CN202195308U - Semiconductor lighting lamp with external heat radiation device - Google Patents
Semiconductor lighting lamp with external heat radiation device Download PDFInfo
- Publication number
- CN202195308U CN202195308U CN2011202835197U CN201120283519U CN202195308U CN 202195308 U CN202195308 U CN 202195308U CN 2011202835197 U CN2011202835197 U CN 2011202835197U CN 201120283519 U CN201120283519 U CN 201120283519U CN 202195308 U CN202195308 U CN 202195308U
- Authority
- CN
- China
- Prior art keywords
- heat
- lamp
- lamp housing
- outside
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a semiconductor lighting lamp with an external heat radiation device, which is characterized in that one parts of heat conductors are arranged in a lamp housing, the other parts of the heat conductors penetrate the lamp housing and extend to the outside of the lamp housing, an external radiator is arranged at the parts of the heat conductors outside the lamp housing, the number of the heat conductors is 1-6000, and the diameter of the heat conductors is 1mm-1000mm. The effective separation of a semiconductor light source from the external heat radiation device in the lamp housing is successfully realized, the quality and the functions are ensured, and the situation that all semiconductor street lamps need to be integrally replaced together with the semiconductor light sources and the lamps together in the past can be fundamentally changed; compared with the prior art, the semiconductor lighting lamp with the external heat radiation device has prominent substantive innovation characteristic and significant progress.
Description
Technical field
The utility model relates to the technical field of lighting cooling system, a kind of specifically semiconductor lamp that has outside heat abstractor, particularly its mechanical connecting structure.
Background technology
Documents, the patent No.: 200720125317.3, the applying date: 2007.07.26; The patentee: Lihong Science and Technology Co., Ltd., notification number: CN201072050, this case discloses a kind of " heat radiating device of road lamp "; Comprise a light cover, a heat dissipation metal plate, an electroluminescent lamp group, a transparent lamp shade, a plurality of heat pipe and a plurality of retaining element, this light cover is a hollow housing, and the both sides of light cover respectively are provided with a radiating part; And in radiating part, establish an embedding hole in order to the intercalation heat pipe; And this transparent lamp shade also is a hollow housing, and a side is established a plane in order to the electroluminescent lamp group to be set, and on the position that the electroluminescent lamp group will be set on this plane, offers one and pass through groove in order to the electroluminescent lamp group is embedded; And around this passes through groove, offering a plurality of fixing holes is fixed on the transparent lamp shade in order to via retaining element heat dissipation metal plate, electroluminescent lamp group and heat pipe are established; Wherein, this heat dissipation metal plate is stacked on the electroluminescent lamp group through retaining element, and an end of heat pipe then is located in the middle of heat dissipation metal plate and the electroluminescent lamp group.
Be not difficult to find out that from documents existing a kind of mode of semiconductor lamp is to adopt the metal shell of conventional lamp to come passive heat radiation, this shell system is processed by the die casting aluminium material; Its thermal conductivity factor is not high, and area of dissipation is not enough, under sealing state, can't realize convection current; Can not satisfy the specific (special) requirements of semiconductor lamp to heat radiation; Radiating effect is not satisfactory, can't realize heat sinking function, and particularly some large-power semiconductor illuminating lamp caloric values are very big; The lamp housing of sealing can't in time dispel the heat, and has produced many problems; Also having a kind of mode is directly to make the lamp holder assembly that has a lot of heat radiating fin structures with extruded aluminium section, though this kind structure can play certain radiating effect, light fixture is very heavy stiff; Be difficult to carry out manufacturing and designing of different lamps profile; Make whole light fixture profile very not attractive in appearance, do not meet the esthetic requirement of people, and cost is high light fixture; Maintenance cost is also very high; In case light fixture breaks down or damages, just need to change whole lamp holder (comprising heat sink assembly), influenced promoting the use of of semiconductor lighting to a certain extent.
Because the defective of above-mentioned technology, so still need further improve existing lamp cooling structure.
The utility model content
The purpose of the utility model is to provide a kind of semiconductor lamp that has outside heat abstractor; Break through existing design limitation fully; Main purpose is creatively to provide a kind of semiconductor lamp that has split type radiator structure, and it is made up of lamp casing, heat carrier and outside heat abstractor, and heat carrier directly penetrates lamp casing; The heat of lamp interior is conducted on the outside heat abstractor; Carry out outside passive heat radiation, thus realized semiconductor light sources in lamp housing with effective separation of outside heat abstractor, reach very better heat radiating effect; When safeguarding, only need to change internal light source and get final product, effectively reduce maintenance cost if take place semiconductor light sources to damage; Can under the prerequisite that keeps original shell, carry out light source part to various light fixtures such as original street lamp, Tunnel Lamp, floodlight and high well lamps freely replaces; Also can carry out free innovative design and manufacturing to light fixture; Has good light fixture appearance and modeling effect; Fundamentally overcome a series of shortcoming and defect that existing semiconductor lamp exists at aspects such as heat sinking function, appearance and modeling, production and maintenance costs, and can realize various light fixtures freely replacing and combination function in conventional light source and semiconductor light sources.
To achieve these goals; The technical scheme of the utility model is: a kind of semiconductor lamp that has outside heat abstractor, and it mainly comprises lamp housing, it is characterized in that: the part that is provided with heat carrier in the said lamp housing; Another part of heat carrier penetrates lamp housing and extends to the lamp housing outside; Be positioned at the outside heat carrier place of lamp housing and be provided with external heat sink, the quantity of said heat carrier is the 1-6000 bar, and the diameter of heat carrier is 1mm-1000mm.
The utility model discloses a kind of semiconductor lamp that has outside heat abstractor, it adopts split type outside radiator structure, utilizes heat carrier directly to penetrate lamp casing; The heat of lamp interior is conducted on the outside heat abstractor, realize outside heat radiation, outside heat abstractor can be installed on lamp housing top or other position as required; Reach very better heat radiating effect, its innovative value has been to break through fully the limitation of existing various Design of Luminaires, and a kind of semiconductor lamp that has split type radiator structure is provided; Successfully realized semiconductor light sources effective separation with outside heat abstractor in lamp housing; When guaranteeing quality and function, fundamentally change all semiconductor road lamps in the past and all must semiconductor light sources have been carried out the situation of integral replacing with light fixture, can be in the implementation process that conventional road lamp is adopted semiconductor lighting transform; Needn't carry out integral replacing to former light fixture; Can keep part accessory such as original lamp housing and only change the Lights section and increase external heat abstractor and get final product, thereby greatly reduce the production and the cost of investment of light fixture, also make things convenient for the regular maintenance operation of semiconductor lighting street lamp simultaneously; Reduce its maintenance cost; Simultaneously, this radiating mode is that the free originality design of lamp outer casing provides than large space, can carry out personalized design according to customer requirements; Improve the integral body of product and beautify effect; And can realize various light fixtures freely the replacing and combination function of conventional light source and semiconductor light sources, thus improve the competitiveness of product in market, have outstanding substantive innovative characteristics and marked improvement compared to existing technologies.
Description of drawings
Fig. 1 is the utility model first example structure sketch map.
Fig. 2 is the external heat sink portion side view of Fig. 1.
Fig. 3 is the utility model second example structure sketch map.
Fig. 4 is the external heat sink portion side view of Fig. 3.
Fig. 5 is the utility model the 3rd example structure sketch map.
Fig. 6 is the side view of Fig. 5.
Fig. 7 is the utility model the 4th example structure sketch map.
Fig. 8 is the utility model the 5th example structure sketch map.
Fig. 9 is the external heat sink portion side view of Fig. 8.
Figure 10 is the utility model the 6th example structure sketch map.
Figure 11 is the utility model the 7th example structure sketch map.
Figure 12 is the utility model the 8th example structure sketch map.
Figure 13 is an external heat sink portion side view among Figure 12.
Figure 14 is the utility model the 9th example structure sketch map.
Figure 15 is an external heat sink portion side view among Figure 14.
Figure 16 is the utility model the tenth example structure sketch map.
Figure 17 is the utility model the 11 example structure sketch map.
Figure 18 is the utility model the 12 example structure sketch map.
Figure 19 is the utility model the 13 example structure sketch map.
The specific embodiment
With reference to the accompanying drawings, the utility model is further described
The utility model is a kind of semiconductor lamp that has outside heat abstractor; It mainly comprises lamp housing 1; It is different from prior art and is: be provided with the part of heat carrier 2 in the said lamp housing 1, another part of heat carrier 2 penetrates lamp housing 1 and extends to lamp housing 1 outside, is positioned at lamp housing 1 outside heat carrier 2 places and is provided with external heat sink 3; The quantity of said heat carrier 2 is the 1-6000 bar, and the diameter of heat carrier 2 is 1mm-1000mm.
In the specific implementation, said heat carrier 2 is metal heat-conducting pipe, metal heat-conducting rod, quartzy heat pipe, inorganic heat pipe, heat conduction raw material of wood-charcoal pipe, thermal conductive ceramic pipe.
In the specific implementation, said metal heat-conducting pipe, inorganic heat pipe, quartzy heat pipe inside all are vacuum state, wherein are provided with superconducting fluid or pure water in the metal heat-conducting pipe, are provided with the inorganic elements liquefied mixture in the inorganic heat pipe.
In the specific implementation; Heat carrier 2 places in the said lamp housing 1 are provided with semiconductor chip 4 or LED bulb 5; Semiconductor chip 4 or LED bulb 5 directly are overlying on the end of heat carrier 2; The light source heat is directly conducted to heat carrier 2, through heat carrier 2 heat is conducted to the outside external heat sink place of lamp housing again, carry out efficiently concentrating heat radiation.
In the specific implementation, said external heat sink 3 is fixed in lamp housing 1 outer wall place, and external heat sink 3 is metal material, heat conduction carbon material, thermal conductive ceramic material.
In the specific implementation; Said lamp housing 1 one ends are provided with lamp body cradling piece 6; External heat sink 3 is fixed in lamp body cradling piece 6 outer walls or lamp body cradling piece 6 outer wall places are fixed in socket; Because traditional lamp body cradling piece 6 is a metal material, have thermal conduction characteristic equally, can utilize this characteristic to share part heat conduction work.
In the specific implementation; Said external heat sink 3 is overlying on outside heat carrier 2 surfaces of lamp housing, and external heat sink can be tiny groups of fins, is overlying on the heat carrier surface equably; And be integral the formula structure with heat carrier, make outside radiating effect quick more, efficient, evenly.
Fig. 1 is a lamp post structure; It adopts single semiconductor chip as light source; And directly being overlying on inner heat carrier end, heat carrier forms " Z " font in lamp housing circuitous, passes from the lamp housing rear portion; The end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in lamp body cradling piece place.
Fig. 3 is a lamp post structure, and it adopts the plurality of LEDs bulb as light source, and adopts two heat carrier structures; Each LED bulb directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous, passes from the lamp housing rear portion, and the end of outside heat carrier is connected with external heat sink; External heat sink then is fixed in lamp body cradling piece surface through Ω type fixed support 7, and external heat sink is with the be placed in one heart and wrapping fully of whole lamp body cradling piece.
Fig. 5 is a lamp post structure; It adopts single semiconductor chip as light source; And directly being overlying on inner heat carrier end, heat carrier forms the right angle in lamp housing circuitous, passes from the lamp housing top; The end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing top through Ω type fixed support 7.
Fig. 7 is a lamp post structure; It adopts the plurality of LEDs bulb as light source, and adopts two heat carrier structures, and each LED bulb directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous; Pass from the lamp housing top, the end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing top through Ω type fixed support 7.
Fig. 8 is a lamp post structure structure, and it adopts single semiconductor chip as light source, and directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous, passes from the lamp housing top, and the end of outside heat carrier is connected with external heat sink; The used external heat sink of this kind of light fixture is strip; Have the strip of being groups of fins to constitute, an end of external heat sink is connected with outside heat carrier, and the other end of external heat sink is connected with the lamp body cradling piece through fixed support 8; Form stable support radiator structure, this kind of light fixture can be used as a most preferred embodiment.
Figure 10 is a floodlight structure; It adopts single semiconductor chip as light source; And directly being overlying on inner heat carrier end, heat carrier forms the right angle in lamp housing circuitous, passes from the lamp housing back; The end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing back through Ω type fixed support 7.
Figure 11 is a floodlight structure; It adopts the plurality of LEDs bulb as light source, and adopts two heat carrier structures, and each LED bulb directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous; Pass from the lamp housing back, the end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing back through Ω type fixed support 7.
A floodlight structure of Figure 12; It adopts single semiconductor chip as light source; And directly be overlying on inner heat carrier middle part, and the two ends of heat carrier all pass from the lamp housing both sides, and the both ends of heat carrier are equipped with an external heat sink; Heat carrier inserts in the centre bit of external heat sink, and external heat sink is petal-shaped.
A floodlight structure of Figure 15, it adopts the plurality of LEDs bulb as light source, and directly is overlying on inner heat carrier middle part; In order to cooperate radiating effect; And adopted two heat carrier structures, the two ends of heat carrier all pass from the lamp housing both sides, and the both ends of heat carrier are equipped with an external heat sink; Heat carrier inserts in the centre bit of external heat sink, and external heat sink is petal-shaped.
A Tunnel Lamp structure of Figure 16, it adopts single semiconductor chip as light source, and directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous; Pass from the lamp housing top, the end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing back.
A Tunnel Lamp structure of Figure 17, it adopts the plurality of LEDs bulb as light source, and directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous; Pass from the lamp housing top, in order to cooperate radiating effect, and adopted two heat carrier structures; The end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing back.
Figure 18 is a high well modulated structure; It adopts single semiconductor chip as light source; And directly being overlying on inner heat carrier end, heat carrier forms the right angle in lamp housing circuitous, passes from the lamp housing sidepiece; The end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing top.
A high well modulated structure of Figure 19, it adopts the plurality of LEDs bulb as light source, and directly is overlying on inner heat carrier end; Heat carrier forms the right angle in lamp housing circuitous; Pass from the lamp housing sidepiece, in order to cooperate radiating effect, and adopted two heat carrier structures; The end of outside heat carrier is connected with external heat sink, and external heat sink then is fixed in the lamp housing top.
Claims (7)
1. semiconductor lamp that has outside heat abstractor; It mainly comprises lamp housing (1); It is characterized in that: be provided with the part of heat carrier (2) in the said lamp housing (1), another part of heat carrier (2) penetrates lamp housing (1) and extends to lamp housing (1) outside, is positioned at the outside heat carrier (2) of lamp housing (1) and locates to be provided with external heat sink (3); The quantity of said heat carrier (2) is the 1-6000 bar, and the diameter of heat carrier (2) is 1mm-1000mm.
2. a kind of semiconductor lamp that has outside heat abstractor according to claim 1 is characterized in that: said heat carrier (2) is metal heat-conducting pipe, metal heat-conducting rod, quartzy heat pipe, inorganic heat pipe, heat conduction raw material of wood-charcoal pipe, thermal conductive ceramic pipe.
3. a kind of semiconductor lamp that has outside heat abstractor according to claim 2 is characterized in that: said metal heat-conducting pipe, inorganic heat pipe, quartzy heat pipe inside all are vacuum state, wherein are provided with superconducting fluid or pure water in the metal heat-conducting pipe.
4. a kind of semiconductor lamp that has outside heat abstractor according to claim 1 is characterized in that: the heat carrier (2) in the said lamp housing (1) locates to be provided with semiconductor chip (4) or LED bulb (5).
5. a kind of semiconductor lamp that has outside heat abstractor according to claim 1; It is characterized in that: said external heat sink (3) is fixed in lamp housing (1) outer wall place, and external heat sink (3) is metal material, heat conduction carbon material, thermal conductive ceramic material.
6. a kind of semiconductor lamp that has outside heat abstractor according to claim 1; It is characterized in that: said lamp housing (1) one end is provided with lamp body cradling piece (6), and external heat sink (3) is fixed in lamp body cradling piece (6) outer wall or lamp body cradling piece (6) outer wall place is fixed in socket.
7. a kind of semiconductor lamp that has outside heat abstractor according to claim 1 is characterized in that: said external heat sink (3) is overlying on outside heat carrier (2) surface of lamp housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202835197U CN202195308U (en) | 2011-08-05 | 2011-08-05 | Semiconductor lighting lamp with external heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202835197U CN202195308U (en) | 2011-08-05 | 2011-08-05 | Semiconductor lighting lamp with external heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202195308U true CN202195308U (en) | 2012-04-18 |
Family
ID=45950217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202835197U Expired - Fee Related CN202195308U (en) | 2011-08-05 | 2011-08-05 | Semiconductor lighting lamp with external heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202195308U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632822A (en) * | 2012-08-21 | 2014-03-12 | 博格华纳贝鲁系统有限公司 | Ignition device for spark ignition engines |
| CN111174966A (en) * | 2020-01-06 | 2020-05-19 | 中国科学院微电子研究所 | Heat radiation structure and capacitive pressure sensor |
-
2011
- 2011-08-05 CN CN2011202835197U patent/CN202195308U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632822A (en) * | 2012-08-21 | 2014-03-12 | 博格华纳贝鲁系统有限公司 | Ignition device for spark ignition engines |
| CN103632822B (en) * | 2012-08-21 | 2017-06-06 | 博格华纳贝鲁系统有限公司 | The igniter of spark ignition engine |
| CN111174966A (en) * | 2020-01-06 | 2020-05-19 | 中国科学院微电子研究所 | Heat radiation structure and capacitive pressure sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103162187A (en) | Energy-efficient light-emitting diode (LED) street lamp bulb | |
| TWM397481U (en) | LED (light emitting diode) lamp capable of regulating illumination angle | |
| CN204785745U (en) | Ball bubble lamp | |
| CN203731137U (en) | LED bulb capable of achieving large-angle illumination | |
| CN202195456U (en) | Semiconductor illuminating lamp with split type heat radiation structure | |
| CN202195308U (en) | Semiconductor lighting lamp with external heat radiation device | |
| CN203190364U (en) | Double-channel cross-ventilation lamp radiation structure and PAR lamp using same | |
| CN203797575U (en) | Combined heat-dissipating type LED corn lamp | |
| CN201057450Y (en) | LED lamp structure | |
| CN204629144U (en) | Cross-ventilation radiating type LED lamp | |
| CN201057392Y (en) | Bar shape LED lamp | |
| CN205480310U (en) | LED (Light emitting diode) globular bulb | |
| CN202195309U (en) | Heat conduction and heat dissipation integrated semi-conductor lighting lamp | |
| CN104251403B (en) | Lamp with high heat dissipation performance | |
| CN207471280U (en) | It is a kind of to shine tree lamp | |
| CN102338301A (en) | Semiconductor illuminating lamp provided with external radiating device | |
| CN102338298A (en) | Semiconductor lighting lamp with spilt radiating structure | |
| CN202511061U (en) | Double-faced luminous light-emitting diode (LED) tube | |
| CN202118585U (en) | Radiating LED bulb | |
| CN202082745U (en) | LED streetlamp | |
| CN203442698U (en) | High thermal conductivity plastic radiator of LED fluorescent lamp | |
| CN205037183U (en) | LED street lamp lamp holder with ultra -long life | |
| CN204005731U (en) | A kind of LED light fixture | |
| CN203797599U (en) | Combined heat-dissipating type LED corn lamp heat-dissipating device and LED corn lamp | |
| CN102338300A (en) | Heat-conduction and heat-radiation integrated semiconductor illuminating lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG POWERMARK ELECTRIC CO., LTD. Free format text: FORMER OWNER: SHANGHAI YELUSHA NEW ENERGY TECHNOLOGY DEVELOPMENT CO., LTD. Effective date: 20120420 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201700 QINGPU, SHANGHAI TO: 313000 HUZHOU, ZHEJIANG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120420 Address after: 313000, building 6, Wuxing science and Technology Pioneer Park, eight Li Town, Huzhou, Zhejiang Patentee after: Zhejiang Baoma Electric Co., Ltd. Address before: 201700, No. 2, Shengli Road, No. 4, building C, zone 147, Qingpu District, Shanghai, China Patentee before: Shanghai Yelusha New Energy Technology Development Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 Termination date: 20130805 |