distributed on the same circumference of mortar cylinder (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203323124U CN202213069U (en) | 2011-09-06 | 2011-09-06 | Device for reducing pollution of iron powder impurities on surface of cut silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203323124U CN202213069U (en) | 2011-09-06 | 2011-09-06 | Device for reducing pollution of iron powder impurities on surface of cut silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202213069U true CN202213069U (en) | 2012-05-09 |
Family
ID=46012338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203323124U Expired - Fee Related CN202213069U (en) | 2011-09-06 | 2011-09-06 | Device for reducing pollution of iron powder impurities on surface of cut silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202213069U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538158A (en) * | 2013-09-18 | 2014-01-29 | 浙江工业大学 | Magnetic abrasive fretsaw cutting method |
| CN105538529A (en) * | 2015-12-01 | 2016-05-04 | 安徽天思朴超精密模具股份有限公司 | Cooling device for wire cutting machine |
-
2011
- 2011-09-06 CN CN2011203323124U patent/CN202213069U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538158A (en) * | 2013-09-18 | 2014-01-29 | 浙江工业大学 | Magnetic abrasive fretsaw cutting method |
| CN103538158B (en) * | 2013-09-18 | 2016-02-03 | 浙江工业大学 | Magnetic abrasive wiresaw cutting method |
| CN105538529A (en) * | 2015-12-01 | 2016-05-04 | 安徽天思朴超精密模具股份有限公司 | Cooling device for wire cutting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20180906 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |