CN202189760U - Plastic packaging and evacuating device of semiconductor device - Google Patents
Plastic packaging and evacuating device of semiconductor device Download PDFInfo
- Publication number
- CN202189760U CN202189760U CN2011203046564U CN201120304656U CN202189760U CN 202189760 U CN202189760 U CN 202189760U CN 2011203046564 U CN2011203046564 U CN 2011203046564U CN 201120304656 U CN201120304656 U CN 201120304656U CN 202189760 U CN202189760 U CN 202189760U
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- vacuum
- plastic packaging
- semiconductor device
- plastic
- evacuating
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Abstract
The utility model relates to a field of semiconductor device packaging technology and especially to a plastic packaging and evacuating device of a semiconductor device. The plastic packaging and evacuating device includes a plastic packaging machine provided with plastic packaging molds. After the plastic packaging molds are assembled, a sealed room is formed. A vacuum containing jar communicates with the sealed room formed after the plastic packaging molds are assembled through a vacuum channel. The vacuum channel is provided with an extraction valve, a release valve and a vacuum pressure meter. The vacuum pressure meter connects the plastic packaging machine through a pressure signal line for signal control. The vacuum containing jar connects with a vacuum pump. By evacuating with the plastic packaging and evacuating device of the semiconductor device in the utility model, the appearance quality of the semiconductor device can be improved distinctively under a vacuum technology condition. And the yield rate of the semiconductor device is improved. The plastic packaging and evacuating device of the semiconductor device in the utility model is suitable for industrial application and promotion. The plastic packaging and evacuating device of the semiconductor device in the utility model has a simple, scientific and reasonable structure, low investment cost, and can be operated, maintained and repaired very conveniently.
Description
Technical field:
The utility model relates to the semiconductor device packaging technique field, especially relates to the semiconductor packages servicing unit.
Background technology:
As the semi-conductor discrete device product, in order effectively to protect its chip and interior welds lead-in wire, need to use epoxy resin to encapsulate the chip and the lead-in wire that are welded on the lead frame, form a hard protective.Yet some product (like SOT-186A, SOT-113 etc.) is because of having special requirement to its performance, and its year central layer back side epoxy resin protective layer thickness is had only about 0.3MM.Under this condition, use traditional packaging technology production, its rate of finished products is low.The product appearance defective is mainly reflected in plastic-sealed body back side pin hole, resin and fills bad and shortcoming such as the Hi-pot test withstand voltage is low.
Summary of the invention:
It is a kind of simple in structure that the purpose of the utility model is to provide, and is prone to the plastic sealing semiconductor device vacuum extractor of making, through vacuum extractor, product is shaped under the vacuum technology condition, promotes its rate of finished products.
For achieving the above object, the utility model adopts following technical scheme:
The plastic sealing semiconductor device vacuum extractor; Include plastic packaging machine; Plastic packaging machine is provided with plastic package die, can form seal cavity behind the plastic package die matched moulds, and a vacuum tank jar is communicated with the seal cavity that forms behind the plastic package die matched moulds through vacuum pipe; Be provided with extraction valve, vent valve and pressure vacuum gauge in vacuum pipe, pressure vacuum gauge connects plastic packaging machine through pressure signal line and carries out signal controlling; Said vacuum tank jar is communicated with a vacuum pump.
In the such scheme, on vacuum pipe, also be provided with air cleaner.
In the such scheme, the vacuum tank jar is installed in one movably in the vacuum engine housing with vacuum pump.
After adopting the utility model, through vacuumizing, can make product under the vacuum technology condition presentation quality be improved significantly, promote its rate of finished products; Accords with industrial utilization and popularization, it is simple in structure, and is scientific and reasonable; Cost of investment is low, and the operation operation is easy, and Maintenance and Repair are very convenient.
Description of drawings:
Accompanying drawing 1 is the structural representation of the utility model.
Embodiment:
Below in conjunction with accompanying drawing the utility model is further specified:
Consult shown in Figure 1; The utility model mainly is relevant a kind of plastic sealing semiconductor device vacuum extractor, includes plastic packaging machine 1, and plastic packaging machine 1 is provided with plastic package die 11; Can form seal cavity behind plastic package die 11 matched moulds; One vacuum tank jar 2 is communicated with the seal cavity that forms behind plastic package die 11 matched moulds through vacuum pipe 21, is provided with extraction valve 3, vent valve 6 and pressure vacuum gauge 4 in vacuum pipe 21, and pressure vacuum gauge 4 connects plastic packaging machine 1 through pressure signal line 41 and carries out signal controlling; Said vacuum tank jar 2 is communicated with a vacuum pump 5.On vacuum pipe 21, also be provided with air cleaner 7, air cleaner 7 effectively filtering from the airborne impurity of mould output and moisture content etc., the work that vacuumizes with lifting.
Plastic package die 11 comprises upper die and lower die, and the square circle body of silica gel strip is equipped with in one of each design and installation on die face up and down, has just formed a sealed space in the square circle body between upper and lower mould behind the mould matched moulds, vacuumizes requirement with satisfied.In the perforate of square circle body correct position; Be communicated with vacuum tank jar 2 through vacuum pipe 21; Vacuum pipe 21 is provided with extraction valve 3, vent valve 6, and vent valve 6 relative extraction valves 3 have so just formed a semiconductor packages servicing unit with vacuum capability more near plastic package die 11.
During work; Extracted the air (extraction valve 3 is in closed condition with vent valve 6 when bleeding) in the vacuum tank jar 2 out by vacuum pump 5 before this; Make vacuum tank jar 2 form vacuum state, plastic packaging machine 1 drives plastic package die 11 matched moulds then, and the matched moulds high-voltage value reaches the ducted extraction valve 3 of final vacuum and opens; Air in the die cavity enters into vacuum tank jar 2; After the air vacuum degree in the die cavity reached set point, pressure vacuum gauge 4 was transferred to the input signal of the PLC of plastic packaging machine 1 through pressure signal line 41, and the plastic packaging machine adapted to injection system is started working.Injecting glue is accomplished the back product and is got into the pressurize cure stage, and the extraction valve 3 when curing timing to 60 second in the vacuum pipe is closed, and vacuum tank jar 2 is proceeded to vacuumize; Vent valve 6 is opened subsequently, makes the vacuum chamber in the mould pass through vacuum pipe 21 and atmosphere, for opening of mould prepared.After product was taken out in the mould die sinking, the utility model had got into another duty cycle.
In the present embodiment, vacuum tank jar 2 is installed in one movably in the vacuum engine housing 8 with vacuum pump 5, and simple in structure, scientific and reasonable, the bodily form is little, and cost of investment is low, and the operation operation is easy, and Maintenance and Repair are very convenient.
Claims (3)
1. plastic sealing semiconductor device vacuum extractor; Include plastic packaging machine (1); It is characterized in that: plastic packaging machine (1) is provided with plastic package die (11), can form seal cavity behind plastic package die (11) matched moulds, and a vacuum tank jar (2) is communicated with the seal cavity that forms behind plastic package die (11) matched moulds through vacuum pipe (21); Be provided with extraction valve (3), vent valve (6) and pressure vacuum gauge (4) in vacuum pipe (21), pressure vacuum gauge (4) connects plastic packaging machine (1) through pressure signal line (41) and carries out signal controlling; Said vacuum tank jar (2) is communicated with a vacuum pump (5).
2. plastic sealing semiconductor device vacuum extractor according to claim 1 is characterized in that: on vacuum pipe (21), also be provided with air cleaner (7).
3. plastic sealing semiconductor device vacuum extractor according to claim 1 is characterized in that: vacuum tank jar (2) is installed in one movably in the vacuum engine housing (8) with vacuum pump (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203046564U CN202189760U (en) | 2011-08-19 | 2011-08-19 | Plastic packaging and evacuating device of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203046564U CN202189760U (en) | 2011-08-19 | 2011-08-19 | Plastic packaging and evacuating device of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202189760U true CN202189760U (en) | 2012-04-11 |
Family
ID=45921195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203046564U Expired - Fee Related CN202189760U (en) | 2011-08-19 | 2011-08-19 | Plastic packaging and evacuating device of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202189760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113650223A (en) * | 2021-08-23 | 2021-11-16 | 东莞市速力科技有限公司 | Quartz sensor packaging method and device |
-
2011
- 2011-08-19 CN CN2011203046564U patent/CN202189760U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113650223A (en) * | 2021-08-23 | 2021-11-16 | 东莞市速力科技有限公司 | Quartz sensor packaging method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20150819 |
|
| EXPY | Termination of patent right or utility model |