CN202178378U - High frequency device and communication terminal equipment - Google Patents

High frequency device and communication terminal equipment Download PDF

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Publication number
CN202178378U
CN202178378U CN2011200290947U CN201120029094U CN202178378U CN 202178378 U CN202178378 U CN 202178378U CN 2011200290947 U CN2011200290947 U CN 2011200290947U CN 201120029094 U CN201120029094 U CN 201120029094U CN 202178378 U CN202178378 U CN 202178378U
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conductor
circuit
inductance component
series circuit
side series
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加藤登
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

The utility model discloses a high frequency device and communication terminal equipment, which can stabilize the frequency characteristics of a high frequency signal without suffering the influence of the shape of transmitting elements or a housing, or the influence of the configuration condition near components, etc., wherein the high frequency device comprises first and second transmitting elements (11, 21), a power supply circuit (30) connected with the transmitting elements (11, 21) respectively, a frequency stabilizing circuit (35) arranged between the power supply circuit (30) and the first transmitting element (11), the frequency stabilizing circuit (35) comprises a primary side serially-connected circuit (36) connected with the power supply circuit (30) and a secondary side serially-connected circuit (37) coupled with the primary side serially-connected circuit (36) through an electric filed or a magnetic field, first and second inductance elements (L1, L2) are serially connected, third and fourth inductance elements (L3, L4) are serially connected, the first and third inductance elements (L1, L3) are mutually coupled, and the second and fourth inductance elements (L2, L4) are mutually coupled.

Description

High-frequency element and communication terminal device
Technical field
The utility model relates to high-frequency element and communication terminal device, particularly is loaded into the high-frequency element of communication terminal devices such as portable phone and the communication terminal device with this high-frequency element.
Background technology
In recent years,, put down in writing, proposed utilization and be configured in the housing dipole antenna of the inner metallic object (ground plate of printed circuit board etc.) of terminal shell as radiated element as patent documentation 1,2,3 as being loaded into antenna device of mobile communication terminal.In this housing dipole antenna,, can obtain the performance identical with dipole antenna through the two blocks of frame ground plates (ground plate of the ground plate of main part housing and cover body part housing) in the mobile terminals of collapsible or slidingtype are carried out differential-feed.In addition,, therefore, need not special-purpose radiated element is set in addition, can realize the miniaturization of mobile terminals owing to utilize the ground plate that is arranged at housing as radiated element.
Yet, in above-mentioned housing dipole antenna, the impedance meeting of ground plate according to the shape of the shape, the housing that are used as the ground plate of radiated element in addition near the configuration state etc. of metallic object (near the electronic devices and components of configuration, hinge parts etc.) change.Therefore, in order to reduce the energy loss of high-frequency signal as much as possible, need be to each machine design impedance matching circuit.In addition; In the mobile terminals of collapsible or slidingtype; The impedance meeting of ground plate, impedance matching circuit changes according to the position of main part housing and cover body part housing relation (for example, in collapsible, the state of closing cap body and the state of opening cover body part).Therefore, for control group, also need control circuit etc. sometimes.
Patent documentation 1: Japanese Patent Laid is opened the 2004-172919 communique
Patent documentation 2: Japanese Patent Laid is opened the 2005-6096 communique
Patent documentation 3: Japanese Patent Laid is opened the 2008-118359 communique
The utility model content
Thereby the purpose of the utility model is to provide a kind of high-frequency element and communication terminal device, and this high-frequency element and communication terminal device can not receive the shape of radiated element or housing, near the influence of configuration state of components and parts etc., stablizes the frequency of high-frequency signal.
The high-frequency element of first mode of the utility model is characterised in that, comprising:
Duplexer, this duplexer are with a plurality of dielectric layers or magnetic is folded layer by layer forms;
Power supply terminal, this power supply terminal is arranged at said duplexer, and is connected with power supply circuits;
Antenna terminal, this antenna terminal is arranged at said duplexer, and is connected with radiated element;
The primary side series circuit, this primary side series circuit is arranged at said duplexer, comprises first coil part and second coil part that is connected in series with this first coil part, and is connected with said power supply terminal; And
The secondary side series circuit; This secondary side series circuit is arranged at said duplexer; Comprise the 4th coil part that is connected with the tertiary coil element of said this first coil part coupling and with said tertiary coil element connected in series and is coupled with said second coil part; And be connected with said antenna terminal
Said first and second coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit,
The the said the 3rd and the 4th coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit.
The high-frequency element of first mode of the utility model is preferably, and said duplexer also comprises the earth terminal of ground connection.
The high-frequency element of first mode of the utility model is preferably, and also comprises capacity cell, and this capacity cell is loaded into an interarea of said duplexer.
The communication terminal device of second mode of the utility model is characterised in that,
Comprise high-frequency element, power supply circuits and radiated element,
Said high-frequency element comprises:
Duplexer, this duplexer are with a plurality of dielectric layers or magnetic is folded layer by layer forms;
Power supply terminal, this power supply terminal is arranged at said duplexer;
Antenna terminal, this antenna terminal is arranged at said duplexer;
The primary side series circuit, this primary side series circuit is arranged at said duplexer, comprises first coil part and second coil part that is connected in series with this first coil part, and is connected with said power supply terminal; And
The secondary side series circuit; This secondary side series circuit is arranged at said duplexer; Comprise the 4th coil part that is connected with the tertiary coil element of said this first coil part coupling and with said tertiary coil element connected in series and is coupled with said second coil part; And be connected with said antenna terminal
Said first and second coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit,
The the said the 3rd and the 4th coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit,
Said power supply circuits are connected with said power supply terminal,
Said radiated element is connected with said antenna terminal.
In said high-frequency element and communication terminal device; Primary side series circuit and secondary side series circuit carry out electromagnetic field couples, magnetic field coupling etc.; Mainly utilize magnetic flux to be coupled with the high degree of coupling; Through the impedance matching of primary side series circuit realization with the power supply circuits side, and through the impedance matching of secondary side series circuit realization with the radiated element side, thereby the frequency stabilization of transmission/reception signal.And the energy transmission efficiency of high-frequency signal is high, does not receive the shape of radiated element or housing, near the influence of the configuration state of components and parts etc., stablizes the frequency of high-frequency signal.
According to the utility model, can not receive the shape of radiated element or housing, near the influence of configuration state of components and parts etc., stablize the frequency of high-frequency signal.
Description of drawings
Fig. 1 is the key diagram that schematically shows the mobile terminals with antenna assembly, and Fig. 1 (A) representes first example, and Fig. 1 (B) representes second example.
Fig. 2 representes the antenna assembly of embodiment 1, and Fig. 2 (A) is an equivalent circuit diagram, and Fig. 2 (B) is a schematic diagram of movements, and Fig. 2 (C) is the circuit diagram that draws from as the angle of filter.
Fig. 3 (A)～Fig. 3 (D) is respectively the curve chart of through characteristic of the antenna assembly of expression embodiment 1.
Fig. 4 representes to constitute the frequency stabilization circuit as duplexer, and Fig. 4 (A) is the stereogram of face side, and Fig. 4 (B) is the stereogram of rear side.
Fig. 5 decomposes and the stereogram that illustrates constituting as first example of the frequency stabilization circuit of duplexer.
Fig. 6 is the key diagram of the operating principle of expression frequency stabilization circuit shown in Figure 5.
Fig. 7 decomposes and the stereogram that illustrates constituting as second example of the frequency stabilization circuit of duplexer.
Fig. 8 is the equivalent circuit diagram of the antenna assembly of expression embodiment 2.
Fig. 9 decomposes and the stereogram that illustrates constituting as the 3rd example of the frequency stabilization circuit of duplexer.
Figure 10 decomposes and the stereogram that illustrates constituting as the 4th example of the frequency stabilization circuit of duplexer.
Figure 11 is the equivalent circuit diagram of the antenna assembly of expression embodiment 3.
Figure 12 is the equivalent circuit diagram of the antenna assembly of expression embodiment 4.
Figure 13 is the equivalent circuit diagram of the antenna assembly of expression embodiment 5.
Figure 14 is the equivalent circuit diagram of the antenna assembly of expression embodiment 6.
Figure 15 is the equivalent circuit diagram of applying examples of the antenna assembly of expression embodiment 6.
Figure 16 representes first example of high-frequency element, and Figure 16 (A) is the stereogram of face side, and Figure 16 (B) is the stereogram of rear side.
Figure 17 decomposes first example of high-frequency element and the stereogram that illustrates.
Figure 18 is the key diagram of operating principle of first example of expression high-frequency element.
Figure 19 decomposes second example of high-frequency element and the stereogram that illustrates.
Figure 20 decomposes the 3rd example of high-frequency element and the stereogram that illustrates.
Figure 21 (A) is the equivalent circuit diagram of the antenna assembly of expression embodiment 7, and Figure 21 (B) is the equivalent circuit diagram of its variation of expression.
Figure 22 decomposes the 4th example of high-frequency element and the stereogram that illustrates.
Figure 23 is the equivalent circuit diagram of the antenna assembly of expression embodiment 8.
Figure 24 decomposes the 5th example of high-frequency element and the stereogram that illustrates.
Figure 25 is the equivalent circuit diagram of the antenna assembly of expression embodiment 9.
Figure 26 decomposes the 6th example of high-frequency element and the stereogram that illustrates.
Figure 27 is the key diagram of operating principle of the 6th example of expression high-frequency element.
Figure 28 representes the impedance transformation element of embodiment 10, and Figure 28 (A) is an equivalent circuit diagram, and Figure 28 (B) is a schematic diagram of movements.
Figure 29 is the concise and to the point stereogram of stepped construction of the impedance transformation element of embodiment 10.
Figure 30 is the schematic diagram of movements in the stepped construction shown in Figure 29.
Figure 31 representes to constitute the impedance transformation element as the embodiment 10 of duplexer, and Figure 31 (A) is the stereogram of face side, and Figure 31 (B) is the stereogram of rear side.
Figure 32 decomposes the stepped construction of the impedance transformation element of embodiment 10 and the stereogram that illustrates.
Figure 33 is the equivalent circuit diagram of the impedance transformation element of expression embodiment 11.
Figure 34 decomposes the stepped construction of the impedance transformation element of embodiment 11 and the stereogram that illustrates.
Figure 35 decomposes the stepped construction of the impedance transformation element of embodiment 12 and the stereogram that illustrates.
Figure 36 is the schematic diagram of movements of the impedance transformation element of embodiment 12.
Figure 37 decomposes the stepped construction of the impedance transformation element of embodiment 13 and the stereogram that illustrates.
Embodiment
Below, with reference to accompanying drawing, the high-frequency element that the utility model is related and the embodiment of communication terminal device are described.In addition, in each figure, mark shared label, omit the explanation of repetition for identical components, part.
(mobile terminals, with reference to Fig. 1)
At the mobile terminals 1 of first example shown in Fig. 1 (A), at the mobile terminals 2 of second example shown in Fig. 1 (B).They are that (common name: high-frequency signal mobile digital TV) is with (470～770MHz) terminal to one section part reception service of portable phone/portable terminal for receiving plane.
Shown in Fig. 1 (A), mobile terminals 1 comprises as first housing 10 of cover body part with as second housing, 20, the first housings 10 of main part and being connected through collapsible or slidingtype with second housing 20.First housing 10 is provided with first emitting element 11, the second housings 20 that also play as the effect of ground plate and is provided with second radiated element 21 that also plays as the effect of ground plate.First and second radiated element 11,21 is formed by the electric conductor film that comprises thick films such as films such as metal forming or conductive paste.This first and second radiated element 11,21 obtains the performance roughly the same with dipole antenna through by power supply circuits 30 differential-feeds.Power supply circuits 30 have the signal processing circuit of RF circuit, baseband circuit and so on.
Shown in Fig. 1 (B), mobile terminals 2 is provided with first emitting element 11 as the antenna monomer.First emitting element 11 can use various antenna elements such as paster antenna, metallic plate antenna, coil antenna.In addition, as this antenna element, also capable of using for example along the inner peripheral surface of housing 10 or outer peripheral face and the linear conductor that is provided with.Second radiated element 21 also plays the effect as the ground plate of second housing 20, also can use the various antennas identical with first emitting element 11.Incidentally, mobile terminals 2 is not collapsible or slidingtype but the terminal of linear structure.In addition, second radiated element 21 also can be not necessarily fully to play the element as the effect of emitter, and first emitting element 11 also can be the element of action as so-called unipole antenna.
One end of power supply circuits 30 is connected with second radiated element 21, and the other end is connected with first emitting element 11 through frequency stabilization circuit 35.In addition, first and second radiated element 11,21 interconnects through connecting line 33.This connecting line 33 plays the effect of the connecting line of the electronic devices and components that are loaded into first and second housing 10,20 respectively (omitting diagram), though move as inductance element for high-frequency signal, the performance of antenna is not played direct effect.
Frequency stabilization circuit 35 is arranged between power supply circuits 30 and the first emitting element 11, makes the high-frequency signal that sends from first and second radiated element 11,21 or utilize the frequency characteristic of the high-frequency signal that first and second radiated element 11,21 receives stable.Therefore, do not receive shape, first housing 10 or second housing 20 of the first emitting element 11 or second radiated element 21 shape, influence near configuration state of components and parts etc., stablize the frequency characteristic of high-frequency signal.Particularly under the situation of the mobile terminals of collapsible or slidingtype; Though the impedance of first and second radiated element 11,21 easily according to cover body part promptly first housing 10 with respect to main part promptly the on off state of second housing 20 change; But, can make the frequency characteristic of high-frequency signal stable through frequency stabilization circuit 35 is set.Promptly; Because this frequency stabilization circuit 35 can be born the adjustment function of setting equifrequent characteristic of setting, the impedance matching of setting that the material particular relevant with the design of antenna is centre frequency, passband width; Antenna element itself only considers that mainly directivity, gain get final product; Therefore, carry out the design of antenna easily.Below, as embodiment 1～6, the details of frequency stabilization circuit 35 are described.
(embodiment 1, with reference to Fig. 2～Fig. 8)
Shown in Fig. 2 (A), the employed frequency stabilization circuit of the antenna assembly of embodiment 1 (being also referred to as stabilizing circuit) 35 is made up of primary side reactance circuit that is connected with power supply circuits 30 and the secondary side reactance circuit that is coupled through electric field or magnetic field and this primary side reactance circuit.The primary side reactance circuit is made up of the primary side series circuit 36 of second reactance component that comprises first reactance component and be connected in series with this first reactance component.The secondary side reactance circuit is connected in series with the 3rd reactance component of first reactance component coupling and with the 3rd reactance component and constitutes with the secondary side series circuit 37 of the 4th reactance component of second reactance component coupling by comprising.Particularly, first reactance component is made up of first inductance component L 1, and second reactance component is made up of second inductance component L 2, and the 3rd reactance component is made up of the 3rd inductance component L 3, and the 4th reactance component is made up of the 4th inductance component L 4.
One end of primary side series circuit 36 (end of first inductance component L 1) is connected with power supply circuits 30, and an end of secondary side series circuit 37 (end of the 3rd inductance component L 3) is connected with first emitting element 11.The other end (other end of the 4th inductance component L 4) of the other end of primary side series circuit 36 (other end of second inductance component L 2) and secondary side series circuit 37 is connected with second radiated element 21.
Shown in Fig. 2 (B), first inductance component L 1 and second inductance component L 2 are carried out magnetic field coupling and field coupled with same phase each other, and likewise, the 3rd inductance component L 3 and the 4th inductance component L 4 are carried out magnetic field coupling and field coupled with same phase each other.Promptly; Form closed magnetic circuit through first and second inductance component L 1, L2; This inductance component L 1, L2 mainly are coupled through electromagnetic field, and so that carry out pattern wiring because of magnetic field coupling electric current that flows through and the corresponding to mode of sense of current that flows through because of field coupled.In addition; Form closed magnetic circuit through the 3rd and the 4th inductance component L 3, L4; This inductance component L 3, L4 mainly are coupled through electromagnetic field, and so that carry out pattern wiring because of magnetic field coupling electric current that flows through and the corresponding to mode of sense of current that flows through because of field coupled.In addition; First inductance component L 1 and the 3rd inductance component L 3 are coupled with opposite phase each other; And so that carry out pattern wiring because of magnetic field coupling electric current that flows through and the corresponding to mode of sense of current that flows through because of field coupled; Likewise, second inductance component L 2 and the 4th inductance component L 4 are coupled with opposite phase each other, and so that carry out pattern wiring because of magnetic field coupling electric current that flows through and the corresponding to mode of sense of current that flows through because of field coupled.Promptly; Because the first and the 3rd inductance component L 1, L3 and the second and the 4th inductance component L 2, L4 form closed magnetic circuit respectively; These closed magnetic circuits each other, be that primary side series circuit 36 mainly is coupled through electromagnetic field with secondary side series circuit 37, field coupled flows through the same direction in electric current edge with the magnetic field coupling, therefore; With the coupling in magnetic field only or only the coupling of electric field compare, can obtain stronger electromagnetic field couples.In addition, so-called " being coupled through electromagnetic field " is meant coupling through electric field, the coupling through magnetic field or the coupling through electric field and magnetic field this two.
In the frequency stabilization circuit 35 that adopts above structure; Flow into high-frequency signal conduct current first inductance component L 1 of primary side series circuit 36 from power supply circuits 30; And; Under the situation that each inductance element is formed by coil pattern, through induced field as secondary current the 3rd inductance component L 3 that leads.In addition, lead the high-frequency signal electric current of second inductance component L 2 through induced field as secondary current the 4th inductance component L 4 that leads.Consequently, the high-frequency signal electric current flows along the direction shown in the arrow among Fig. 2 (B).
Promptly; In primary side series circuit 36, owing to first inductance component L 1 is connected with 2 series connection of second inductance component L and with same phase, therefore; If there is electric current to flow through first inductance component L 1 and second inductance component L 2, then between each inductance component L 1, L2, form closed magnetic circuit.Likewise; In secondary side series circuit 37; Because the 3rd inductance component L 3 is connected with 4 series connection of the 4th inductance component L and with same phase; Therefore, if the closed magnetic circuit that is produced because of primary side series circuit 36 causes that induced current flows through the 3rd inductance component L 3 and the 4th inductance component L 4, then forms closed magnetic circuit between each inductance component L 3, L4.
And; Because first inductance component L 1 and second inductance component L 2 form closed magnetic circuit as above-mentioned; And be coupled with same phase; Therefore, the total inductance value of primary side series circuit 36 can be regarded as less than the inductance value of the inductance value of the inductance value of first inductance component L 1 and second inductance component L 2 being carried out after the simple addition.On the other hand, first inductance component L 1 and the 3rd inductance component L 3 be through mutual inductance coupling, and this mutual inductance value becomes carries out the inductance value after the addition with the inductance value of the inductance value of first inductance component L 1 and the 3rd inductance component L 3.The relation of second inductance component L 2 and the 4th inductance component L 4 too.
Promptly; Because the summation of the mutual inductance value that between primary side series circuit 36 and secondary side series circuit 37, forms can regard bigger relatively than the inductance value of primary side series circuit 36 or secondary side series circuit 37 as; Therefore, the degree of coupling that can be observed primary side series circuit 36 and secondary side series circuit 37 uprises.That is,, therefore, produce whole the inductance value (=L1+L2-M of series circuit 36 because the magnetic field in primary side series circuit 36 and the secondary side series circuit 37 forms closed magnetic circuit respectively L1L2) and whole the inductance value (=L3+L4-M of series circuit 37 L3L4), in secondary side series circuit 37, flow through and the electric current of counteracting by electric current (for example identical) equidirectional of the direction in the magnetic field of primary side series circuit 36 generations with displacement current.Thereby, because primary side series circuit 36 does not have leakage basically with secondary side series circuit 37 power separately, and, whole mutual inductance the value (=M of series circuit 36 and series circuit 37 L1L3+ M L2L4) greater than whole the inductance value (=L1+L2-M of series circuit 36 L1L2) and whole the inductance value (=L3+L4-M of series circuit 37 L3L4), therefore, the degree of coupling of primary side series circuit 36 and secondary side series circuit 37 uprises.Thus, the degree of coupling of primary side series circuit 36 and secondary side series circuit 37 can obtain more than 0.7 even the high degree of coupling of 1.0 above (particularly according to frequency, can reach the degree of coupling 2.0).
In above-mentioned frequency stabilization circuit 35; Owing to mainly utilize the impedance matching of 36 realizations of primary side series circuit and power supply circuits 30 1 sides; Utilize the impedance matching of 37 realizations of secondary side series circuit and first emitting element 11 1 sides, that is, owing to can distinguish the impedance of independent design primary side series circuit 36 and the impedance of secondary side series circuit 37; Therefore, carry out impedance matching easily.
If from come the equivalent electric circuit shown in the depiction 2 (B) as the angle of filter, then become image pattern 2 (C) that kind.Capacity cell C1 is the line capacitance that is formed by first and second inductance component L 1, L2, and capacity cell C2 is the line capacitance that is formed by the 3rd and the 4th inductance component L 3, L4.In addition, capacity cell C3 is the line capacitance (parasitic capacitance) that is formed by primary side series circuit 36 and secondary side series circuit 37.That is, utilize primary side series circuit 36 to form LC antiresonant circuit R1, utilize secondary side series circuit 37 to form LC antiresonant circuit R2.
And, be that resonance frequency among F1, the LC antiresonant circuit R2 is F2 if establish resonance frequency among the LC antiresonant circuit R1, then under the situation of F1=F2, come the high-frequency signal of self-powered circuit 30 to present the through characteristic shown in Fig. 3 (A).Through first and second inductance component L 1, L2, the 3rd and the 4th inductance component L 3, L4 are coupled with opposite phase respectively; Because L1+L2 and L3+L4 diminish, therefore, even increase the inductance value of each inductance component L 1～L4; Resonance frequency can not descend yet, thereby can increase L1～L4.Therefore, can obtain wide band through characteristic.And, shown in Fig. 3 (B), can obtain the wide band through characteristic shown in the curve A from the high-frequency signal of first emitting element 11.Though this mechanism is not necessarily clear, can think therefore to degenerate and can remove owing to LC antiresonant circuit R1, R2 are coupled, Δ F depends on the degree of coupling of resonant circuit R1, R2.That is the realization broad in band that can be directly proportional with the degree of coupling.
On the other hand, under the situation of F1 ≠ F2, come the high-frequency signal of self-powered circuit 30 to present the through characteristic shown in Fig. 3 (C).Shown in Fig. 3 (D), can obtain the wide band through characteristic shown in the curve B from the high-frequency signal of first emitting element 11.Can think that this also is owing to LC antiresonant circuit R1, R2 are coupled, and therefore degenerates and can remove.If the degree of coupling of resonant circuit R1, R2 is bigger, then broadening becomes wide band through characteristic.
Like this, since resonance characteristic itself that utilize frequency stabilization circuit 35 to have, decision impedance matching equifrequent characteristic, and therefore, frequency is not easy to produce deviation.In addition,, change, also can guarantee through frequency band even impedance has slightly through obtaining wide band through characteristic.That is, irrelevant with the environment of size, shape even the radiated element of radiated element, can make the frequency characteristic of high-frequency signal of transmitting-receiving stable.In addition, because frequency stabilization circuit 35 is formed by closed magnetic circuit, therefore, shielding pattern also can be positioned at the top and the bottom of resonant circuit.Thus, the characteristic variations that produces because of external environment condition further diminishes.
Above-mentioned frequency stabilization circuit 35 can be used as the duplexer 40 of patch-type shown in Figure 4 and constitutes.This duplexer 40 is that a plurality of substrate layers that formed by medium or magnetic are carried out range upon range of parts, the antenna terminal 43 that is provided with the power supply terminal 41 that is connected with power supply circuits 30, the earth terminal 42 that is connected with second radiated element 21 at its back side and is connected with first emitting element 11.In addition, also be provided with the NC terminal 44 that is used to install overleaf.In addition, also can load patch-type inductor or the patch-type capacitor that impedance matching is used as required on the surface of duplexer 40.Under the situation that adopts this structure, only change inductor or the capacitor that loads, just can be corresponding to various input and output impedances.In addition, also can in duplexer 40, utilize electrode pattern to form inductance element or capacity cell.
Here, with reference to Fig. 5, first example of the frequency stabilization circuit 35 that is built in above-mentioned duplexer 40 is described.In this first example; On the substrate layer 51a of the superiors, be formed with conductor 61; On the substrate layer 51b of the second layer, be formed with the conductor 62 that becomes first and second inductance component L 1, L2, on the 3rd layer substrate layer 51c, be formed with two conductors 63,64 that become first and second inductance component L 1, L2.On the 4th layer substrate layer 51d, be formed with two conductors 65,66 that become the 3rd and the 4th inductance component L 3, L4, on the substrate layer 51e of layer 5, be formed with the conductor 67 that becomes the 3rd and the 4th inductance component L 3, L4.In addition, on the substrate layer 51f of layer 6, be formed with earthing conductor 68, be formed with power supply terminal 41, earth terminal 42 and antenna terminal 43 at the back side of the substrate layer 51g of layer 7.In addition, in the substrate layer 51a of the superiors laminated not shown pattern-free substrate layer is arranged.
As conductor 61～68, can conductive materials such as silver or copper be formed as main component.As substrate layer 51a～51g, if medium then can use glass ceramic material, epoxylite material etc., if magnetic then can use the ferrite ceramics material or contain ferritic resin material etc.As the material that substrate layer is used, particularly under the situation of the frequency stabilization circuit that formation UHF frequency band is used, preferred working medium material under the situation of the frequency stabilization circuit that formation HF frequency band is used, preferably uses the magnetic material.
Through range upon range of above-mentioned substrate layer 51a～51g, conductor 61～68 separately and terminal 41,42,43 are connected through interlayer bonding conductor (via hole conductor), form the equivalent electric circuit shown in Fig. 2 (A).
That is, power supply terminal 41 is connected with an end of coil pattern 63 through via hole conductor 45a, conductor 61 and via hole conductor 45b, and the other end of coil pattern 63 is connected with the end of coil pattern 62a through via hole conductor 45c.In addition, the other end of coil pattern 62a is connected with the end of coil pattern 62b, and the other end of coil pattern 62b is connected with an end of coil pattern 64 through via hole conductor 45d.The other end of coil pattern 64 is connected with earthing conductor 68 through via hole conductor 45e, and earthing conductor 68 is connected with earth terminal 42 through via hole conductor 45f.That is, utilize coil pattern 63 and coil pattern 62a to constitute first coil pattern, be inductance component L 1, utilize coil pattern 62b and coil pattern 64 to constitute second coil pattern, be inductance component L 2.
In addition, antenna terminal 43 is connected with an end of coil pattern 65 through via hole conductor 45g, and the other end of coil pattern 65 is connected with the end of coil pattern 67a through via hole conductor 45h.In addition, the other end of coil pattern 67a is connected with the end of coil pattern 67b, and the other end of coil pattern 67b is connected with an end of coil pattern 66 through via hole conductor 45i.The other end of coil pattern 66 is connected with earthing conductor 68 through via hole conductor 45j, and earthing conductor 68 is connected with earth terminal 42 through via hole conductor 45f.That is, utilize coil pattern 65 and coil pattern 67a to constitute the tertiary coil pattern, be inductance component L 3, utilize coil pattern 67b and coil pattern 66 to constitute the 4th coil pattern, be inductance component L 4.
And; As shown in Figure 5; First and second coil pattern becomes parallel mode disposed adjacent with the wireline reel of first coil pattern and the wireline reel of second coil pattern, and the 3rd and the 4th coil pattern becomes parallel mode disposed adjacent with the wireline reel of tertiary coil pattern and the wireline reel of the 4th coil pattern.In addition; First and the tertiary coil pattern arrangement become the wireline reel of first coil pattern and the wireline reel of tertiary coil pattern to become same straight line substantially, the second and the 4th coil pattern is configured to the wireline reel of second coil pattern and the wireline reel of the 4th coil pattern becomes same straight line substantially.
In addition, though each coil pattern utilizes the ring-shaped conductor of a circle to constitute, also can utilize the ring-shaped conductor of multiturn to constitute.In addition; First and the tertiary coil pattern wireline reel that need not to be configured to each coil pattern strictly become same straight line, as long as when overlooking first and overlapped, the public magnetic flux of coil aperture of tertiary coil pattern reel through each coil pattern is such.Likewise; The wireline reel that the second and the 4th coil pattern need not to be configured to each coil pattern strictly becomes same straight line, as long as overlapped, the public magnetic flux of the coil aperture of the second and the 4th coil pattern is reeled through each coil pattern is such when overlooking.
As above; Through inductance component L 1～L4 being built in the duplexer 40 that forms by medium or magnetic; The zone that particularly will become the coupling part of primary side series circuit 36 and secondary side series circuit 37 is arranged on the inside of duplexer 40, thus the degree of coupling of component value even primary side series circuit 36 and secondary side series circuit 37 that constitutes the element of frequency stabilization circuit 35 be difficult to receive from the influence of other electronic components of duplexer 40 disposed adjacent.Consequently, can realize the further stable of frequency characteristic.
Yet the printed circuit board (not shown) that loads above-mentioned duplexer 40 is provided with various wirings, and these wirings and frequency stabilization circuit 35 might interfere with each other.As present embodiment; Through in the bottom of duplexer 40 earthing conductor 68 being arranged to cover the opening of the coil pattern that forms by conductor 61～67, make the magnetic field that produces by coil pattern be difficult to receive influence from the magnetic field of the various wirings on the printed circuit board.In other words, the L value of inductance component L 1～L4 is difficult to produce deviation.
In the frequency stabilization circuit 35 of first example; As shown in Figure 6; From the high-frequency signal electric current of power supply terminal 41 input is shown in arrow a, b, flow; First inductance component L 1 that leads shown in arrow c, d (conductor 62,63), and second inductance component L 2 (conductor 62,64) that leads further shown in arrow e, f.Through the magnetic field C that produces by primary current (arrow c, d), in the 3rd inductance component L 3 (conductor 65,67), motivate the high-frequency signal electric current shown in arrow g, h, flow through induced current (secondary current).Likewise,, in the 4th inductance component L 4 (conductor 66,67), motivate the high-frequency signal electric current shown in arrow i, j, flow through induced current (secondary current) through the magnetic field C that produces by primary current (arrow e, f).Consequently, the high-frequency signal electric current shown in the arrow k flows through antenna terminal 43, and the high-frequency signal electric current shown in the arrow l flows through earth terminal 42.In addition, (arrow is a rightabout a), and then other electric currents also flow in opposite direction as if the electric current that flows through power supply terminal 41.In addition; Because the coil pattern 63 of first inductance component L 1 is relative with the coil pattern 65 of the 3rd inductance component L 3; Therefore; Can produce field coupled, electric current (displacement current) the edge direction identical with induced current that flows through because of this field coupled flows, and utilizes magnetic field coupling and field coupled to improve the degree of coupling.Likewise, the coil pattern 66 of the coil pattern 64 of second inductance component L 2 and the 4th inductance component L 4 also produces magnetic field coupling and field coupled.
In primary side series circuit 36, first and second inductance component L 1, L2 are coupled with same phase each other, and in secondary side series circuit 37, the 3rd and the 4th inductance component L 3, L4 are coupled each self-forming closed magnetic circuit each other with same phase.Therefore, can reduce between first inductance component L 1 and second inductance component L 2 and the energy loss between the 3rd inductance component L 3 and the 4th inductance component L 4.In addition, if make inductance value, the 3rd and the 4th inductance component L 3 of first and second inductance component L 1, L2, the inductance value of L4 be essentially the similar elements value, then the leakage field of closed magnetic circuit reduces, and can further reduce energy loss.In addition, owing to carry out field coupled through earthing conductor 68, the three inductance component L 3 and the 4th inductance component L 4, therefore, the displacement current that flows through because of this field coupled has strengthened the degree of coupling between element L3, the L4.Likewise, through between element L1, L2, producing field coupled, can strengthen the degree of coupling between element L1, the L2.
In addition, by the magnetic field C that primary current encouraged in the primary side series circuit 36 with by the magnetic field D that secondary current encouraged in the secondary side series circuit 37, be to produce with the mode of offsetting magnetic field each other through induced current.Through utilizing induced current to reduce energy loss, the first and the 3rd inductance component L 1, L3 and the second and the 4th inductance component L 2, L4 are coupled with the high degree of coupling.That is, primary side series circuit 36 is coupled through the high degree of coupling with secondary side series circuit 37.
In addition, the inductance value of frequency stabilization circuit 35 is preferably less than the inductance value of the connecting line 33 that connects two radiated elements 11,21.This is owing to can reduce the influence of the inductance value of the connecting line relevant with frequency characteristic 33.Through first and second inductance component L 1, L2, the 3rd and the 4th inductance component L 3, L4 are coupled with same phase, can reduce the inductance value of frequency stabilization circuit 35.
Present embodiment according to above that kind; Because primary side series circuit 36 and secondary side series circuit 37 utilize the coupling (electromagnetic field couples) between closed magnetic circuit and the closed magnetic circuit; Therefore; Through the impedance matching of primary side series circuit 36 realizations with power supply circuits 30 1 sides, and through the impedance matching of secondary side series circuit 37 realizations with first emitting element 11 1 sides, thereby can carry out impedance matching independently at primary side and secondary side.And, because the efficiency of transmission of higher frequency signal energy improves, therefore, can not receive the considerable influence of the shape, on off state etc. of radiated element 11,21 and housing 10,20, can in broadband, stablize the frequency characteristic of high-frequency signal.
Next, with reference to Fig. 7, second example of frequency stabilization circuit 35 is described.This second example and above-mentioned first example adopt essentially identical structure, are with the difference of first example: omit substrate layer 51a and on substrate layer 51b, form conductor 61, and omit earthing conductor 68 and on substrate layer 51h, form and connect with conductor 69.In this second example,, therefore, preferably on the printed circuit board that loads this duplexer 40, be provided with and use conductor with earthing conductor 68 suitable shieldings owing to omitted earthing conductor 68.
(embodiment 2, with reference to Fig. 8～Figure 10)
The antenna assembly of expression embodiment 2 in Fig. 8.Here employed frequency stabilization circuit 35 is circuit that another secondary side series circuit 38 (secondary side reactance circuit) is set on the basis of above-mentioned primary side series circuit 36 and secondary side series circuit 37.The 5th inductance component L 5 and the 6th inductance component L 6 that constitute secondary side series circuit 38 are coupled with same phase each other.The 5th inductance component L 5 and first inductance component L 1 are coupled with opposite phase, and the 6th inductance component L 6 and second inductance component L 2 are coupled with opposite phase.One end of the 5th inductance component L 5 is connected with first emitting element 11, and an end of the 6th inductance component L 6 is connected with second radiated element 21.
With reference to Fig. 9, explanation constitutes this frequency stabilization circuit 35 as duplexer 40 the 3rd example.The 3rd example is on the duplexer 40 shown in above-mentioned first example, further range upon range of substrate layer 51i, the 51j that is formed with the conductor 71,72,73 of the 5th and the 6th inductance component L 5 that becomes secondary side series circuit 38, L6.Promptly; Identical with above-mentioned first～the 4th reactance component; Constitute the 5th and the 6th reactance component by the 5th and the 6th inductance component L 5, L6 respectively; Utilize coil pattern to form the 5th and the 6th inductance component L 5, L6, and, the coil pattern that constitutes the 5th and the 6th inductance component L 5, L6 is reeled with the mode that this inductance component L 5, magnetic field that L6 was produced form closed magnetic circuit.
The action of the 3rd example of present embodiment 2 and duplexer 40 and the foregoing description 1 are basic identical with above-mentioned first example.In present embodiment 2, clip primary side series circuit 36 through utilizing two secondary side series circuits 37,38, the power transfer loss of 37,38 high-frequency signal reduces from primary side series circuit 36 to the secondary side series circuit.
Next, with reference to Figure 10, explanation constitutes this frequency stabilization circuit 35 as duplexer 40 the 4th example.The 4th example is the further range upon range of substrate layer 51k that is provided with earthing conductor 74 on the duplexer 40 of above-mentioned the 3rd example.Earthing conductor 74 is identical with the earthing conductor 68 that is arranged on the bottom, has the area of covering by the opening of conductor 71,72,73 formed coils.Therefore, in this 4th example, through earthing conductor 74 is set, the magnetic field that forms by coil be difficult to receive from be configured in duplexer 40 directly over the influence in magnetic field of various wirings.Like this, even the first and the 3rd inductance component L 1, L3, the second and the 4th inductance component L 2, L4 are coupled with same phase respectively, primary side series circuit 36 and secondary side series circuit 37 are coupled.
(embodiment 3, with reference to Figure 11)
The antenna assembly of expression embodiment 3 in Figure 11.Here employed frequency stabilization circuit 35 has and the foregoing description 1 essentially identical structure.Difference is: first inductance component L 1 and the 3rd inductance component L 3 are coupled with same phase each other, and second inductance component L 2 and the 4th inductance component L 4 are coupled with same phase each other.That is, the first and the 3rd inductance component L 1, L3 mainly are coupled through magnetic field, and the second and the 4th inductance component L 2, L4 mainly are coupled through magnetic field.The action effect of present embodiment 3 and embodiment 1 are basic identical.
Reel like this through making the coil pattern that constitutes each inductance component L 1～L4; Because the closed magnetic circuit (the 3rd closed magnetic circuit) that is formed with closed magnetic circuit (second closed magnetic circuit), forms by this first closed magnetic circuit and second closed magnetic circuit in the closed magnetic circuit (first closed magnetic circuit) that forms between inductance component L 1 and the inductance component L 2, formation between inductance component L 3 and inductance component L 4; Therefore, can the loss of the high-frequency signal among each inductance component L 1～L4 be suppressed at bottom line.
(embodiment 4, with reference to Figure 12)
The antenna assembly of expression embodiment 4 in Figure 12.Here employed frequency stabilization circuit 35 is identical with embodiment 1, and its action effect is identical with embodiment 1.And the difference of embodiment 1 is: between the frequency stabilization circuit 35 and second radiated element 21, dispose capacity cell C4.Capacity cell C4 plays the effect of isolating (bias cut) usefulness as the biasing that is used for isolated DC component, low frequency component, also plays the effect as ESD reply element.
(embodiment 5, with reference to Figure 13)
The antenna assembly of expression embodiment 5 in Figure 13.This antenna assembly be can be corresponding with GSM mode or CDMA mode the employed antenna assembly of the corresponding type mobile radio communications system of multiband (800MHz frequency band, 900MHz frequency band, 1800MHz frequency band, 1900MHz frequency band).Here employed frequency stabilization circuit 35 is the circuit that between primary side series circuit 36 and secondary side series circuit 37, insert capacity cell C5, and other structures are identical with embodiment 1, and its action effect and embodiment 1 are basic identical.In addition, be provided with fork mono-polar antenna 11a, 11b as radiated element.In addition, capacity cell C5 plays the effect of mainly not leading to the coupling capacitor of power supply circuits 30 (perhaps opposite) as the signal that is used to make high frequency band side (1800MHz frequency band, 1900MHz frequency band) through primary side series circuit 36 with secondary side series circuit 37 and from fork mono-polar antenna 11a, 11b.If the impedance ratio that is formed by primary side series circuit 36 and secondary side series circuit 37 all matees at the either side of high frequency band side (1800MHz frequency band, 1900MHz frequency band) and low-frequency band side (800MHz frequency band, 900MHz frequency band), then not necessarily capacity cell C5 need be set.
This antenna assembly can be used as the main antenna of mobile communication terminal.In this fork mono-polar antenna 11a, 11b; Antenna 11a mainly plays the effect as the antenna radiated element of high frequency band side (1800～2400MHz frequency band), and antenna 11b mainly plays the effect as the antenna radiated element of low-frequency band side (800～900MHz frequency band).Here, fork mono-polar antenna 11a, 11b need not to carry out resonance at corresponding frequency band separately as antenna.This is because frequency stabilization circuit 35 matees the impedance phase of characteristic impedance that antenna 11a, 11b had and RF circuit.For example, frequency stabilization circuit 35 is complementary the characteristic impedance that antenna 11b had and the impedance (being generally 50 Ω) of RF circuit under 800～900MHz frequency band.Thus, can send the signal of RF circuit from antenna 11b, or utilize antenna 11b to receive signal to the RF circuit.
In addition, realizing under the situation of impedance matchings like this at a distance of bigger a plurality of frequency bands, also can be with a plurality of frequency stabilization circuit 35 parallel connection configurations etc., realize impedance matching at frequency band separately.In addition, a plurality of secondary side series circuits 37 are coupled with primary side series circuit 36, utilize a plurality of secondary side series circuits 37 to be implemented in the impedance matching of frequency band separately.
(embodiment 6, with reference to Figure 14 and Figure 15)
Shown in Figure 14 (A), the employed frequency stabilization circuit 35 of the antenna assembly of embodiment 6 is made up of primary side reactance circuit that is connected with power supply circuits 30 and the secondary side reactance circuit that is coupled through electric field or magnetic field and this primary side reactance circuit.The primary side reactance circuit is made up of the primary side series circuit 36 of second reactance component that comprises first reactance component and be connected in series with this first reactance component.The secondary side reactance circuit is connected in series with the 3rd reactance component of first reactance component coupling and with the 3rd reactance component and constitutes with the secondary side series circuit 37 of the 4th reactance component of second reactance component coupling by comprising.Particularly, first reactance component is made up of first inductance component L 1, and second reactance component is made up of second inductance component L 2, and the 3rd reactance component is made up of the 3rd inductance component L 3, and the 4th reactance component is made up of the 4th inductance component L 4.
One end of primary side series circuit 36 (end of first inductance component L 1) is connected with power supply circuits 30, and an end of secondary side series circuit 37 (end of the 3rd inductance component L 3) is connected with first emitting element 11.The other end (other end of the 4th inductance component L 4) of the other end of primary side series circuit 36 (other end of second inductance component L 2) and secondary side series circuit 37 is connected with second radiated element 21.
Shown in Figure 14 (B), first inductance component L 1 and second inductance component L 2 are coupled with opposite phase each other, and likewise, the 3rd inductance component L 3 and the 4th inductance component L 4 are coupled with opposite phase each other.In addition, first inductance component L 1 and the 3rd inductance component L 3 are coupled with opposite phase each other, and likewise, second inductance component L 2 and the 4th inductance component L 4 are coupled with opposite phase each other.
In the frequency stabilization circuit 35 that adopts above structure; Flow into high-frequency signal conduct current first inductance component L 1 of primary side series circuit 36 from power supply circuits 30; And; Under the situation that each inductance element is formed by coil pattern, through induced field as secondary current the 3rd inductance component L 3 that leads.In addition, lead the high-frequency signal electric current of second inductance component L 2 through induced field as secondary current the 4th inductance component L 4 that leads.Consequently, the high-frequency signal electric current flows along the direction shown in the arrow among Figure 14 (B).
In the structure of present embodiment 6; First inductance component L 1 and second inductance component L 2 are moved with the mode in mutual enhancing magnetic field; And; The 3rd inductance component L 3 and the 4th inductance component L 4 are also moved with the mode in mutual enhancing magnetic field, and the magnetic field between primary side series circuit 36 and the secondary side series circuit 37 forms closed magnetic circuit.
Thereby; Particularly shown in figure 15; Comprise through utilization inductance component L 3 and inductance component L 4 series circuit the first secondary side series circuit 37 and comprise inductance component L 5 and the second secondary side series circuit 38 of the series circuit of inductance component L 6 clips primary side series circuit 36, can reduce the power transfer loss of high-frequency signal from secondary side series circuit 37,38 to primary side series circuit 36.In addition, structure that should use-case has also changed the coiling direction of antenna assembly shown in Figure 8 and inductance component L 2, L4, L6.
(first example of high-frequency element, with reference to Figure 16～Figure 18)
High-frequency element 135 can be used as the duplexer 140 of patch-type shown in Figure 16 and constitutes.This duplexer 140 is that a plurality of substrate layers that formed by medium or magnetic are carried out range upon range of parts, the antenna terminal 143 that is provided with the power supply terminal 141 that is connected with power supply circuits 30, the earth terminal 142 that is connected with second emitter 21 at its back side and is connected with first emitter 11.In addition, also be provided with the NC terminal 144 that is used to install overleaf.In addition, also can load inductance or the capacitor that impedance matching is used as required on the surface of duplexer 140.In addition, also can in duplexer 140, utilize electrode pattern to form inductance or capacitor.
Here, with reference to Figure 17, first example of the high-frequency element 135 that is built in above-mentioned duplexer 140 is described.In this first example; On the substrate layer 151a of ground floor, be formed with above-mentioned various terminal 141,142,143,144; On the substrate layer 151b of the second layer, be formed with the conductor 161,163 that becomes the first and the 3rd inductance component L 1, L3, on the 3rd layer substrate layer 151c, be formed with the conductor 162,164 that becomes the second and the 4th inductance component L 2, L4.
As conductor 161～164, can be with carrying out silk screen printing with conductive materials such as silver or copper as the thickener of main component or metal forming carried out etching etc. and forming.As substrate layer 151a～151c, if medium then can use glass ceramic material, epoxylite material etc., if magnetic then can use the ferrite ceramics material or contain ferritic resin material etc.
Through range upon range of above-mentioned substrate layer 151a～151c, conductor 161～164 separately and terminal 141,142,143 are connected through interlayer bonding conductor (via hole conductor), form the equivalent electric circuit shown in above-mentioned Figure 14 (A).That is, power supply terminal 141 is connected with an end of conductor 161 (first inductance component L 1) through via hole conductor 165a, and the other end of conductor 161 is connected with an end of conductor 162 (second inductance component L 2) through via hole conductor 165b.The other end of conductor 162 is connected with earth terminal 142 through via hole conductor 165c, and the other end of the conductor 164 behind the fork (the 4th inductance component L 4) is connected with an end of conductor 163 (the 3rd inductance component L 3) through via hole conductor 165d.The other end of conductor 163 is connected with antenna terminal 143 through via hole conductor 165e.
As above; Through inductance component L 1～L4 being built in the duplexer 140 that forms by medium or magnetic; The zone that particularly will become the coupling part of primary side series circuit 36 and secondary side series circuit 37 is arranged on the inside of duplexer 140, thus high-frequency element 135 be difficult to receive from the influence of other electronic components of duplexer 140 disposed adjacent.Consequently, can realize the further stable of frequency characteristic.
In addition; Through the first reactance component L1 and the 3rd reactance component L3 being arranged on same one deck (substrate layer 151b) of duplexer 140; The second reactance component L2 and the 4th reactance component L4 are arranged on same one deck (substrate layer 151c) of duplexer 140, thus the thickness attenuation of duplexer 140 (high-frequency element 135).In addition; Because can be (for example through same operation; The coating of conductive paste) comes to form respectively the first reactance component L1 and the 3rd reactance component L3 and the second reactance component L2 and the 4th reactance component L4 that intercouples; Therefore, the deviation of the degree of coupling that can suppress to cause because of range upon range of skew etc. improves reliability.
In the high-frequency element 135 of first example, shown in figure 18, mobile shown in arrow a among first and second inductance component L 1, L2 (conductor 161,162) from the high-frequency signal electric current of power supply terminal 141 input.Through (magnetic field that arrow a) produces motivates the high-frequency signal electric current shown in the arrow b in the 3rd and the 4th inductance component L 3, L4 (conductor 163,164), flow through induced current (secondary current) by this primary current.On the other hand, if it is opposite with arrow a to flow through the sense of current of first and second inductance component L 1, L2 (conductor 161,162), then in the 3rd and the 4th inductance component L 3, L4 (conductor 163,164), flow through the direction electric current opposite with arrow b.
In primary side series circuit 36, first and second inductance component L 1, L2 are coupled with opposite phase each other, and in secondary side series circuit 37, the 3rd and the 4th inductance component L 3, L4 are coupled each self-forming closed magnetic circuit each other with opposite phase.Therefore, can reduce energy loss.In addition, if make the inductance value of inductance value, the 3rd and the 4th inductance component L 3, L4 of first and second inductance component L 1, L2 identical in fact, then the leakage field of closed magnetic circuit reduces, and can further reduce energy loss.
In addition, by the magnetic field that primary current encouraged in the primary side series circuit 36 with by the magnetic field that secondary current encouraged in the secondary side series circuit 37, be to produce with the mode of offsetting magnetic field each other through induced current.Through utilizing induced current to reduce energy loss, the first and the 3rd inductance component L 1, L3 and the second and the 4th inductance component L 2, L4 are coupled with the high degree of coupling.That is, primary side series circuit 36 is coupled through the high degree of coupling with secondary side series circuit 37.
In addition, the inductance value of high-frequency element 135 is preferably less than the inductance value of connecting line 33.This is owing to can reduce the influence of the inductance value of connecting line 33.Through first and second inductance component L 1, L2, the 3rd and the 4th inductance component L 3, L4 are coupled with opposite phase, can reduce the inductance value of high-frequency element 135.
Basis first example according to above that kind; Because primary side series circuit 36 utilizes electromagnetic field (closed magnetic circuit) to be coupled with secondary side series circuit 37; Therefore; Through the impedance matching of primary side series circuit 36 realizations with power supply circuits 30 1 sides, and through the impedance matching of secondary side series circuit 37 realizations with first emitter, 11 1 sides, thereby can carry out impedance matching independently at primary side and secondary side.And, because the efficiency of transmission of higher frequency signal energy improves, therefore, can not receive the considerable influence of the shape, on off state etc. of emitter 11,21 and housing 10,20, can in broadband, stablize the frequency characteristic of high-frequency signal.In addition; Through the first reactance component L1 and the 3rd reactance component L3 are arranged on same one deck, the second reactance component L2 and the 4th reactance component L4 are arranged on same one deck, thus the thickness attenuation of duplexer 40; The deviation of the degree of coupling that can suppress to cause because of range upon range of skew etc. improves reliability.
(second example of high-frequency element, with reference to Figure 19)
Next, with reference to Figure 19, second example of high-frequency element is described.On the substrate layer 171a of ground floor, be formed with above-mentioned various terminal 141,142,143,144, on the substrate layer 171b of the second layer, be formed with conductor 172a, 172b.On the 3rd layer substrate layer 171c, respectively be formed with the conductor 173,175 that two circles become the first and the 3rd inductance component L 1, L3, on the 4th layer substrate layer 171d, respectively be formed with the conductor 174,176 that two circles become the second and the 4th inductance component L 2, L4.
Through range upon range of above-mentioned substrate layer 171a～171d, conductor 173～176 separately and terminal 141,142,143 are connected through interlayer bonding conductor (via hole conductor), form the equivalent electric circuit shown in above-mentioned Figure 14 (A).That is, power supply terminal 141 is connected with an end of conductor 173 (first inductance component L 1) through via hole conductor 177a, and the other end of conductor 173 is connected with an end of conductor 174 (second inductance component L 2) through via hole conductor 177b.The other end of conductor 174 is connected with earth terminal 142 through via hole conductor 177c, conductor 172a and via hole conductor 177d; The other end of conductor 172a is connected with an end of conductor 176 (the 4th inductance component L 4) through via hole conductor 177e, and the other end of conductor 176 is connected with an end of conductor 175 (the 3rd inductance component L 3) through via hole conductor 177f.The other end of conductor 175 is connected with antenna terminal 143 through via hole conductor 177g, conductor 172b and via hole conductor 177h.
In the high-frequency element of second example, also play and the identical action effect of above-mentioned first example.Primary current (arrow a) with the relation that kind shown in figure 19 of secondary current (arrow b).Particularly in second example,,, then can increase inductance value if the number of turn of coil increases with the conductor 173～176 that forms inductance component L 1～L4 two circles of respectively reeling.Certainly, also can be more than three circles, perhaps, also can make each coil stride across multilayer and reel.
(the 3rd example of high-frequency element, with reference to Figure 20)
Next, with reference to Figure 20, the 3rd example of high-frequency element is described.The 3rd example is following example: between the substrate layer 151a of the duplexer 140 that illustrates as above-mentioned first example, 151b; The range upon range of substrate layer 151d that is provided with earthing conductor 166; And, the range upon range of substrate layer 151e that is provided with earthing conductor 167 under substrate layer 151c.
Promptly; Power supply terminal 141 is connected with an end of conductor 161 (first inductance component L 1) through via hole conductor 165a, the conductor 168 that is arranged at substrate layer 151d and via hole conductor 165f, and the other end of conductor 161 is connected with an end of conductor 162 (second inductance component L 2) through via hole conductor 165b.The other end of conductor 162 is connected with an end of earthing conductor 166 through via hole conductor 165c, and the other end of earthing conductor 166 is connected with earth terminal 142 through via hole conductor 165h.In addition, the other end of conductor 162 is connected with earthing conductor 167 through via hole conductor 165g.Be connected with an end of conductor 163 (the 3rd inductance component L 3) through via hole conductor 165d from the other end of the conductor 164 (the 4th inductance component L 4) of conductor 162 fork.The other end of conductor 163 is connected with antenna terminal 143 through via hole conductor 165e.
In the high-frequency element of the 3rd example, also play and the identical action effect of above-mentioned first example.Particularly in the 3rd example; Through in the top of duplexer 140 and bottom earthing conductor 166,167 being arranged to cover the opening of the coil that forms by conductor 161～164, make the magnetic field that produces by coil be difficult to receive influence from the magnetic field of the various wirings on the printed circuit board.In other words, the L value of inductance component L 1～L4 is difficult to produce deviation.
(embodiment 7, with reference to Figure 21 and Figure 22)
The antenna assembly of expression embodiment 7 in Figure 21 (A).Here employed frequency stabilization circuit 135 adopts basically the structure identical with frequency stabilization circuit shown in Fig. 2 (A) 35; Also be connected with capacity cell C11, and capacity cell C12 and the 3rd inductance component L 3 and the 4th inductance component L 4 are connected in parallel at (between an end of end of first inductance component L 1 and the 3rd inductance component L 3) between primary side series circuit 36 and the secondary side series circuit 37.
In addition, shown in Figure 21 (B), except above-mentioned capacity cell C11, C12, also can capacity cell C13 and first inductance component L 1 and second inductance component L 2 be connected in parallel.
High-frequency element 135 shown in Figure 21 (A) (the 4th example) is to constitute as duplexer shown in Figure 22 140.In this duplexer 140, be provided with the substrate layer 151b of conductor 161,163 (inductance component L 1, L3) and be provided with the substrate layer 151c of conductor 162,164 (inductance component L 2, L4) identical with substrate layer shown in Figure 17.Range upon range of between substrate layer 151a, 151b have substrate layer 151f, 151g, a 151h.On substrate layer 151f, be formed with capacitance electrode 181, on substrate layer 151g, be formed with capacitance electrode 182 and conductor 183, on substrate layer 151h, be formed with earthing conductor 184.
Through laminated substrate layer 151a～151h, form capacity cell C11 at capacitance electrode 181, between 182, between capacitance electrode 182 and earthing conductor 184, form capacity cell C12.More detailed, power supply terminal 141 is connected with capacitance electrode 181 through via hole conductor 165j, and is connected with an end of conductor 183 through via hole conductor 165i.The other end of conductor 183 is connected with an end of conductor 161 (first inductance component L 1) through via hole conductor 165f, and the other end of conductor 161 is connected with an end of conductor 162 (second inductance component L 2) through via hole conductor 165b.The other end of conductor 162 is connected with an end of earthing conductor 184 through via hole conductor 165c, and the other end of earthing conductor 184 is connected with earth terminal 142 through via hole conductor 165k.
In addition, the other end from the conductor 164 (the 4th inductance component L 4) of conductor 162 fork is connected with an end of conductor 163 (the 3rd inductance component L 3) through via hole conductor 165d.The other end of conductor 163 is connected with antenna terminal 143 through via hole conductor 165e.Via hole conductor 165e is connected with capacitance electrode 182 at substrate layer 151g.
In the 4th example of this high-frequency element 135, can adjust the degree of coupling of primary side series circuit 36 and secondary side series circuit 37 through the capacitance of capacity cell C11.In addition, can adjust the resonance frequency of secondary side series circuit 37 through the capacitance of capacity cell C12.In the variation shown in Figure 21 (B), can adjust the resonance frequency of primary side series circuit 36 through the capacitance of capacity cell C13.
(embodiment 8, with reference to Figure 23 and Figure 24)
The antenna assembly of expression embodiment 8 in Figure 23.Here employed frequency stabilization circuit is the circuit that another primary side series circuit 38 (primary side reactance circuit) is set on the basis of above-mentioned primary side series circuit 36 and secondary side series circuit 37.The 5th inductance component L 5 and the 6th inductance component L 6 that constitute primary side series circuit 38 are coupled with opposite phase each other.The 5th inductance component L 5 and first inductance component L 1 are coupled with opposite phase, and the 6th inductance component L 6 and second inductance component L 2 are coupled with opposite phase.One end of the 3rd inductance component L 3 is connected with first emitter 11, and an end of the 4th inductance component L 4 is connected with second emitter 21.
With reference to Figure 24, this high-frequency element 135 (the 5th example) is described.The 5th example is formed with above-mentioned various terminal 141,142,143,144 on the substrate layer 181a of ground floor, on the substrate layer 181b of the second layer, be formed with conductor 197,198,199.On the 3rd layer substrate layer 181c, be formed with the conductor 191,193,195 that becomes the first, the 3rd and the 5th inductance component L 1, L3, L5, on the 4th layer substrate layer 181d, be formed with the conductor 192,194,196 that becomes the second, the 4th and the 6th inductance component L 2, L4, L6.Clip conductor 193 by conductor 191,195, clip conductor 194 by conductor 192,196.
Through range upon range of above-mentioned substrate layer 181a～181d, conductor 197～199,191～196 separately and terminal 141,142,143 are connected through interlayer bonding conductor (via hole conductor), form equivalent electric circuit shown in Figure 23.Promptly; Power supply terminal 141 is connected with the pars intermedia of conductor 197 through via hole conductor 201a; One end of conductor 197 is connected with an end of conductor 191 (first inductance component L 1) through via hole conductor 201b, and the other end of conductor 191 is connected with an end of conductor 192 (second inductance component L 2) through via hole conductor 201c.The other end of conductor 192 is connected with earth terminal 142 through via hole conductor 201d.Via hole conductor 201d is connected with an end of conductor 198 at substrate layer 181b, and the other end of conductor 198 is connected with an end of conductor 196 (the 6th inductance component L 6) through via hole conductor 201e.The other end of conductor 196 is connected with an end of conductor 195 (the 5th inductance component L 5) through via hole conductor 201f, and the other end of conductor 195 is connected with the other end of conductor 197 through via hole conductor 201g.That is, the other end of the 5th inductance L 5 is connected with power supply terminal 141 through via hole conductor 201g, conductor 197 and via hole conductor 201a.
On the other hand; The above-mentioned conductor 198 that is connected with earth terminal 142 is connected with an end of conductor 194 (the 4th inductance component L 4) through via hole conductor 201h, and the other end of conductor 194 is connected with an end of conductor 193 (the 3rd inductance component L 3) through via hole conductor 201i.The other end of conductor 193 is connected with an end of conductor 199 through via hole conductor 201j, and the other end of conductor 199 is connected with antenna terminal 143 through via hole conductor 201k.
The action of the 5th example of present embodiment 8 and duplexer 140 and the foregoing description 1 are basic identical with above-mentioned first example.In present embodiment 8, clip secondary side series circuit 37 through utilizing two primary side series circuits 36,38, can improve the degree of coupling of circuit 36 and circuit 37,38, the power transfer loss of high-frequency signal reduces.
In addition, also can be to utilize two secondary side series circuits to clip the structure of primary side series circuit.
(embodiment 9, with reference to Figure 25～Figure 27)
The antenna assembly of expression embodiment 9 in Figure 25.Here employed high-frequency element 135 has basically the structure identical with the foregoing description 1.Difference is: first inductance component L 1 and the 3rd inductance component L 3 are coupled with same phase each other, and second inductance component L 2 and the 4th inductance component L 4 are coupled with same phase each other.That is, the first and the 3rd inductance component L 1, L3 mainly are coupled through magnetic field, and the second and the 4th inductance component L 2, L4 mainly are coupled through magnetic field.The action effect of present embodiment 9 and embodiment 1 are basic identical.
The 6th example of expression high-frequency element 135 in Figure 26.The 6th example has and the essentially identical structure of first example shown in Figure 17, and its difference is: conductor 161 (first inductance component L 1) and conductor 162 (second inductance component L 2) are configured in the inboard of conductor 163 (the 3rd inductance component L 3) and conductor 164 (the 4th inductance component L 4).In addition, corresponding with this configuration, the configuration exchange of power supply terminal 141 and antenna terminal 142 on substrate layer 151a.
In the high-frequency element 135 of the 6th example, that kind shown in the arrow a flows in high-frequency signal electric current (primary current) image pattern 27, and induced current (secondary current) flows shown in arrow b.This point and illustrated the same of Figure 18.
(embodiment 10, with reference to Figure 28～Figure 32)
Shown in Figure 28 (A), the impedance transformation element 235 of embodiment 10 is made up of primary side series circuit 236 that is connected with terminals P 1, P2 and the secondary side series circuit 237 that is coupled through electric field or magnetic field and this primary side series circuit 236.Primary side series circuit 236 comprises the first coil part L11 and the second coil part L12 that is connected in series with this first coil part L11.Secondary side series circuit 237 comprise be connected in series with the tertiary coil element L13 of first coil part L11 coupling and with this tertiary coil element L13 and with the 4th coil part L14 of second coil part L12 coupling.
One end of primary side series circuit 236 (end of the first coil part L11) is connected with terminals P 1, and an end of secondary side series circuit 237 (end of tertiary coil element L13) is connected with terminals P 3.The other end of primary side series circuit 236 (other end of the second coil part L12) is connected with terminals P 2, and the other end of secondary side series circuit 237 (other end of the 4th coil part L14) is connected with terminals P 4.
Shown in Figure 28 (B), the first coil part L11 and the second coil part L12 are coupled with opposite phase each other, and likewise, tertiary coil element L13 and the 4th coil part L14 are coupled with opposite phase each other.In addition, the first coil part L11 and tertiary coil element L13 are coupled with opposite phase each other, and likewise, the second coil part L12 and the 4th coil part L14 are coupled with opposite phase each other.
In the impedance transformation element 235 that adopts above structure; Flow into the high-frequency signal conduct current first coil part L11 of primary side series circuit 236 from terminals P 1; And; Under the situation that each coil part is formed by coil pattern, through induced field as secondary current guiding tertiary coil element L13.In addition, lead the high-frequency signal electric current of the second coil part L12 through induced field as secondary current the 4th coil part L14 that leads.Consequently, the high-frequency signal electric current flows along the direction shown in the arrow among Figure 28 (B).
In the structure of present embodiment 10; The first coil part L11 and the second coil part L12 move with the mode that weakens magnetic field each other; And; Tertiary coil element L13 and the 4th coil part L14 also move with the mode that weakens magnetic field each other, and the magnetic field between primary side series circuit 236 and the secondary side series circuit 237 forms closed magnetic circuit.In addition; The electric current that flows through because of the field coupled between the first coil part L11 and the tertiary coil element L13, and the electric current that flows through because of the coupling of the magnetic field between the first coil part L11 and the tertiary coil element L13 flow along same direction, coupling by this way generates an electromagnetic field.Between the second coil part L12 and the 4th coil part L14, too, the electric current that flows through because of field coupled, flow along same direction with the electric current that flows through because of the magnetic field coupling, coupling by this way generates an electromagnetic field.In addition, the first coil part L11 and the second coil part L12 carry out capacitive coupling through not shown electrode pattern, make the electric current edge direction identical with the diagram sense of current flow.Tertiary coil element L13 and the 4th coil part L14 carry out capacitive coupling through not shown electrode pattern similarly, make the electric current edge direction identical with the diagram sense of current flow.
The concrete structure of each coil part L1～L4 in the above-mentioned impedance transformation element 235 is described here.Figure 29 representes the schematic structure of coil part L1～L4, and Figure 32 representes structure more specifically.At first, with reference to Figure 31 and Figure 32 concrete structure is described.
Impedance transformation element 235 can be used as the duplexer 240 of patch-type shown in Figure 31 and constitutes.This duplexer 240 is that a plurality of substrate layers that formed by medium or magnetic are carried out range upon range of parts, the NC terminals P 5 that also be provided with terminals P 1～P4 at its back side, is used to install.
Here, with reference to Figure 29 and Figure 32, the concrete example of the impedance transformation element 235 that is built in above-mentioned duplexer 240 is described.This concrete example and stepped construction shown in Figure 5 are basic identical, and mark has the label identical with Fig. 5.Promptly; On the substrate layer 51a of the superiors, be formed with conductor 61; On the substrate layer 51b of the second layer, be formed with the conductor 62 that becomes first and second coil part L11, L12, on the 3rd layer substrate layer 51c, be formed with two conductors 63,64 that become first and second coil part L11, L12.On the 4th layer substrate layer 51d, be formed with two conductors 65,66 that become the 3rd and the 4th coil part L13, L14, on the substrate layer 51e of layer 5, be formed with the conductor 67 that becomes the 3rd and the 4th coil part L13, L14.In addition, on the substrate layer 51f of layer 6, be formed with conductor 68, be formed with terminals P 1～P4 at the back side of the substrate layer 51g of layer 7.In addition, in the substrate layer 51a of the superiors laminated not shown pattern-free substrate layer is arranged.
Through range upon range of above-mentioned substrate layer 51a～51g, conductor 61～68 separately and terminals P 1～P4 are connected through interlayer bonding conductor (via hole conductor), form the equivalent electric circuit shown in Figure 28 (A).
That is, terminals P 1 is connected with an end of coil pattern 63 through via hole conductor 45a, conductor 61 and via hole conductor 45b, and the other end of coil pattern 63 is connected with the end of coil pattern 62a through via hole conductor 45c.In addition, the other end of coil pattern 62a is connected with the end of coil pattern 62b, and the other end of coil pattern 62b is connected with an end of coil pattern 64 through via hole conductor 45d.The other end of coil pattern 64 is connected with conductor 68 through via hole conductor 45e, and conductor 68 is connected with terminals P 2 through via hole conductor 45f.That is, utilize coil pattern 63 and coil pattern 62a to constitute first coil pattern, be coil part L11, utilize coil pattern 62b and coil pattern 64 to constitute second coil pattern, be coil part L12.
In addition, terminals P 3 is connected with an end of coil pattern 65 through via hole conductor 45g, and the other end of coil pattern 65 is connected with the end of coil pattern 67a through via hole conductor 45h.In addition, the other end of coil pattern 67a is connected with the end of coil pattern 67b, and the other end of coil pattern 67b is connected with an end of coil pattern 66 through via hole conductor 45i.The other end of coil pattern 66 is connected with terminals P 4 through via hole conductor 45j.That is, utilize coil pattern 65 and coil pattern 67a to constitute the tertiary coil pattern, be coil part L13, utilize coil pattern 67b and coil pattern 66 to constitute the 4th coil pattern, be coil part L14.
And; Like Figure 29 and shown in Figure 32; First and second coil pattern becomes parallel mode disposed adjacent with the wireline reel of first coil pattern and the wireline reel of second coil pattern, and the 3rd and the 4th coil pattern becomes parallel mode disposed adjacent with the wireline reel of tertiary coil pattern and the wireline reel of the 4th coil pattern.In addition; First and the tertiary coil pattern arrangement become the wireline reel of first coil pattern and the wireline reel of tertiary coil pattern to become same straight line substantially, the second and the 4th coil pattern is configured to the wireline reel of second coil pattern and the wireline reel of the 4th coil pattern becomes same straight line substantially.
In addition, though each coil pattern utilizes the ring-shaped conductor of a circle to constitute, also can utilize the ring-shaped conductor of multiturn to constitute.In addition; First and the tertiary coil pattern wireline reel that need not to be configured to each coil pattern strictly become same straight line, as long as when overlooking first and overlapped, the public magnetic flux of coil aperture of tertiary coil pattern reel through each coil pattern is such.Likewise; The wireline reel that the second and the 4th coil pattern need not to be configured to each coil pattern strictly becomes same straight line, as long as overlapped, the public magnetic flux of the coil aperture of the second and the 4th coil pattern is reeled through each coil pattern is such when overlooking.
As above; Through coil part L11～L14 being built in the duplexer 240 that forms by medium or magnetic; The zone that particularly will become the coupling part of primary side series circuit 236 and secondary side series circuit 237 is arranged on the inside of duplexer 240, thus the degree of coupling of component value even primary side series circuit 236 and secondary side series circuit 237 that constitutes the element of impedance transformation element 235 be difficult to receive from the influence of other electronic components of duplexer 240 disposed adjacent.
In the impedance transformation element 235 of embodiment 10; Shown in figure 30; From the high-frequency current of terminals P 1 input is shown in arrow a, flow; The first coil part L11 (conductor 62,63) that leads shown in arrow c, d, and the second coil part L12 (conductor 62,64) that leads further shown in arrow e, f are from flowing out terminals P 2 is shown in arrow l.Through the magnetic field C that produces by primary current (arrow c, d), in tertiary coil element L13 (conductor 65,67), motivate high-frequency current shown in arrow g, h, flow through induced current (secondary current).Likewise,, in the 4th coil part L14 (conductor 66,67), motivate high-frequency current shown in arrow i, j, flow through induced current (secondary current) through the magnetic field C that produces by primary current (arrow e, f).Consequently, the high-frequency current shown in the arrow k flows through terminals P 3, and the high-frequency current shown in the arrow m flows through terminals P 4.In addition, (arrow is a rightabout a), and then other electric currents also flow in opposite direction as if the electric current that flows through terminals P 1.In addition, flow with the mobile displacement current edge direction identical of the field coupled between the tertiary coil element L13 because of the first coil part L11 with induced current.In addition, for the second coil part L12 and the 4th coil part L14 too, the direction identical with induced current because of the mobile displacement current edge of field coupled separately flows.In addition, the first coil part L11 and the second coil part L12 carry out capacitive coupling through not shown electrode pattern, and the electric current edge direction identical with primary current (arrow d, e) flows.Tertiary coil element L13 and the 4th coil part L14 carry out capacitive coupling through not shown electrode pattern similarly, and the electric current edge direction identical with secondary current (arrow h, i) flows.
In primary side series circuit 236; First and second coil part L11, L12 are coupled with opposite phase each other; In secondary side series circuit 237, the 3rd and the 4th coil part L13, L14 are coupled with opposite phase each other, each self-forming closed magnetic circuit.Therefore, can reduce the energy loss that is accompanied by impedance conversion between the first coil part L11 and the second coil part L12 and between tertiary coil element L13 and the 4th coil part L14.In addition, if make inductance value, the 3rd and the 4th coil part L13 of first and second coil part L11, L12, the inductance value of L14 be essentially the similar elements value, then the leakage field of closed magnetic circuit reduces, and can further reduce energy loss.
In addition, by the magnetic field C that primary current encouraged in the primary side series circuit 236 with by the magnetic field D that secondary current encouraged in the secondary side series circuit 237, be to produce with the mode of offsetting magnetic field each other through induced current.Through utilizing induced current to reduce energy loss, first and tertiary coil element L11, L13 and the second and the 4th coil part L12, L14 be coupled with the high degree of coupling.That is, primary side series circuit 236 is coupled through the high degree of coupling with secondary side series circuit 237.
(embodiment 11, with reference to Figure 33 and Figure 34)
The impedance transformation element 235 of expression embodiment 11 in Figure 33.This impedance transformation element 235 is elements that another secondary side series circuit 238 is set on the basis of above-mentioned primary side series circuit 236 and secondary side series circuit 237.The 5th coil part L15 and the 6th coil part L16 that constitute secondary side series circuit 238 are coupled with opposite phase each other.The 5th coil part L15 and the first coil part L11 are coupled with opposite phase, and the 6th coil part L16 and the second coil part L12 are coupled with opposite phase.The end of the 5th coil part L15 is connected with terminals P 3, and the end of the 6th coil part L16 is connected with terminals P 4.
With reference to Figure 34, explanation constitutes this impedance transformation element 235 as duplexer 240 concrete example.This concrete example is on above-mentioned duplexer shown in Figure 32 240, further range upon range of substrate layer 51i, the 51j that is formed with the conductor 71,72,73 of the 5th and the 6th coil part L15 that becomes secondary side series circuit 238, L16.Promptly; Identical with above-mentioned first～the 4th coil part L11～L14; Utilize coil pattern to form the 5th and the 6th coil part L15, L16; And the magnetic field that the coil pattern that constitutes the 5th and the 6th coil part L15, L16 is produced with this coil part L15, L16 forms the mode of closed magnetic circuit and reels.
The action of present embodiment 11 and the foregoing description 10 are basic identical.In present embodiment 11, clip primary side series circuit 236 through utilizing two secondary side series circuits 237,238, the power transfer loss of 237,238 high-frequency current reduces from primary side series circuit 236 to the secondary side series circuit.
(embodiment 12, with reference to Figure 35 and Figure 36)
The impedance transformation element 235 of embodiment 12 is to constitute as the duplexer 240 of patch-type shown in Figure 35.This duplexer 240 is that a plurality of substrate layers that formed by medium or magnetic are carried out range upon range of parts, and its structure and duplexer 140 shown in Figure 17 are basic identical, mark the label identical with Figure 17.Promptly; On the substrate layer 151a of ground floor, be formed with terminals P 1～P4; On the substrate layer 151b of the second layer, being formed with becomes first and the conductor 161,163 of tertiary coil element L11, L13, on the 3rd layer substrate layer 151c, is formed with the conductor 162,164 that becomes the second and the 4th coil part L12, L14.
As conductor 161～164, can be with carrying out silk screen printing with conductive materials such as silver or copper as the thickener of main component or metal forming carried out etching etc. and forming.As substrate layer 151a～151c, if medium then can use glass ceramic material, epoxylite material etc., if magnetic then can use the ferrite ceramics material or contain ferritic resin material etc.
Through range upon range of above-mentioned substrate layer 151a～151c, conductor 161～164 separately and terminals P 1～P4 are connected through interlayer bonding conductor (via hole conductor), form the equivalent electric circuit shown in above-mentioned Figure 28 (A).That is, terminals P 1 is connected with an end of conductor 161 (the first coil part L11) through via hole conductor 165a, and the other end of conductor 161 is connected with an end of conductor 162 (the second coil part L12) through via hole conductor 165b.The other end of conductor 162 is connected with terminals P 2 through via hole conductor 165c.One end of conductor 163 (tertiary coil element L13) is connected with terminals P 3 through via hole conductor 165e; The other end of conductor 163 is connected with an end of conductor 164 (the 4th coil part L14) through via hole conductor 165d, and the other end of conductor 164 is connected with terminals P 4 through via hole conductor 165f.
In present embodiment 12; Through the first coil part L11 and tertiary coil element L13 being arranged on same one deck (substrate layer 151b) of duplexer 240; The second coil part L12 and the 4th coil part L14 are arranged on same one deck (substrate layer 151c) of duplexer 240, thus the thickness attenuation of duplexer 240.In addition; Because can be (for example through same operation; The coating of conductive paste) comes to form respectively the first coil part L11 and tertiary coil element L13 and the second coil part L12 and the 4th coil part L14 that intercouples; Therefore, the deviation of the degree of coupling that can suppress to cause because of range upon range of skew etc. improves reliability.
In this impedance transformation element 235, shown in figure 36, mobile shown in arrow a among first and second coil part L11, L12 (conductor 161,162) from the high-frequency current of terminals P 1 input.Through (magnetic field that arrow a) produces motivates the high-frequency current shown in the arrow b in the 3rd and the 4th coil part L13, L14 (conductor 163,164), flow through induced current (secondary current) by this primary current.On the other hand, if it is opposite with arrow a to flow through the sense of current of first and second coil part L11, L12 (conductor 161,162), then in the 3rd and the 4th coil part L13, L14 (conductor 163,164), flow through the direction electric current opposite with arrow b.
In primary side series circuit 236; First and second coil part L11, L12 are coupled with opposite phase each other; In secondary side series circuit 237, the 3rd and the 4th coil part L13, L14 are coupled with opposite phase each other, each self-forming closed magnetic circuit.Therefore, can reduce energy loss.In addition, identical in fact as if the inductance value of the inductance value that makes first and second coil part L11, L12, the 3rd and the 4th coil part L13, L14, then the leakage field of closed magnetic circuit reduces, and can further reduce energy loss.
In addition, by the magnetic field that primary current encouraged in the primary side series circuit 236 with by the magnetic field that secondary current encouraged in the secondary side series circuit 237, be to produce with the mode of offsetting magnetic field each other through induced current.Through utilizing induced current to reduce energy loss, first and tertiary coil element L11, L13 and the second and the 4th coil part L12, L14 be coupled with the high degree of coupling.That is, primary side series circuit 236 is coupled through the high degree of coupling with secondary side series circuit 237.
(embodiment 13, with reference to Figure 37)
The impedance transformation element 235 of embodiment 13 is following elements: shown in figure 37; In duplexer 240; With the first coil part L11 and the second coil part L12 at grade near configuration; And with tertiary coil element L13 and the 4th coil part L14 near configuration at grade, each coil part L11～L14 three circles of reeling respectively.In addition, the wireline reel of the wireline reel of the first coil part L11 and tertiary coil element L13 is configured on the same straight line of cardinal principle, and the wireline reel of the wireline reel of the second coil part L12 and the 4th coil part L14 is configured on the same straight line of cardinal principle.
The equivalent electric circuit of present embodiment 13 is identical with the embodiment 10 shown in Figure 28 (A), and its action effect is also identical with embodiment 10.Particularly in embodiment 13,, improve coupling value through increasing the number of turn of coil part L11～L14.
(other embodiment)
In addition, high-frequency element and communication terminal device that the utility model is related are not limited to the foregoing description, can in it wants point range, carry out various changes.
For example, the utility model not only is used for the mobile radio communications system of mobile digital TV or corresponding multiband, also can be used near radio system (2.4GHz frequency band), the gps system various communication systems such as (1.5GHz frequency bands) of bluetooth or W-LAN and so on.
In addition; The mode of frequency stabilization circuit, high-frequency element is except that as the duplexer of patch-type and constituting, and also can be used as with the module of other being integrally formed of element such as strip line, loads or be built in the module of the printed circuit board that is provided with radiated element and constitute.In addition, frequency stabilization circuit, high-frequency element be except that being arranged to primary side series circuit and secondary side series circuit one cover, overlap also capable of being combined and form multistage more.Also can form multistage as a cover structure of utilizing the secondary side series circuit to clip the primary side series circuit shown in embodiment 2.Multistage through forming, can reduce the power transfer loss of high-frequency signal, make sharply decay of return loss (return loss).In addition, the number of elements of the coil part (reactance component) in primary side series circuit, the secondary side series circuit also can be more than three.
As supply power mode, under the situation that first emitting element and second radiated element is regarded as radiated element respectively, be the balanced feeding type, be non-balanced feeding type first emitting element being regarded as radiated element, second radiated element being regarded as under the situation of ground connection.
In addition, above-mentioned impedance transformation element can be used for step-up/down circuit, unsteady flow/shunt circuit, balance-non-equilibrium translation circuit etc.In above-mentioned impedance transformation element,, can set the conversion ratio of impedance arbitrarily through the inductance value of suitable setting primary side series circuit and the inductance value of secondary side series circuit (for example, the number of turn of the annular patterns in the coil part).
Practicality in the industry
As stated, the utility model is useful for high-frequency element and communication terminal device, and is particularly more excellent in the frequency this point of stablizing high-frequency signal.
Label declaration
1,2 mobile terminals
10 first housings
11 first emitting elements
11a, 11b fork mono-polar antenna
20 second housings
21 second radiated elements
30 power supply circuits
35 frequency stabilization circuits
36 primary side series circuits
37,38 secondary side series circuits
40 duplexers
135 high-frequency elements
140 duplexers
235 impedance transformation elements
L1～L6 inductance element
L11～L16 coil part

Claims (4)

1. a high-frequency element is characterized in that, comprising:
Duplexer, this duplexer are with a plurality of dielectric layers or magnetic is folded layer by layer forms;
Power supply terminal, this power supply terminal is arranged at said duplexer, and is connected with power supply circuits;
Antenna terminal, this antenna terminal is arranged at said duplexer, and is connected with radiated element;
The primary side series circuit, this primary side series circuit is arranged at said duplexer, comprises first coil part and second coil part that is connected in series with this first coil part, and is connected with said power supply terminal; And
The secondary side series circuit; This secondary side series circuit is arranged at said duplexer; Comprise the 4th coil part that is connected with the tertiary coil element of said this first coil part coupling and with said tertiary coil element connected in series and is coupled with said second coil part; And be connected with said antenna terminal
Said first and second coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit,
The the said the 3rd and the 4th coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit.
2. high-frequency element as claimed in claim 1 is characterized in that,
Said duplexer also comprises the earth terminal of ground connection.
3. according to claim 1 or claim 2 high-frequency element is characterized in that,
Also comprise capacity cell, this capacity cell is loaded into an interarea of said duplexer.
4. a communication terminal device is characterized in that,
Comprise high-frequency element, power supply circuits and radiated element,
Said high-frequency element comprises:
Duplexer, this duplexer are with a plurality of dielectric layers or magnetic is folded layer by layer forms;
Power supply terminal, this power supply terminal is arranged at said duplexer;
Antenna terminal, this antenna terminal is arranged at said duplexer;
The primary side series circuit, this primary side series circuit is arranged at said duplexer, comprises first coil part and second coil part that is connected in series with this first coil part, and is connected with said power supply terminal; And
The secondary side series circuit; This secondary side series circuit is arranged at said duplexer; Comprise the 4th coil part that is connected with the tertiary coil element of said this first coil part coupling and with said tertiary coil element connected in series and is coupled with said second coil part; And be connected with said antenna terminal
Said first and second coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit,
The the said the 3rd and the 4th coil part is reeled with the mode that the magnetic field that these coil parts were produced forms closed magnetic circuit,
Said power supply circuits are connected with said power supply terminal,
Said radiated element is connected with said antenna terminal.
CN2011200290947U 2010-01-19 2011-01-19 High frequency device and communication terminal equipment Expired - Lifetime CN202178378U (en)

Applications Claiming Priority (6)

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JP2010009513 2010-01-19
JP2010-009513 2010-01-19
JP2010-098312 2010-04-21
JP2010-098313 2010-04-21
JP2010098313 2010-04-21
JP2010098312 2010-04-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023221319A1 (en) * 2022-05-19 2023-11-23 安徽安努奇科技有限公司 Frequency divider

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023221319A1 (en) * 2022-05-19 2023-11-23 安徽安努奇科技有限公司 Frequency divider

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