CN202150102U - Capacitive touch sensitive device - Google Patents
Capacitive touch sensitive device Download PDFInfo
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- CN202150102U CN202150102U CN201120269007U CN201120269007U CN202150102U CN 202150102 U CN202150102 U CN 202150102U CN 201120269007 U CN201120269007 U CN 201120269007U CN 201120269007 U CN201120269007 U CN 201120269007U CN 202150102 U CN202150102 U CN 202150102U
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- conductive layer
- induction installation
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- touch induction
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Abstract
The utility model provides a capacitive touch sensitive device which comprises a base plate and a film plating layer, wherein the base plate comprises a transparent touch sensitive part and a lead part; the film plating layer comprises a first sensing layer arranged on the touch sensitive part, a second sensing layer arranged on the lead part, an insulating layer arranged on the first sensing layer, a first conductive layer arranged on the insulating layer and a second conductive layer arranged on the second sensing layer; the touch sensitive part and the lead part are connected through the first sensing layer and the second sensing layer; and the first conductive layer and the second conductive layer are not positioned on the same plane in the horizontal direction, so that the thickness of the conducive layer is reduced, therefore, the transparency is ensured, and the capacitive touch sensitive device is more applicable to various products.
Description
Technical field
The utility model relates to a kind of capacitance touch induction installation, relates in particular to a kind of capacitance touch induction installation of single face processing procedure.
Background technology
That touch induction device has is sturdy and durable, reaction velocity fast, save the space, be easy to many advantages such as interchange, in recent years, is applied to touch induction device on the electronics and IT products more and more.Touch induction device can be divided into five basic kind by know-why: vector pressure sensing technology touch induction device, resistive technologies touch induction device, capacitance technology touch induction device, infrared technology touch induction device, surface acoustic wave technique touch induction device.
The capacitance touch induction installation has been widely applied in each electronic product, for example mobile phone, e-book, POS terminal or the like.And the capacitance touch induction installation is divided into two-sided processing procedure capacitance touch induction installation and single face processing procedure capacitance touch induction installation.
The capacitance touch induction installation of existing single face processing procedure generally comprises the transparency carrier that is arranged at the bottom, is arranged at the coatings on the substrate.Substrate comprises mainboard and lead member again, and mainboard and lead member are arranged at same plane.Coatings comprises sensed layer, insulation course and conductive layer; Sensed layer is arranged on mainboard and the lead member, and its consistency of thickness plays the purpose of induction; Insulation course is arranged on the sensed layer; Conductive layer then is arranged on the sensed layer, and is justifying conduction plated film, uses promptly that material is identical, thickness is also identical.Lead member is for satisfying the resistance requirement, and the thickness of conductive layer also has requirement, generally at 300-500nm, yet, if the conductive layer thickness of mainboard is 300-500nm, can influence the transparency of mainboard, even influence later product result of use.
Given this, be necessary to provide a kind of new capacitance touch induction installation to solve the problems referred to above.
The utility model content
The purpose of the utility model is to provide a kind of capacitance touch induction installation that improves translucent effect.
For realizing aforementioned purpose, the technical scheme that the utility model adopts is following:
A kind of capacitance touch induction installation is characterized in that, said capacitance touch induction installation comprises:
Substrate, said substrate comprises touch sensible parts and lead member;
Coatings; Comprise first sensed layer that is arranged on the said touch sensible parts, be arranged at second sensed layer on the lead member; Be arranged at the insulation course on said first sensed layer; Be arranged at first conductive layer on the said insulation course and be arranged at second conductive layer on said second sensed layer, said touch sensible parts are connected with second sensed layer through first sensed layer with said lead member;
Said first conductive layer and said second conductive layer are not in a plane in the horizontal direction.
Further, said first conductive layer and said second conductive layer thickness do not wait.
Further, said first conductive layer and second conductive layers apart design.
Further, said first conductive layer is processed by Ag film, IZO film or MO/AL/MO film.
Further, said second conductive layer is processed by the MO/AL/MO film.
Further, the thickness of first sensed layer and on-fixed, the fixed thickness of said second sensed layer.
Further, first sensed layer and the second sensed layer consistency of thickness, said first conductive layer and said second conductive layer are not in a plane in the horizontal direction.
Further, first sensed layer and the second sensed layer thickness do not wait, and said first conductive layer and said second conductive layer have at least one side not to be in a plane in the horizontal direction.
Further; Said first sensed layer comprises the tactic first adjacent electrode and second electrode; Said insulation course comprises insulating mat; Said first conductive layer comprises conducting bridge, and said insulating mat connects said first electrode and second electrode, and said conducting bridge strides across said insulating mat and connects first electrode and second electrode.
Further, said first sensed layer comprises continue first detecting part of arranging and second detecting part that separates arrangement, and said first electrode and second electrode are arranged on second detecting part.
Compared with prior art; The beneficial effect of the utility model is: the appearance formula touch induction device that the utility model provides, and the conductive layer thickness of touch sensible parts and lead member does not wait, and reduces the thickness of touch sensible parts conductive layer; Thereby guaranteed transparency, strengthened translucent effect.
Description of drawings
Fig. 1 is the floor map of capacitance touch induction installation in the utility model one embodiment.
Fig. 2 is the part plan synoptic diagram of capacitance touch induction installation in the utility model one embodiment.
Fig. 3 is the part plan synoptic diagram of capacitance touch induction installation in another embodiment of the utility model.
Fig. 4 is the oval local enlarged diagram that encloses part among Fig. 1.
Wherein 1 is substrate, and 11 is the touch sensible parts, and 12 is lead member, and 2 is coatings, and 3 is sensed layer; 31 is first sensed layer, and 311 is first detecting part, and 312 is second detecting part, and 313 is first electrode, and 314 is second electrode; 32 is second sensed layer, and 4 is insulation course, and 41 is insulating mat, and 5 is conductive layer; 51 is first conductive layer, and 511 is conducting bridge, and 52 is second conductive layer, and 521 is conductive part.
Embodiment
Below will combine the preferred implementation of accompanying drawing and the utility model to do further explanation.
Like Fig. 1, Fig. 2 and shown in Figure 3, the capacitance touch induction installation in the utility model comprises substrate 1 and is arranged at the coatings 2 on the said substrate 1.Said substrate 1 comprises touch sensible parts 11 and the lead member that is connected said touch sensible parts 11 12, and wherein, said touch sensible parts 11 are in same plane in the horizontal direction with lead member 12.Said substrate 1 is a transparency carrier, can adopt rigid transparent materials such as unorganic glass, organic glass to make.
Wherein, said coatings 2 comprises the sensed layer 3 that directly is arranged on the said substrate 1, is arranged at the insulation course 4 on the said sensed layer 3 and is arranged at the conductive layer 5 on the said insulation course 4.Said sensed layer 3 comprises first sensed layer 31 and second sensed layer 32 that is covered in said lead member 12 that is covered in said touch sensible parts.Said touch sensible parts 11 are connected with second sensed layer 32 through first sensed layer 31 with said lead member 12.Said first sensed layer 31 comprises first detecting part 311 and second detecting part 312 that separates arrangement of continuous arrangement, and said first detecting part 311 and second detecting part, 312 parallel interval are arranged.Said first detecting part 311 is continuous argyle design, and the argyle design that separates with said second detecting part 312 cooperatively interacts.Yet in other embodiments, first detecting part 311 and second detecting part 312 also can be that other pattern cooperatively interacts, and for example circular and circularly cooperate, square and square cooperation or the like.Said first sensed layer 31 also comprises first electrode 313 and second electrode 314, and said first electrode 313 and second electrode 314 are arranged at the diagonal angle part (not label) of second detecting part, 312 corresponding argyle designs.Said second sensed layer 32 evenly is covered on the said lead member 12; Preferably, first sensed layer 31 and second sensed layer 32 are ITO (Indium Tin Oxides, indium tin metal oxide) film layer structure; Its thickness is 10-20nm; The thickness of first sensed layer 31 thickness with said second sensed layer 32 under situation about having is identical, and inequality with the thickness of said second sensed layer 32 under situation about having, the thickness of said first sensed layer 31 can be controlled.
Like Fig. 2, Fig. 3 and shown in Figure 4, said insulation course 4 comprises insulating mat 41, and the two ends of said insulating mat 41 connect first electrode 313 and second electrode 314, and preferably, said insulating mat 41 is processed by OC glue.Said conductive layer 5 comprises first conductive layer 51 and second conductive layer 52; Said first conductive layer 51 is covered on the said insulation course 4; The one side that said insulating mat 41 contacts with first conductive layer 51 is a cambered surface, and said second conductive layer 52 is covered on said second sensed layer 32.Said first conductive layer 51 comprises conducting bridge 511; Said conducting bridge 511 is a sheet, is covered on the said insulating mat 41, and cross-over connection first electrode 313 and second electrode 314; Two electrodes that said conducting bridge 511 will be spaced couple together, and form continuous sensing circuit.The conducting bridge 511 and first electrode 313 and second electrode 314 are insulated pad 41 isolates, and prevents first detecting part 311 and 312 short circuits of second detecting part.Said second conductive layer 52 comprises conductive part 521, and preferably, said conductive part 521 is made up of the MO/AL/MO rete, yet in order to satisfy the requirement of resistance, its thickness is necessary for 300-500nm.Said conducting bridge 511 can be made up of Ag rete, IZO rete or MO/AL/MO rete.
As shown in Figure 2, the conducting bridge 511 in the present embodiment adopts the MO/AL/MO rete, and conductive part 521 also adopts the MO/AL/MO rete of 300-500nm.Its first sensed layer 31 is identical with the thickness of second sensed layer 32; And the thickness of conducting bridge 511 is less than the thickness of conductive part 521; Thus, the top of conducting bridge 511 and conductive part 521 is not in same plane, and promptly first conductive layer 51 and second conductive layer 52 are not in a plane in the horizontal direction.Conducting bridge 511 also can adopt Ag rete or IZO rete in the present embodiment, but the thickness of conducting bridge 511 is different with conductive part 521.
As shown in Figure 3, conducting bridge 511 adopts the IZO rete in the present embodiment, and conductive part 521 adopts the MO/AL/MO rete of 300-500nm.And the thickness of first sensed layer 31 is greater than the thickness of second sensed layer 32; Because the thickness of conducting bridge 511 is less than the thickness of conductive part 521; At this moment; The top of conducting bridge 511 and conductive part 521 is in same surface level, and the bottom of conducting bridge 511 and conductive part 521 is not in same surface level, and promptly first conductive layer 51 and second conductive layer 52 have at least a surface not to be in a plane in the horizontal direction.
Omitted the connection of long part among Fig. 2 and Fig. 3 between touch sensible parts 11 and the lead member 12, touch sensible parts 11 interconnect with lead member 12 in the practical application.
In the utility model; Through variation to the thickness of capacitance touch induction installation conducting bridge 511, conductive layer 512, first sensed layer 31 and second sensed layer 32; Make the thickness of conducting bridge 511 obviously diminish, thereby strengthened the sharpness of touch sensible parts, more be applicable to the application of product.
Although be the example purpose; The preferred implementation of the utility model is disclosed; But those of ordinary skill in the art will recognize, under situation about not breaking away from by the scope of the disclosed the utility model of appending claims and spirit, various improvement, increase and replacement are possible.
Claims (10)
1. a capacitance touch induction installation is characterized in that, said capacitance touch induction installation comprises:
Substrate, said substrate comprises touch sensible parts and lead member;
Coatings; Comprise first sensed layer that is arranged on the said touch sensible parts, be arranged at second sensed layer on the lead member; Be arranged at the insulation course on said first sensed layer; Be arranged at first conductive layer on the said insulation course and be arranged at second conductive layer on said second sensed layer, said touch sensible parts are connected with second sensed layer through first sensed layer with said lead member;
Said first conductive layer and said second conductive layer are not in a plane in the horizontal direction.
2. capacitance touch induction installation according to claim 1 is characterized in that: said first conductive layer and said second conductive layer thickness do not wait.
3. capacitance touch induction installation according to claim 2 is characterized in that: said first conductive layer and the design of second conductive layers apart.
4. capacitance touch induction installation according to claim 1 is characterized in that: said first conductive layer is processed by Ag film, IZO film or MO/AL/MO film.
5. capacitance touch induction installation according to claim 1 is characterized in that: said second conductive layer is processed by the MO/AL/MO film.
6. capacitance touch induction installation according to claim 2 is characterized in that: the thickness of first sensed layer and on-fixed, the fixed thickness of said second sensed layer.
7. capacitance touch induction installation according to claim 6 is characterized in that: first sensed layer and the second sensed layer consistency of thickness, said first conductive layer and said second conductive layer are not in a plane in the horizontal direction.
8. capacitance touch induction installation according to claim 6 is characterized in that: first sensed layer and the second sensed layer thickness do not wait, and said first conductive layer and said second conductive layer have at least one side not to be in a plane in the horizontal direction.
9. capacitance touch induction installation according to claim 1; It is characterized in that: said first sensed layer comprises the tactic first adjacent electrode and second electrode; Said insulation course comprises insulating mat; Said first conductive layer comprises conducting bridge, and said insulating mat connects said first electrode and second electrode, and said conducting bridge strides across said insulating mat and connects first electrode and second electrode.
10. capacitance touch induction installation according to claim 9 is characterized in that: said first sensed layer comprises continue first detecting part of arranging and second detecting part that separates arrangement, and said first electrode and second electrode are arranged on second detecting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120269007U CN202150102U (en) | 2011-07-27 | 2011-07-27 | Capacitive touch sensitive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120269007U CN202150102U (en) | 2011-07-27 | 2011-07-27 | Capacitive touch sensitive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202150102U true CN202150102U (en) | 2012-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120269007U Expired - Lifetime CN202150102U (en) | 2011-07-27 | 2011-07-27 | Capacitive touch sensitive device |
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| Country | Link |
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| CN (1) | CN202150102U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102968216A (en) * | 2012-11-30 | 2013-03-13 | 信利光电(汕尾)有限公司 | Touch screen and manufacturing method thereof |
| CN103176677A (en) * | 2013-03-06 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch screen conductive structure and manufacturing method |
| CN103176678A (en) * | 2013-03-06 | 2013-06-26 | 南昌欧菲光科技有限公司 | Conductive grid bridging structure and manufacturing method thereof |
| US9287644B2 (en) | 2013-03-06 | 2016-03-15 | Nanchang O-Film Tech Co., Ltd. | Bridge structure in conductive mesh and method for manufacturing the same |
-
2011
- 2011-07-27 CN CN201120269007U patent/CN202150102U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102968216A (en) * | 2012-11-30 | 2013-03-13 | 信利光电(汕尾)有限公司 | Touch screen and manufacturing method thereof |
| CN103176677A (en) * | 2013-03-06 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch screen conductive structure and manufacturing method |
| CN103176678A (en) * | 2013-03-06 | 2013-06-26 | 南昌欧菲光科技有限公司 | Conductive grid bridging structure and manufacturing method thereof |
| CN103176677B (en) * | 2013-03-06 | 2014-06-18 | 南昌欧菲光科技有限公司 | Touch screen conductive structure and manufacturing method |
| TWI497392B (en) * | 2013-03-06 | 2015-08-21 | Nanchang O Film Tech Co Ltd | Bypass structure of conductive grid and preparation method thereof |
| US9287644B2 (en) | 2013-03-06 | 2016-03-15 | Nanchang O-Film Tech Co., Ltd. | Bridge structure in conductive mesh and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120222 |
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| CX01 | Expiry of patent term |